Material Declaration Datasheet (MDDS) - FBGA064 (LAA064) - BKK - Au Wire - Non Pb Free.pdf

Package Chemistry Substances Analysis Table
Package Type:
Dimension:
Weight of Unit Package:
Temperature rating:
MSL:
Assembly Location:
Description
Silicon Die
Bond wire
0.9 mil
Die Attach
Substrate
Mold compound
Solder ball
LAA 064 (SnPb solder balls)
13 x 11 mm
270 mg
260°C
3
BKK
Product is NOT RoHS Compliant
Chemicals Present
#1 Silicon
subtotal
#1 Gold
subtotal
#1 Epoxy resin
#2 Polytetrafluoroethylene
subtotal
#1 Brominated Epoxy Resins
#2 Copper
#3 Gold
#4 Nickel
#5 Epoxy resin
#6 Silica
#7 SiO2 Glass Cloth
subtotal
#1 Silica (fused)
#2 Carbon Black
#3 Epoxy resin
#4 Phosphoric organic catalyst
subtotal
#1 Tin
#2 Lead
subtotal
CAS Number unit weight(mg)
7440-21-3
8.5899
8.5899
7440-57-5
0.5697
0.5697
Trade Secret
0.1331
9002-84-0
0.1089
0.2419
Trade Secret
5.5580
7440-50-8
22.3279
7440-57-5
0.3395
7440-02-0
1.5655
Trade Secret
23.9026
14808-60-7
4.7029
65997-17-3
20.5219
78.9184
60676-86-0
114.6114
1333-86-4
0.2590
Trade Secret
13.9865
Trade Secret
0.6475
129.5044
7440-31-5
32.7762
7439-92-1
19.2495
52.0256
TOTAL PACKAGE
269.8500
unit weight/package (%)
3.1832
3.1832
0.2111
0.2111
0.0493
0.0403
0.0897
2.0597
8.2742
0.1258
0.5801
8.8577
1.7428
7.6049
29.2453
42.4723
0.0960
5.1831
0.2400
47.9913
12.1461
7.1334
19.2795
100.0000
Amount (ppm)
31,832
31,832
2,111
2,111
493
403
897
20,597
82,742
1,258
5,801
88,577
17,428
76,049
292,453
424,723
960
51,831
2,400
479,913
121,461
71,334
192,795
1,000,000
Disclaimer:
In general, four decimal values are shown. However, some varience remains from package to package. The mass values presented are thought to be
accurate to within 20 percent. The report does not include materials not intentionally added to our products (impurities), or material concentrations
less than 1 ppm.
Document No. 002-12940 Rev. **
Page 1 of 2
CYPRESS
Company Confidential
Document History Page
Document Title:
Material Declaration Datasheet (MDDS) - FBGA064 (LAA064) - BKK - Au Wire - Non Pb Free
Document Number: 002-12940
Rev.
**
ECN No. Orig. of Description of Change
Change
5268246 AAC
Initial Release.
Document No. 002-12940 Rev. **
Page 2 of 2
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