84- BGA (6 x 6 x 0.6 mm) Pb-Free Package PACKAGE MATERIAL DECLARATION DATASHEET Cypress Package Code Package Weight – Site 1 BU B1 : 35.8180 mg B2 : 35.5692 mg Body Size (mil/mm) Package Weight – Site 2 6 x 6 x 0.6mm B1 : 34.7526 mg B2 : 34.9649 mg SUMMARY The 84L-BGA package is compliant to RoHS. Cypress Ordering Part Numbers containing an “X” (e.g. CY7C1328G-133AXI, CY2308SXC-1HT) meet the Directive 2002/95/EC (RoHS) requirement. ASSEMBLY Site1: Advanced Semiconductor Engineering Taiwan (ASET) Package Qualification Report # 121302, 123605 (Note 1) I. DECLARATION OF PACKAGED UNITS A. BANNED SUBSTANCES Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this product. Substances / Compounds Cadmium and Cadmium Compounds Hexavalent Chromium and its Compounds Lead and Lead Compounds Mercury and Mercury Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) Asbestos Azo colorants Ozone Depleting Substances Polychlorinated Biphenyls (PCBs) Polychlorinated Napthalenes Radioactive Substances Shortchain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Formaldehyde Weight by mg PPM 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 0 0 0 0 0 0 0 0 0 0 Analysis Report (Note 2) CoA-BU84ASET As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data Document No. 001-78056 Rev. *D Page 1 of 8 84- BGA (6 x 6 x 0.6 mm) Pb-Free Package B1. MATERIAL COMPOSITION (Note 3) Using Goldwire material Material Purpose of Use Substrate Base Material Solder Ball External Plating Die Attach Die Wire Mold Compound Adhesive Circuit Interconnect Encapsulation Substance Composition CAS Number SiO2 Acrylic 60676-86-0 Trade Secret Epoxy Trade Secret Bisphenol Triazol Cu Ni Au Sn Ag Cu Modified epoxy resin Epoxy resin Daspone Treated fumed silica Substituted silane Elastomeric polymer Epoxy resin Si Au Ion impurities SiO2 Epoxy Resin Phenol Resin Crabon Black 13676-54-5 25722-66-2 7440-50-8 7440-02-0 7440-57-5 7440-31-5 7440-22-4 7440-50-8 Trade Secret Trade Secret 80-08-0 67762-90-7 Trade Secret Trade Secret Trade Secret 7440-21-3 7440-57-5 Trade Secret 60676-86-0 Trade Secret Trade Secret 1333-86-4 Package Weight (mg): 1.2804 11.0000 35,747 % weight of substance per package 3.5747 1.1640 0.9312 10.0000 8.0000 32,498 25,998 3.2498 2.5998 1.7460 2.0370 4.2428 0.1746 0.0640 4.9551 0.0503 0.0252 15.0000 17.5000 36.4500 1.500 0.5500 98.5000 1.0000 0.5000 48,747 56,871 118,454 4,875 1,787 138,341 1,404 702 4.8747 5.6871 11.8454 0.4875 0.1787 13.8341 0.1404 0.0702 1.2749 0.2920 0.1460 65.5000 15.0000 7.5000 35,594 8,151 4,076 3.5594 0.8151 0.4076 0.0584 0.0584 3.0000 3.0000 1,630 1,630 0.1630 0.1630 0.0584 0.0584 3.2770 1.4643 0.0001 11.1761 0.6853 0.5607 0.0374 3.0000 3.0000 100.0000 99.9900 0.0100 89.7000 5.5000 4.5000 0.3000 1,630 1,630 91,491 40,883 4.089 312,028 19,132 15,653 1,044 0.1630 0.1630 9.1491 4.0883 0.0004 31.2028 1.9132 1.5653 0.1044 % Total: 100.0000 Weight by mg 35.8180 % weight of substance per Homogenous material PPM Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data Document No. 001-78056 Rev. *D Page 2 of 8 84- BGA (6 x 6 x 0.6 mm) Pb-Free Package B2. MATERIAL COMPOSITION (Note 3) Using Copper-Palladium Wire material Material Purpose of Use Substrate Base Material Solder Ball External Plating Die Attach Die Wire Mold Compound Adhesive Circuit Interconnect Encapsulation Substance Composition CAS Number SiO2 Acrylic 60676-86-0 Trade Secret Epoxy Trade Secret Bisphenol Triazol Cu Ni Au Sn Ag Cu Modified epoxy resin Epoxy resin Daspone Treated fumed silica Substituted silane Elastomeric polymer Epoxy resin Si Cu Pd SiO2 Epoxy Resin Phenol Resin Crabon Black 13676-54-5 25722-66-2 7440-50-8 7440-02-0 7440-57-5 7440-31-5 7440-22-4 7440-50-8 Trade Secret Trade Secret 80-08-0 67762-90-7 Trade Secret