56L- TSOP I Pb-Free Package PACKAGE MATERIAL DECLARATION DATASHEET Cypress Package Code Package Weight – Site 1 TS B1: 586.0116 mg Package Weight – Site 3 Body Size (mil/mm) Package Weight – Site 2 14 x 18.4 mm Package Weight – Site 4 SUMMARY The 56L-TSOP I package is compliant to RoHS. Cypress (Legacy Spansion Part) ordering part numbers containing an “F” (e.g. S29AL008J70TFI040) meet the Directive of 2002/95/ EC (Rohs) requirement. ASSEMBLY Site 1: Cypress Bangkok (SB) Package Qualification Report # 153705 (Note 1) I. DECLARATION OF PACKAGED UNITS A. BANNED SUBSTANCES Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this product. Substances / Compounds Cadmium and Cadmium Compounds Hexavalent Chromium and its Compounds Lead and Lead Compounds Mercury and Mercury Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) Asbestos Azo colorants Ozone Depleting Substances Polychlorinated Biphenyls (PCBs) Polychlorinated Napthalenes Radioactive Substances Shortchain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Formaldehyde Weight by mg 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 PPM < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 0 0 0 0 0 0 0 0 0 0 Analysis Report (Note 2) Material Analysis report As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data, Document No. 002-03791 Rev. ** Page 1 of 4 56L- TSOP I Pb-Free Package B. MATERIAL COMPOSITION (Note 3) B1. Using Cu wire and Pure Sn Lead Finish Material Copper Iron Zinc Phosphorus Silver 7440-50-8 7439-89-6 7440-66-6 7723-14-0 7440-22-4 133.0359 3.2764 0.1365 0.0683 0.3245 97.2189% 2.3943% 0.0998% 0.0499% 0.2371% 227,019 5,591 233 116 554 % weight of substance per package 22.7019% 0.5591% 0.0233% 0.0116% 0.0554% Tin 7440-31-5 5.4800 100.0000% 9,351 0.9351% Organic filler Silica Epoxy Resin A Epoxy Resin B Diluent Phenolic Hardener Adhesion promoter Silicon Copper Epoxy Resin Phenol Resin Carbon Black Silica (Amorphous) Phosphoric Catalyst Trade Secret Trade Secret 9003-36-5 Trade Secret Trade Secret Trade Secret Trade Secret 7440-21-3 7440-50-8 1333-86-4 Trade Secret 60676-86-0 Trade Secret Trade Secret 0.9075 0.3630 0.6806 0.6806 1.0890 0.6806 0.1361 91.4000 0.1329 2.0857 27.8096 303.8195 10.4286 3.4762 20.0000% 8.0000% 15.0000% 15.0000% 24.0000% 15.0000% 3.0000% 100.0000% 100.0000% 0.6000% 8.0000% 87.4000% 3.0000% 1.0000% 1,549 619 1,161 1,161 1,858 1,161 232 155,970 227 3,559 47,456 518,453 17,796 5,932 0.1549% 0.0619% 0.1161% 0.1161% 0.1858% 0.1161% 0.0232% 15.5970% 0.0227% 0.3559% 4.7456% 51.8453% 1.7796% 0.5932% Purpose of Use Leadframe Base Material Leadfinish External Plating Die Attach Adhesive Die Wire Circuit Interconnect Mold Compound Encapsulation Substance Composition CAS Number Package Weight (mg): Weight by mg 586.0116 % weight of substance per Homogenous material PPM % Total: 100.0000 Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data, Document No. 002-03791 Rev. ** Page 2 of 4 56L- TSOP I Pb-Free Package II. DECLARATION OF PACKAGING / INDIRECT MATERIALS Type Tape & Reel Tray Others Material Cover tape Carrier tape Plastic Reel Tray Shielding bag Moisture Barrier bag Protective Band Shipping and Inner Box Dessicant Bubble Pack Lead PPM < 2.0 < 2.0 < 2.0 < 2.0 Cadmium PPM < 2.0 < 2.0 < 2.0 < 2.0 Cr VI PPM < 2.0 < 2.0 < 2.0 < 2.0 Mercury PPM < 2.0 < 2.0 < 2.0 < 2.0 PBB PPM <5.0 <5.0 <5.0 <5.0 PBDE PPM <5.0 <5.0 <5.0 <5.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 <5.0 <5.0 <5.0 <5.0 <5.0 <5.0 <5.0 <5.0 Analysis Report (Note2) CoA-COVT-R CoA-CART-R CoA-PLRL-R CoA-TRAY-R CoA-TRAY-T CoA-SBAG –R CoA-MBBG-R CoA-PROB-R CoA-ABOX-R < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 <5.0 <5.0 <5.0 <5.0 CoA-DESS-R CoA-BUBP-R Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data, Document No. 002-03791 Rev. ** Page 3 of 4 56L- TSOP I Pb-Free Package Document History Page Document Title: Document Number: Rev. ** 56L-TSOP I PB-FREE PACKAGE MATERIAL DECLARATION DATASHEET 002-03791 ECN No. Orig. of Description of Change Change 4939309 CHAL New document Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data, Document No. 002-03791 Rev. ** Page 4 of 4