44L -TQFP Pb-Free Package PACKAGE MATERIAL DECLARATION DATASHEET Cypress Package Code Package Weight – Site 1 AZ B1: 180.0023 mg B2: 329.9900 mg B3: 335.5330 mg Body Size (mil/mm) Package Weight – Site 2 Package Weight – Site 3 B1: 260.0379 mg B2: 260.5300 mg B: 342.2580 mg Page Weight – Site 4 Package Weight – Site 5 10 x 10 mm B1: 343.9689 mg B2: 265.0051 mg B3: 351.5650 mg B4: 464.6297 mg B4: 465.1001 mg B1: 329.9900 mg B2: 328.4354 mg SUMMARY The 44L-TQFP package is qualified at three assembly sites. Packages from different assembly sites are likely to have different materials composition. Cypress ordering part numbers containing an “X” (e.g. CY7C1328G-133AXI, CY2308SXC-1HT) meet the Directive of 2002/95/ EC (Rohs) requirement. ASSEMBLY Site 1: Cypress Manufacturing Limited (CML) Package Qualification Report # 040806, 062603, 133102 (See Note 1) I. DECLARATION OF PACKAGED UNITS A. BANNED SUBSTANCES Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this product. Substances / Compounds Cadmium and Cadmium Compounds Hexavalent Chromium and its Compounds Lead and Lead Compounds Mercury and Mercury Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) Asbestos Azo colorants Ozone Depleting Substances Polychlorinated Biphenyls (PCBs) Polychlorinated Napthalenes Radioactive Substances Shortchain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Formaldehyde Weight by mg PPM 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 0 0 0 0 0 0 0 0 0 0 Analysis Report (Note 2) CoA-AZ44CML As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-04267 Rev. *T Page 1 of 24 44L -TQFP Pb-Free Package B1. MATERIAL COMPOSITION (Note 3) NiPdAu Using Standard Mold Compound Material Purpose of Use Base Material Leadframe Lead Finish External Plating Die Attach Adhesive Die Wire Circuit Interconnect Mold Compound Encapsulation Substance Composition CAS Number Weight by mg % Weight of Substance per Homogeneous Material PPM % Weight of Substance per Package Cu 7440-50-8 40.1483 93.9800% 223,043 22.3043% Mg 7439-95-4 0.0598 0.1400% 332 0.0332% Si 7440-21-3 0.4699 1.1000% 2,611 0.2611% Ni Fe Zn Ni Pd Au Ag Bismaleimide Polymer Methacrylate Acylate ester Organic Peroxide Si Au SiO2 Epoxy Resin Phenol Resin Brominated Epoxy Resin Antimony Trioxide Others 7440-02-0 7439-89-6 7440-66-6 7440-02-0 7440-05-3 7440-57-5 7440-22-4 Trade Secret Trade Secret Trade Secret Trade Secret Trade Secret 7440-21-3 7440-57-5 60676-86-0 Trade Secret Trade Secret Trade Secret 1.5208 0.0897 0.4315 0.193 0.0035 0.0035 0.3465 0.0495 0.0297 0.0099 0.0099 0.0045 6.22 6.32 109.2028 6.204 6.204 0.9926 3.5600% 0.2100% 1.0100% 96.5200% 1.7400% 1.7400% 77.0100% 11.0000% 6.6000% 2.2000% 2.2000% 0.9900% 100.0000% 100.0000% 88.0100% 5.0000% 5.0000% 0.8000% 8,449 498 2,397 1,072 19 19 1,925 275 165 55 55 25 34,555 35,111 606,674 34,466 34,466 5,515 0.8449% 0.0498% 0.2397% 0.1072% 0.0019% 0.0019% 0.1925% 0.0275% 0.0165% 0.0055% 0.0055% 0.0025% 3.4555% 3.5111% 60.6674% 3.4466% 3.4466% 0.5515% 1309-64-4 Trade Secret 0.4963 0.9926 0.4000% 0.8000% 2,757 5,515 0.2757% 0.5515% Package Weight (mg): 180.0023 % Total: 100.0000 Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-04267 Rev. *T Page 2 of 24 44L -TQFP Pb-Free Package B2. MATERIAL COMPOSITION (Note 3) NiPdAu Using Green Mold Compound Material Leadframe Purpose of Use Base Material Lead Finish External Plating Die Attach Adhesive Die Wire Circuit Interconnect Mold Compound Encapsulation Substance Composition CAS Number Weight by mg % Weight of Substance per Homogeneous Material PPM % Weight of Substance per Package Cu 7440-50-8 92.9100 96.2000% 281,554 28.1554% Si 7440-21-3 0.6278 0.6500% 1,902 0.1902% Mg 7439-95-4 0.1449 0.1500% 439 0.0439% Ni Ni Pd Au Ag Bismaleimide Polymer Methacrylate Acylate ester Organic Peroxide Si Au SiO2 Phenol Resin Epoxy Resin 7440-02-0 7440-02-0 7440-05-3 7440-57-5 7440-22-4 Trade Secret Trade Secret Trade Secret Trade Secret Trade Secret 7440-21-3 7440-57-5 60676-86-0 Trade Secret Trade Secret 2.8974 2.3261 0.0419 0.0419 0.4160 