48-TFBGA (8 X 9.5 mm) Non Pb-Free Package PACKAGE MATERIAL DECLARATION DATASHEET Cypress Package Code Package Weight – Site 1 BA 284.9900 mg 8 x 9.5 mm N/A Body Size (mil/mm) Package Weight – Site 2 SUMMARY The 48-TFBGA is a Non Pb-Free package. Standard components (Non Pb-Free) currently in production are RoHS 5 compliant. Standard components may contain Pb, but do not contain the other 5 substances (above allowable levels). ASSEMBLY Site 1: Advanced Semiconductor Engineering Taiwan (ASET) Package Qualification Report #s 044501, 021801, 021113 (Note 1) I. DECLARATION OF PACKAGED UNITS A. BANNED SUBSTANCES Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS are listed in section 1A. Materials from this list may be contained or intentionally added to this product, as it is not considered Pb-Free or RoHS compliant. Substances / Compounds Cadmium and Cadmium Compounds Hexavalent Chromium and its Compounds Lead and Lead Compounds Mercury and Mercury Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) Asbestos Azo colorants Ozone Depleting Substances Polychlorinated Biphenyls (PCBs) Polychlorinated Napthalenes Radioactive Substances Shortchain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Formaldehyde Weight by mg PPM Analysis Report (Note 2) 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 < 5.0 < 5.0 7,400 < 5.0 < 5.0 < 5.0 0 0 0 0 0 0 0 0 0 0 As per MSDS Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-05126 Rev.*D Page 1 of 4 48-TFBGA (8 X 9.5 mm) Non Pb-Free Package B. MATERIAL COMPOSITION (Note 3) Material Purpose of Use Substance Composition SiO2 Substrate Solder Ball Base Material External Plating Die Attach Adhesive Die Wire Circuit Interconnect Mold Compound Encapsulation CAS Number 60676-86-0 4.2800 % Weight of Substance per Homogenous Material 10.9941% Weight by mg PPM 15,000 % Weight of Substance per Package 1.5000% Acrylic 29690-82-2 3.9000 10.0180% 13,700 1.3700% Epoxy 68541-56-0 3.1100 7.9887% 10,900 1.0900% Bisphenol Triazol Cu 13676-54-5 25722-66-1 7440-50-8 5.8400 6.8100 14.1600 15.0013% 17.4929% 36.3730% 20,500 23,900 49,700 2.0500% 2.3900% 4.9700% Ni 7440-02-0 0.5700 1.4642% 2,000 0.2000% Au Br Sn Pb Fused Silica Diester Epoxy Resin Functionalized esters Polymeric Resin Filler Bismaleimide Methacrylates Divinyl Ether Polymer Si Au Silica Fused Epoxy Resin Phenolic Resin 7440-57-5 7726-95-6 7440-31-5 7439-92-1 60676-86-0 --------------------------------- 0.2300 0.0300 3.5900 2.1100 41.0100 21.0000 4.1900 0.5908% 0.0771% 62.9825% 37.0175% 39.7846% 20.3725% 4.0648% 800 100 12,600 7,400 143,900 73,700 14,700 0.0800% 0.0100% 1.2600% 0.7400% 14.3900% 7.3700% 1.4700% ----------------- 7.6400 7.4117% 26,800 2.6800% ----------------9002-84-0 ----------------------------------------------------------------7440-21-3 7440-57-5 60676-86-0 --------------------------------- 2.2800 11.6000 9.4300 4.0500 1.3400 0.5400 39.5300 4.9900 82.5600 5.1000 5.1000 2.2119% 11.2534% 9.1482% 3.9290% 1.3000% 0.5239% 100.0000% 100.0000% 89.0039% 5.4980% 5.4980% 8,000 40,700 33,100 14,200 4,700 1,900 138,700 17,500 289,700 17,900 17,900 0.8000% 4.0700% 3.3100% 1.4200% 0.4700% 0.1900% 13.8700% 1.7500% 28.9700% 1.7900% 1.7900% % Total: 100.0000 Package Weight (mg): 284.9900 Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-05126 Rev.*D Page 2 of 4 48-TFBGA (8 X 9.5 mm) Non Pb-Free Package II. DECLARATION OF PACKAGING / INDIRECT MATERIALS Type Tape & Reel Tray Others Lead PPM Cadmium PPM Cr VI PPM Mercury PPM Cover tape < 5.0 < 5.0 < 5.0 Carrier tape Plastic Reel Tray Moisture Barrier bag Shielding bag Protective Band Shipping and inner/ pizza box < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 Material PBB PPM PBDE PPM < 5.0 < 5.0 < 5.0 Analysis Report (Note2) CoA-COVT-R < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 CoA-CART-R CoA-PLRL-R CoA-TRAY-R CoA-MBBG-R CoA-SBAG-R CoA-PROB-R CoA-ABOX-R Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-05126 Rev.*D Page 3 of 4 48-TFBGA (8 X 9.5 mm) Non Pb-Free Package Document History Page Document Title: Document Number: 48-TFBGA 8X9.5mm Non Pb-Free Package Material Declaration Datasheet 001-05126 Rev. ECN No. Orig. of Description of Change Change ** 400641 GFJ New Specification. *A 2581994 JARG Added column for %weight of substance per homogeneous material in material composition. Updated and added Lead, Cr+VI, PBB and PBDE on the Declaration of Packaging/Indirect Materials table Change CAS Number for Au in material composition table Add CAS Number for Br in material composition table Updated Cypress Logo. *B 3358816 JARG Updated Declaration of Packaging / Indirect Materials for Assembly Site 1 *C 3705434 JARG Updated material composition table to reflect 4 decimal places on values. *D 4032141 YUM Added Assembly site name in the Assembly heading. Removed entire Tube row in the Indirect Materials section. Distribution: WEB Posting: None Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-05126 Rev.*D Page 4 of 4