QTP#152604:Automotive Generation6 TouchScreen (TSG6_XL) Product Family S8SPF-10P Technology, HHGrace1

Document No. 002-12007 Rev. **
ECN #: 5200006
Cypress Semiconductor Automotive
Product Qualification Report
QTP# 152604 VERSION **
April 2016
Automotive Generation6 TouchScreen (TSG6_XL) Product Family
S8SPF-10P Technology, HHGrace1
CYAT81688X
Automotive TrueTouch ® Multi-Touch
All-Points Touchscreen Controller
FOR ANY QUESTIONS ON THIS REPORT, PLEASE CONTACT
[email protected] or via a CYLINK CRM CASE
Prepared By:
Honesto Sintos
Reliability Engineer
Reviewed By:
Rene Rodgers
Reliability Manager
Approved By:
Don Darling
Reliability Director
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 1 of 11
Document No. 002-12007 Rev. **
ECN #: 5200006
PRODUCT QUALIFICATION HISTORY
Qual
Report
152604
Description of Qualification Purpose
Qualification of Automotive 6th Generation TouchScreen TSG6_XL Device (8A20680AH)
S8SPF-10P Technology, HHGrace1
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 2 of 11
Date
Comp
Mar 16
Document No. 002-12007 Rev. **
ECN #: 5200006
PRODUCT DESCRIPTION (for qualification)
Qualification Purpose: Qualification of Automotive 6th Generation TouchScreen TSG6_XL Device (8A20680AH)
S8SPF-10P Technology, HHGrace1
CYAT8168X (61, 71, 77, 88 I/OS)
Marketing Part #:
Device Description:
AUTOMOTIVE TRUETOUCH(R) MULTI-TOUCH ALL-POINTS TOUCHSCREEN CONTROLLER
Cypress Division:
Cypress Semiconductor Corporation – Programmable Systems Division(PSD)
TECHNOLOGY/FAB PROCESS DESCRIPTION
Number of Metal Layers:
Metal
Composition:
5
Passivation Type and Materials:
drawn):
Gate Oxide Material/Thickness (MOS):
Name/Location of Die Fab (prime) Facility:
Die Fab Line ID/Wafer Process ID:
Metal 1: 50A Ti/100A TiN/3000A Al 0.5% Cu/100A Ti/300A TiN
Metal 2: 50A Ti/100A TiN/3000A Al 0.5% Cu/100A Ti/300A TiN
Metal 3: 150A Ti/8000A Al 0.5%Cu/100A Ti/300A TiN
Metal 4: 150A Ti/8000A Al 0.5%Cu/100A Ti/300A TiN
Metal 5: 300A Ti/300A TiN/12000A Al 0.5%Cu/500A TiN
SiO2 / Si3N4
S8SPF-10R
SiO2 / 32A / 120A
HHNEC / China
HHGrace Fab1 / S8SPF-10P
PACKAGE AVAILABILITY
PACKAGE
ASSEMBLY FACILITY SITE
QTP NUMBER
100-Lead TQFP
CML-Autoline (RA)
152607
128-Lead TQFP
ASEK-Taiwan (G)
152603
Company Confidential
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Page 3 of 11
Document No. 002-12007 Rev. **
ECN #: 5200006
MAJOR PACKAGE INFORMATION USED IN THIS QUALIFICATION
Package Designation:
AZ128
Package Outline, Type, or Name:
128L TQFP 14x20x1.4mm
Mold Compound Name/Manufacturer:
EME-G631 / Sumitomo
Mold Compound Flammability Rating:
Class V-0
Mold Compound Alpha Emission Rate:
N/A, not low alpha
Oxygen Rating Index:
54%
Lead Frame Designation:
FMP
Lead Frame Material:
Copper with Ag plating
Lead Finish, Composition / Thickness:
Pure Sn
Die Backside Preparation Method/Metallization:
Wafer backgrind
Die Separation Method:
Wafer Saw
Die Attach Supplier:
Sumitomo
Die Attach Material:
CRM-1076
Die Attach Method:
Epoxy
Bond Diagram Designation:
001-97920
Wire Bond Method:
Thermosonic
Wire Material/Size:
Au / 0.8mil
Thermal Resistance Theta JA °C/W:
33C/W
Package Cross Section Yes/No:
No
Assembly Process Flow:
49-41999M
Name/Location of Assembly (prime) facility:
ASEK-Taiwan (G)
MSL Level
3
Reflow Profile
260C
ELECTRICAL TEST / FINISH DESCRIPTION
Test Location:
CML-R
Note: Please contact a Cypress Representative for other packages availability.
