QTP 104407:AUTOMOTIVE PSOC KRYPTON CY8C20566A DEVICE FAMILY, S8DIN-5RP TECHNOLOGY, FAB4

Document No. 001-71957 Rev. *B
ECN #: 4502537
Cypress Semiconductor Automotive
Product Qualification Report
QTP# 104407 VERSION*B
September, 2014
Automotive PSoC Device Family
S8DIN-5RP Technology, Fab4
CY8C20566A Automotive Capsense(R) Applications
CY8C20236A Automotive Capsense(R) Applications
FOR ANY QUESTIONS ON THIS REPORT, PLEASE CONTACT
[email protected] or via a CYLINK CRM CASE
Prepared By:
Josephine Pineda
Reliability Engineer
Reviewed By:
Rene Rodgers
Reliability Manager
Approved By:
Richard Oshiro
Reliability Director
Company Confidential
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Page 1 of 10
Document No. 001-71957 Rev. *B
ECN #: 4502537
PRODUCT QUALIFICATION HISTORY
Qual
Report
104407
Description of Qualification Purpose
Qualification of Automotive SONOS S8 Technology in FAB4 using 8A20x66E Device
Company Confidential
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Page 2 of 10
Date
Comp
Jul 11
Document No. 001-71957 Rev. *B
ECN #: 4502537
PRODUCT DESCRIPTION (for qualification)
Qualification Purpose: Qualify CY8C20566A Automotive Device at Fab 4, S8DIN-5RP Technology
CY8C20566A-12PVXE, CY8C20566A-24PVXA, CY8C20566A-12PVXA,
Marketing Part #:
CY8C20236A-24LKXA
Device Description:
Automotive PSOC Programmable System – On – Chip
Cypress Division:
Cypress Semiconductor Corporation – Programmable System Division
TECHNOLOGY/FAB PROCESS DESCRIPTION – S8DIN-5RP
Number of Metal Layers:
3
Metal
Composition:
Metal 1: 100ª Ti / 3200ª Al 0.5% Cu / 300 A TiW
Metal 2: 100ª Ti / 3200ª Al 0.5% Cu / 300 A TiW
Metal 3: 500ª TiW / 21250ª Al 0.5% Cu / 300 A TiW
Passivation Type and Materials:
700A TEOS / 5400A Si3N4
Generic Process Technology/Design Rule (µ-drawn): 1P3M, 0.13 um
Gate Oxide Material/Thickness (MOS):
120Å SiO2/ 32Å SiO2
Name/Location of Die Fab (prime) Facility:
CMI / Minnesota
Die Fab Line ID/Wafer Process ID:
Fab4, S8DIN-5RP
PACKAGE AVAILABILITY
PACKAGE
ASSEMBLY FACILITY SITE
48L SSOP
CML-R
16L QFN (Chip-on-Lead)
Amkor-L (Korea)
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Page 3 of 10
Document No. 001-71957 Rev. *B
ECN #: 4502537
MAJOR PACKAGE INFORMATION USED IN THIS QUALIFICATION
Package Designation:
SP48
Package Outline, Type, or Name:
48-Lead Shrunk Small Outline Package (SSOP)
Mold Compound Name/Manufacturer:
Kyocera KEG3000
Mold Compound Flammability Rating:
V-0 PER UL-94
Mold Compound Alpha Emission Rate:
0.002 CPH/cm2
Oxygen Rating Index:
N/A
Lead Frame Material:
Copper
Lead Finish, Composition / Thickness:
NiPdAu
Die Backside Preparation Method/Metallization:
Backgrind
Die Separation Method:
100% Saw
Die Attach Supplier:
Henkel
Die Attach Material:
QMI 509
Die Attach Method:
Epoxy
Bond Diagram Designation:
001-61640
Wire Bond Method:
Thermosonic
Wire Material/Size:
Au, 1.0 mil
Thermal Resistance Theta JA °C/W:
101 °C/W
Package Cross Section Yes/No:
No
Assembly Process Flow:
001-62661
Name/Location of Assembly (prime) facility:
CML-R
MSL Level
3
Reflow Profile
260C
ELECTRICAL TEST / FINISH DESCRIPTION
Test Location:
CML-R
Note: Please contact a Cypress Representative for other packages availability.
