PHILIPS UZZ9001

DISCRETE SEMICONDUCTORS
DATA SHEET
UZZ9001
Sensor Conditioning Electronic
Product specification
Supersedes data of 2000 May 19
2000 Nov 27
Philips Semiconductors
Product specification
Sensor Conditioning Electronic
UZZ9001
FEATURES
PINNING
• One chip angle sensor output signal conditioning
SYMBOL
• 180° angle range with KMZ41
PIN
DESCRIPTION
+VO2
1
sensor 2 positive differential input
• Accuracy better than 1° together with KMZ41
+VO1
2
sensor 1 positive differential input
• Temperature range from −40 to +150 °C
VDD2
3
digital supply voltage
• SPI protocol
VSS
4
digital ground
• SO24 package.
GND
5
analog ground
RST
6
reset of the digital part; note 1
GENERAL DESCRIPTION
TEST1
7
for production test; note 1
The UZZ9001 is an integrated circuit that combines two
sinusoidal signals (sine and cosine) into one single linear
output signal. These signals might come from the
magnetoresistive sensor KMZ41. This results in a
measurement system for angles up to 180°. The
integrated circuit UZZ9001 can also be used for all other
applications in which an angle has to be calculated from a
sine and cosine signal. A typical application would be any
kind of resolver application.
The two input signals are converted into the digital domain
with two separate AD converters. A CORDIC algorithm
performs the inverse tangent transformation. The output
stage implements the Motorola Serial Peripheral Interface
(SPI) protocol.
TEST2
8
note 2
DATA_CLK
9
trim-mode data-clock; note 1
SMODE
10
serial mode programmer; note 1
TEST3
11
note 2
data
12
SPI data output
CLK
13
SPI data clock in
CS
14
SPI chip select
OFFS2
15
offset trimming input sensor 2
OFFS1
16
offset trimming input sensor 1
VDDA
17
analog supply voltage
GND
18
analog ground
TEST4
19
for production test; note 1
TEST5
20
for production test; note 1
VDD1
21
digital supply voltage
Tout
22
test output
−VO2
23
sensor 2 negative differential input
−VO1
24
sensor 1 negative differential input
Notes
1. Connected to ground.
2. Pin to be left unconnected.
QUICK REFERENCE DATA
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
VDDA
supply voltage
note 1
4.5
5
5.5
V
VDD1
supply voltage
note 1
4.5
5
5.5
V
VDD2
supply voltage
note 1
4.5
5
5.5
V
ICCtot
total supply current
no output load
−
5
15
mA
Res
resolution
−
13
−
bit
A
accuracy
±0.35
−
−
deg
Idata-out
peak output current
−
−
10
mA
with ideal input signal
Note
1. VDDA, VDD1 and VDD2 must be connected to the same supply voltage.
2000 Nov 27
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Philips Semiconductors
Product specification
Sensor Conditioning Electronic
UZZ9001
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
VDDA
supply voltage
−0.3
+6
V
VDD1
supply voltage
−0.3
+6
V
VDD2
supply voltage
−0.3
+6
V
Vpin
voltage at all pins
−0.3
VDD
V
Tstg
storage temperature
−55
+150
°C
Tamb
operating temperature
−40
+150
°C
125 to 150 °C; max 200 hours
THERMAL CHARACTERISTICS
SYMBOL
Rth j-a
PARAMETER
thermal resistance from junction to ambient
VALUE
UNIT
80
K/W
VALUE
UNIT
2
kV
±150
V
ESD SENSITIVITY
SYMBOL
ESD
PARAMETER
ESD sensitivity
CONDITIONS
human body model
machine model
2000 Nov 27
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Philips Semiconductors
Product specification
Sensor Conditioning Electronic
UZZ9001
ELECTRICAL CHARACTERISTICS
Tamb = −40 to +150 °C; VDD = 4.5 to 5.5 V; typical characteristics for Tamb = 25 °C and VDD = 5 V unless otherwise
specified.
