Document No. 002-11632 Rev. *A ECN #: 5178588 Cypress Semiconductor Product Qualification Report QTP# 161003 VERSION ** March 2016 CCG1 Device Family S8PF-10R, Fab 25 CYPD1103** CYPD1104** CYPD1105** CYPD1120** CYPD1121** USB Type-C Port Controller with Power Delivery CYPD1122** CYPD1131** CYPD1132** CYPD1134** FOR ANY QUESTIONS ON THIS REPORT, PLEASE CONTACT [email protected] or via a CYLINK CRM CASE Prepared By: Josephine Pineda (JYF) Sr. Reliability Engineer Reviewed By: Rene Rodgers (RT) Sr. MTS Reliability Engineer Approved By: Don Darling Reliability Director (DCDA) Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 1 of 15 Document No. 002-11632 Rev. *A ECN #: 5178588 PRODUCT QUALIFICATION HISTORY QTP Number Description of Qualification Purpose Date 151008 Qualification of S8* Technology in Fab 25 using TSG6M Device Dec. 2015 161003 Qualification of CCG1 Device in Fab 25 using S8PF-10R Technology Mar. 2016 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 2 of 15 Document No. 002-11632 Rev. *A ECN #: 5178588 PRODUCT DESCRIPTION (for qualification) Qualification Purpose: To qualify CCG1 device in Fab 25 using S8PF-10R technology Device Description: CYPD1103**/ CYPD1104**/ CYPD1105**/CYPD1120**/CYPD1121**/ CYPD1122**/ CYPD1131**/ CYPD1132**/ CYPD1134** USB Type-C Port Controller with Power Delivery Cypress Division: Cypress Semiconductor Corporation – Data Communication Division Marketing Part #: TECHNOLOGY/FAB PROCESS DESCRIPTION 5 Number of Metal Layers: Metal 1: 150A Ti/ 250 Ti/TiN / 3200Al-0.5%Cu / 500A Ti/TiN Metal 2: 150A Ti/ 250 Ti/TiN / 3200Al-0.5%Cu / 500A Ti/TiN Metal 3: 150A Ti/ 250 Ti/TiN / 7200Al-0.5%Cu / 500A Ti/TiN Metal 4:150A Ti/ 250 Ti/TiN / 7200Al-0.5%Cu / 500A Ti/TiN Metal 5: 150A Ti/ 250 Ti/TiN / 12000Al-0.5%Cu / 500A Ti/TiN 1KA NFUXOX / 6KA Nitride Metal Composition: Passivation Type and Thickness: Generic Process Technology/Design Rule (-drawn): S8 / 0.13u Gate Oxide Material/Thickness (MOS): 32Å / 110 Å SiO2 Name/Location of Die Fab (prime) Facility: Cypress, Fab 25 Die Fab Line ID/Wafer Process ID: Fab 25 / S8PF-10P ALTERNATIVE FAB FACILITY SITE FAB SITE LOCATION QTP NUMBER Cypress CMI Fab4 Minnesota , USA QTP# 151304 PACKAGE AVAILABILITY ASSEMBLY FACILITY SITE WIRE MATERIAL QTP NUMBER CML-RA Au QTP# 150801 UTL-Thailand CuPd QTP# 152303 40L QFN CML-RA CuPd QTP# 151904 35-Ball WLCSP DT-Philippines - QTP# 144402 FAB SITE 16L SOIC (150 mils) Company Confidential A printed copy of this document is considered uncontrolled. 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Page 3 of 15 Document No. 002-11632 Rev. *A ECN #: 5178588 MAJOR PACKAGE INFORMATION USED IN THIS QUALIFICATION Package Designation: Package Outline, Type, or Name: Mold Compound Name/Manufacturer: SZ161 16L SOIC (150 mils) KE-G3000DA/Kyocera Mold Compound Flammability Rating: UL-94 V-0 Oxygen Rating Index: >28% 54% Leadframe Designation FMP Lead Frame Material: Copper Lead Finish, Composition / Thickness: NiPdAu Die Backside Preparation Method/Metallization: Backgrind Die Separation Method: Saw Die Attach Supplier: Henkel Die Attach Material: QMI 519 Bond Diagram Designation: 001-95720 Wire Bond Method: Thermosonic Wire Material/Size: Au/ 0.8 mil Thermal Resistance Theta JA °C/W: 85°C/W Package Cross Section Yes/No: No Assembly Process Flow: 11-21099 Name/Location of Assembly (prime) facility: CML-RA MSL Level 3 Reflow Profile 260C ELECTRICAL TEST / FINISH DESCRIPTION Test Location: CML-RA Company Confidential A printed copy of this document is considered uncontrolled. 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Page 4 of 15 Document No. 002-11632 Rev. *A ECN #: 5178588 MAJOR PACKAGE INFORMATION USED IN THIS QUALIFICATION Package Designation: Package Outline, Type, or Name: Mold Compound Name/Manufacturer: SZ161 16L SOIC (150 mils) EME-G605/Sumitomo Mold Compound Flammability Rating: UL-94 V-0 Oxygen Rating Index: >28% 54% Leadframe Designation FMP Lead Frame Material: Copper Lead Finish, Composition / Thickness: NiPdAu-Ag Die Backside Preparation Method/Metallization: Backgrind Die Separation Method: Saw Die Attach Supplier: Henkel Die Attach Material: 8200T Bond Diagram Designation: 001-97694 Wire Bond Method: Thermosonic Wire Material/Size: CuPd/ 0.8 mil Thermal Resistance Theta JA °C/W: 85°C/W Package Cross Section Yes/No: No Assembly Process Flow: 001-85398 Name/Location of Assembly (prime) facility: UTL- Thailand (UT) MSL Level 3 Reflow Profile 260C ELECTRICAL TEST / FINISH DESCRIPTION Test Location: CML-RA Company Confidential A printed copy of this document is considered uncontrolled. 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Page 5 of 15 Document No. 002-11632 Rev. *A ECN #: 5178588 MAJOR PACKAGE INFORMATION USED IN THIS QUALIFICATION Package Designation: Package Outline, Type, or Name: Mold Compound Name/Manufacturer: LQ40A 40L Quad Flat No Lead (6x6x0.6mm) 7470LA/Nitto Mold Compound Flammability Rating: UL-94 V-0 Oxygen Rating Index: >28% 54% Leadframe Designation FMP Lead Frame Material: Copper Lead Finish, Composition / Thickness: NiPdAu Die Backside Preparation Method/Metallization: Backgrind Die Separation Method: Saw Die Attach Supplier: Henkel Die Attach Material: QMI 519 Bond Diagram Designation: 001-72734 Wire Bond Method: Thermosonic Wire Material/Size: CuPd/ 0.8 mil Thermal Resistance Theta JA °C/W: 15.34°C/W Package Cross Section Yes/No: Yes Assembly Process Flow: 11-21099 Name/Location of Assembly (prime) facility: CML-RA MSL Level 3 Reflow Profile 260C ELECTRICAL TEST / FINISH DESCRIPTION Test Location: CML-RA Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 6 of 15 Document No. 002-11632 Rev. *A ECN #: 5178588 MAJOR PACKAGE INFORMATION USED IN THIS QUALIFICATION Package Designation: Package Outline, Type, or Name: FN35A 35-Ball Wafer Level Chip Scale Package (WLCSP) (3.23 x 2.10 x 0.55mm) Die Backside Preparation Method: Backgrind Die Separation Method: Saw Solder Ball/Bump Material: SAC405 Bonding Method: Bump/ RDL Bond Diagram Designation: 001-95722 Thermal Resistance Theta JA °C/W: 28°C/W Package Cross Section Yes/No: N/A Assembly Process Flow: 001-69882 Name/Location of