Trade Secret Trade Secret 7440-21-3 7440-50-8 7440-05-3 60676-86-0 Trade Secret Trade Secret 1333-86-4 Package Weight (mg): 1.2804 11.0000 35,998 % weight of substance per package 3.5998 1.1640 0.9312 10.0000 8.0000 32,725 26,180 3.2725 2.6180 1.7460 2.0370 4.2428 0.1746 0.0640 4.9551 0.0503 0.0252 15.0000 17.5000 36.4500 1.5000 0.5500 98.5000 1.0000 0.5000 49,088 57,269 119,281 4,909 1,800 139,309 1,414 707 4.9088 5.7269 11.9281 0.4909 0.1800 13.9309 0.1414 0.0707 1.2749 0.2920 0.1460 65.5000 15.0000 7.5000 35,843 8,208 4,104 3.5843 0.8208 0.4104 0.0584 0.0584 3.0000 3.0000 1,642 1,642 0.1642 0.1642 0.0584 0.0584 3.2770 1.1828 0.0328 11.1761 0.6853 0.5607 0.0374 3.0000 3.0000 100.0000 97.3000 2.7000 89.7000 5.5000 4.5000 0.3000 1,642 1,642 92,131 33,254 923 314,209 19,266 15,763 1,051 0.1642 0.1642 9.2131 3.3254 0.0923 31.4209 1.9266 1.5763 0.1051 % Total: 100.0000 Weight by mg 35.5692 % weight of substance per Homogenous material PPM Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data Document No. 001-78056 Rev. *D Page 3 of 8 84- BGA (6 x 6 x 0.6 mm) Pb-Free Package ASSEMBLY Site 2: Advanced Semiconductor Engineering Chung-Li Package Qualification Report # 123401, 123603 (Note 1) I. DECLARATION OF PACKAGED UNITS A. BANNED SUBSTANCES Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this product. Substances / Compounds Cadmium and Cadmium Compounds Hexavalent Chromium and its Compounds Lead and Lead Compounds Mercury and Mercury Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) Asbestos Azo colorants Ozone Depleting Substances Polychlorinated Biphenyls (PCBs) Polychlorinated Napthalenes Radioactive Substances Shortchain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Formaldehyde Weight by mg PPM 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 0 0 0 0 0 0 0 0 0 0 Analysis Report (Note 2) CoA-BU84ASE Chung-Li As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data Document No. 001-78056 Rev. *D Page 4 of 8 84- BGA (6 x 6 x 0.6 mm) Pb-Free Package B1. MATERIAL COMPOSITION (Note 3) Using Copper/Palladium Wire Material Material Substrate Purpose of Use Base Material Solder Ball External Plating Die Attach Adhesive Die Wire Circuit Interconnect Mold Compound Encapsulation Bismaleimide(B) Triazine / Epoxy Resin Continuous Filament Fiber Glass Inorganic Filler 105391-33-1 2.1458 % weight of substance per Homogenous material 25.5000 65997-17-3 1.3127 15.6000 37,773 3.7773% 21645-51-2 0.9509 11.3000 27,362 2.7362% Barium Sulfate 7727-43-7 0.7574 9.0000 21,794 2.1794% Monomethlyl ether 34590-94-8 0.2104 2.5000 6,054 0.6054% Talc 14807-96-6 0.0421 0.5000 1,211 0.1211% Silica, amorphous 7631-86-9 0.0421 0.5000 1,211 0.1211% Epoxy Resin Cu Ni Au Sn Ag Cu Modified epoxy resin Epoxy resin Daspone Treated fumed silica Substituted silane Elastomeric polymer Epoxy resin Si Cu Pd SiO2 Epoxy Resin Phenol Resin Crabon Black Trade Secret 7440-50-8 7440-02-0 7440-57-5 7440-31-5 7440-22-4 7440-50-8 Trade Secret 0.0842 2.6928 0.1262 0.0505 4.9289 0.0602 0.0251 0.2713 1.0000 32.0000 1.5000 0.6000 98.5000 1.0000 0.5000 2,423 77,485 3,631 1,453 141,828 1,732 722 7,807 0.2423% 7.7485% 0.3631% 0.1453% 14.1828% 0.1732% 0.0722% 0.7807% Trade Secret 80-08-0 67762-90-7 0.0835 0.0292 0.0083 20.0000 7.0000 2,403 840 239 0.2403% 0.0840% 0.0239% Trade Secret Trade Secret 0.0083 0.0083 2.0000 239 239 0.0239% 0.0239% Trade Secret 7440-21-3 7440-50-8 7440-05-3 60676-86-0 Trade Secret Trade Secret 1333-86-4 0.0083 2.7244 0.1783 0.0034 15.6960 1.2600 0.9900 0.0540 2.0000 100.0000 97.3000 2.7000 87.2000 7.0000 5.5000 0.3000 239 78,394 5,131 98 451,650 36,256 28,487 1,554 0.0239% 7.8394% 0.5131% 0.0098% 45.1650% 3.6256% 2.8487% 0.1554% Substance Composition CAS Number Package Weight (mg): Weight by