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 4 of 11
Document No. 002-12007 Rev. **
ECN #: 5200006
RELIABILITY TESTS PERFORMED PER SPECIFICATION REQUIREMENT
Stress/Test
High Temperature Operating Life
Early Failure Rate
High Temperature Operating Life
Latent Failure Rate
NVM Endurance /High
Temperature Operating Life Latent
Failure Rate
Test Condition
(Temp/Bias)
AEC-Q100-008 and JESD22-A108, 150°C
Dynamic Operating Condition, Vcc Max = 2.07V
JESD22-A108, 150°C
Dynamic Operating Condition, Vcc Max = 2.07V
AEC-Q100-005 and JESD22-A108, 150°C
Dynamic Operating Condition, Vcc Max = 2.07V
High Accelerated Saturation Test
(HAST)
JESD22-A110, 130C, 5V, 85%RH
Precondition: JESD22-A113 Moisture Sensitivity MSL 3
192 Hrs, 30C/60%RH+3IR-Reflow, 260C+0, -5C
Temperature Cycle
JESD22-A104, -65C to 150C
Precondition: JESD22-A113 Moisture Sensitivity MSL 3
192 Hrs, 30C/60%RH+3IR-Reflow, 260C+0, -5C
JESD22-A102, 121C, 100%RH, 15 Psig
Precondition: JESD22-A113 Moisture Sensitivity MSL 3
192 Hrs, 30C/60%RH+3IR-Reflow, 260C+0, -5C
Pressure Cooker
Result
P/F
P
P
P
P
P
P
Electrostatic Discharge
Human Body Model (ESD-HBM)
AEC-Q100-002
500V/1000V/2000V/4000V
P
Electrostatic Discharge
Charge Device Model (ESD-CDM)
AEC-Q100-011
250V/500V/750V
P
Wire Ball Shear
AEC-Q100-001
P
Wire Bond Pull
Mil-Std 883, Method 2011
P
Electrical Distribution
AEC-Q100-009
P
Final Visual
JESD22-B101B
P
Physical Dimensions
JESD22-B100/108
P
Solderability
JESD22-B102
P
Acoustic Microscopy
JEDEC JSTD-020
Precondition: JESD22-A113 Moisture Sensitivity MSL 3
P
192 Hrs, 30C/60%RH+3IR-Reflow, 260C+0, -5C
Static Latch-up
AEC-Q100-004, 85C, 140mA
Post Temperature Cycle Wire
Mil-Std 883, Method 2011
Bond Pull
Dye Penetrant Test
Criteria: No Package Crack
Company Confidential
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Page 5 of 11
P
P
P
Document No. 002-12007 Rev. **
ECN #: 5200006
RELIABILITY FAILURE RATE SUMMARY
Stress/Test
High Temperature Operating Life Early
Failure Rate
NVM Endurance / High Temperature
Operating Life1,2 Long Term Failure Rate
Device Tested/
Device Hours
#
Fails
Activation
Energy
Thermal
AF3
Failure
Rate
10,301 Devices
0
N/A
N/A
0 PPM
162,512 Device Hours
0
0.7
170
** FIT
**Insufficient samples to calculate FIT Rate.
**Based on Automotive qualification samples size.
1
Assuming an ambient temperature of 55C and a junction temperature rise of 15C.
Chi-squared 60% estimations used to calculate the failure rate..
3 Thermal Acceleration Factor is calculated from the Arrhenius equation
2
E  1 1  
AF = exp  A  -  
 k  T2 T1  
where:
EA =The Activation Energy of the defect mechanism.
K = Boltzmann’s constant = 8.62x10-5 eV/Kelvin.
T1 is the junction temperature of the device under stress and T2 is the junction temperature of the device at
use conditions.