Assembly (prime) facility: DT-Philippines MSL Level 1 Reflow Profile 260C ELECTRICAL TEST / FINISH DESCRIPTION Test Location: DT-Philippines Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 7 of 15 Document No. 002-11632 Rev. *A ECN #: 5178588 RELIABILITY TESTS PERFORMED PER SPECIFICATION REQUIREMENTS Stress/Test Test Condition (Temp/Bias) Result P/F Acoustic Microscopy J-STD-020 Precondition: JESD22 Moisture Sensitivity Level (192 Hrs., 30 C, 60% RH, 260C Reflow) P Data Retention 150°C, No Bias JESD22-A117 and JESD22-A103 P Electrostatic Discharge Charge Device Model (ESD-CDM) 500V/750V/1,000V/1,250V/1,500V/1,750V/2,000V JESD22-C101 P Electrostatic Discharge Human Body Model (ESD-HBM) 1,100V/2,200V /3,300V/4,000V/5,000V JESD22, Method A114 P Endurance Test MIL-STD-883, Method 883-1033/ JESD22-A117 P High Accelerated Saturation Test (HAST) JEDEC STD 22-A110: 130°C, 85% RH, 5.5V Precondition: JESD22 Moisture Sensitivity Level (192 Hrs., 30 C, 60% RH, 260C Reflow) P High Temperature Operating Life Early Failure Rate Dynamic Operating Condition, Vcc Max=2.07V, 150°C JESD22-A-108 P High Temperature Operating Life Latent Failure Rate Dynamic Operating Condition, Vcc Max=2.07V, 150°C JESD22-A-108 P Low Temperature Operating Life Dynamic Operating Condition, -40°C JESD22-A108 P Pressure Cooker JESD22-A102:121°C /100%RH, 15 PSIG Precondition: JESD22 Moisture Sensitivity Level (192 Hrs., 30 C, 60% RH, 260C Reflow) P SEM Analysis MIL-STD-883, Method 2018 P Static Latch-up Temperature Cycle 85C, +/-140mA, +/-200mA, +/- 300mA 125C, +/-140mA JESD 78 MIL-STD-883, Method 1010, Condition C, -65°C to 150°C Precondition: JESD22 Moisture Sensitivity Level (192 Hrs., 30 C, 60% RH, 260C Reflow) Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 8 of 15 P P Document No. 002-11632 Rev. *A ECN #: 5178588 RELIABILITY FAILURE RATE SUMMARY Stress/Test Device Tested/ Device Hours # Fails Activation Energy Thermal AF3 Failure Rate High Temperature Operating Life Early Failure Rate 1,510 Devices 0 N/A N/A 0 PPM 1 High Temperature Operating Life Long Term Failure Rate 178,000 0 0.7 170 30 FIT 2 1. 2. Early Failure Rate was computed from QTP# 161003. Long Term Failure Rate was computed from QTP# 151008 and QTP# 161003. 1 2 3 Assuming an ambient temperature of 55C and a junction temperature rise of 15C. Chi-squared 60% estimations used to calculate the failure rate. Thermal Acceleration Factor is calculated from the Arrhenius equation E 1 1 AF = exp A - k T2 T1 where: EA =The Activation Energy of the defect mechanism. K = Boltzmann’s constant = 8.62x10-5 eV/Kelvin. T1 is the junction temperature of the device under stress and T2 is the junction temperature of the device at use conditions. 