44L – QFN 5X5X0.6 mm (Saw Version) Pb-Free PACKAGE MATERIAL DECLARATION DATASHEET Cypress Package Code Package Weight – Site 1 LQ B1: 43.3168 mg B2: 44.0660 mg B3: 45.000 mg Body Size (mil/mm) Package Weight – Site 2 QFN 5X5X0.6mm 46.5930 mg SUMMARY The QFN 44L Pb-Free package is compliant to RoHS. Cypress Ordering Part Numbers containing an “X” (e.g. CY8C21434-24LQXI) meet the Directive 2002/95/EC (RoHS) requirement. ASSEMBLY Site 1: Advanced Semiconductor Engineering Taiwan (ASET) Package Qualification Report # 120407, 123902, 140905 I. DECLARATION OF PACKAGED UNITS 100. BANNED SUBSTANCES Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this product. Substances / Compounds Cadmium and Cadmium Compounds Hexavalent Chromium and its Compounds Lead and Lead Compounds Mercury and Mercury Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) Asbestos Azo colorants Ozone Depleting Substances Polychlorinated Biphenyls (PCBs) Polychlorinated Napthalenes Radioactive Substances Shortchain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Formaldehyde Weight by mg PPM 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 0 0 0 0 0 0 0 0 0 0 Analysis Report (Note 2) CoA-LQ44ASET As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-75797 Rev. *E Page 1 of 8 44L – QFN 5X5X0.6 mm (Saw Version) Pb-Free B. MATERIAL COMPOSITION (Note 3) B1. Using Au Wire Material Lead frame Frame Plating Purpose of Use Base Material Frame Plating Substance Composition CAS Number Weight by mg % weight of substance per Homogenous material PPM % weight of substance per package Copper 7440-50-8 25.4900 96.1900% 588455 58.8455 Nickel 7440-02-0 0.8000 3.0200% 18469 1.8469 Silicon 7440-21-3 0.1700 0.6400% 3925 0.3925 Magnesium 7439-95-4 0.0400 0.1500% 923 0.0923 Ni 7440-02-0 0.4110 96.9300% 9488 0.9488 Pd 7440-05-3 0.0110 2.5900% 254 0.0254 Au 7440-57-5 0.0020 0.4700% 46 0.0046 Phenol Resin Trade Secret 0.1300 12.1500% 3001 0.3001 Epoxy Resin Trade Secret 0.1300 12.1500% 3001 0.3001 SiO2 Filler 68611-44-9 0.0600 5.6100% 1385 0.1385 Trade Secret 0.7500 70.0900% 17314 1.7314 Die Attach Adhesive (Meta)Acrylic Copolymer Die Circuit Si 100.0000% 87726 8.7726 Interconnect Au 7440-21-3 7440-57-5 3.8000 Wire 0.9500 99.9900% 21931 2.1931 Epoxy Resin-A Trade secret 0.3540 3.3482% 8172 0.8172 Epoxy Resin-B Trade secret 0.3540 3.3482% 8172 0.8172 Phenol Resin Trade secret 0.6136 5.8036% 14165 1.4165 Carbon Black 1333-86-4 0.0472 0.4464% 1090 0.1090 Silica fused 60676-86-0 9.2040 87.0536% Mold Compound Encapsulation Package Weight (mg): 43.3168 212481 % Total: 21.2481 100.0000 Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-75797 Rev. *E Page 2 of 8 44L – QFN 5X5X0.6 mm (Saw Version) Pb-Free B. MATERIAL COMPOSITION (Note 3) B2. CuPd Wire using Sumitomo G631 Mold Compound Material Lead frame Leadfinish Purpose of Use Base Material External Plating Substance Composition Adhesive Wire Mold Compound Circuit Interconnect Encapsulation % weight of substance per package PPM 7440-50-8 25.8375 97.5000 586,416 58.6416 Iron 7439-89-6 0.6228 2.3500 14,134 1.4134 0.0180 Phosphorus 7723-14-0 0.0080 0.0300 180 Zinc 7440-66-6 0.0318 0.1200 722 0.0722 Sn 7440-31-5 0.4000 100.0000 Trade Secret 0.1284 12.0000 9,079 2,914 0.9079 0.2914 Trade Secret 0.1284 12.0000 2,914 0.2914 68611-44-9 0.0642 6.0000 1,457 0.1457 17,000 1.7000 Trade Secret 0.7490 Si Copper 7440-21-3 7440-50-8 3.3200 0.9698 70.0000 100.0000 75,352 22,011 7.5352 2.2011 Palladium 7440-05-3 0.0002 0.0200 4 0.0004 0.8034 Amorphous Silica Acrylic Copolymer Die Weight by mg Copper Phenol Resin Novolak Epoxy Resin Die Attach CAS Number % weight of substance per Homogenous material 99.9800 Epoxy Resin-A Trade secret 0.3540 3.0000 8,034 Epoxy Resin-B Trade secret 0.3540 3.0000 8,034 0.8034 Phenol Resin Trade secret 0.6195 5.2000 14,060 1.4060 0.1071 Carbon Black 1333-86-4 0.0472 0.4000 1,071 Silica fused 60676-86-0 9.2040 78.0000 208,897 20.8897 Silica fused 76361-86-9 