0.0468 0.0260 0.0104 0.0104 0.0104 7.1900 6.7800 192.6939 10.8255 12.9906 3.0000% 96.5200% 1.7400% 1.7400% 80.0000% 9.0000% 5.0000% 2.0000% 2.0000% 2.0000% 100.0000% 100.0000% 89.0000% 5.0000% 6.0000% 8,780 7,049 127 127 1,261 142 79 32 32 32 21,789 20,546 583,939 32,806 39,367 0.8780% 0.7049% 0.0127% 0.0127% 0.1261% 0.0142% 0.0079% 0.0032% 0.0032% 0.0032% 2.1789% 2.0546% 58.3939% 3.2806% 3.9367% Package Weight (mg): 329.9900 % Total: 100.0000 Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-04267 Rev. *T Page 3 of 24 44L -TQFP Pb-Free Package B3. MATERIAL COMPOSITION (Note 3) NiPdAu Using Green Mold Compound with Copper-Palladium (Cu-Pd) wire Material Leadframe Purpose of Use Base Material Lead Finish External Plating Die Attach Adhesive Die Wire Circuit Interconnect Mold Compound Encapsulation Substance Composition CAS Number Weight by mg % Weight of Substance per Homogeneous Material PPM % Weight of Substanc e per Package Cu 7440-50-8 93.5017 95.8613% 278,666 27.8666% Si 7440-21-3 0.8795 0.9017% 2,621 0.2621% Mg 7439-95-4 0.1678 0.1720% 500 0.0500% 7440-02-0 7440-02-0 7440-05-3 7440-57-5 7440-22-4 Trade Secret Trade Secret Trade Secret Trade Secret Trade Secret 7440-21-3 7440-50-8 7440-05-3 60676-86-0 Trade Secret Trade Secret 2.9895 2.4549 0.0655 0.0624 0.6984 0.0768 0.0378 0.0208 0.0208 0.0208 8.2540 7.9957 0.5195 193.9535 10.9430 12.8706 3.0649% 95.0480% 2.5360% 2.4160% 79.7807% 8.7731% 4.3180% 2.3761% 2.3761% 2.3761% 100.0000% 93.8991% 6.1009% 89.0646% 5.0251% 5.9103% 8,910 7,316 195 186 2,081 229 113 62 62 62 24,600 23,830 1,548 578,046 32,614 38,359 0.8910% 0.7316% 0.0195% 0.0186% 0.2081% 0.0229% 0.0113% 0.0062% 0.0062% 0.0062% 2.4600% 2.3830% 0.1548% 57.8046% 3.2614% 3.8359% Package Weight (mg): 335.5330 Ni Ni Pd Au Ag Bismaleimide Polymer Methacrylate Acylate ester Organic Peroxide Si Cu Pd SiO2 Phenol Resin Epoxy Resin % Total: 100.0000 Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-04267 Rev. *T Page 4 of 24 44L -TQFP Pb-Free Package II. DECLARATION OF PACKAGING / INDIRECT MATERIALS Type Tape & Reel Tray Others Material Cover tape Carrier tape Plastic Reel Tray Shielding bag Moisture Barrier bag Protective Band Shipping and Inner Box Dessicant Bubble Pack Lead PPM < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 Cadmium PPM < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 Cr VI PPM < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 Mercury PPM < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 PBB PPM <5.0 <5.0 <5.0 --------<5.0 PBDE PPM <5.0 <5.0 <5.0 --------<5.0 Analysis Report (Note2) CoA-COVT-R CoA-CART-R CoA-PLRL-R < 2.0 < 2.0 < 2.0 < 2.0 <5.0 <5.0 CoA-MBBG-R < 2.0 < 2.0 < 2.0 < 2.0 <5.0 <5.0 CoA-PROB-R < 10.0 < 4.0 < 4.0 < 5.0 --------- ----------- CoA-ABOX-R < 10.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 1.0 < 2.0 < 3.0 < 100.0 < 3.0 < 90.0 CoA-DESS-R CoA-BUBP-R CoA-TRAY-R CoA-SBAG –R Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-04267 Rev. *T Page 5 of 24 44L -TQFP Pb-Free Package ASSEMBLY Site 2: Advanced Semiconductor Engineering Taiwan (ASET) Package Qualification Report # 034101, 120201, 123808, 141404 (See Note 1) I. DECLARATION OF PACKAGED UNITS A. BANNED SUBSTANCES Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this product. Substances / Compounds Cadmium and Cadmium Compounds Hexavalent Chromium and its Compounds Lead and Lead Compounds Mercury and Mercury Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) Asbestos Azo colorants Ozone Depleting Substances Polychlorinated Biphenyls (PCBs) Polychlorinated Napthalenes Radioactive Substances Shortchain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Formaldehyde Weight by mg 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 PPM < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 0 0 0 0 0 0 0 0 0 0 Analysis Report (Note 2) CoA-AZ44ASET As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-04267 Rev. *T Page 6 of 24 44L -TQFP Pb-Free Package B1. MATERIAL COMPOSITION (Note 3) Gold Wire Material Material Base