64L –TQFP (14 x 14 mm) Pb-Free Package PACKAGE MATERIAL DECLARATION DATASHEET Cypress Package Code Package Weight – Site 1 Package Weight – Site 3 AZ B1: 589.9943 mg B2: 654.9992 mg B3. 654.9267 mg B1: 654.9992 mg B2: 621.5263 mg B3: 631.8959 mg Body Size (mil/mm) Package Weight – Site 2 14 x 14 mm B1: 639.9319 mg B2: 638.4269 mg Package Weight – Site 4 649.6101 mg SUMMARY The 64L-TQFP package is qualified at two assembly sites. Packages from different assembly sites are likely to have different materials composition. However, Cypress guarantees that product ordered with a part number containing an “X” (e.g. CY7C1328G-133AXI, CY2308SXC-1HT) meets all requirement of the EU RoHS directive. ASSEMBLY Site 1: Cypress Manufacturing Limited (CML) Package Qualification Report # 040806, 062603, 152917 (See Note 1) I. DECLARATION OF PACKAGED UNITS A. BANNED SUBSTANCES Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this product. Substances / Compounds Cadmium and Cadmium Compounds Hexavalent Chromium and its Compounds Lead and Lead Compounds Mercury and Mercury Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) Asbestos Azo colorants Ozone Depleting Substances Polychlorinated Biphenyls (PCBs) Polychlorinated Napthalenes Radioactive Substances Shortchain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Formaldehyde Weight by mg PPM 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 0 0 0 0 0 0 0 0 0 0 Analysis Report (Note 2) CoA-AZ64CML As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-04269 Rev *M Page 1 of 16 64L –TQFP (14 x 14 mm) Pb-Free Package B. MATERIAL COMPOSITION (Note 3) B1. NiPdAu Using Standard Mold Compound Material Purpose of Use Leadframe Base Material Lead Finish External Plating Die Attach Adhesive Die Wire Mold Compound Circuit Interconnect Encapsulation Substance Composition CAS Number Weight by mg % Weight of Substance per Homogeneous Material PPM % Weight of Substance per Package Cu 7440-50-8 41.6720 97.4100% 70,631 7.0631% Fe 7439-89-6 1.0310 2.4100% 1,747 0.1747% P Zn Ni Pd Au Ag Bismaleimide Polymer Methacrylate Acrylate ester Organic Peroxide Si Au SiO2 Antimony Trioxide Epoxy Resin Phenol Resin Brominated Epoxy Resin Others 7723-14-0 7440-66-6 7440-02-0 7440-05-3 7440-57-5 7440-22-4 -----------------------------------------------------------------------------------------------7440-21-3 7440-57-5 60676-86-0 1309-64-4 0.0299 0.0513 0.1930 0.0035 0.0035 0.8800 0.1000 0.0600 0.0200 0.0200 0.0200 15.4800 3.4200 462.1878 2.6351 0.0700% 0.1200% 96.5200% 1.7400% 1.7400% 80.0000% 9.0900% 5.4500% 1.8200% 1.8200% 1.8200% 100.0000% 100.0000% 87.7000% 0.5000% 51 87 327 6 6 1,492 169 102 34 34 34 26,238 5,797 783,377 4,466 0.0051% 0.0087% 0.0327% 0.0006% 0.0006% 0.1492% 0.0169% 0.0102% 0.0034% 0.0034% 0.0034% 2.6238% 0.5797% 78.3377% 0.4466% 85954-11-6 26834-02-6 -------------------- 26.3505 25.2965 5.2701 5.0000% 4.8000% 1.0000% 44,662 42,876 8,932 4.4662% 4.2876% 0.8932% -------------------- 5.2701 1.0000% 8,932 0.8932% % Total: 100.0000 Package Weight (mg): 589.9943 Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-04269 Rev *M Page 2 of 16 64L –TQFP (14 x 14 mm) Pb-Free Package B2. NiPdAu Using Green Mold Compound Material Leadframe Purpose of Use Base Material Lead Finish External Plating Die Attach Adhesive Die Wire Circuit Interconnect Mold Compound Substance Composition CAS Number Cu 7440-50-8 Si Mg 7440-21-3 Ni Ni Pd Au Ag Bismaleimide Polymer Methacrylate Acrylate ester Organic Peroxide Si Au SiO2 Phenol Resin Epoxy Resin 7439-95-4 7440-02-0 7440-02-0 7440-05-3 7440-57-5 7440-22-4 -----------------------------------------------------------------------------------------------7440-21-3 7440-57-5 60676-86-0 --------------------------------------- Weight by mg % Weight of Substance per Homogeneous Material PPM % Weight of Substance per Package 166.1165 96.2000% 253,613 25.3613% 1.1224 0.6500% 1,714 0.1714% 0.2590 5.1803 4.1714 0.0751 0.0753 0.4369 0.0491 0.0273 0.0109 0.0109 0.0109 7.6453 8.1667 410.8606 23.0821 27.6985 0.1500% 3.0000% 96.5204% 1.7370% 1.7427% 80.0000% 9.0000% 5.0000% 2.0000% 2.0000% 2.0000% 100.0000% 100.0000% 89.0000% 5.0000% 6.0000% 395 7,909 6,368 115 115 667 75 42 17 17 17 11,672 12,468 627,268 35,240 42,288 0.0395% 0.7909% 0.6368% 0.0115% 0.0115% 0.0667% 0.0075% 0.0042% 0.0017% 0.0017% 0.0017% 1.1672% 1.2468% 62.7268% 3.5240% 4.2288% % Total: 100.0000 Encapsulation Package Weight (mg): 654.9992 Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-04269 Rev *M Page 3 of 16 64L –TQFP (14 x 14 mm) Pb-Free Package B3. NiPdAu with Green Mold Compound using CuPd Bonding Wire Material Purpose of Use Leadframe Base Material Lead Finish Die Attach External Plating Adhesive Die Wire Circuit Interconnect Mold Compound Encapsulation Substance Composition CAS Number Weight by mg % weight of substance per Homogeneou s PPM %Weight of Substance per package Cu 7440-50-8 187.9723 95.6222% 287,013 28.7013% Si Mg Ni Ni 7440-21-3 7439-95-4 7440-02-0 7440-02-0 1.4083 0.2438 6.9536 4.9275 0.7164% 0.1240% 3.5373% 99.9371% 2,150 372 10,617 7,524 0.2150% 0.0372% 1.0617% 0.7524% Pd Au Ag Proprietary bismaleimide 7440-05-3 7440-57-5 7440-22-4 Trade Secret 0.0019 0.0012 1.4859 0.2335 0.0385% 0.0243% 74.9584% 11.7792% 3 2 2,269 357 0.0003% 0.0002% 0.2269% 0.0357% Proprietary polymer Methacrylate Acrylate ester Organic Peroxide Trade Secret 0.1741 8.7827% 266 0.0266% Trade Secret Trade Secret Trade Secret 0.0496 0.0196 0.0196 2.5021% 0.9888% 0.9888% 76 30 30 0.0076% 0.0030% 0.0030% Si Cu Pd SiO2 7440-21-3 7440-50-8 7440-50-3 60676-86-0 21.7743 6.3822 0.0006 373.6237 100.0000% 99.9906% 0.0094% 88.2690% 33,247 9,745 1 570,482 3.3247% 0.9745% 0.0001% 57.0482% Phenol Resin Epoxy Resin Trade Secret Trade Secret 25.9159 23.7391 6.1227% 5.6084% 39,571 36,247 3.9571% 3.6247% Package Weight (mg): 654.9267 % Total: 100.0000% II. DECLARATION OF PACKAGING / INDIRECT MATERIALS Type Tape & Reel Tray Others Cover tape Carrier tape Plastic Reel Tray Lead PPM <20.0 <5.0 < 5.0 < 5.0 Cadmium PPM <20.0 <5.0 < 5.0 < 5.0 Cr VI PPM <20.0 <5.0 < 5.0 < 5.0 Mercury PPM <20.0 <10.0 < 10.0 < 10.0 PBB PPM <20.0 <50.0 <50.0 <50.0 PBDE PPM <20.0 <45.0 <45.0 <45.0 Shielding bag <2 .0 <2.0 <2.0 <2.0 <5.0 <5.0 Material Analysis Report (Note2) CoA-COVT-R CoA-CART-R