388 - FCBGA Non Pb-Free Package PACKAGE MATERIAL DECLARATION DATASHEET Cypress Package Code Package Weight – Site 1 FG 13,418.0100 mg Body Size (mil/mm) Package Weight – Site 2 35 X 35 mm N/A SUMMARY The 388-FCBGA is a Non Pb-Free package. Standard components (Non Pb-Free) currently in production are RoHS 5 compliant. Standard components may contain Pb, but do not contain the other 5 substances (above allowable levels). ASSEMBLY Site 1: Amkor Technology Gwangiu Korea (K4) Package Qualification Report # 043404 (Note 1) I. DECLARATION OF PACKAGED UNITS A. BANNED SUBSTANCES Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS are listed in section 1A. Materials from this list may be contained or intentionally added to this product, as it is not considered Pb-Free or RoHS compliant. Substances / Compounds Cadmium and Cadmium Compounds Hexavalent Chromium and its Compounds Lead and Lead Compounds Mercury and Mercury Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) Asbestos Azo colorants Ozone Depleting Substances Polychlorinated Biphenyls (PCBs) Polychlorinated Napthalenes Radioactive Substances Shortchain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Formaldehyde Weight by mg PPM 0 0 296 0 0 0 0 0 0 0 0 0 0 0 0 0 < 5.0 < 5.0 22,060 < 5.0 < 5.0 < 5.0 0 0 0 0 0 0 0 0 0 0 Analysis Report (Note 2) As per MSDS Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-05869 Rev. *F Page 1 of 4 388 - FCBGA Non Pb-Free Package B. MATERIAL COMPOSITION (Note 3) Material Purpose of Use Submateri al Substance Composition Laminate Sb Laminate Substrate Base Material Stiffiner Stiffiner Adhesive Solder Ball External Plating Pad Ball Underfill Die Attach Adhesive Bump FC Bump Pad Die Heatspreader Circuit Heat Dissipation Plating CAS Number Weight by mg Trade Secret 2023.4300 % Weight of Substance per Homogeneous Material 32.1600% 150,800 % Weight of Substance per Package 15.0800% PPM 7440-36-0 0.1300 0.0000% 10 0.0000% Brominated Compound Solder Mask Cu Cu Polymer Resin Trade Secret 250.5800 3.9800% 18,675 1.8700% Trade Secret 7440-50-8 7440-50-8 Trade Secret 69.1000 1179.4400 2654.0800 34.6200 1.1000% 18.7500% 42.1900% 0.5500% 5,150 87,900 197,800 2,580 0.5100% 8.7900% 19.7800% 0.2600% Silane Silica Ni Pd Au Sn Pb Si Zn Al Bis F Epoxy Resin Bis A Epoxy Resin Phenolic Resin Silica Carbon Black Additives Sn Pb Sn Pb Ni Pd Au Si Cu Ni Trade Secret Trade Secret 7440-02-0 7440-05-3 7440-57-5 7440-31-5 7439-92-1 7440-21-3 7440-66-6 7429-90-5 Trade Secret 3.4900 76.4800 3.6200 0.5400 0.4000 497.8100 292.5100 6.4400 19.4600 39.0500 18.7900 0.0600% 1.2200% 0.4600% 0.0700% 0.0500% 62.6300% 36.8000% 3.8000% 11.4800% 23.0300% 11.0800% 260 5,700 270 40 30 37,100 21,800 480 1,450 2,910 1,400 0.0300% 0.5700% 0.0300% 0.0000% 0.0000% 3.7100% 2.1800% 0.0500% 0.1500% 0.2900% 0.1400% Trade Secret 2.4200 1.4300% 180 0.0200% Trade Secret Trade Secret Trade Secret Trade Secret 7440-31-5 7439-92-1 7440-31-5 7439-92-1 7440-02-0 7440-05-3 7440-57-5 7440-21-3 7440-50-8 7440-02-0 19.0500 52.3300 0.5400 1.8800 4.4300 2.6800 1.3400 0.8100 0.2700 0.0400 0.0300 589.7200 5463.8100 108.6900 11.2300% 30.8600% 0.3200% 1.1100% 2.6100% 1.5800% 0.7900% 0.4800% 0.1600% 0.0200% 0.0200% 9.5700% 88.6700% 1.7600% 1,420 3,900 40 140 330 200 100 60 20 3 2 43,950 407,200 8,100 0.1400% 0.3900% 0.0000% 0.0100% 0.0300% 0.0200% 0.0100% 0.0100% 0.0000% 0.0000% 0.0000% 4.3900% 40.7200% 0.8100% Package Weight (mg): 13,418.0100 % Total: 100.0000 Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-05869 Rev. *F Page 2 of 4 388 - FCBGA Non Pb-Free Package II. DECLARATION OF PACKAGING / INDIRECT MATERIALS Type Tape & Reel Tube Others Material Cover tape Carrier tape Plastic Reel Plastic Tube End Plug Shielding bag Moisture Barrier bag Protective Band Shipping and Inner Box Desiccant Bubble Pack Lead PPM < 2.0 < 2.0 < 2.0 < 0.5 < 0.5 < 2.0 < 2.0 < 2.0 < 10.0 Cadmium PPM < 2.0 < 2.0 < 2.0 < 1.0 < 1.0 < 2.0 < 2.0 < 2.0 < 4.0 Cr VI PPM < 2.0 < 2.0 < 2.0 < 1.0 < 1.0 < 2.0 < 2.0 < 2.0 < 4.0 Mercury PPM < 2.0 < 2.0 < 2.0 < 1.0 < 1.0 < 2.0 < 2.0 < 2.0 < 5.0 PBB PPM <5.0 <5.0 <5.0 < 5.0 < 5.0 <5.0 <5.0 <5.0 --------- PBDE PPM <5.0 <5.0 <5.0 < 5.0 < 5.0 <5.0 <5.0 <5.0 ----------- < 10.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 1.0 < 2.0 < 3.0 < 100.0 < 3.0 < 90.0 Analysis Report (Note2) CoA-COVT-R CoA-CART-R CoA-PLRL-R CoA-PLTB-R CoA-EPLG-R CoA-SBAG –R CoA-MBBG-R CoA-PROB-R CoA-ABOX-R CoA-DESS-R CoA-BUBP-R Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-05869 Rev. *F Page 3 of 4 388 - FCBGA Non Pb-Free Package Document History Page Document Title: Document Number: 388-FCBGA Non Pb-Free PACKAGE MATERIAL DECLARATION DATASHEET 001-05869 Rev. ECN No. Orig. of Change ** 410770 GFJ *A 2589324 MAHA *B DCon 2794115 MAHA *C *D 3084072 MAHA 3824788 MRB *E 4031244 YUM *F 5081480 MRB DCON Description of Change New document 1. Updated Cypress logo. 2. Added % weight of substance per Homogenous Material and % weight of substance per package on the Material Composition for Assembly Site 1. 3. Completed the RoHS Substances namely; Lead Cadmium, Mercury, Chromium VI, PBB and PBDE on Declaration of Packaging Indirect Materials table for Assembly Site 1. Replaced CML with WEB in distribution list. Corrected CAS number of Au for assembly site 1. Added CAS number of Pb for the solder ball on assembly site 1. Added the weight of Lead on Table A. Updated the Package Weight from 13,418 to 13,418.0100 mg Updated the material composition table to reflect 4 decimal places on values. Added Assembly site name in the Assembly heading. Removed Tray and End Pin in the Indirect Materials section. Changed CAS # from “-------------“ to Trade Secret Removed Distribution: WEB and Posting: None in the document history page. Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-05869 Rev. *F Page 4 of 4