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
VDDA
supply voltage
4.5
5
5.5
V
VDD1
supply voltage
4.5
5
5.5
V
VDD2
supply voltage
4.5
5
5.5
V
IDD
supply current
without load
−
5
15
mA
(+VO)-(−VO)
differential input voltage
referred to VDD
±6.6
−
±28
mV/V
common mode range
referred to VDD
490
−
510
mV/V
lost magnet threshold
referred to VDD
−
3
−
mV/V
fext
external clock frequency
for trim interface
0.1
−
1
MHz
fint
internal clock frequency
2.3
4
5.7
MHz
Io
data output
Vreset
switching voltage
threshold
constant current
−
−
1
mA
peak current
−
−
10
mA
between falling and
rising VDD
2.8
−
4.5
V
−
0.3
−
V
±0.35
−
−
degree
hysteresis
A
accuracy
with ideal input signal
Res
resolution
−
13
−
bit
ton
power up time
−
−
20
ms
tr
response time
−
0.7
1.2
ms
VID
digital input voltage
to 95% of final value
LO signal
0
−
0.3 x VDD
V
HI signal
0.7 x VDD
−
VDD
V
VOD
digital output voltage
LO signal
−
−
0.4
V
HI signal
VDD −0.8
−
−
V
VLM
sensor voltage
lost magnet threshold
12
15
20
mV
FUNCTIONAL DESCRIPTION
The bitstream is fed into a decimation filter which performs
both low pass filtering and down-sampling. The IC has two
input channels each of which has its own ADC and
decimation filter. The two decimation filter outputs are
15-bit digital words at a lower frequency of typically
3.9 kHz which is the typical sampling frequency of the
sensor system. The digital representations of the two
signals are then used to calculate the current angle. This
calculation is carried out using the so-called CORDIC
algorithm. The angle is represented with a 13-bit
resolution. An SPI compatible interface converts the
output word to the serial peripheral interface protocol.
The UZZ9001 is a mixed signal IC for angle measurement
systems. It combines two analog signals (sine and cosine)
into a linear output signal. The output stage implements
the Motorola Serial Peripheral Interface (SPI) protocol.
The UZZ9001 has been designed for use with the double
sensor KMZ41.
The analog measurement signals on the IC input are
converted to digital data with two ADC’s. The ADC’s are a
Sigma-Delta modulator employing a 4th order continuous
time architecture with an over-sampling ratio of 128 to
achieve high resolution. The converter output is a digital
bitstream with an over-sampling frequency of typically
500 kHz.
2000 Nov 27
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Philips Semiconductors
Product specification
Sensor Conditioning Electronic
UZZ9001
handbook, full pagewidth
+VO1
−VO1
+VO2
−VO2
ADC1
DECIMATION
FILTER
ADC2
DECIMATION
FILTER
ALU
data
CLK
CS
SPI
DATA-CLK
CONTROL
RESET
UZZ9001
SMODE
OSCILLATOR
MHB698
reset
Fig.1 Block diagram.
The following list gives a short description of the relevant
block functions:
Serial Peripheral interface (SPI)
The UZZ9001 provides an interface to SPI compatible
devices, and as a slave node functions in one operational
mode only. For Motorola SPI devices, this mode is
selected by setting CPHA to 1 and CPOL to 1. In this
transfer mode, data bits are sampled by the master using
the leading edge of the clock as shown in Figure 2. The
falling edge indicates that the next data bit has to be
provided by the slave device (shift operation).
An advantage of this mode is that the CS input toggles only
once between every two sensor data bytes (see Fig.3).
Data transmission can be stopped by the user at any time.
The leading edge of the CS input initialises the SPI shift
register allowing the start of a complete new transmission.
If the CS line is held active low during stop of transmission,
resumption of transmission can be made without loss of
data
1. The ADC block contains two Sigma Delta AD
converters, sensor offset correction circuitry and the
circuitry required for the sensitivity and offset
adjustment of the chip output voltage curve.
2. Two digital low pass decimation filters convert the low
resolution high speed bit stream coming from the ADC
Sigma Delta converters into a low speed digital word.
3. The ALU block derives an angle value from the two
digital inputs using the CORDIC algorithm.