CoA-PLRL-R CoA-TRAY-R CoA-TRAY-M CoA-SBAG –R CoA-SBAG –M Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-04269 Rev *M Page 4 of 16 64L –TQFP (14 x 14 mm) Pb-Free Package ASSEMBLY Site 2: Advanced Semiconductor Engineering Taiwan (ASET) Package Qualification Report # 034101, 120201 (Note 1) I. DECLARATION OF PACKAGED UNITS A. BANNED SUBSTANCES Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this product. Substances / Compounds Cadmium and Cadmium Compounds Hexavalent Chromium and its Compounds Lead and Lead Compounds Mercury and Mercury Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) Asbestos Azo colorants Ozone Depleting Substances Polychlorinated Biphenyls (PCBs) Polychlorinated Napthalenes Radioactive Substances Shortchain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Formaldehyde Weight by mg PPM 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 0 0 0 0 0 0 0 0 0 0 Analysis Report (Note 2) CoA-AZ64ASET As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-04269 Rev *M Page 5 of 16 64L –TQFP (14 x 14 mm) Pb-Free Package B. MATERIAL COMPOSITION (Note 3) B1: Using Gold Wire Material Leadframe Purpose of Use Base Material Lead Finish External Plating Die Attach Adhesive Die Wire Circuit Interconnect Mold Compound Encapsulation Substance Composition CAS Number Weight by mg % Weight of Substance per Homogeneous Material % Weight of Substance per Package PPM Cu 7440-50-8 104.5090 90.8300% 163,313 16.3313% Ni 7440-02-0 3.2562 2.8300% 5,088 0.5088% Si 7440-21-3 0.7019 0.6100% 1,097 0.1097% 7439-95-4 7440-22-4 7440-31-5 7440-22-4 Proprietary 7440-50-8 ------------------ 0.1956 6.3973 19.9700 2.5600 0.7000 0.0599 0.0599 0.1700% 5.5600% 100.0000% 74.4200% 20.3500% 1.7400% 1.7400% 306 9,997 31,206 4,001 1,094 94 94 0.0306% 0.9997% 3.1206% 0.4001% 0.1094% 0.0094% 0.0094% ------------------ 0.0599 1.7400% 94 0.0094% 7440-21-3 7440-57-5 85954-11-6 26834-02-6 60676-86-0 139189-30-3 20.6700 2.8200 23.8532 19.1208 423.0477 7.1703 100.0000% 100.0000% 4.9900% 4.0000% 88.5000% 1.5000% 32,300 4,407 37,275 29,879 661,082 11,205 3.2300% 0.4407% 3.7275% 2.9879% 66.1082% 1.1205% ------------------ 4.7802 1.0000% 7,470 0.7470% Package Weight (mg): 639.9319 % Total: 100.0000 Mg Ag Pure Sn Ag Epoxy Resin Cu GammaButyrolactone Aromatic Hydrocarbons Si Au Epoxy Resin Phenol Resin SiO2 Aromatic Phosphate Others Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-04269 Rev *M Page 6 of 16 64L –TQFP (14 x 14 mm) Pb-Free Package B2: Using Copper Wire Material Purpose of Use Leadframe Base Material Lead Finish External Plating Die Attach Adhesive Die Wire Mold Compound Circuit Interconnect Encapsulation Substance Composition CAS Number Weight by mg % Weight of Substance per Homogeneous Material % Weight of Substance per Package PPM Cu 7440-50-8 104.5090 90.8300% 163,698 16.3698% Ni 7440-02-0 3.2562 2.8300% 5,100 0.5100% Si 7440-21-3 0.7019 0.6100% 1,099 0.1099% 7439-95-4 7440-22-4 7440-31-5 7440-22-4 9003-36-5 Trade Secret Trade Secret Trade Secret 0.1956 6.3973 19.9700 2.5454 0.1376 0.2064 0.1376 0.2064 0.1700% 5.5600% 100.0000% 74.0000% 4.0000% 6.0000% 4.0000% 6.0000% 306 10,020 31,280 