Material Leadframe Lead Finish External Plating Die Attach Adhesive Die Wire Substance Composition Purpose of Use Circuit Interconnect Encapsulation Mold Compound CAS Number Weight by mg % Weight of Substance per Homogeneous Material PPM % Weight of Substance per Package Cu 7440-50-8 83.4169 91.9600% 242,513 24.2513% Ni 7440-02-0 2.6124 2.8800% 7,595 0.7595% Si 7440-21-3 0.5533 0.6100% 1,609 0.1609% Mg Ag Sn Ag Epoxy Resin Gamma Butyrolactone Phenolic Resin Aromatic Hydrocarbons Si Au Silica Fused 7439-95-4 7440-22-4 7440-31-5 7440-22-4 9003-36-5 96-48-0 0.1361 3.9912 12.2100 2.5099 0.6899 0.1001 0.1500% 4.4000% 100.0000% 71.7100% 19.7100% 2.8600% 396 11,603 35,497 7,297 2,006 291 0.0396% 1.1603% 3.5497% 0.7297% 0.2006% 0.0291% 0.1001 0.1001 2.8600% 2.8600% 291 291 0.0291% 0.0291% 100.0000% 100.0000% 88.5100% 71,198 5,814 543,151 7.1198% 0.5814% 54.3151% Epoxy Resin Phenol Resin Aromatic Phosphate Others 85954-11-6 26834-02-6 1333-86-4 24.4900 2.0000 186.826 9 10.5540 8.4221 3.1662 5.0000% 3.9900% 1.5000% 30,683 24,485 9,205 3.0683% 2.4485% 0.9205% 2.0897 0.9900% 6,075 0.6075% 9003-35-5 Trade Secret 7440-21-3 7440-57-5 60676-86-0 Trade Secret Package Weight (mg): 343.9689 % Total: 100.0000 Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-04267 Rev. *T Page 7 of 24 44L -TQFP Pb-Free Package B2. MATERIAL COMPOSITION (Note 3) 1.0 mm thick package using Cu wire Material Leadframe Base Material Lead Finish External Plating Die Attach Adhesive Die Wire Mold Compound Substance Composition Purpose of Use Circuit Interconnect Encapsulation CAS Number Weight by mg % Weight of Substance per Homogeneous Material PPM % Weight of Substance per Package Cu 7440-50-8 92.2254 94.3000% 348,014 34.8014% Ni 7440-02-0 2.4450 2.5000% 9,226 0.9226% Si 7440-21-3 0.4890 0.5000% 1,845 0.1845% 7439-95-4 7440-22-4 7440-31-5 7440-22-4 9003-36-5 Trade Secret Trade Secret Trade Secret 0.0978 2.5428 5.3550 0.3515 0.0180 0.0180 0.0180 0.0180 0.1000% 2.6000% 100.0000% 78.1000% 4.0000% 4.0000% 4.0000% 4.0000% 369 9,595 20,207 1,326 68 68 68 68 0.0369% 0.9595% 2.0207% 0.1326% 0.0068% 0.0068% 0.0068% 0.0068% Trade Secret 0.0225 5.0000% 85 0.0085% 461-58-5 Trade secret 7440-21-3 7440-50-8 Trade secret 0.0014 0.0027 3.1200 0.2800 7.9000 0.3000% 0.6000% 100.0000% 100.0000% 5.0000% 5 10 11,773 1,057 29,811 0.0005% 0.0010% 1.1773% 0.1057% 2.9811% 29690-82-2 7.9000 5.0000% 29,811 2.9811% Trade secret Trade secret 1333-86-4 14808-60-7 7631-86-9 60676-86-0 7.9000 7.9000 0.4740 109.6520 15.8000 0.4740 5.0000% 5.0000% 0.3000% 69.4000% 10.0000% 0.3000% 29,811 29,811 1,789 413,772 59,622 1,789 2.9811% 2.9811% 0.1789% 41.3772% 5.9622% 0.1789% % Total: 100.0000 Mg Ag Sn Silver Epoxy Resin A Epoxy Resin B Diluent A Diluent B Phenolic Hardener Dicyandiamide Organic peroxide Si Copper (Cu) Epoxy Resin A Epoxy, Cresol Novolac Phenol Resin Metal Hydroxide Carbon Black Silica, Crystalline Silica Fused B Silica Fused A Package Weight (mg): 265.0051 Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-04267 Rev. *T Page 8 of 24 44L -TQFP Pb-Free Package B3. MATERIAL COMPOSITION (Note 3) 1.4mm thick package using Cu wire Material Leadframe Base Material Lead Finish External Plating Die Attach Adhesive Die Wire Mold Compound Substance Composition Purpose of Use Circuit Interconnect Encapsulation CAS Number Weight by mg % Weight of Substance per Homogeneous Material PPM % Weight of Substance per Package Cu 7440-50-8 59.8805 94.3000% 170,326 17.0326% Ni 7440-02-0 1.5875 2.5000% 4,516 0.4516% Si 7440-21-3 0.3175 0.5000% 903 0.0903% 7439-95-4 7440-22-4 7440-31-5 7440-22-4 9003-36-5 Trade Secret Trade Secret Trade Secret 0.0635 1.6510 5.3550 0.5311 0.0272 0.0272 0.0272 0.0272 0.1000% 2.6000% 100.0000% 78.1000% 4.0000% 4.0000% 4.0000% 4.0000% 181 4,696 15,232 1,511 77 77 77 77 0.0181% 0.4696% 1.5232% 0.1511% 0.0077% 0.0077% 0.0077% 0.0077% Trade Secret 0.0340 5.0000% 97 0.0097% 461-58-5 Trade secret 7440-21-3 7440-50-8 Trade secret 0.0020 0.0041 5.0100 0.2200 13.8400 0.3000% 0.6000% 100.0000% 100.0000% 5.0000% 6 