36 – FBGA (7 x 8.5 x 1.2 mm) Non Pb-Free Package PACKAGE MATERIAL DECLARATION DATASHEET Cypress Package Code Package Weight – Site 1 BA B1: 165.0400 mg B2: 157.1686 mg Body Size (mil/mm) Package Weight – Site 2 7 x 8.5 x 1.2 mm N/A SUMMARY The 36-FBGA is a Non Pb-Free package. Standard components (Non Pb-Free) currently in production are RoHS 5 compliant. Standard components may contain Pb, but do not contain the other 5 substances (above allowable levels). ASSEMBLY Site 1: Advanced Semiconductor Engineering Taiwan (ASET) Package Qualification Report # 011707, 120612 (Note 1) I. DECLARATION OF PACKAGED UNITS A. BANNED SUBSTANCES Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS are listed in section 1A. Materials from this list may be contained or intentionally added to this product, as it is not considered Pb-Free or RoHS compliant. Substances / Compounds Cadmium and Cadmium Compounds Hexavalent Chromium and its Compounds Lead and Lead Compounds Mercury and Mercury Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) Asbestos Azo colorants Ozone Depleting Substances Polychlorinated Biphenyls (PCBs) Polychlorinated Napthalenes Radioactive Substances Shortchain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Formaldehyde Weight by mg PPM Analysis Report (Note 2) 0 0 1.5899 0 0 0 0 0 0 0 0 0 0 0 0 0 < 5.0 < 5.0 9,875 < 5.0 < 5.0 < 5.0 0 0 0 0 0 0 0 0 0 0 As per MSDS Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-05724 Rev.*F Page 1 of 5 36 – FBGA (7 x 8.5 x 1.2 mm) Non Pb-Free Package B1. MATERIAL COMPOSITION (Note 3) Using Gold wire material Material Purpose of Use Substance Composition SiO2 Acrylic Epoxy Substrate Base Material Solder Ball External Plating Die Attach Adhesive Die Wire Circuit Interconnect Mold Compound Encapsulation Bisphenol Triazol Cu Ni Au Br Sn Pb Silver Epoxy Resin Functionalized Ester Diester Si Au Silica (fused) Epoxy resin Phenolic resin Silica Mixed siloxanes Brominated compound Silica (quartz) Carbon black pigment Silica (Cristobalite) Antimony Trioxide CAS Number 60676-86-0 Trade Secret, 29690-82-2 68541-56-0, 25068-38-6 13676-54-5 25722-66-1 7440-50-8 7440-02-0 7440-57-5 7726-95-6 7440-31-5 7439-92-1 7440-22-4 Trade Secret 5.2492 % Weight of Substance per Homogenous Material 11.0000% 4.7720 Weight by mg PPM % Weight of Substance per Package 31,806 3.1806% 10.0000% 28,914 2.8914% 3.8224 8.0100% 23,160 2.3160% 7.1580 8.3510 17.3605 0.7206 0.2577 0.0286 2.7001 1.5899 21.3894 1.5406 15.0000% 17.5000% 36.3800% 1.5100% 0.5400% 0.0600% 62.9400% 37.0600% 76.5000% 5.5100% 43,371 50,600 105,190 4,366 1,561 174 16,360 9,633 129,601 9,335 4.3371% 5.0600% 10.5190% 0.4366% 0.1561% 0.0173% 1.6360% 0.9633% 12.9601% 0.9335% Trade Secret 1.5406 5.5100% 9,335 0.9335% Trade Secret 7440-21-3 7440-57-5 60676-86-0 Trade Secret Trade Secret 7631-86-9 3.4894 24.3700 1.4200 41.4960 7.4100 2.9581 2.9581 12.4800% 100.0000% 100.0000% 70.0000% 12.5000% 4.9900% 4.9900% 21,143 147,661 8,604 251,430 44,898 17,923 17,923 2.1143% 14.7661% 0.8604% 25.1431% 4.4898% 1.7923% 1.7923% Trade Secret 1.1856 2.0000% 7,184 0.7184% Trade Secret 1.1915 2.0100% 7,220 0.7220% 14808-60-7 1333-86-4 0.5928 1.0000% 3,592 0.3592% 0.3023 0.5100% 1,832 0.1832% 0.5928 1.0000% 3,592 0.3592% 0.5928 1.0000% 3,592 0.3592% % Total: 100.0000 14464-46-1 1309-64-4 Package Weight (mg): 165.0400 Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-05724 Rev.