3,987 216 323 216 323 0.0306% 1.0020% 3.1280% 0.3987% 0.0216% 0.0323% 0.0216% 0.0323% Trade Secret 0.1720 5.0000% 269 0.0269% 461-58-5 0.0172 0.5000% 27 0.0027% Trade Secret 0.0172 0.5000% 27 0.0027% 7440-21-3 7440-50-8 Trade Secret 20.6700 1.3150 23.8986 100.0000% 100.0000% 5.0000% 32,376 2,060 37,434 3.2376% 0.2060% 3.7434% 29690-82-2 23.8986 5.0000% 37,434 3.7434% Trade Secret Trade Secret 1333-86-4 60676-86-0 7631-86-9 14808-60-7 23.8986 23.8986 1.4339 331.7127 47.7972 1.4339 5.0000% 5.0000% 0.3000% 69.4000% 10.0000% 0.3000% 37,434 37,434 2,246 519,578 74,867 2,246 3.7434% 3.7434% 0.2246% 51.9578% 7.4867% 0.2246% Package Weight (mg): 638.4269 % Total: 100.0000 Mg Ag Sn Ag Epoxy resin A Epoxy resin B Diluent A Diluent B Phenolic Hardener Dicyandiamide Organic peroxide Si Copper Epoxy resin A Epoxy,Cresol Novolac Phenol resin Metal Hydroxide Carbon Black Silica Fused A Silica Fused B Silica,crystalline Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-04269 Rev *M Page 7 of 16 64L –TQFP (14 x 14 mm) Pb-Free Package II. DECLARATION OF PACKAGING INDIRECT MATERIALS Type Tape & Reel Tray Others Cover tape Carrier tape Plastic Reel Tray Lead PPM <20.0 <5.0 < 5.0 < 5.0 Cadmium PPM <20.0 <5.0 < 5.0 < 5.0 Cr VI PPM <20.0 <5.0 < 5.0 < 5.0 Mercury PPM <20.0 <10.0 < 10.0 < 10.0 PBB PPM <20.0 <50.0 <50.0 <50.0 PBDE PPM <20.0 <45.0 <45.0 <45.0 Shielding bag <2 .0 <2.0 <2.0 <2.0 <5.0 <5.0 Material Analysis Report (Note2) CoA-COVT-R CoA-CART-R CoA-PLRL-R CoA-TRAY-R CoA-TRAY-M CoA-SBAG –R CoA-SBAG –M Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-04269 Rev *M Page 8 of 16 64L –TQFP (14 x 14 mm) Pb-Free Package ASSEMBLY Site 3: Jiangsu Changjiang Electronics Technology (JCET) Package Qualification Report # 110901, 141302, ***151704 (See Note 1) I. DECLARATION OF PACKAGED UNITS A. BANNED SUBSTANCES Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this product. Substances / Compounds Cadmium and Cadmium Compounds Hexavalent Chromium and its Compounds Lead and Lead Compounds Mercury and Mercury Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) Asbestos Azo colorants Ozone Depleting Substances Polychlorinated Biphenyls (PCBs) Polychlorinated Napthalenes Radioactive Substances Shortchain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Formaldehyde Weight by mg 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 PPM < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 0 0 0 0 0 0 0 0 0 0 Analysis Report (Note 2) CoA-AZ64JCET As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-04269 Rev *M Page 9 of 16 64L –TQFP (14 x 14 mm) Pb-Free Package B. MATERIAL COMPOSITION (Note 3) B1.USING GOLD WIRE Material Leadframe Purpose of Use Base Material Lead Finish External Plating Die Attach Adhesive Die Wire Circuit Interconnect Mold Compound Substance Composition CAS Number Cu 7440-50-8 Si Mg 7440-21-3 Ni Ni Pd Au Ag Bismaleimide Polymer Methacrylate Acrylate ester Organic Peroxide Si Au SiO2 Phenol Resin Epoxy Resin 7439-95-4 7440-02-0 7440-02-0 7440-05-3 7440-57-5 7440-22-4 -----------------------------------------------------------------------------------------------7440-21-3 7440-57-5 