Package Chemistry Substances Analysis Table Package Type: Dimension: Weight of Unit Package: Temperature rating: MSL: Assembly Location: Description Silicon Die Bond wire 0.9 mil Die Attach Substrate Mold compound Solder ball LAA 064 (SnPb solder balls) 13 x 11 mm 270 mg 260°C 3 BKK Product is NOT RoHS Compliant Chemicals Present #1 Silicon subtotal #1 Gold subtotal #1 Epoxy resin #2 Polytetrafluoroethylene subtotal #1 Brominated Epoxy Resins #2 Copper #3 Gold #4 Nickel #5 Epoxy resin #6 Silica #7 SiO2 Glass Cloth subtotal #1 Silica (fused) #2 Carbon Black #3 Epoxy resin #4 Phosphoric organic catalyst subtotal #1 Tin #2 Lead subtotal CAS Number unit weight(mg) 7440-21-3 8.5899 8.5899 7440-57-5 0.5697 0.5697 Trade Secret 0.1331 9002-84-0 0.1089 0.2419 Trade Secret 5.5580 7440-50-8 22.3279 7440-57-5 0.3395 7440-02-0 1.5655 Trade Secret 23.9026 14808-60-7 4.7029 65997-17-3 20.5219 78.9184 60676-86-0 114.6114 1333-86-4 0.2590 Trade Secret 13.9865 Trade Secret 0.6475 129.5044 7440-31-5 32.7762 7439-92-1 19.2495 52.0256 TOTAL PACKAGE 269.8500 unit weight/package (%) 3.1832 3.1832 0.2111 0.2111 0.0493 0.0403 0.0897 2.0597 8.2742 0.1258 0.5801 8.8577 1.7428 7.6049 29.2453 42.4723 0.0960 5.1831 0.2400 47.9913 12.1461 7.1334 19.2795 100.0000 Amount (ppm) 31,832 31,832 2,111 2,111 493 403 897 20,597 82,742 1,258 5,801 88,577 17,428 76,049 292,453 424,723 960 51,831 2,400 479,913 121,461 71,334 192,795 1,000,000 Disclaimer: In general, four decimal values are shown. However, some varience remains from package to package. The mass values presented are thought to be accurate to within 20 percent. The report does not include materials not intentionally added to our products (impurities), or material concentrations less than 1 ppm. Document No. 002-12940 Rev. ** Page 1 of 2 CYPRESS Company Confidential Document History Page Document Title: Material Declaration Datasheet (MDDS) - FBGA064 (LAA064) - BKK - Au Wire - Non Pb Free Document Number: 002-12940 Rev. ** ECN No. Orig. of Description of Change Change 5268246 AAC Initial Release. Document No. 002-12940 Rev. ** Page 2 of 2