Document No. 002-12007 Rev. ** ECN #: 5200006 Cypress Semiconductor Automotive Product Qualification Report QTP# 152604 VERSION ** April 2016 Automotive Generation6 TouchScreen (TSG6_XL) Product Family S8SPF-10P Technology, HHGrace1 CYAT81688X Automotive TrueTouch ® Multi-Touch All-Points Touchscreen Controller FOR ANY QUESTIONS ON THIS REPORT, PLEASE CONTACT [email protected] or via a CYLINK CRM CASE Prepared By: Honesto Sintos Reliability Engineer Reviewed By: Rene Rodgers Reliability Manager Approved By: Don Darling Reliability Director Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 1 of 11 Document No. 002-12007 Rev. ** ECN #: 5200006 PRODUCT QUALIFICATION HISTORY Qual Report 152604 Description of Qualification Purpose Qualification of Automotive 6th Generation TouchScreen TSG6_XL Device (8A20680AH) S8SPF-10P Technology, HHGrace1 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 2 of 11 Date Comp Mar 16 Document No. 002-12007 Rev. ** ECN #: 5200006 PRODUCT DESCRIPTION (for qualification) Qualification Purpose: Qualification of Automotive 6th Generation TouchScreen TSG6_XL Device (8A20680AH) S8SPF-10P Technology, HHGrace1 CYAT8168X (61, 71, 77, 88 I/OS) Marketing Part #: Device Description: AUTOMOTIVE TRUETOUCH(R) MULTI-TOUCH ALL-POINTS TOUCHSCREEN CONTROLLER Cypress Division: Cypress Semiconductor Corporation – Programmable Systems Division(PSD) TECHNOLOGY/FAB PROCESS DESCRIPTION Number of Metal Layers: Metal Composition: 5 Passivation Type and Materials: drawn): Gate Oxide Material/Thickness (MOS): Name/Location of Die Fab (prime) Facility: Die Fab Line ID/Wafer Process ID: Metal 1: 50A Ti/100A TiN/3000A Al 0.5% Cu/100A Ti/300A TiN Metal 2: 50A Ti/100A TiN/3000A Al 0.5% Cu/100A Ti/300A TiN Metal 3: 150A Ti/8000A Al 0.5%Cu/100A Ti/300A TiN Metal 4: 150A Ti/8000A Al 0.5%Cu/100A Ti/300A TiN Metal 5: 300A Ti/300A TiN/12000A Al 0.5%Cu/500A TiN SiO2 / Si3N4 S8SPF-10R SiO2 / 32A / 120A HHNEC / China HHGrace Fab1 / S8SPF-10P PACKAGE AVAILABILITY PACKAGE ASSEMBLY FACILITY SITE QTP NUMBER 100-Lead TQFP CML-Autoline (RA) 152607 128-Lead TQFP ASEK-Taiwan (G) 152603 Company Confidential A printed copy of this document is considered uncontrolled. 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Page 3 of 11 Document No. 002-12007 Rev. ** ECN #: 5200006 MAJOR PACKAGE INFORMATION USED IN THIS QUALIFICATION Package Designation: AZ128 Package Outline, Type, or Name: 128L TQFP 14x20x1.4mm Mold Compound Name/Manufacturer: EME-G631 / Sumitomo Mold Compound Flammability Rating: Class V-0 Mold Compound Alpha Emission Rate: N/A, not low alpha Oxygen Rating Index: 54% Lead Frame Designation: FMP Lead Frame Material: Copper with Ag plating Lead Finish, Composition / Thickness: Pure Sn Die Backside Preparation Method/Metallization: Wafer backgrind Die Separation Method: Wafer Saw Die Attach Supplier: Sumitomo Die Attach Material: CRM-1076 Die Attach Method: Epoxy Bond Diagram Designation: 001-97920 Wire Bond Method: Thermosonic Wire Material/Size: Au / 0.8mil Thermal Resistance Theta JA °C/W: 33C/W Package Cross Section Yes/No: No Assembly Process Flow: 49-41999M Name/Location of Assembly (prime) facility: ASEK-Taiwan (G) MSL Level 3 Reflow Profile 260C ELECTRICAL TEST / FINISH DESCRIPTION Test Location: CML-R Note: Please contact a Cypress Representative for other packages availability. 