Company Confidential
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Page 4 of 10
Document No. 001-71957 Rev. *B
ECN #: 4502537
RELIABILITY TESTS PERFORMED PER SPECIFICATION REQUIREMENT
Stress/Test
High Temperature Operating Life
Early Failure Rate
High Temperature Operating Life
Latent Failure Rate
NVM Endurance /High
Temperature Operating Life Latent
Failure Rate
Test Condition
(Temp/Bias)
AEC-Q100-008 and JESD22-A108, 150°C
Dynamic Operating Condition, Vcc Max = 2.1V
JESD22-A108, 150°C
Dynamic Operating Condition, Vcc Max = 2.1V
AEC-Q100-005 and JESD22-A108, 150°C
Dynamic Operating Condition, Vcc Max = 2.1V
High Accelerated Saturation Test
(HAST)
JESD22-A110, 130°C, 5.25V, 85%RH
Precondition: JESD22-A113 Moisture Sensitivity MSL 3
(192 Hrs., 30°C, 60% RH, 260°C Reflow)
Temperature Cycle
JESD22-A104, -65°C to 150°C
Precondition: JESD22-A113 Moisture Sensitivity MSL 3
(192 Hrs., 30°C, 60% RH, 260°C Reflow)
JESD22-A102, 121°C, 100%RH, 15 Psig
Precondition: JESD22-A113 Moisture Sensitivity MSL 3
(192 Hrs., 30°C, 60% RH, 260°C Reflow)
Pressure Cooker
Result
P/F
P
P
P
P
P
P
Electrostatic Discharge
Human Body Model (ESD-HBM)
AEC-Q100-002
500V/1000V/1500V/2000V
P
Electrostatic Discharge
Charge Device Model (ESD-CDM)
AEC-Q100-011
250V/500V
P
Wire Ball Shear
AEC-Q100-001
P
Wire Bond Pull
Mil-Std 883, Method 2011
P
Electrical Distribution
AEC-Q100-009
P
NVM Endurance/Data Retention
AEC-Q100-005, 150°C, non-biased
P
Final Visual
JESD22-B101
P
Physical Dimensions
JESD22-B100/108
P
Solderability
JESD22-B102
P
Static Latch-up
AEC-Q100-004, 125C,± 140mA
Dye Penetrant Test
Test to determine the existence and extent of cracks,
Criteria: No Package Crack
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Page 5 of 10
P
P
Document No. 001-71957 Rev. *B
ECN #: 4502537
RELIABILITY FAILURE RATE SUMMARY
Stress/Test
High Temperature Operating Life Early
Failure Rate
NVM Endurance / High Temperature
1,2
Operating Life Long Term Failure Rate
Device Tested/
Device Hours
#
Fails
Activation
Energy
Thermal
AF3
Failure
Rate
10,982 Devices
0
N/A
N/A
0 PPM
207,360 Device Hours
0
0.7
170
26 FIT
1
Assuming an ambient temperature of 55°C and a junction temperature rise of 15°C.
Chi-squared 60% estimations used to calculate the failure rate..
3
Thermal Acceleration Factor is calculated from the Arrhenius equation
2
E  1 1  
AF = exp  A  -  
 k  T 2 T1  
where:
EA =The Activation Energy of the defect mechanism.
-5
K = Boltzmann’s constant = 8.62x10 eV/Kelvin.
T1 is the junction temperature of the device under stress and T2 is the junction temperature of the device at
use conditions.