4. The SPI converts the output of the ALU block to a SPI
compatible 16 bit word.
5. The CONTROL block provides the clock and the
control signals for the chip.
6. The RESET block supplies a reset signal during
power-up and power-down when the power supply is
below a certain value.
7. The Oscillator unit generates the master clock.
2000 Nov 27
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Philips Semiconductors
Product specification
Sensor Conditioning Electronic
UZZ9001
handbook, full pagewidth
CS
1
3
2
5
CLK
4
10
9
8
DATA
note1
MSB-OUT
Bits 6-1
LSB-OUT
MHB699
10
11
(1) Not defined data, normally LSB of character previously transmitted.
Fig.2 UZZ9001 SPI timing.
Table 1
SPI-Timing
DIAGRAM
NUMBER
PARAMETER
SYMBOL
MIN.
MAX.
UNIT
REMARKS/TEST CONDITIONS
1
cycle time
tcyc
1
−
µs
2
enable lead time
tlead
15
−
ns
determined by master module
3
enable lag time
tlag
15
−
ns
determined by master module
4
clock high time
tclk_high
100
−
ns
determined by master module
5
clock low time
tclk_low
100
−
ns
determined by master module
8
access time
tacc
0
20
ns
time to data active from fixed VSS
state
9
disable time
tdis
−
25
ns
hold time to fixed VSS state
10
data valid time
(after clock edge)
tv
−
40
ns
with 100 pF on all SPI pins
11
data hold time
th
(output, after clock edge)
5
−
ns
operating frequency
fop
−
1
MHz
transmission delay
(time between the
leading edge of CS until
the next falling edge)
tdelay
1.2
−
µs
2000 Nov 27
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Philips Semiconductors
Product specification
Sensor Conditioning Electronic
handbook, full pagewidth
UZZ9001
sensor byte 2
DATA
sensor byte 1
CS
MHB700
Fig.3 CS Line timing.
Sensor signal coding
The error and diagnostic conditions are indicated by
D13 = 1 (active high). In an error situation the last two bits
(D0 and D1) specify the error code (see Table 2). All other
bits (D3 to D12) still show the current measurement value,
but as the last two bits are lost for measurement
representation the resolution is reduced to 11 bit.
The sensor signal comprises 14 bits (D13 to D0) as shown
in Fig.4. Bits D12 to D0 are used for the coding of the
angle while D0 is reserved to indicate error and diagnostic
conditions as defined below. The 14 data bits are arranged
in 2 Bytes. D13 is the MSB of the sensor signal and D0 is
the LSB of the sensor signal. Byte 2, which is sent first,
contains data bits D13 to D7 and additionally the parity bit
P2 which is included for the recognition of interrupted
messages. P2 gives the ODD parity of data bits D13 to D7
and has to be evaluated by the master module.Similarly,
Byte 1 comprises data bits D6 to D0 and parity bit P1,
which gives the ODD parity of data bits D6 to D0. The
internal coding of angle values is as follows:
00 0000 0000 0000B =
0°, 180°
01 1111 1111 1111B =
(2
D13
DO
13
Table 2
Error and diagnostic cases coding
MEASUREMENT
VALUE
RELIABLE
D1
D0
CASE
0
0
no valid value presently no
available due to RESET
0
1
magnet lost
no
1
0
reserved
−
1
1
reserved
−
180°
– 1 ) -----------≈ 179.978
13
2
During normal operation, bit D13 is active low. Each
increment represents an angle value
180°
≈ 0.022°
of: α inc = -----------13
2
handbook, full pagewidth
sensor byte 2
P2 D13 D12 D11 D10 D9
sensor byte 1
D8
D7
P1
D6
D5
D4
MSB
D3
D2
D1
D0
LSB
MHB701
Fig.4 Sensor signal coding.
2000 Nov 27
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Philips Semiconductors
Product specification
Sensor Conditioning Electronic
UZZ9001
Magnet lost condition
Trim interface
If both offset corrected input signal of sensor 1 and
sensor 2 are below the lost magnet threshold then the
failure ‘Magnet lost’ is assumed.