60676-86-0 --------------------------------------- Weight by mg % Weight of Substance per Homogeneous Material PPM % Weight of Substance per Package 166.1165 96.2000% 253,613 25.3613% 1.1224 0.6500% 1,714 0.1714% 0.2590 5.1803 4.1714 0.0751 0.0753 0.4369 0.0491 0.0273 0.0109 0.0109 0.0109 7.6453 8.1667 410.8606 23.0821 27.6985 0.1500% 3.0000% 96.5204% 1.7370% 1.7427% 80.0000% 9.0000% 5.0000% 2.0000% 2.0000% 2.0000% 100.0000% 100.0000% 89.0000% 5.0000% 6.0000% 395 7,909 6,368 115 115 667 75 42 17 17 17 11,672 12,468 627,268 35,240 42,288 0.0395% 0.7909% 0.6368% 0.0115% 0.0115% 0.0667% 0.0075% 0.0042% 0.0017% 0.0017% 0.0017% 1.1672% 1.2468% 62.7268% 3.5240% 4.2288% % Total: 100.0000 Encapsulation Package Weight (mg): 654.9992 Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-04269 Rev *M Page 10 of 16 64L –TQFP (14 x 14 mm) Pb-Free Package B2.USING COPPER PALLADIUM WIRE Material Purpose of Use Leadframe Base Material Lead Finish External Plating Die Attach Adhesive Die Circuit Wire Interconnect Mold Compound Encapsulation Substance Composition CAS Number Nickel Silicon 7440-02-0 7440-21-3 Magnesium Silver Copper 7439-95-4 7440-22-4 7440-50-8 Tin Silver Proprietary Bismaleimide Proprietary Polymer Methacrylate Acrylate Ester Organic Peroxide Silicon Copper Palladium Epoxy Resin A Epoxy Resin B Phenol Resin Silica(Amorphous) Carbon Black 7440-31-5 7440-22-4 Proprietary Weight by mg 2.5300 0.5175 0.1725 2.6450 109.1350 19.9700 0.4369 0.0491 Proprietary Proprietary Proprietary Proprietary 7440-21-3 7440-50-8 7440-05-3 Trade Secret Trade Secret Trade Secret 60676-86-0 1333-86-4 0.0273 0.0109 0.0109 0.0109 7.6453 1.3410 0.0240 14.3100 14.3100 23.8500 423.0990 1.4310 Package Weight (mg): 621.5263 4,071 833 278 4,256 175,592 % Weight of Substance per package 0.4071% 0.0833% 0.0278% 0.4256% 17.5592% 32,131 3.2131% 703 0.0703% 79 0.0079% 44 18 18 18 12,301 2,158 39 23,024 23,024 38,373 680,742 2,302 0.0044% 0.0018% 0.0018% 0.0018% 1.2301% 0.2158% 0.0039% 2.3024% 2.3024% 3.8373% 68.0742% 0.2302% % Total: 100.0000 % weight of substance per Homogeneous 2.2000% 0.4500% 0.1500% 2.3000% 94.9000% PPM 100.0000% 80.0000% 9.0000% 5.0000% 2.0000% 2.0000% 2.0000% 100.0000% 98.2400% 1.7600% 3.0000% 3.0000% 5.0000% 88.7000% 0.3000% Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-04269 Rev *M Page 11 of 16 64L –TQFP (14 x 14 mm) Pb-Free Package *** B3.USING COPPER PALLADIUM WIRE Material Purpose of Use Leadframe Base Material Lead Finish External Plating Die Attach Adhesive Die Circuit Wire Interconnect Mold Compound Encapsulation Substance Composition CAS Number Nickel Silicon 7440-02-0 7440-21-3 Magnesium Silver Copper 7439-95-4 7440-22-4 7440-50-8 Tin Silver Proprietary Bismaleimide Proprietary Polymer Methacrylate Acrylate Ester Organic Peroxide Silicon Copper Palladium Epoxy Resin A Epoxy Resin B Phenol Resin Silica(Amorphous) Carbon Black 7440-31-5 7440-22-4 Proprietary Weight by mg 3.8580 1.0931 0.1929 2.5720 120.8840 12.9100 0.4369 0.0491 Proprietary Proprietary Proprietary Proprietary 7440-21-3 7440-50-8 7440-05-3 Trade Secret Trade Secret Trade Secret 60676-86-0 1333-86-4 0.0273 0.0109 