Company Confidential
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Page 6 of 11
Document No. 002-12007 Rev. **
ECN #: 5200006
Reliability Test Data
QTP #: 152604
Device
Fab Lot #
Assy Lot #
Assy Loc
Duration
Samp
Rej
CYAT81688 (8A206803AH)
5532014
611534015
ASEK-G
COMP
22
0
CYAT81688 (8A206803AH)
5532014
611534014
ASEK-G
COMP
21
0
CYAT81688 (8A206803AH)
5527014
611536506
ASEK-G
COMP
22
0
CYAT81688 (8A206803AH)
5532014
611534015
ASEK-G
COMP
150
0
CYAT81688 (8A206803AH)
5532014
611534014
ASEK-G
COMP
150
0
CYAT81688 (8A206803AH)
5527014
611536506
ASEK-G
COMP
150
0
CYAT81688 (8A206803AH)
5532014
611534015
ASEK-G
COMP
150
0
CYAT81688 (8A206803AH)
5532014
611534014
ASEK-G
COMP
150
0
CYAT81688 (8A206803AH)
5527014
611536506
ASEK-G
COMP
150
0
5532014
611534014
ASEK-G
COMP
5
0
CYAT81688 (8A206803AH)
5532014
611534015
ASEK-G
COMP
15
0
CYAT81688 (8A206803AH)
5532014
611534014
ASEK-G
COMP
15
0
CYAT81688 (8A206803AH)
5527014
611536506
ASEK-G
COMP
15
0
Failure Mechanism
STRESS: ACOUSTICS
STRESS: BALL SHEAR
STRESS: BOND PULL
STRESS: CONSTRUCTIONAL ANALYSIS
CYAT81688 (8A206803AH)
STRESS: DYE PENETRANT
STRESS: ELECTRICAL DISTRIBUTION
CYAT81688 (8A206803AH)
5532014
611534015
ASEK-G
COMP
45
0
CYAT81688 (8A206803AH)
5532014
611534014
ASEK-G
COMP
45
0
CYAT81688 (8A206803AH)
5527014
611536506
ASEK-G
COMP
45
0
CYAT81688 (8A206802AH)
5527015
611528216
CML-R
COMP
130
0
STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-EARLY FAILURE RATE, 150C, 2.07V, Vcc Max
CYAT81688 (8A206803AH)
5527015
611534013
ASEK-G
48
3232
0
CYAT81688 (8A206803AH)
5532014
611534015
ASEK-G
48
207
0
CYAT81688 (8A206803AH)
5532014
611534014
ASEK-G
48
3424
0
CYAT81688 (8A206803AH)
5527014
611536506
ASEK-G
48
3438
0
Company Confidential
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Page 7 of 11
Document No. 002-12007 Rev. **
ECN #: 5200006
Reliability Test Data
QTP #: 152604
Device
Fab Lot #
Assy Lot #
Assy Loc
Duration
Samp
Rej
Failure Mechanism
STRESS: LOW TEMP ENDURANCE / DATA RETENTION TEST
CYAT81688 (8A206803AH)
5532014
611534014
ASEK-G
1000
45
0
1000
45
0
STRESS: HIGH TEMP ENDURANCE / DATA RETENTION TEST
CYAT81688 (8A206803AH)
5532014
611534014
ASEK-G
STRESS: ENDURANCE / HIGH TEMP DYNAMIC OPERATING LIFE-LATENT FAILURE RATE, 150C, 2.07V, Vcc Max
CYAT81688 (8A206803AH)
5532014
611534015
ASEK-G
408
80
0
CYAT81688 (8A206803AH)
5532014
611534014
ASEK-G
408
80
0
CYAT81688 (8A206803AH)
5527014
611536506
ASEK-G
408
79
0
STRESS: ESD-CHARGE DEVICE MODEL
CYAT81688 (8A206803AH)
5532014
611534014
ASEK-G
250
3
0
CYAT81688 (8A206803AH)
5532014
611534014
ASEK-G
500
3
0
CYAT81688 (8A206803AH)
5532014
611534014
ASEK-G
750
3
0
STRESS: ESD-HUMAN BODY CIRCUIT PER JESD22-A114-B
CYAT81688 (8A206803AH)
5532014
611534014
ASEK-G
500
3
0
CYAT81688 (8A206803AH)
5532014
611534014
ASEK-G
1000
3
0
CYAT81688 (8A206803AH)
5532014
611534014
ASEK-G
2000
3
0
CYAT81688 (8A206803AH)
5532014
611534014
ASEK-G
4000
3
0
CYAT81688 (8A206803AH)
5532014
611534015
ASEK-G
COMP
1637
0
CYAT81688 (8A206803AH)
5532014
611534014
ASEK-G
COMP
7761
0
CYAT81688 (8A206803AH)
5527014
611536506
ASEK-G
COMP
7193
0
STRESS: FINAL VISUAL
STRESS: HI-ACCEL SATURATION TEST, 130C, 85%RH, 5V, PRE COND 192 HR 30C/60%RH, MSL3