The UZZ9001 trim mode serial interface consists of the
two terminals SMODE (pin 10) and DATA_CLK (pin 9).
The structure of this protocol is shown in Figure 5.
All signal levels of DATA_CLK and SMODE must lie within
the ranges set out in Table 3. The protocol starts with
a falling edge at the SMODE, which must occur at a high
DATA_CLK level. The following five bits are used to code
the message sent to the UZZ9001. They are transferred
via the SMODE and are sampled with the rising edge of
the DATA_CLK. During the fifth high level output of
DATA_CLK (counted from the start condition onwards),
a rising edge must appear at the SMODE and the
DATA_CLK follows this with one more change to low level
in order to successfully complete the protocol.
Offset trimming
To achieve a linear output characteristic, it is necessary to
shift the offsets of the two input signals to the input stage
of the UZZ9001. For this reason a sensor offset
cancellation procedure has been implemented in the
UZZ9001 which is started by sending a special serial data
protocol to the UZZ9001. This trimming procedure is
required for both input signals.
handbook, full pagewidth start
stop
condition
statusbit #
condition
1
2
3
4
5
DATA_CLK
(input at pin 9)
SMODE
(input at pin 10)
T1
TOUT
(output at pin 22)
T0
MHB702
Fig.5 Protocol used to set UZZ9001 into trim mode.
Table 3
Definition of the trim interface signals
PARAMETER
MIN.
MAX.
UNIT
low level of DATA_CLK, SMODE
0
5
%VDD
high level of DATA_CLK, SMODE
95
100
%VDD
rise and fall time of DATA_CLK and SMODE signal edges
(10 to 90% VDD) and (90 to 10% VDD)
8
−
ns
0.1
1
MHz
DATA_CLK frequency
2000 Nov 27
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Philips Semiconductors
Product specification
Sensor Conditioning Electronic
Table 4
UZZ9001
Programming of trim modes
STATUS BITS
MODE
1
2
3
4
5
enter trim mode for sensor input channel 1
0
0
0
1
0
enter trim mode for sensor input channel 2
0
0
1
0
0
leave trim mode for either input channel
0
0
0
0
0
How to enter the trim mode
Measurement dynamics
Details of voltage levels and timing of the status bits to be
transmitted to the UZZ9001 are given in Table 3. Note that
a complete protocol has to be sent before normal
operation can be resumed. The trim mode can also be
exited by resetting the device. After entering one of the trim
modes and provided there is a dynamic input signal there
will be a square wave output at the terminal TOUT (pin 22).
The UZZ9001 includes an on-chip RC Oscillator that
generates the clock for the whole device. Consequently,
no external clock supply is required for the measurement
system. The nominal clock frequency of the on-chip
oscillator is 4 MHz at room temperature. It varies with
temperature change. At −40 °C the clock frequency may
decrease to 2.3 MHz. At higher temperatures however,
a frequency up to 5.7 MHz may occur. This influences the
dynamics of measurements. From an application point of
view, two different effects have to be distinguished. The
system delay, which means how long it takes until a
changed input signal is recognized at the output, and the
measurement update rate. The system delay is mainly
caused by the settling time of the low pass decimation
filter, which depends on the maximum frequency content
(shape) of the input signals and the clock frequency. The
following maximum values can be expected for the entire
system delay. The measurement update rate, however, is
directly related to the oscillator frequency. At room
temperature, a new value is available every 0.26 ms.
When taking the entire temperature range into account,
update rates between 0.45 and 0.18 ms are possible.
(see Table 5)
Reset
In addition to the external reset pin (pin 6), the UZZ9001
provides an internal power-up/ power-down reset logic
which continuously monitors the supply voltage. When the
supply voltage increases and reaches a safe level, reset
becomes inactive and the device starts initialization. When
the supply voltage exceeds the safe voltage level, the
device is reset immediately. This internal reset logic can be
over-ridden in all modes and at any time by applying an
external active high command to the RES input pin (pin 6)
in all modes and at any time. The reset pin RES (pin 6).
This pin is internally pulled to ground and therefore need
not be connected if the function is not required.