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Page 4 of 11 Document No. 002-12007 Rev. ** ECN #: 5200006 RELIABILITY TESTS PERFORMED PER SPECIFICATION REQUIREMENT Stress/Test High Temperature Operating Life Early Failure Rate High Temperature Operating Life Latent Failure Rate NVM Endurance /High Temperature Operating Life Latent Failure Rate Test Condition (Temp/Bias) AEC-Q100-008 and JESD22-A108, 150°C Dynamic Operating Condition, Vcc Max = 2.07V JESD22-A108, 150°C Dynamic Operating Condition, Vcc Max = 2.07V AEC-Q100-005 and JESD22-A108, 150°C Dynamic Operating Condition, Vcc Max = 2.07V High Accelerated Saturation Test (HAST) JESD22-A110, 130C, 5V, 85%RH Precondition: JESD22-A113 Moisture Sensitivity MSL 3 192 Hrs, 30C/60%RH+3IR-Reflow, 260C+0, -5C Temperature Cycle JESD22-A104, -65C to 150C Precondition: JESD22-A113 Moisture Sensitivity MSL 3 192 Hrs, 30C/60%RH+3IR-Reflow, 260C+0, -5C JESD22-A102, 121C, 100%RH, 15 Psig Precondition: JESD22-A113 Moisture Sensitivity MSL 3 192 Hrs, 30C/60%RH+3IR-Reflow, 260C+0, -5C Pressure Cooker Result P/F P P P P P P Electrostatic Discharge Human Body Model (ESD-HBM) AEC-Q100-002 500V/1000V/2000V/4000V P Electrostatic Discharge Charge Device Model (ESD-CDM) AEC-Q100-011 250V/500V/750V P Wire Ball Shear AEC-Q100-001 P Wire Bond Pull Mil-Std 883, Method 2011 P Electrical Distribution AEC-Q100-009 P Final Visual JESD22-B101B P Physical Dimensions JESD22-B100/108 P Solderability JESD22-B102 P Acoustic Microscopy JEDEC JSTD-020 Precondition: JESD22-A113 Moisture Sensitivity MSL 3 P 192 Hrs, 30C/60%RH+3IR-Reflow, 260C+0, -5C Static Latch-up AEC-Q100-004, 85C, 140mA Post Temperature Cycle Wire Mil-Std 883, Method 2011 Bond Pull Dye Penetrant Test Criteria: No Package Crack Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 5 of 11 P P P Document No. 002-12007 Rev. ** ECN #: 5200006 RELIABILITY FAILURE RATE SUMMARY Stress/Test High Temperature Operating Life Early Failure Rate NVM Endurance / High Temperature Operating Life1,2 Long Term Failure Rate Device Tested/ Device Hours # Fails Activation Energy Thermal AF3 Failure Rate 10,301 Devices 0 N/A N/A 0 PPM 162,512 Device Hours 0 0.7 170 ** FIT **Insufficient samples to calculate FIT Rate. **Based on Automotive qualification samples size. 1 Assuming an ambient temperature of 55C and a junction temperature rise of 15C. Chi-squared 60% estimations used to calculate the failure rate.. 3 Thermal Acceleration Factor is calculated from the Arrhenius equation 2 E 1 1 AF = exp A - k T2 T1 where: EA =The Activation Energy of the defect mechanism. K = Boltzmann’s constant = 8.62x10-5 eV/Kelvin. T1 is the junction temperature of the device under stress and T2 is the junction temperature of the device at use conditions. 