12 14,251 626 39,367 0.0006% 0.0012% 1.4251% 0.0626% 3.9367% 29690-82-2 13.8400 5.0000% 39,367 3.9367% Trade secret Trade secret 1333-86-4 14808-60-7 7631-86-9 60676-86-0 13.8400 13.8400 0.8304 192.0992 27.6800 0.8304 5.0000% 5.0000% 0.3000% 69.4000% 10.0000% 0.3000% 39,367 39,367 2,362 546,409 78,734 2,362 3.9367% 3.9367% 0.2362% 54.6409% 7.8734% 0.2362% Package Weight (mg): 351.5650 % Total: 100.0000 Mg Ag Sn Silver Epoxy Resin A Epoxy Resin B Diluent A Diluent B Phenolic Hardener Dicyandiamide Organic peroxide Si Copper (Cu) Epoxy Resin A Epoxy, Cresol Novolac Phenol Resin Metal Hydroxide Carbon Black Silica, Crystalline Silica Fused B Silica Fused A Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-04267 Rev. *T Page 9 of 24 44L -TQFP Pb-Free Package B4. MATERIAL COMPOSITION (Note 3) 1.4mm thick package using Die Attach Film and Cu wire Material Leadframe Lead Finish Die Attach Substance Composition Purpose of Use Base Material External Plating Adhesive Die Wire Circuit Interconnect Mold Compound Encapsulation CAS Number Weight by mg % Weight of Substance per Homogeneous Material PPM % Weight of Substance per Package Cu 7440-50-8 125.5410 96.2000 270,196 27.0196 Ni 7440-02-0 3.9150 3.0000 8,426 0.8426 Si 7440-21-3 0.8483 0.6500 1,826 0.1826 Mg Sn Novolak Epoxy Resin Phenol Resin Amorphous Silica Acrylic Copolymer Si Copper Epoxy Resin-1 Epoxy Resin-2 Phenol Resin Carbon Black Silica (SiO2) 7439-95-4 7440-31-5 0.1958 13.8000 0.1500 100.0000 421 29,701 0.0421 2.9701 Trade Secret 0.1296 12.0000 279 0.0279 Trade Secret 0.1296 12.0000 279 0.0279 68611-44-9 0.0540 5.0000 116 0.0116 Trade Secret 0.7668 71.0000 1,650 0.1650 7440-21-3 7440-50-8 Trade secret Trade secret Trade secret 1333-86-4 60676-86-0 5.6000 1.8496 14.0310 9.3540 20.5788 1.5590 266.2772 100.0000 100.0000 4.5000 3.0000 6.6000 0.5000 85.4000 12,053 2,982 30,198 20,132 44,291 3,355 573,095 1.2053 0.3982 3.0198 2.0132 4.4291 0.3355 57.3095 Package Weight (mg): 464.6297 % Total: 100.0000 Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-04267 Rev. *T Page 10 of 24 44L -TQFP Pb-Free Package B5. MATERIAL COMPOSITION (Note 3) 1.4mm thick package using CuPd Bonding Wire Material Leadframe Lead Finish Die Attach Die Wire Mold Compound Substance Composition Purpose of Use Base Material External Plating Adhesive Circuit Interconnect Encapsulation CAS Number Weight by mg % Weight of Substance per Homogeneous Material PPM % Weight of Substance per Package Cu 7440-50-8 127.0802 96.2000 273,232 27.3232 Ni 7440-02-0 3.9630 3.0000 8,521 0.8521 Si 7440-21-3 0.6500 0.1500 100.0000 0.1846 7439-95-4 7440-31-5 0.8587 0.1982 13.8000 1,846 Mg Sn Novolak Epoxy Resin Phenol Resin Amorphous Silica Acrylic Copolymer Si Copper Palladium Epoxy Resin-1 Epoxy Resin-2 Phenol Resin Carbon Black Silica (SiO2) 426 29,671 0.0426 2.9671 0.1296 0.1296 12.0000 12.0000 279 0.0279 279 0.0279 0.0540 5.0000 116 0.0116 71.0000 100.0000 99.9800 0.0200 4.5000 3.0000 6.6000 0.5000 85.4000 1,649 0.1649 Trade secret Trade secret Trade secret 1333-86-4 60676-86-0 0.7668 5.6000 1.9196 0.0004 13.9770 9.3180 20.4996 1.5530 265.2524 12,040 4,127 0.83 30,052 20,034 44,076 3,339 570,313 1.2040 0.4127 0.0001 3.0052 2.0034 4.4076 0.3339 57.0313 Package Weight (mg): 465.1001 % Total: 100.0000 Trade Secret Trade Secret 68611-44-9 Trade Secret 7440-21-3 7440-50-8 7440-05-3 Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-04267 Rev. *T Page 11 of 24 44L -TQFP Pb-Free Package II. DECLARATION OF PACKAGING / INDIRECT MATERIALS Type Tape & Reel Tray Others Material Cover tape Carrier tape Plastic Reel Tray Shielding bag Moisture Barrier bag Protective Band Shipping and Inner Box Dessicant Bubble Pack Lead PPM < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 Cadmium PPM < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 Cr VI PPM < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 Mercury PPM < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 PBB PPM <5.0 <5.0 <5.0 --------<5.0 PBDE PPM <5.0 <5.0 <5.0 --------<5.0 Analysis Report (Note2) CoA-COVT-R CoA-CART-R CoA-PLRL-R < 2.0 < 2.0 < 2.0 < 2.0 <5.0 <5.0 CoA-MBBG-R < 2.0 < 2.0 < 2.0 < 2.0 <5.0 <5.0 CoA-PROB-R < 10.0 < 4.0 < 4.0 < 5.0 --------- ----------- CoA-ABOX-R < 10.