2000 Nov 27
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Philips Semiconductors
Product specification
Sensor Conditioning Electronic
Table 5
UZZ9001
System delay and update rates of the UZZ9001
PARAMETER
MIN.
TYP.
MAX.
UNIT
System delay (time elapsed until 95% of the final value is reached)
max. signal frequency < 200 MHz
−
−
0.6
ms
transients (step response)
−
−
1.2
ms
−40 °C
0.45
−
−
ms
+25 °C (room temperature)
−
0.26
−
ms
+150 °C
−
−
0.18
ms
Measurement update rate
APPLICATION INFORMATION
handbook, full pagewidth
C1
100 nF
+VO2
+VO1
KMZ41 VDD
3, 4
VSS
2
6
1
24
2
23
3
22
4
21
5
6
7
1
5
(1)
7, 8
8
(1)
−VO2
20
UZZ9001
19
(1)
1
2
OFFS1
3
1
18
17
9
16
10
15
11
14
12
13
GND
−VO1
2
OFFS2
3
CS (chip select)
CLK (clock in)
SPI
in/out
data out
ground
MHB703
(1) For test applications pin to be left unconnected.
Fig.6 UZZ9001 trim mode configuration.
2000 Nov 27
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Philips Semiconductors
Product specification
Sensor Conditioning Electronic
UZZ9001
PACKAGE OUTLINE
SO24: plastic small outline package; 24 leads; body width 7.5 mm
SOT137-1
D
E
A
X
c
HE
y
v M A
Z
13
24
Q
A2
A
(A 3)
A1
pin 1 index
θ
Lp
L
1
12
e
detail X
w M
bp
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (1)
e
HE
L
Lp
Q
v
w
y
mm
2.65
0.30
0.10
2.45
2.25
0.25
0.49
0.36
0.32
0.23
15.6
15.2
7.6
7.4
1.27
10.65
10.00
1.4
1.1
0.4
1.1
1.0
0.25
0.25
0.1
0.9
0.4
inches
0.10
0.012 0.096
0.004 0.089
0.01
0.019 0.013
0.014 0.009
0.61
0.60
0.30
0.29
0.050
0.419
0.043
0.055
0.394
0.016
0.043
0.039
0.01
0.01
0.004
0.035
0.016
Z
(1)
θ
8o
0o
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
SOT137-1
075E05
MS-013
2000 Nov 27
EIAJ
EUROPEAN
PROJECTION
ISSUE DATE
97-05-22
99-12-27
11
Philips Semiconductors
Product specification
Sensor Conditioning Electronic
UZZ9001
DATA SHEET STATUS
DATA SHEET STATUS
PRODUCT
STATUS
DEFINITIONS (1)
Objective specification
Development
This data sheet contains the design target or goal specifications for
product development. Specification may change in any manner without
notice.
Preliminary specification
Qualification
This data sheet contains preliminary data, and supplementary data will be
published at a later date. Philips Semiconductors reserves the right to
make changes at any time without notice in order to improve design and
supply the best possible product.
Product specification
Production
This data sheet contains final specifications. Philips Semiconductors
reserves the right to make changes at any time without notice in order to
improve design and supply the best possible product.
Note
1. Please consult the most recently issued data sheet before initiating or completing a design.
DEFINITIONS
DISCLAIMERS
Short-form specification  The data in a short-form
specification is extracted from a full data sheet with the
same type number and title. For detailed information see
the relevant data sheet or data handbook.
Life support applications  These products are not
designed for use in life support appliances, devices, or
systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips
Semiconductors customers using or selling these products
for use in such applications do so at their own risk and
agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.
Limiting values definition  Limiting values given are in
accordance with the Absolute Maximum Rating System
(IEC 60134). Stress above one or more of the limiting
values may cause permanent damage to the device.
These are stress ratings only and operation of the device
at these or at any other conditions above those given in the
Characteristics sections of the specification is not implied.
Exposure to limiting values for extended periods may
affect device reliability.