CYAT81688 (8A206803AH)
5532014
611534015
ASEK-G
96
80
0
CYAT81688 (8A206803AH)
5532014
611534014
ASEK-G
96
80
0
CYAT81688 (8A206803AH)
5527014
611536506
ASEK-G
96
79
0
STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-LATENT FAILURE RATE, 150C, 2.07V, Vcc Max
CYAT81688 (8A206803AH)
5532014
611534015
ASEK-G
408
80
0
CYAT81688 (8A206803AH)
5532014
611534014
ASEK-G
408
80
0
CYAT81688 (8A206803AH)
5527014
611536506
ASEK-G
408
79
0
CYAT81688 (8A206802AH)
5527015
611528216
CML-R
500
130
0
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 8 of 11
Document No. 002-12007 Rev. **
ECN #: 5200006
Reliability Test Data
QTP #: 152604
Device
Fab Lot #
Assy Lot #
Assy Loc
Duration
Samp
Rej
Failure Mechanism
STRESS: PRESSURE COOKER TEST, 121C, 100%RH, 15 Psig, PRE COND 192 HR 30C/60%RH, MSL3
CYAT81688 (8A206803AH)
5532014
611534015
ASEK-G
96
80
0
CYAT81688 (8A206803AH)
5532014
611534015
ASEK-G
168
80
0
CYAT81688 (8A206803AH)
5532014
611534014
ASEK-G
96
80
0
CYAT81688 (8A206803AH)
5532014
611534014
ASEK-G
168
79
0
CYAT81688 (8A206803AH)
5527014
611536506
ASEK-G
96
80
0
CYAT81688 (8A206803AH)
5527014
611536506
ASEK-G
168
80
0
STRESS: PHYSICAL DIMENSION
CYAT81688 (8A206803AH)
5532014
611534015
ASEK-G
COMP
10
0
CYAT81688 (8A206803AH)
5532014
611534014
ASEK-G
COMP
10
0
CYAT81688 (8A206803AH)
5527014
611536506
ASEK-G
COMP
10
0
ASEK-G
500
5
0
STRESS: POST TEMPERATURE CYCLE WIRE BOND PULL
CYAT81688 (8A206803AH)
5532014
611534015
STRESS: PRE /POST LFR CRITICAL PARAMETER
CYAT81688 (8A206803AH)
5532014
611534015
ASEK-G
COMP
80+2
0
CYAT81688 (8A206803AH)
5532014
611534014
ASEK-G
COMP
80+2
0
CYAT81688 (8A206803AH)
5527014
611536506
ASEK-G
COMP
80+2
0
CYAT81688 (8A206802AH)
5527015
611528216
CML-R
COMP
130+2
0
STRESS: STATIC LATCH-UP TESTING, +/-140mA 125C
CYAT81688 (8A206803AH)
5532014
611534014
ASEK-G
COMP
6
0
CYAT81688 (8A206803AH)
5532014
611534015
ASEK-G
COMP
15
0
CYAT81688 (8A206803AH)
5532014
611534014
ASEK-G
COMP
15
0
CYAT81688 (8A206803AH)
5527014
611536506
ASEK-G
COMP
15
0
STRESS: SOLDERABILITY
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 9 of 11
Document No. 002-12007 Rev. **
ECN #: 5200006
Reliability Test Data
QTP #: 152604
Device
Fab Lot #
Assy Lot #
Assy Loc
Duration
Samp
Rej
Failure Mechanism
STRESS: TC COND. C -65C TO 150C, PRE COND 192 HRS 30C/60%RH, MSL3
CYAT81688 (8A206803AH)
5532014
611534015
ASEK-G
500
84
0
CYAT81688 (8A206803AH)
5532014
611534015
ASEK-G
1000
79
0
CYAT81688 (8A206803AH)
5532014
611534014
ASEK-G
500
82
0
CYAT81688 (8A206803AH)
5532014
611534014
ASEK-G
1000
81
0
CYAT81688 (8A206803AH)
5527014
611536506
ASEK-G
500
85
0
CYAT81688 (8A206803AH)
5527014
611536506
ASEK-G
1000
85
0
Company Confidential
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Page 10 of 11
Document No. 002-12007 Rev. **
ECN #: 5200006
Document History Page
Document Title:
Document Number:
QTP#152604: Automotive Generation6 TouchScreen (TSG6_XL) Product Family S8SPF-10P
Technology, HHGrace1
002-12007
Rev. ECN
No.
Orig. of
Change
Description of Change
**
HSTO
Initial spec release
5200006
Company Confidential
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Page 11 of 11
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