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 1.0 < 2.0 < 3.0 < 100.0 < 3.0 < 90.0 CoA-DESS-R CoA-BUBP-R CoA-TRAY-R CoA-SBAG –R Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-04267 Rev. *T Page 12 of 24 44L -TQFP Pb-Free Package ASSEMBLY Site 3: Amkor Technology Seoul Korea Package Qualification Report # 034602 (See Note 1) I. DECLARATION OF PACKAGED UNITS A. BANNED SUBSTANCES Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this product. Substances / Compounds Cadmium and Cadmium Compounds Hexavalent Chromium and its Compounds Lead and Lead Compounds Mercury and Mercury Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) Asbestos Azo colorants Ozone Depleting Substances Polychlorinated Biphenyls (PCBs) Polychlorinated Napthalenes Radioactive Substances Shortchain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Formaldehyde Weight by mg PPM 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 0 0 0 0 0 0 0 0 0 0 Analysis Report (Note 2) CoA-AZ44Amkor Seoul As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-04267 Rev. *T Page 13 of 24 44L -TQFP Pb-Free Package B1. MATERIAL COMPOSITION (Note 3) Using C151 Leadframe Copper Alloy Material Purpose of Use Leadframe Base Material Lead Finish External Plating Die Attach Adhesive Die Wire Circuit Interconnect Mold Compound Encapsulation Substance Composition Cu Cr Sn Zn Ag Pure Sn Ag Epoxy Resin Anhydride Si Au Phenol Resin Epoxy Resin Silica Fused Carbon Black CAS Number Weight by mg 7440-50-8 7440-47-3 7440-31-5 7440-66-6 7440-22-4 7440-31-5 7440-22-4 Trade Secret Trade Secret 7440-21-3 7440-57-5 Trade Secret Trade Secret 60676-86-0 1333-86-4 75.6081 0.2307 0.1923 0.1538 0.7229 3.49 0.67 0.19 0.1 3.46 1.27 9.7934 10.4022 152.8847 0.8698 Package Weight (mg): % Weight of Substance per Homogeneous Material PPM 98.3200% 0.3000% 0.2500% 0.2000% 0.9400% 100.0000% 69.7900% 19.7900% 10.4200% 100.0000% 100.0000% 5.6300% 5.9800% 87.8900% 0.5000% 260.0379 290,758 887 739 591 2,780 13,421 2,576 731 385 13,306 4,884 37,661 40,003 587,933 3,345 % Total: % Weight of Substance per Package 29.0758% 0.0887% 0.0739% 0.0591% 0.2780% 1.3421% 0.2576% 0.0731% 0.0385% 1.3306% 0.4884% 3.7661% 4.0003% 58.7933% 0.3345% 100.0000 B2. MATERIAL COMPOSITION (Note 3) Using C194 Leadframe Copper Alloy Material Purpose of Use Leadframe Base Material Lead Finish External Plating Die Attach Adhesive Die Wire Circuit Interconnect Mold Compound Encapsulation Substance Composition Cu Fe P Zn Ag Pure Sn Ag Epoxy Resin Anhydride Si Au Epoxy Resin Silica Fused Carbon Black CAS Number 7440-50-8 7439-89-6 7723-14-0 7440-66-6 7440-22-4 7440-31-5 7440-22-4 Trade Secret Trade Secret 7440-21-3 7440-57-5 Trade Secret 60676-86-0 1333-86-4 Weight by mg 74.5270 1.7960 0.0230 0.0920 1.0400 3.5020 0.6710 0.1920 0.0960 3.4600 1.2740 19.9940 152.9940 0.8690 % Weight of Substance per Homogeneous Material 96.1912% 2.3181% 0.0297% 0.1187% 1.3423% 100.0000% 69.9687% 20.0209% 10.0104% 100.0000% 100.0000% 11.5003% 87.9999% 0.4998% PPM 286,059 6,894 88 353 3,992 13,442 2,576 737 368 13,281 4,890 76,744 587,241 3,335 % Weight of Substance per Package 28.6059% 0.6894% 0.0088% 0.0353% 0.3992% 1.3442% 0.2576% 0.0737% 0.0368% 1.3281% 0.4890% 7.6744% 58.7241% 0.3335% Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-04267 Rev. *T Page 14 of 24 44L -TQFP Pb-Free Package Package Weight (mg): 260.5300 % Total: 100.0000 II. DECLARATION OF PACKAGING INDIRECT MATERIALS Type Tape & Reel Tray Others Material Cover tape Carrier tape Plastic Reel Tray Shielding bag Moisture Barrier bag Protective Band Shipping and Inner Box Dessicant Bubble Pack Lead PPM Cadmium PPM Cr VI PPM Mercury PPM < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 Analysis Report (Note2) CoA-COVT-R CoA-CART-R CoA-PLRL-R PBB PPM PBDE PPM < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 <5.0 <5.0 <5.0 --------<5.0 <5.0 <5.0 <5.0 --------<5.0 < 2.0 < 2.0 <5.0 <5.0 CoA-MBBG-R < 2.0 < 2.0 < 2.0 <5.0 <5.0 CoA-PROB-R < 10.0 < 4.0 < 4.0 < 5.0 --------- ----------- CoA-ABOX-R < 10.