Company Confidential
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Page 6 of 10
Document No. 001-71957 Rev. *B
ECN #: 4502537
Reliability Test Data
QTP #:
Device
104407
Fab Lot #
Assy Lot #
Assy Loc
Duration
Samp
Rej
CY8C20566A (8ª205662A)
4944970
611053462
CML-R
COMP
15
0
CY8C20566A (8ª205662A)
4028092
611053460
CML-R
COMP
15
0
CY8C20566A (8ª205662A)
4021040
611053459
CML-R
COMP
15
0
4944970
611053462
CML-R
COMP
30
0
4944970
611053462
CML-R
COMP
30
0
611053462
CML-R
COMP
5
0
Failure Mechanism
STRESS: ACOUSTICS
STRESS: BALL SHEAR
CY8C20566A (8ª205662A)
STRESS: BOND PULL
CY8C20566A (8ª205662A)
STRESS: CONSTRUCTIONAL ANALYSIS
CY8C20566A (8ª205662A)
4944970
STRESS: DYE PENETRANT TEST
CY8C20566A (8ª205662A)
4944970
611053462
CML-R
COMP
15
0
CY8C20566A (8ª205662A)
4028092
611053460
CML-R
COMP
15
0
CY8C20566A (8ª205662A)
4021040
611053459
CML-R
COMP
15
0
STRESS: ELECTRICAL DISTRIBUTION
CY8C20566A (8ª205662A)
4944970
611053462
CML-R
COMP
30
0
CY8C20566A (8ª205662A)
4028092
611053460
CML-R
COMP
30
0
CY8C20566A (8ª205662A)
4021040
611053459
CML-R
COMP
30
0
CML-R
COMP
3
0
CML-R
COMP
3
0
COMP
3
0
COMP
3
0
COMP
3
0
COMP
3
0
STRESS: ESD-CHARGE DEVICE MODEL, 250V
CY8C20566A (8ª205662A)
4944970
611053462
STRESS: ESD-CHARGE DEVICE MODEL, 500V
CY8C20566A (8A205662A)
4944970
611053462
STRESS: ESD-HUMAN BODY CIRCUIT PER JESD22-A114, 500V
CY8C20566A (8ª205662A)
4944970
611053462
CML-R
STRESS: ESD-HUMAN BODY CIRCUIT PER JESD22-A114, 1,000V
CY8C20566A (8ª205662A)
4944970
611053462
CML-R
STRESS: ESD-HUMAN BODY CIRCUIT PER JESD22-A114, 1,500V
CY8C20566A (8ª205662A)
4944970
611053462
CML-R
STRESS: ESD-HUMAN BODY CIRCUIT PER JESD22-A114, 2,000V
CY8C20566A (8ª205662A)
4944970
611053462
CML-R
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Page 7 of 10
Document No. 001-71957 Rev. *B
ECN #: 4502537
Reliability Test Data
QTP #:
Device
Fab Lot #
Assy Lot #
104407
Assy Loc
Duration
Samp
Rej
Failure Mechanism
STRESS: HI-ACCEL SATURATION TEST, 130C, 85%RH, 5.25V, PRE COND 192 HR 30C/60%RH, MSL3
CY8C22345 (8A22345AK)
4932232
610931673
CML-RA
96
80
0
CY8C22345 (8A22345AK)
4934794
610932830
CML-RA
96
80
0
CY8C22345 (8A22345AK)
4942780
610942047
CML-RA
96
80
0
1000
80
0
STRESS: HIGH TEMPERATURE STORAGE LIFE TEST, 150C
CY8C20566A (8A205662A)
4944970
611053462
CML-RA
STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-EARLY FAILURE RATE, 150C, 2.1V, Vcc Max
CY8C20566A (8ª205662A)
4944970
611053462
CML-RA
24
3613
0
CY8C20566A (8ª205662A)
4028092
611053460
CML-RA
24
3680
0
CY8C20566A (8A205662A)
4021040
611053459
CML-RA
24
3689
0
STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-LATENT FAILURE RATE, 150C, 2.1V, Vcc Max
CY8C20566A (8ª205662A)
4944970
611053462
CML-RA
432
80
0
CY8C20566A (8ª205662A)
4028092
611053460
CML-RA
432
80
0
CY8C20566A (8A205662A)
4021040