Right to make changes  Philips Semiconductors
reserves the right to make changes, without notice, in the
products, including circuits, standard cells, and/or
software, described or contained herein in order to
improve design and/or performance. Philips
Semiconductors assumes no responsibility or liability for
the use of any of these products, conveys no licence or title
under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that
these products are free from patent, copyright, or mask
work right infringement, unless otherwise specified.
Application information  Applications that are
described herein for any of these products are for
illustrative purposes only. Philips Semiconductors make
no representation or warranty that such applications will be
suitable for the specified use without further testing or
modification.
2000 Nov 27
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Philips Semiconductors
Product specification
Sensor Conditioning Electronic
UZZ9001
NOTES
2000 Nov 27
13
Philips Semiconductors
Product specification
Sensor Conditioning Electronic
UZZ9001
NOTES
2000 Nov 27
14
Philips Semiconductors
Product specification
Sensor Conditioning Electronic
UZZ9001
NOTES
2000 Nov 27
15
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TOKYO 108-8507, Tel. +81 3 3740 5130, Fax. +81 3 3740 5057
Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL,
Tel. +82 2 709 1412, Fax. +82 2 709 1415
Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR,
Tel. +60 3 750 5214, Fax. +60 3 757 4880
Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905,
Tel. +9-5 800 234 7381, Fax +9-5 800 943 0087
Middle East: see Italy
Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB,
Tel. +31 40 27 82785, Fax. +31 40 27 88399
New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND,
Tel. +64 9 849 4160, Fax. +64 9 849 7811
Norway: Box 1, Manglerud 0612, OSLO,
Tel. +47 22 74 8000, Fax. +47 22 74 8341
Pakistan: see Singapore
Philippines: Philips Semiconductors Philippines Inc.,
106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI,
Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474
Poland: Al.Jerozolimskie 195 B, 02-222 WARSAW,
Tel. +48 22 5710 000, Fax. +48 22 5710 001
Portugal: see Spain
Romania: see Italy
Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW,
Tel. +7 095 755 6918, Fax. +7 095 755 6919
Singapore: Lorong 1, Toa Payoh, SINGAPORE 319762,
Tel. +65 350 2538, Fax. +65 251 6500
Slovakia: see Austria
Slovenia: see Italy
South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale,
2092 JOHANNESBURG, P.O. Box 58088 Newville 2114,
Tel. +27 11 471 5401, Fax. +27 11 471 5398
South America: Al. Vicente Pinzon, 173, 6th floor,
04547-130 SÃO PAULO, SP, Brazil,
Tel. +55 11 821 2333, Fax. +55 11 821 2382
Spain: Balmes 22, 08007 BARCELONA,
Tel. +34 93 301 6312, Fax. +34 93 301 4107
Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM,
Tel. +46 8 5985 2000, Fax. +46 8 5985 2745
Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,
Tel. +41 1 488 2741 Fax. +41 1 488 3263
Taiwan: Philips Semiconductors, 5F, No. 96, Chien Kuo N. Rd., Sec. 1,
TAIPEI, Taiwan Tel. +886 2 2134 2451, Fax. +886 2 2134 2874
Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,
60/14 MOO 11, Bangna Trad Road KM. 3, Bagna, BANGKOK 10260,
Tel. +66 2 361 7910, Fax. +66 2 398 3447
Turkey: Yukari Dudullu, Org. San. Blg., 2.Cad. Nr. 28 81260 Umraniye,
ISTANBUL, Tel. +90 216 522 1500, Fax. +90 216 522 1813
Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,
252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461
United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,
MIDDLESEX UB3 5BX, Tel. +44 208 730 5000, Fax. +44 208 754 8421
United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
Tel. +1 800 234 7381, Fax. +1 800 943 0087
Uruguay: see South America
Vietnam: see Singapore
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,
Tel. +381 11 3341 299, Fax.+381 11 3342 553
For all other countries apply to: Philips Semiconductors,
Marketing Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN,
The Netherlands, Fax. +31 40 27 24825
Internet: http://www.semiconductors.philips.com
SCA 70
© Philips Electronics N.V. 2000
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
613520/02/pp16
Date of release: 2000
Nov 27
Document order number:
9397 750 07784