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 1.0 < 2.0 < 3.0 < 100.0 < 3.0 < 90.0 CoA-DESS-R CoA-BUBP-R CoA-TRAY-R CoA-SBAG –R Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-04267 Rev. *T Page 15 of 24 44L -TQFP Pb-Free Package ASSEMBLY Site 4: Jiangsu Changjiang Electronics Technology (JCET) Package Qualification Report # 110901, 141302 (See Note 1) I. DECLARATION OF PACKAGED UNITS A. BANNED SUBSTANCES Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this product. Substances / Compounds Cadmium and Cadmium Compounds Hexavalent Chromium and its Compounds Lead and Lead Compounds Mercury and Mercury Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) Asbestos Azo colorants Ozone Depleting Substances Polychlorinated Biphenyls (PCBs) Polychlorinated Napthalenes Radioactive Substances Shortchain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Formaldehyde Weight by mg PPM 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 0 0 0 0 0 0 0 0 0 0 Analysis Report (Note 2) CoA-AZ44- JCET As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-04267 Rev. *T Page 16 of 24 44L -TQFP Pb-Free Package B. MATERIAL COMPOSITION (Note 3) B1.USING GOLD WIRE Material Leadframe Purpose of Use Base Material Lead Finish External Plating Die Attach Adhesive Die Wire Circuit Interconnect Mold Compound Encapsulation Substance Composition CAS Number Weight by mg % Weight of Substance per Homogeneous Material PPM % Weight of Substance per Package Cu 7440-50-8 92.9100 96.2000% 281,554 28.1554% Si 7440-21-3 0.6278 0.6500% 1,902 0.1902% Mg 7439-95-4 0.1449 0.1500% 439 0.0439% Ni Ni Pd Au Ag Bismaleimide Polymer Methacrylate Acylate ester Organic Peroxide Si Au SiO2 Phenol Resin Epoxy Resin 7440-02-0 7440-02-0 7440-05-3 7440-57-5 7440-22-4 Trade Secret Trade Secret Trade Secret Trade Secret Trade Secret 7440-21-3 7440-57-5 60676-86-0 Trade Secret Trade Secret 2.8974 2.3261 0.0419 0.0419 0.4160 0.0468 0.0260 0.0104 0.0104 0.0104 7.1900 6.7800 192.6939 10.8255 12.9906 3.0000% 96.5200% 1.7400% 1.7400% 80.0000% 9.0000% 5.0000% 2.0000% 2.0000% 2.0000% 100.0000% 100.0000% 89.0000% 5.0000% 6.0000% 8,780 7,049 127 127 1,261 142 79 32 32 32 21,789 20,546 583,939 32,806 39,367 0.8780% 0.7049% 0.0127% 0.0127% 0.1261% 0.0142% 0.0079% 0.0032% 0.0032% 0.0032% 2.1789% 2.0546% 58.3939% 3.2806% 3.9367% Package Weight (mg): 329.9900 % Total: 100.0000 Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-04267 Rev. *T Page 17 of 24 44L -TQFP Pb-Free Package B2.USING COPPER PALLADIUM WIRE Material Purpose of Use Leadframe Base Material Lead Finish External Plating Die Attach Adhesive Die Circuit Wire Interconnect Mold Compound Encapsulation Substance Composition Nickel Silicon Magnesium Silver Copper CAS Number 7440-02-0 7440-21-3 7439-95-4 7440-22-4 7440-50-8 Tin Silver Proprietary Bismaleimide Proprietary Polymer Methacrylate Acrylate Ester Organic Peroxide Silicon Copper Palladium Epoxy Resin A Epoxy Resin B Phenol Resin Silica(Amorphous) Carbon Black 7440-31-5 7440-22-4 Trade Secret Trade Secret Trade Secret Trade Secret Trade Secret 7440-21-3 7440-50-8 7440-05-3 Trade Secret Trade Secret Trade Secret 60676-86-0 1333-86-4 Package Weight (mg): Weight by mg 1.9800 0.4050 0.1350 2.0700 85.4100 12.2102 0.4160 0.0468 0.0260 0.0104 0.0104 0.0104 7.1900 1.4888 0.0264 6.5100 6.5100 10.8500 192.4790 0.6510 328.4354 % weight of substance per Homogeneous 2.2000% 0.4500% 0.1500% 2.3000% 94.9000% 100.0000% 80.0000% PPM 6,029 1,233 411 6,303 260,051 0.6029% 0.1233% 0.0411% 0.6303% 26.0051% 37,177 3.7177% 1,267 0.1267% 142 0.0142% 79 0.0079% 32 32 32 21,892 4,533 80 19,821 19,821 33,035 586,048 1,982 0.0032% 0.0032% 0.0032% 2.1892% 0.4533% 0.0080% 1.9821% 1.9821% 3.3035% 58.6048% 0.1982% % Total: 100.000 9.0000% 5.0000% 2.0000% 2.0000% 2.0000% 100.0000% 98.2600% 1.7400% 3.0000% 3.0000% 5.0000% 88.7000% 