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Page 6 of 11 Document No. 002-12007 Rev. ** ECN #: 5200006 Reliability Test Data QTP #: 152604 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej CYAT81688 (8A206803AH) 5532014 611534015 ASEK-G COMP 22 0 CYAT81688 (8A206803AH) 5532014 611534014 ASEK-G COMP 21 0 CYAT81688 (8A206803AH) 5527014 611536506 ASEK-G COMP 22 0 CYAT81688 (8A206803AH) 5532014 611534015 ASEK-G COMP 150 0 CYAT81688 (8A206803AH) 5532014 611534014 ASEK-G COMP 150 0 CYAT81688 (8A206803AH) 5527014 611536506 ASEK-G COMP 150 0 CYAT81688 (8A206803AH) 5532014 611534015 ASEK-G COMP 150 0 CYAT81688 (8A206803AH) 5532014 611534014 ASEK-G COMP 150 0 CYAT81688 (8A206803AH) 5527014 611536506 ASEK-G COMP 150 0 5532014 611534014 ASEK-G COMP 5 0 CYAT81688 (8A206803AH) 5532014 611534015 ASEK-G COMP 15 0 CYAT81688 (8A206803AH) 5532014 611534014 ASEK-G COMP 15 0 CYAT81688 (8A206803AH) 5527014 611536506 ASEK-G COMP 15 0 Failure Mechanism STRESS: ACOUSTICS STRESS: BALL SHEAR STRESS: BOND PULL STRESS: CONSTRUCTIONAL ANALYSIS CYAT81688 (8A206803AH) STRESS: DYE PENETRANT STRESS: ELECTRICAL DISTRIBUTION CYAT81688 (8A206803AH) 5532014 611534015 ASEK-G COMP 45 0 CYAT81688 (8A206803AH) 5532014 611534014 ASEK-G COMP 45 0 CYAT81688 (8A206803AH) 5527014 611536506 ASEK-G COMP 45 0 CYAT81688 (8A206802AH) 5527015 611528216 CML-R COMP 130 0 STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-EARLY FAILURE RATE, 150C, 2.07V, Vcc Max CYAT81688 (8A206803AH) 5527015 611534013 ASEK-G 48 3232 0 CYAT81688 (8A206803AH) 5532014 611534015 ASEK-G 48 207 0 CYAT81688 (8A206803AH) 5532014 611534014 ASEK-G 48 3424 0 CYAT81688 (8A206803AH) 5527014 611536506 ASEK-G 48 3438 0 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 7 of 11 Document No. 002-12007 Rev. ** ECN #: 5200006 Reliability Test Data QTP #: 152604 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: LOW TEMP ENDURANCE / DATA RETENTION TEST CYAT81688 (8A206803AH) 5532014 611534014 ASEK-G 1000 45 0 1000 45 0 STRESS: HIGH TEMP ENDURANCE / DATA RETENTION TEST CYAT81688 (8A206803AH) 5532014 611534014 ASEK-G STRESS: ENDURANCE / HIGH TEMP DYNAMIC OPERATING LIFE-LATENT FAILURE RATE, 150C, 2.07V, Vcc Max CYAT81688 (8A206803AH) 5532014 611534015 ASEK-G 408 80 0 CYAT81688 (8A206803AH) 5532014 611534014 ASEK-G 408 80 0 CYAT81688 (8A206803AH) 5527014 611536506 ASEK-G 408 79 0 STRESS: ESD-CHARGE DEVICE MODEL CYAT81688 (8A206803AH) 5532014 611534014 ASEK-G 250 3 0 CYAT81688 (8A206803AH) 5532014 611534014 ASEK-G 500 3 0 CYAT81688 (8A206803AH) 5532014 611534014 ASEK-G 750 3 0 STRESS: ESD-HUMAN BODY CIRCUIT PER JESD22-A114-B CYAT81688 (8A206803AH) 5532014 611534014 ASEK-G 500 3 0 CYAT81688 (8A206803AH) 5532014 611534014 ASEK-G 1000 3 0 CYAT81688 (8A206803AH) 5532014 611534014 ASEK-G 2000 3 0 CYAT81688 (8A206803AH) 5532014 611534014 ASEK-G 4000 3 0 CYAT81688 (8A206803AH) 5532014 611534015 ASEK-G COMP 1637 0 CYAT81688 (8A206803AH) 5532014 611534014 ASEK-G COMP 7761 0 CYAT81688 (8A206803AH) 5527014 611536506 ASEK-G COMP 7193 0 STRESS: FINAL VISUAL STRESS: HI-ACCEL SATURATION TEST, 130C, 85%RH, 