0.0109 0.0109 7.2200 2.7748 0.0451 16.7930 16.7930 11.9950 431.8200 2.3990 Package Weight (mg): 631.8959 3.0000% 0.8500% 3749 1,318 %% Weight of Substance per package 0.3749 0.1318 0.1500% 2.0000% 94.0000% 233 4,082 191,849 0.0233 0.4082 19.1849 100.0000% 80.0000% 20,489 705 2.0489 0.0705 9.0000% 5.0000% 2.0000% 2.0000% 2.0000% 100.0000% 98.4000% 1.6000% 3.5000% 3.5000% 2.5000% 90.0000% 0.5000% 79 44 18 18 18 11,458 4,404 71 26,651 26,651 19,036 685,318 3,807 0.0079 0.0044 0.0018 0.0018 0.0018 1.1458 0.4404 0.0071 2.6651 2.6651 1.9036 68.5318 0.3807 % Total: 100.0000 % weight of substance per Homogeneous PPM II. DECLARATION OF PACKAGING / INDIRECT MATERIALS Type Tape & Reel Tray Others Cover tape Carrier tape Plastic Reel Tray Lead PPM <20.0 <5.0 < 5.0 < 5.0 Cadmium PPM <20.0 <5.0 < 5.0 < 5.0 Cr VI PPM <20.0 <5.0 < 5.0 < 5.0 Mercury PPM <20.0 <10.0 < 10.0 < 10.0 PBB PPM <20.0 <50.0 <50.0 <50.0 PBDE PPM <20.0 <45.0 <45.0 <45.0 Shielding bag <2 .0 <2.0 <2.0 <2.0 <5.0 <5.0 Material Analysis Report (Note2) CoA-COVT-R CoA-CART-R CoA-PLRL-R CoA-TRAY-R CoA-TRAY-M CoA-SBAG –R CoA-SBAG –M Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-04269 Rev *M Page 12 of 16 64L –TQFP (14 x 14 mm) Pb-Free Package ASSEMBLY Site 4: Amkor Technology Philippines (P1/P2) Package Qualification Report # 113604 (See Note 1) I. DECLARATION OF PACKAGED UNITS A. BANNED SUBSTANCES Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this product. Substances / Compounds Cadmium and Cadmium Compounds Hexavalent Chromium and its Compounds Lead and Lead Compounds Mercury and Mercury Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) Asbestos Azo colorants Ozone Depleting Substances Polychlorinated Biphenyls (PCBs) Polychlorinated Napthalenes Radioactive Substances Shortchain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Formaldehyde Weight by mg PPM 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 0 0 0 0 0 0 0 0 0 0 Analysis Report (Note 2) CoA-AZ64Amkor Philippines (P1/P2) As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-04269 Rev *M Page 13 of 16 64L –TQFP (14 x 14 mm) Pb-Free Package B. MATERIAL COMPOSITION (Note 3) Material Purpose of Use Substance Composition Lead frame Base Material Lead Finish External Plating Die Attach Adhesive Die Wire Circuit Interconnect Mold Compound Encapsulation CAS Number Weight by mg % weight of substance per homogeneous material % weight of substance per package PPM Cu Fe Zn P Ag 7440-50-8 7439-89-6 7440-66-6 7723-14-0 7440-22-4 132.4628 3.2655 0.1640 0.0410 0.6968 96.9500% 2.3900% 0.1200% 0.0300% 0.5100% 203,911 5,027 252 63 1,073 20.3911% 0.5027% 0.0252% 0.0063% 0.1073% Pure Sn Resin Ag Anhydride Si Au Epoxy Resin Silica Phenol Resin Carbon Black 7440-31-5 ------7440-22-4 ------7440-21-3 7440-57-5 ------60676-86-0 ------1333-86-4 5.0900 0.7360 2.5760 0.3680 21.2400 1.9500 31.2663 423.2976 24.0510 2.4051 100.0000% 20.0000% 70.0000% 10.0000% 100.0000% 100.0000% 6.5000% 88.0000% 5.0000% 0.5000% 7,835 1,133 3,965 566 32,697 3,002 48,131 651,618 37,024 3,702 0.7835% 0.1133% 0.3965% 0.0566% 3.2697% 0.3002% 4.8131% 65.1618% 3.7024% 0.3702% Package Weight (mg): 