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Page 9 of 15 Document No. 002-11632 Rev. *A ECN #: 5178588 Reliability Test Data QTP #: 151008 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: ACOUSTIC, MSL3 CYTT214032 (8CP206101) 4539372 611534008 CML-RA COMP 15 0 CYTT214032 (8CP206101) 4540145 611534709 CML-RA COMP 15 0 CY8C42452 (8CP44200) 611531543 CML-RA COMP 15 0 4537464 STRESS: DATA RETENTION, PLASTIC, 150C CYTT214032 (8CP206101) 4539372 611534008 CML-RA 500 80 0 CYTT214032 (8CP206101) 4539372 611534008 CML-RA 1000 80 0 CYTT214032 (8CP206101) 4540145 611534709 CML-RA 500 80 0 CYTT214032 (8CP206101) 4540145 611534709 CML-RA 1000 80 0 CY8C42452 (8CP44200) 611531543 CML-RA 500 80 0 4537464 STRESS: DATA RETENTION, PLASTIC, 175C CYTT214032 (8CP206101) 4539372 611534008 CML-RA 76 80 0 CYTT214032 (8CP206101) 4539372 611534008 CML-RA 152 79 0 CYTT214032 (8CP206101) 4540145 611534709 CML-RA 76 80 0 CYTT214032 (8CP206101) 4540145 611534709 CML-RA 152 80 0 CY8C42452 (8CP44200) 4537464 611531543 CML-RA 76 80 0 CY8C42452 (8CP44200) 4537464 611531543 CML-RA 152 80 0 STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-EARLY FAILURE RATE (150, 2.07V, Vcc Max) CYTT214032 (8CP206101) 4539372 611534008 CML-RA 48 1490 0 CYTT214032 (8CP206101) 4540145 611534709 CML-RA 48 1510 0 CYTT214032 (8CP206101) 4545249 611537364 CML-RA 48 1547 0 CYTT214032 (8CP206101) 4539372 611534008 CML-RA 168 78 0 CYTT214032 (8CP206101) 4539372 611534008 CML-RA 500 78 0 CYTT214032 (8CP206101) 4540145 611534709 CML-RA 168 80 0 CYTT214032 (8CP206101) 4540145 611534709 CML-RA 500 80 0 CY8C42452 (8CP44200) 4537464 611531543 CML-RA 168 80 0 CY8C42452 (8CP44200) 4537464 611531543 CML-RA 500 80 0 STRESS: ENDURANCE STRESS: ESD-CHARGE DEVICE MODEL CYTT214032 (8CP206101) 4539372 611534008 CML-RA 500 9 0 CYTT214032 (8CP206101) 4539372 611534008 CML-RA 750 3 0 CYTT214032 (8CP206101) 4539372 611534008 CML-RA 1000 3 0 CYTT214032 (8CP206101) 4539372 611534008 CML-RA 1250 3 0 CYTT214032 (8CP206101) 4539372 611534008 CML-RA 1500 3 0 CYTT214032 (8CP206101) 4539372 611534008 CML-RA 1750 3 0 Company Confidential A printed copy of this document is considered uncontrolled. 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Page 10 of 15 Document No. 002-11632 Rev. *A ECN #: 5178588 Reliability Test Data QTP #: 151008 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: ESD-CHARGE DEVICE MODEL CYTT214032 (8CP206101) 4540145 611534709 CML-RA 500 9 0 CYTT214032 (8CP206101) 4540145 611534709 CML-RA 750 3 0 CYTT214032 (8CP206101) 4540145 611534709 CML-RA 1000 3 0 CYTT214032 (8CP206101) 4540145 611534709 CML-RA 1250 3 0 CYTT214032 (8CP206101) 4540145 611534709 CML-RA 1500 3 0 CYTT214032 (8CP206101) 4540145 611534709 CML-RA 1750 3 0 CY8C42452 (8CP44200) 4537464 611531543 CML-RA 500 9 0 CY8C42452 (8CP44200) 4537464 611531543 CML-RA 750 3 0 CY8C42452 (8CP44200) 4537464 611531543 CML-RA 1000 3 0 CY8C42452 (8CP44200) 4537464 611531543 CML-RA 1250 3 0 CY8C42452 (8CP44200) 4537464 611531543 CML-RA 1500 3 0 CY8C42452 (8CP44200) 4537464 611531543 CML-RA 1750 3 0 STRESS: ESD-HUMAN BODY MODEL PER JESD22, METHOD A114 CYTT214032 (8CP206101) 4539372 611534008 CML-RA 1100 3 0 CYTT214032 (8CP206101) 4539372 611534008 CML-RA 2200 8 0 CYTT214032 (8CP206101) 4539372 611534008 CML-RA 3300 3 0 CYTT214032 (8CP206101) 4539372 611534008 CML-RA 4000 3 0 CYTT214032 (8CP206101) 4539372 611534008 CML-RA 5000 3 0 CYTT214032 (8CP206101) 4540145 