5V, PRE COND 192 HR 30C/60%RH, MSL3 CYAT81688 (8A206803AH) 5532014 611534015 ASEK-G 96 80 0 CYAT81688 (8A206803AH) 5532014 611534014 ASEK-G 96 80 0 CYAT81688 (8A206803AH) 5527014 611536506 ASEK-G 96 79 0 STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-LATENT FAILURE RATE, 150C, 2.07V, Vcc Max CYAT81688 (8A206803AH) 5532014 611534015 ASEK-G 408 80 0 CYAT81688 (8A206803AH) 5532014 611534014 ASEK-G 408 80 0 CYAT81688 (8A206803AH) 5527014 611536506 ASEK-G 408 79 0 CYAT81688 (8A206802AH) 5527015 611528216 CML-R 500 130 0 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 8 of 11 Document No. 002-12007 Rev. ** ECN #: 5200006 Reliability Test Data QTP #: 152604 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: PRESSURE COOKER TEST, 121C, 100%RH, 15 Psig, PRE COND 192 HR 30C/60%RH, MSL3 CYAT81688 (8A206803AH) 5532014 611534015 ASEK-G 96 80 0 CYAT81688 (8A206803AH) 5532014 611534015 ASEK-G 168 80 0 CYAT81688 (8A206803AH) 5532014 611534014 ASEK-G 96 80 0 CYAT81688 (8A206803AH) 5532014 611534014 ASEK-G 168 79 0 CYAT81688 (8A206803AH) 5527014 611536506 ASEK-G 96 80 0 CYAT81688 (8A206803AH) 5527014 611536506 ASEK-G 168 80 0 STRESS: PHYSICAL DIMENSION CYAT81688 (8A206803AH) 5532014 611534015 ASEK-G COMP 10 0 CYAT81688 (8A206803AH) 5532014 611534014 ASEK-G COMP 10 0 CYAT81688 (8A206803AH) 5527014 611536506 ASEK-G COMP 10 0 ASEK-G 500 5 0 STRESS: POST TEMPERATURE CYCLE WIRE BOND PULL CYAT81688 (8A206803AH) 5532014 611534015 STRESS: PRE /POST LFR CRITICAL PARAMETER CYAT81688 (8A206803AH) 5532014 611534015 ASEK-G COMP 80+2 0 CYAT81688 (8A206803AH) 5532014 611534014 ASEK-G COMP 80+2 0 CYAT81688 (8A206803AH) 5527014 611536506 ASEK-G COMP 80+2 0 CYAT81688 (8A206802AH) 5527015 611528216 CML-R COMP 130+2 0 STRESS: STATIC LATCH-UP TESTING, +/-140mA 125C CYAT81688 (8A206803AH) 5532014 611534014 ASEK-G COMP 6 0 CYAT81688 (8A206803AH) 5532014 611534015 ASEK-G COMP 15 0 CYAT81688 (8A206803AH) 5532014 611534014 ASEK-G COMP 15 0 CYAT81688 (8A206803AH) 5527014 611536506 ASEK-G COMP 15 0 STRESS: SOLDERABILITY Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 9 of 11 Document No. 002-12007 Rev. ** ECN #: 5200006 Reliability Test Data QTP #: 152604 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: TC COND. C -65C TO 150C, PRE COND 192 HRS 30C/60%RH, MSL3 CYAT81688 (8A206803AH) 5532014 611534015 ASEK-G 500 84 0 CYAT81688 (8A206803AH) 5532014 611534015 ASEK-G 1000 79 0 CYAT81688 (8A206803AH) 5532014 611534014 ASEK-G 500 82 0 CYAT81688 (8A206803AH) 5532014 611534014 ASEK-G 1000 81 0 CYAT81688 (8A206803AH) 5527014 611536506 ASEK-G 500 85 0 CYAT81688 (8A206803AH) 5527014 611536506 ASEK-G 1000 85 0 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 10 of 11 Document No. 002-12007 Rev. ** ECN #: 5200006 Document History Page Document Title: Document Number: QTP#152604: Automotive Generation6 TouchScreen (TSG6_XL) Product Family S8SPF-10P Technology, HHGrace1 002-12007 Rev. ECN No. Orig. of Change Description of Change ** HSTO Initial spec release 5200006 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 11 of 11