mg 34.7526 65.0000 2.0000 61,745 % weight of substance per package 6.1745% PPM 2.0000 % Total: Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data Document No. 001-78056 Rev. *D Page 5 of 8 100.0000 84- BGA (6 x 6 x 0.6 mm) Pb-Free Package B2. MATERIAL COMPOSITION (Note 3) Using Gold Wire Material Material Substrate Purpose of Use Base Material Solder Ball External Plating Die Attach Adhesive Die Wire Circuit Interconnect Mold Compound Encapsulation CAS Number Weight by mg 105391-33-1 2.1458 % weight of substance per Homogenous material 25.5000 65997-17-3 1.3127 15.6000 37,545 3.7545% 21645-51-2 0.9509 11.3000 27,196 2.7196% Barium Sulfate 7727-43-7 0.7574 9.0000 21,660 2.1660% Monomethlyl ether 34590-94-8 0.2104 2.5000 6,017 0.6017% Talc 14807-96-6 0.0421 0.5000 1,203 0.1203% Silica, amorphous 7631-86-9 0.0421 0.5000 1,203 0.1203% Epoxy Resin Cu Ni Au Sn Ag Cu Modified epoxy resin Epoxy resin Daspone Treated fumed silica Substituted silane Elastomeric polymer Epoxy resin Si Au Pd SiO2 Epoxy Resin Phenol Resin Crabon Black Trade Secret 7440-50-8 7440-02-0 7440-57-5 7440-31-5 7440-22-4 7440-50-8 Trade Secret 0.0842 2.6928 0.1262 0.0505 4.9315 0.0602 0.0251 0.2713 1.0000 32.0000 1.5000 0.6000 98.5000 1.0000 0.5000 65.0000 2,407 77,014 3,610 1,444 141,041 1,722 717 7,758 0.2407% 7.7014% 0.3610% 0.1444% 14.1041% 0.1722% 0.0717% 0.7758% -------------------80-08-0 67762-90-7 0.0835 0.0292 0.0083 20.0000 7.0000 2.0000 2,387 835 239 0.2387% 0.0835% 0.0239% Trade Secret Trade Secret 0.0083 0.0083 2.0000 2.0000 239 239 0.0239% 0.0239% Trade Secret 7440-21-3 7440-57-5 7440-05-3 60676-86-0 Trade Secret Trade Secret 1333-86-4 0.0083 2.7244 0.3875 0.0039 15.6960 1.2600 0.9900 0.0540 2.0000 100.0000 99.0000 1.0000 87.2000 7.0000 5.5000 0.3000 239 77,917 11,083 112 448,908 36,036 28,314 1,544 0.0239% 7.7917% 1.1083% 0.0112% 44.8908% 3.6036% 2.8314% 0.1544% Substance Composition Bismaleimide(B) Triazine / Epoxy Resin Continuous Filament Fiber Glass Inorganic Filler Package Weight (mg): 34.9649 61,371 % weight of substance per package 6.1371% PPM % Total: Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data Document No. 001-78056 Rev. *D Page 6 of 8 100.0000 84- BGA (6 x 6 x 0.6 mm) Pb-Free Package II. DECLARATION OF PACKAGING INDIRECT MATERIALS Type Tape & Reel Tray Others Material Cover tape Carrier tape Plastic Reel Tray Moisture Barrier bag Shielding bag Protective Band Shipping and inner/ pizza box Desiccant Bubble Pack Cadmium PPM Cr VI PPM Mercury PPM PBB PPM < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 Analysis Report (Note2) CoA-COVT-R CoA-CART-R CoA-PLRL-R CoA-TRAY-R CoA-MBBG-R < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 CoA-SBAG-R CoA-PROB-R CoA-ABOX-R < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 CoA-DESS-R CoA-BUBP-R Lead PPM PBDE PPM Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data Document No. 001-78056 Rev. *D Page 7 of 8 84- BGA (6 x 6 x 0.6 mm) Pb-Free Package Document History Page Document Title: 84 - BGA (6X6X0.6MM) PB-FREE PACKAGE MATERIAL DECLARATION DATASHEET Document Number: 001-78056 Rev. ** *A ECN No. Orig. of Change 3564923 JSO 3787622 JSO *B 4064088 YUM *C *D 4771626 HLR 5285407 HLR MEL Description of Change Initial Release Added CuPd material composition for Assembly Site 1. Added Assembly Site 2 for CuPd and Au wire. Added assembly site name in the Assembly heading in site 1 and 2. Changed assembly code to assembly site name in site 1 and 2. Sunset Due – No Change Changed Cypress Logo. Changed the substances with “------------- “and Proprietary to “Trade Secret". Removed distribution and posting from the document history page. Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data Document No. 001-78056 Rev. *D Page 8 of 8