0.3000% %% Weight of Substance per package Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-04267 Rev. *T Page 18 of 24 44L -TQFP Pb-Free Package II. DECLARATION OF PACKAGING / INDIRECT MATERIALS Type Tape & Reel Tray Others Material Cover tape Carrier tape Plastic Reel Tray Shielding bag Moisture Barrier bag Protective Band Shipping and Inner Box Dessicant Bubble Pack Lead PPM < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 Cadmium PPM < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 Cr VI PPM < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 Mercury PPM < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 PBB PPM <5.0 <5.0 <5.0 --------<5.0 PBDE PPM <5.0 <5.0 <5.0 --------<5.0 Analysis Report (Note2) CoA-COVT-R CoA-CART-R CoA-PLRL-R < 2.0 < 2.0 < 2.0 < 2.0 <5.0 <5.0 CoA-MBBG-R < 2.0 < 2.0 < 2.0 < 2.0 <5.0 <5.0 CoA-PROB-R < 10.0 < 4.0 < 4.0 < 5.0 --------- ----------- CoA-ABOX-R < 10.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 1.0 < 2.0 < 3.0 < 100.0 < 3.0 < 90.0 CoA-DESS-R CoA-BUBP-R CoA-TRAY-R CoA-SBAG –R Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-04267 Rev. *T Page 19 of 24 44L -TQFP Pb-Free Package ASSEMBLY Site 5: Amkor Technology Philippines (ATP1) Package Qualification Report # 150202 (See Note 1) I. DECLARATION OF PACKAGED UNITS A. BANNED SUBSTANCES Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this product. Substances / Compounds Cadmium and Cadmium Compounds Hexavalent Chromium and its Compounds Lead and Lead Compounds Mercury and Mercury Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) Asbestos Azo colorants Ozone Depleting Substances Polychlorinated Biphenyls (PCBs) Polychlorinated Napthalenes Radioactive Substances Shortchain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Formaldehyde Weight by mg PPM 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 0 0 0 0 0 0 0 0 0 0 Analysis Report (Note 2) CoA-AZ44- ATP1 As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-04267 Rev. *T Page 20 of 24 44L -TQFP Pb-Free Package B. MATERIAL COMPOSITION (Note 3) Material Purpose of Use Base Material Leadframe Lead Finish External Plating Die Attach Adhesive Die Circuit Wire Interconnect Mold Compound Encapsulation Substance Composition CAS Number Weight by mg % Weight of Substance per Homogeneous Material PPM % Weight of Substance per Package Cu 7440-50-8 73.9229 96.1619% 215,986 21.5986% Fe 7439-89-6 1.8206 2.3683% 5,319 0.5319% Zn 7440-66-6 0.0910 0.1184% 266 0.0266% P Ag Sn 7723-14-0 7440-22-4 7440-31-5 0.0228 1.0161 3.5024 0.0296% 1.3218% 100.0000% 66 2,969 10,233 0.0066% 0.2969% 1.0233% Polymer 1,4Butanedioldiglycidyl Ether Phenolic Resin Ethylene glycol monobutyl ether acetate Silver Silicon Cu Pd Epoxy Resin A Epoxy Resin B Silica Fused Carbon Black Phenol Resin 9003-36-5 2425-79-8 0.2115 0.0385 11.0000% 2.0000% 618 112 0.0618% 0.0112% 9003-35-4 112-07-2 0.0385 0.0962 2.0000% 5.0000% 112 284 0.0112% 0.0284% 1.5384 8.9964 0.3488 0.0075 20.0485 5.0121 210.5094 1.2530 13.7834 80.0000% 100.0000% 97.8970% 2.1030% 8.0000% 2.0000% 84.0000% 0.5000% 5.5000% 4,495 26,285 1,019 22 58,577 14,644 615,060 3,661 40,272 0.4495% 2.6285% 0.1019% 0.0022% 5.8577% 1.4644% 61.5060% 0.3661% 4.0272% 7440-22-4 7440-21-3 7440-50-8 7440-05-3 Trade Secret Trade Secret 60676-86-0 1333-86-4 Trade Secret Package Weight (mg): 342.2580 % Total: 100.0000 Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-04267 Rev. *T Page 21 of 24 44L -TQFP Pb-Free Package II. DECLARATION OF PACKAGING / INDIRECT MATERIALS Type Tape & Reel Tray Others Material Cover tape Carrier tape Plastic Reel Tray Shielding bag Moisture Barrier bag Protective Band Shipping and Inner Box Dessicant Bubble Pack Lead PPM < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 Cadmium PPM < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 Cr VI PPM < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 Mercury PPM < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 PBB PPM <5.0 <5.0 <5.0 --------<5.0 PBDE PPM <5.0 <5.0 <5.0 --------<5.0 Analysis Report (Note2) CoA-COVT-R CoA-CART-R CoA-PLRL-R < 2.0 < 2.0 < 2.0 < 2.0 <5.0 <5.0 CoA-MBBG-R < 2.0 < 2.0 < 2.0 < 2.0 <5.0 <5.0 CoA-PROB-R < 10.0 < 4.0 < 4.0 < 5.0 --------- ----------- CoA-ABOX-R < 10.