649.6101 % Total: 100.0000 II. DECLARATION OF PACKAGING INDIRECT MATERIALS Type Tape & Reel Tray Others Cover tape Carrier tape Plastic Reel Tray Lead PPM <20.0 <5.0 < 5.0 < 5.0 Cadmium PPM <20.0 <5.0 < 5.0 < 5.0 Cr VI PPM <20.0 <5.0 < 5.0 < 5.0 Mercury PPM <20.0 <10.0 < 10.0 < 10.0 PBB PPM <20.0 <50.0 <50.0 <50.0 PBDE PPM <20.0 <45.0 <45.0 <45.0 Shielding bag <2 .0 <2.0 <2.0 <2.0 <5.0 <5.0 Material Analysis Report (Note2) CoA-COVT-R CoA-CART-R CoA-PLRL-R CoA-TRAY-R CoA-TRAY-M CoA-SBAG –R CoA-SBAG –M Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-04269 Rev *M Page 14 of 16 64L –TQFP (14 x 14 mm) Pb-Free Package Document History Page Document Title: Document Number: Rev. 64L-TQFP (14X14MM) PB-FREE PACKAGE MATERIAL DECLARATION DATASHEET 001-04269 ECN No. Orig. of Change 390185 GFJ 2247089 MAHA Description of Change *B *C *D 2678536 HLR 2741162 MAHA MAHA 4404978 *E 3287026 REYD *F 3534186 HLR *G 3645691 COPI *H 3864427 MRB Added CAS number of Antimony Trioxide Corrected the PPM values for assembly site 2. Added the following for assembly site 1: a. Package weight for B2 b. Reference QTP# 062603 c. CoA-AZ64-R1 d. Table B2. NiPdAu Using Green Mold Compound Added Assembly Site 3- JCET. Expressed in 4 decimal places the Weight by mg, % weight of substance per Homogenous material, % weight of substance per package and total package weight of Assembly Site1 Material Composition B2. Expressed Package Weight – Site 1-B2 in 4 decimal places. Updated Assembly Sites 1(B1) and 2 to reflect 4 decimal places on values of material composition table. Added Assembly Site 4 Update the Indirect Materials table. Added PMDD B2 for Assembly site 2 – ASE Taiwan Copper wire qualification under QTP # 120201. Updated analysis report on Assembly site 4 from CoA-AZ64-L to CoA-AZ64-M in align to QTP report 113604 Updated package weight on Assembly site 4 from 649.6100 to ** *A New document 1. Updated Cypress logo. 2. Added “% weight of substance per Homogenous Material” and “% Weight of Substance per Package” on the Material Composition table. 3. Completed the RoHS Substances namely: Lead, Cadmium, Mercury, Chromium VI, PBB and PBDE on Declaration of Packaging Indirect Materials table. 4. Added Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. 649.6101 *I 4031297 YUM Added Assembly site name in the Assembly heading. Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-04269 Rev *M Page 15 of 16 64L –TQFP (14 x 14 mm) Pb-Free Package Rev. ECN No. Orig. of Change *J 4404978 REYD *K *L 4756622 HLR 4811967 JVP *M 5219437 AWP SLLO Description of Change Changed Assembly Code to Assembly Site Name. Removed entire Tube row in the Indirect Materials Section. Added B2 on Package Weight and QTP # 141302 under Site 3. Added subsections B1.USING GOLD WIRE and B2.USING COPPER PALLADIUM WIRE under Assembly Site 3. Sunset Due – No Change Added Section B3 Copper Palladium for Assembly Site 3 JCET for QTP#151704 Added Section B3 Copper Palladium for Assembly Site 1 CML for QTP#152917 Removed Distribution and Posting from the document history page Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-04269 Rev *M Page 16 of 16