*F Page 2 of 5 36 – FBGA (7 x 8.5 x 1.2 mm) Non Pb-Free Package B2. MATERIAL COMPOSITION (Note 3) Using Copper-Palladium wire material Material Purpose of Use Substance Composition SiO2 Acrylic Substrate Base Material Solder Ball External Plating Die Attach Adhesive Die Circuit Wire Interconnect Mold Compound Encapsulation Epoxy Bisphenol Triazol Cu Ni Au Br Sn Pb Bismaleimide monomer Epoxy Resin Acrylate monomer Acrylic resin Silica Fused Si Copper Palladium Silica (fused) Epoxy resin Phenolic resin Carbon black pigment CAS Number 60676-86-0 Trade Secret, 29690-82-2 68541-56-0, 25068-38-6 13676-54-5 25722-66-1 7440-50-8 7440-02-0 7440-57-5 7726-95-6 7440-31-5 7439-92-1 5.2492 % Weight of Substance per Homogenous Material 11.0000% 4.7720 Weight by mg PPM % Weight of Substance per Package 33,399 3.3399% 10.0000% 30,362 3.0362% 3.8224 7.1580 8.3510 17.3605 0.7206 0.2577 0.0286 2.7001 1.5899 8.0100% 15.0000% 17.5000% 36.3800% 1.5100% 0.5400% 0.0600% 62.9400% 37.0600% 24,320 45,543 53,134 110,458 4,585 1,640 182 17,180 10,116 2.4320% 4.5543% 5.3134% 11.0458% 0.4585% 0.1640% 0.0182% 1.7180% 1.0116% Trade Secret Trade Secret 8.7319 1.8258 31.2300% 6.5300% 55,558 11,617 5.5558% 1.1617% Trade Secret Trade Secret 60676-86-0 7440-21-3 7440-50-8 7440-05-3 60676-86-0 Trade Secret Trade Secret 2.6422 0.9758 13.7843 24.3700 0.6447 0.0175 41.4960 7.4100 2.9581 9.4500% 3.4900% 49.3000% 100.0000% 97.3626% 2.6374% 86.9200% 6.4900% 6.4900% 16,811 6,209 87,704 155,056 4,102 111 264,022 47,147 18,821 1.6811% 0.6209% 8.7704% 15.5056% 0.4102% 0.0111% 26.4022% 4.7147% 1.8821% 1333-86-4 0.3023 0.1000% 1,923 0.1923% % Total: 100.0000 Package Weight (mg): 157.1686 Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-05724 Rev.*F Page 3 of 5 36 – FBGA (7 x 8.5 x 1.2 mm) Non Pb-Free Package II. DECLARATION OF PACKAGING / INDIRECT MATERIALS Type Tape & Reel Tray Others Material Cover tape Carrier tape Plastic Reel Tray Moisture Barrier Bag Lead PPM Cadmium PPM Cr VI PPM Mercury PPM PBB PPM PBDE PPM < 2.0 < 2.0 < 5.0 < 2.0 < 2.0 < 2.0 < 5.0 < 2.0 < 2.0 < 2.0 < 5.0 < 2.0 < 2.0 < 2.0 < 10.0 < 2.0 < 50.00 < 50.00 <50.0 < 0.0005 < 45.00 < 45.00 <45.0 < 0.0005 <2.0 <2.0 <2.0 <2.0 <5.0 <5.0 Analysis Report (Note2) CoA-COVT-R CoA-CART-R CoA-PLRL-R CoA-TRAY-R CoA-MBBG –R Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-05724 Rev.*F Page 4 of 5 36 – FBGA (7 x 8.5 x 1.2 mm) Non Pb-Free Package Document History Page Document Title: DATASHEET Document Number: 36 - FBGA (7x8.5x1.2mm) NON PB-FREE PACKAGE MATERIAL DECLARATION 001-05724 ** *A Orig. of Change 407157 YXP 2581994 JARG *B 3445748 JARG *C *D 3612504 UDR 3825324 JARG *E 4031244 YUM *F 5058361 MRB Rev. ECN No. SLLO Description of Change New specification Added column for %weight of substance per homogeneous material in material composition. Updated and added Lead, Cr+VI, PBB and PBDE on the Declaration of Packaging/Indirect Materials table Change CAS Number for Au in material composition table Add CAS Number for Br in material composition table Updated Cypress Logo. Updated Material Composition Tables for Assembly Sites 1 to reflect 4 decimal places on values. Added B2 for Site 1 with reference QTP # 120612. Changed document title from 36 – FBGA 7x8.5x1.2mm Non PbFree Package Material Declaration Datasheet to 36 – FBGA (7x8.5x1.2mm) NON PB-FREE PACKAGE MATERIAL DECLARATION DATASHEET (PMDD) Removed hyperlink on Au and Br substances. Added weight of Pb for Banned Substances Table of Assembly Site 1. Added assembly site name in the Assembly heading. Removed entire Tube row in the Indirect Materials section. Changed CAS # from Proprietary to Trade Secret on Assy site1_B1 and CASE # from “-----------“ to Trade Secret on Assy site 1-B2 Removed Distribution and Posting from the document history page. Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-05724 Rev.*F Page 5 of 5