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 1.0 < 2.0 < 3.0 < 100.0 < 3.0 < 90.0 CoA-DESS-R CoA-BUBP-R CoA-TRAY-R CoA-SBAG –R Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-04267 Rev. *T Page 22 of 24 44L -TQFP Pb-Free Package Document History Page Document Title: Document Number: Rev. 44L-TQFP PB-FREE PACKAGE MATERIAL DECLARATION DATASHEET 001-04267 ** *A *B *C ECN No. Orig. of Change 390185 GFJ 391439 GFJ 399136 GFJ 401531 GFJ *D 2247127 MAHA *E 2677622 HLR *F 2767274 MAHA *G 2882692 HLR *H 3375125 HLR *I 3561356 EBZ *J 3657419 COPI Description of Change New document Changed of material composition (updating the leadframe used). Additional assembly site with different materials used. Added Package weight in site 3 and word “PMDD”. Change the word from two to three in summary of qualified assembly sites. Deleted error existing link in assembly site 1 & 2 under section 1-A – Analysis report. Added assembly site 3 1. Updated Cypress logo. 2. Changed QTP# 034101 to 034602 for assembly site 3. 3. Added “% weight of substance per Homogenous Material” and “% Weight of Substance per Package” on the Material Composition table. 4. Completed the RoHS Substances namely: Lead, Cadmium, Mercury, Chromium VI, PBB and PBDE on Declaration of Packaging Indirect Materials table. 5. Deleted inactive bookset CML and change it to WEB in the distribution list. Added CAS Number of Antimony Trioxide. Changed CAS Number of Gold. Added the following for assembly site 1: a. Added package weight for B2. b. CoA-AZ44-R1 c. Added reference QTP 062603. d. Added material composition table for NiPdAu using green mold compound. Added CAS Number for Silica Fused and Carbon Black on Assembly Site 3. Added Assembly Site 4 – JCET Updated the material composition table to reflect 4 decimal places on values. Added package weight B2 for Site 2. Added Material Composition table B2 using copper wire material for Site 2. Added reference QTP #120103 for Site 2. Changed QTP reference # 120103 to QTP # 120201 in Assembly Site 2. Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-04267 Rev. *T Page 23 of 24 44L -TQFP Pb-Free Package Document History Page Document Title: Document Number: Rev. 44L-TQFP PB-FREE PACKAGE MATERIAL DECLARATION DATASHEET 001-04267 ECN No. Orig. of Change *K *L 3978911 HLR 4031297 YUM *M 4102877 AWP HLR *N 4340124 HLR *O 4399451 HLR *P 4404991 REYD *Q 4632520 ZJL *R 4677869 VFR *S 4897115 MRB *T 5268684 Description of Change Added 1.0mm thick package using cu wire in B2 and Added B3 1.4mm thick package using cu wire. Removed Tube specification on Indirect Materials tables. Added Assembly site name in the Assembly heading. Changed Assembly Code to Assembly Site Name. Added on Site 1- CML:B3 – 335.5330 gm and QTP 133102 on the topmost table and added new Table B3. Using Green Mold Compound with Copper-Palladium (Cu-Pd) wire at Autoline (reference QTP#133102) Changed/corrected the Total Package Weight for Assembly Site 1. B1 and Assembly Site 3. Added B4 Material Composition for Assembly Site 2 in reference to QTP No. 123808. Added B5 Material Composition for Assembly Site 2 in reference to QTP No. 141404 (CuPd Bonding Wire) Added B2 on Package Weight and QTP # 141302 under Site 4. Added subsections B1.USING GOLD WIRE and B2.USING COPPER PALLADIUM WIRE under Assembly Site 4 Added item B2 Material Composition for Site 3 Amkor Korea using C194 leadframe. Added PMDD for Assembly Site 5 – Amkor Technology Philippines under QTP # 150202 Added reference Package QTP # 141404 for CuPd wire on Assembly site 2_B5 MEL Removed Distribution: WEB and Posting: None from the document history page HLR Changed the substances with “------------- “and Proprietary to “Trade Secret. Changed Cypress Logo. Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-04267 Rev. *T Page 24 of 24