611534709 CML-RA 1100 3 0 CYTT214032 (8CP206101) 4540145 611534709 CML-RA 2200 8 0 CYTT214032 (8CP206101) 4540145 611534709 CML-RA 3300 3 0 CYTT214032 (8CP206101) 4540145 611534709 CML-RA 4000 3 0 CY8C42452 (8CP44200) 4537464 611531543 CML-RA 1100 3 0 CY8C42452 (8CP44200) 4537464 611531543 CML-RA 2200 8 0 CY8C42452 (8CP44200) 4537464 611531543 CML-RA 3300 3 0 CY8C42452 (8CP44200) 4537464 611531543 CML-RA 4000 3 0 STRESS: HI-ACCEL SATURATION TEST (130C, 85%RH, 5.5V), PRE COND 192 HR 30C/60%RH (MSL3) CYTT214032 (8CP206101) 4539372 611534008 CML-RA 96 30 0 CYTT214032 (8CP206101) 4540145 611534709 CML-RA 96 30 0 STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-LATENT FAILURE RATE (150C, 2.07V, Vcc Max) CYTT214032 (8CP206101) 4539372 611534008 CML-RA 80 116 0 CYTT214032 (8CP206101) 4539372 611534008 CML-RA 500 116 0 CYTT214032 (8CP206101) 4540145 611534709 CML-RA 80 120 0 CYTT214032 (8CP206101) 4540145 611534709 CML-RA 500 120 0 Company Confidential A printed copy of this document is considered uncontrolled. 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Page 11 of 15 Document No. 002-11632 Rev. *A ECN #: 5178588 Reliability Test Data QTP #: 151008 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: LOW TEMPERATURE OPERATING LIFE, -40C CYTT214032 (8CP206101) 4539372 611534008 CML-RA 160 40 0 CYTT214032 (8CP206101) 4539372 611534008 CML-RA 380 40 0 STRESS: PRESSURE COOKER TEST (121C, 100%RH), 15 Psig, PRE COND 192 HR 30C/60%RH (MSL3) CYTT214032 (8CP206101) 4539372 611534008 CML-RA 168 75 0 CYTT214032 (8CP206101) 4540145 611534709 CML-RA 168 78 0 CY8C42452 (8CP44200) 4537464 611531543 CML-RA 168 80 0 CY8C42452 (8CP44200) 4537464 611531543 CML-RA 288 80 0 STRESS: PRE/POST LFR PARAMETER ASSESSMENT CYTT214032 (8CP206101) 4539372 611534008 CML-RA COMP 10+2 0 CYTT214032 (8CP206101) 4540145 611534709 CML-RA COMP 10+2 0 CY8C42452 (8CP44200) 611531543 CML-RA COMP 10+2 0 4537464 STRESS: STATIC LATCH-UP (85C, 140mA) CYTT214032 (8CP206101) 4539372 611534008 CML-RA COMP 6 0 CYTT214032 (8CP206101) 4540145 611534709 CML-RA COMP 6 0 CY8C42452 (8CP44200) 611531543 CML-RA COMP 6 0 4537464 STRESS: STATIC LATCH-UP (85C, 200mA) CYTT214032 (8CP206101) 4539372 611534008 CML-RA COMP 3 0 CYTT214032 (8CP206101) 4540145 611534709 CML-RA COMP 3 0 CY8C42452 (8CP44200) 611531543 CML-RA COMP 3 0 4537464 STRESS: STATIC LATCH-UP (85C, 300mA) CYTT214032 (8CP206101) 4539372 611534008 CML-RA COMP 3 0 CYTT214032 (8CP206101) 4540145 611534709 CML-RA COMP 3 0 CY8C42452 (8CP44200) 611531543 CML-RA COMP 3 0 611534008 CML-RA COMP 1 0 STRESS: 4537464 SEM CROSS SECTION CYTT214032 (8CP206101) 4539372 STRESS: TC COND. C -65C TO 150C, PRE COND 192 HRS 30C/60%RH (MSL3) CYTT214032 (8CP206101) 4539372 611534008 CML-RA 500 80 0 CYTT214032 (8CP206101) 4539372 611534008 CML-RA 1000 80 0 CYTT214032 (8CP206101) 4540145 611534709 CML-RA 500 80 0 CY8C42452 (8CP44200) 4537464 611531543 CML-RA 500 79 0 CY8C42452 (8CP44200) 4537464 611531543 CML-RA 1000 79 0 CML-RA COMP 1 0 STRESS: THERMAL JUNCTION MEASUREMENT CYTT214032 (8CP206101) 4539372 611534008 