611053459
CML-RA
432
80
0
STRESS: NVM ENDURANCE / HIGH TEMP DYNAMIC OPERATING LIFE-LATENT FAILURE RATE, 150C, 2.1V, Vcc Max
CY8C20566A (8ª205662A)
4944970
611053462
CML-RA
432
80
0
CY8C20566A (8ª205662A)
4028092
611053460
CML-RA
432
80
0
CY8C20566A (8A205662A)
4021040
611053459
CML-RA
432
80
0
STRESS: NVM ENDURANCE / DATA RETENTION TEST
CY8C20566A (8ª205662A)
4944970
611053462
CML-R
1000
80
0
CY8C20566A (8ª205662A)
4028092
611053460
CML-R
1000
80
0
CY8C20566A (8ª205662A)
4021040
611053459
CML-R
1000
80
0
STRESS: PHYSICAL DIMENSION
CY8C20566A (8ª205662A)
4944970
611053462
CML-R
COMP
10
0
CY8C20566A (8ª205662A)
4028092
611053460
CML-R
COMP
10
0
CY8C20566A (8ª205662A)
4021040
611053459
CML-R
COMP
10
0
CML-R
COMP
5
0
STRESS: POST TEMPERATURE CYCLE WIRE BOND PULL
CY8C20566A (8ª205662A)
4944970
611053462
Company Confidential
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Page 8 of 10
Document No. 001-71957 Rev. *B
ECN #: 4502537
Reliability Test Data
QTP #:
Device
Fab Lot #
Assy Lot #
104407
Assy Loc
Duration
Samp
Rej
Failure Mechanism
STRESS: PRESSURE COOKER TEST, 121C, 100%RH, 15 Psig, PRE COND 192 HR 30C/60%RH, MSL3
CY8C20566A (8ª205662A)
4944970
611053462
CML-RA
96
80
0
CY8C20566A (8ª205662A)
4944970
611053462
CML-RA
168
80
0
CY8C20566A (8ª205662A)
4028092
611053460
CML-RA
96
80
0
CY8C20566A (8ª205662A)
4028092
611053460
CML-RA
168
80
0
CY8C20566A (8ª205662A)
4021040
611053459
CML-RA
96
80
0
CY8C20566A (8A205662A)
4021040
611053459
CML-RA
168
80
0
STRESS: TC COND. C -65C TO 150C, PRE COND 192 HRS 30C/60%RH, MSL3
CY8C20566A (8ª205662A)
4944970
611053462
CML-R
500
85
0
CY8C20566A (8ª205662A)
4028092
611053460
CML-R
500
80
0
CY8C20566A (8A205662A)
4021040
611053459
CML-R
500
80
0
CY8C20566A (8ª205662A)
4944970
611053462
CML-R
COMP
15
0
CY8C20566A (8ª205662A)
4028092
611053460
CML-R
COMP
15
0
CY8C20566A (8ª205662A)
4021040
611053459
CML-R
COMP
15
0
CML-R
COMP
6
0
STRESS: SOLDERABILITY
STRESS: STATIC LATCH-UP TESTING, +/140mA
CY8C20566A (8ª205662A)
4944970
611053462
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Page 9 of 10
Document No. 001-71957 Rev. *B
ECN #: 4502537
Document History Page
Document Title:
QTP 104407: AUTOMOTIVE PSOC KRYPTON CY8C20566A DEVICE FAMILY, S8DIN-5RP
TECHNOLOGY, FAB4
Document Number:
001-71957
Rev. ECN
No.
Orig. of
Change
Description of Change
**
*A
3336771
3556418
NSR
NSR
*B
4502537 JYF
Initial spec release
Added CY8C20236A and 16L QFN (Chip-on-Lead) package from Amkor-L.
Remove QTP Version 1.0.
Sunset review:
Updated QTP title page and Reliability Tests Performed table
( PCT, TCT, HAST, DPT, FVI, Static Latch-Up) for template alignment;
Updated division of the device from MPD to PSD.
Distribution: WEB
Posting:
None
Company Confidential
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Page 10 of 10