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 12 of 15 Document No. 002-11632 Rev. *A ECN #: 5178588 Reliability Test Data QTP #: 161003 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: ACOUSTIC, MSL3 CYPD1103 (8F44100) 4537464 611531543 CML-R COMP 15 0 CML-R 500 80 0 STRESS: DATA RETENTION, PLASTIC, 150C CYPD1103 (8F44100) 4537464 611531543 STRESS: DATA RETENTION, PLASTIC, 175C CYPD1103 (8F44100) 4537464 611531543 CML-R 76 80 0 CYPD1103 (8F44100) 4537464 611531543 CML-R 152 80 0 STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-EARLY FAILURE RATE (150C, 2.07V, Vcc Max) CYPD1103 (8F44100) 4537464 611531543 CML-R 48 1510 0 CYPD1103 (8F44100) 4537464 611531543 CML-R 168 80 0 CYPD1103 (8F44100) 4537464 611531543 CML-R 500 80 0 500 9 0 STRESS: ENDURANCE STRESS: ESD-CHARGE DEVICE MODEL CYPD1103 (8F44100) 4537464 611531543 CML-R CYPD1103 (8F44100) 4537464 611531543 CML-R 750 3 0 CYPD1103 (8F44100) 4537464 611531543 CML-R 1000 3 0 CYPD1103 (8F44100) 4537464 611531543 CML-R 1250 3 0 CYPD1103 (8F44100) 4537464 611531543 CML-R 1500 3 0 CYPD1103 (8F44100) 4537464 611531543 CML-R 1750 3 0 CYPD1103 (8F44100) 4537464 611531543 CML-R 2000 3 0 STRESS: ESD-HUMAN BODY MODEL PER JESD22, METHOD A114 CYPD1103 (8F44100) 4537464 611531543 CML-R 1100 3 0 CYPD1103 (8F44100) 4537464 611531543 CML-R 2200 8 0 CYPD1103 (8F44100) 4537464 611531543 CML-R 3300 3 0 CYPD1103 (8F44100) 4537464 611531543 CML-R 4000 3 0 STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-LATENT FAILURE RATE (150C, 2.07V, Vcc Max) CYPD1103 (8F44100) 4537464 611531543 CML-R 80 120 0 CYPD1103 (8F44100) 4537464 611531543 CML-R 500 120 0 STRESS: PRESSURE COOKER TEST (121C, 100%RH), 15 Psig, PRE COND 192 HR 30C/60%RH (MSL3) CYPD1103 (8F44100) 4537464 611531543 CML-R 168 80 0 CYPD1103 (8F44100) 4537464 611531543 CML-R 288 80 0 CML-R COMP 10+2 0 CML-R COMP 6 0 CML-R COMP 3 0 CML-R COMP 3 0 STRESS: PRE/POST LFR PARAMETER ASSESSMENT CYPD1103 (8F44100) 4537464 611531543 STRESS: STATIC LATCH-UP (85C, 140mA) CYPD1103 (8F44100) 4537464 611531543 STRESS: STATIC LATCH-UP (85C, 200mA) CYPD1103 (8F44100) 4537464 611531543 STRESS: STATIC LATCH-UP (125C, 140mA) CYPD1103 (8F44100) 4537464 611531543 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 13 of 15 Document No. 002-11632 Rev. *A ECN #: 5178588 Reliability Test Data QTP #: 161003 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: STATIC LATCH-UP (85C, 300mA) CYPD1103 (8F44100) 4537464 611531543 CML-R COMP 3 0 STRESS: TC COND. C -65C TO 150C, PRE COND 192 HRS 30C/60%RH (MSL3) CYPD1103 (8F44100) 4537464 611531543 CML-R 500 79 0 CYPD1103 (8F44100) 4537464 611531543 CML-R 1000 79 0 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 14 of 15 Document No. 002-11632 Rev. *A ECN #: 5178588 Document History Page Document Title: QTP# 161003: CCG1 DEVICE FAMILY S8PF-10R TECHNOLOGY, FAB 25 Document Number: 002-11632 Rev. ECN No. ** 5170984 *A 5178588 Orig. of Change JYF JYF Description of Change Initial spec release. Deleted CYPD1106** and CYPD1136** in the MPN coverage. 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