1.1800 10.0000 26,782 2.6782 0.4000 1,071 0.1071 Silica, crystalline 14808-60-7 Package Weight (mg): 0.0472 44.0660 % Total: 100.0000 Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-75797 Rev. *E Page 3 of 8 44L – QFN 5X5X0.6 mm (Saw Version) Pb-Free B. MATERIAL COMPOSITION (Note 3) B3. CuPd Wire using Sumitomo G700LA Mold Compound Material Lead frame Leadfinish Die Attach Die Wire Purpose of Use Base Material External Plating Adhesive Circuit Interconnect Mold Compound Encapsulation Substance Composition CAS Number Weight by mg % weight of substance per Homogenous material % weight of substance per package PPM Nickel 7440-02-0 0.7500 3.0000 16667 1.6667 Silicon 7440-21-3 0.2500 1.0000 5556 0.5556 Magnesium 7439-95-4 0.0375 0.1500 833 0.0833 Silver 7440-22-4 1.4625 5.8500 32500 3.2500 Copper 7440-50-8 22.5000 90.0000 500000 50.0000 Sn 7440-31-5 0.4000 100.0000 8889 0.8889 Acrylic Resin Polybutadiene derivative Butadiene copolymer Trade Secret 0.0825 7.5000 1833 0.1833 Trade Secret 0.1100 10.0000 2444 0.2444 Trade Secret 0.0055 0.5000 122 0.0122 Acrylate Trade Secret 0.0825 7.5000 1833 0.1833 Peroxide Trade Secret 0.0055 0.5000 122 0.0122 Additive Trade Secret 0.0165 1.5000 367 0.0367 Silver 7440-22-4 0.7975 72.5000 17722 1.7722 Si 7440-21-3 1.8000 100.0000 40000 4.0000 Copper 7440-50-8 0.1965 98.2500 4367 0.4367 Palladium 7440-05-3 0.0035 1.7500 78 0.0078 Epoxy Resin Trade secret 1.3200 8.0000 29333 2.9333 Phenol Resin Trade secret 0.6600 4.0000 14667 1.4667 Silica(Amorphous) A 60676-86-0 13.1010 79.4000 291133 29.1133 Silica(Amorphous) B 76361-86-9 1.3200 8.0000 29333 2.9333 Carbon Black 1333-86-4 0.0990 0.6000 Package Weight (mg): 45.0000 2200 % Total: 0.2200 100.0000 Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-75797 Rev. *E Page 4 of 8 44L – QFN 5X5X0.6 mm (Saw Version) Pb-Free II. DECLARATION OF PACKAGING / INDIRECT MATERIALS Type Tape & Reel Tray Others Material Lead PPM Cadmium PPM Cr VI PPM Mercury PPM Cover tape Carrier tape Plastic Reel Tray Shielding bag < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 PBB PPM PBDE PPM <5.0 <5.0 <0.0005 <5.0 <5.0 <5.0 <5.0 <0.0005 <5.0 <5.0 Analysis Report (Note2) CoA-COVT-R CoA-CART-R CoA-PLRL-R CoA-TRAY-R CoA-SBAG –R Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-75797 Rev. *E Page 5 of 8 44L – QFN 5X5X0.6 mm (Saw Version) Pb-Free ASSEMBLY Site 2: Cypress Manufacturing Limited (CML) Package Qualification Report # 131701 (See Note 1) I. DECLARATION OF PACKAGED UNITS 100. BANNED SUBSTANCES Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this product. Substances / Compounds Cadmium and Cadmium Compounds Hexavalent Chromium and its Compounds Lead and Lead Compounds Mercury and Mercury Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) Asbestos Azo colorants Ozone Depleting Substances Polychlorinated Biphenyls (PCBs) Polychlorinated Napthalenes Radioactive Substances Shortchain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Formaldehyde Weight by mg PPM 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 0 0 0 0 0 0 0 0 0 0 Analysis Report (Note 2) CoA-LQ44CML As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-75797 Rev. *E Page 6 of 8 44L – QFN 5X5X0.6 mm (Saw Version) Pb-Free B. MATERIAL COMPOSITION (Note 3) Using Copper-Palladium (Cu-Pd) Wire Material Purpose of Use Lead Frame Base material Lead Finish External Plating Die Attach Die Adhesive Circuit Wire Interconnect Mold Compound Encapsulation I. Type Weight by mg CAS Number Cu Ni Si Mg Nickel Palladium Gold Silver Carbocyclic acrylate Bismaleimide resin Acrylate Additive Silicon Copper Palladium SiO2 Metal Hydroxide Phenol Resin Epoxy Resin Carbon Black Crystalline Silica 7440-50-8 7440-02-0 7440-21-3 7439-95-4 7440-02-0 7440-05-3 7440-57-5 7440-22-4 Trade Secret Trade Secret Trade Secret Trade Secret 7440-21-3 7440-50-8 7440-05-3 60676-86-0 Trade Secret Trade Secret Trade Secret 1333-86-4 14808-60-7 Package Weight (mg): 17.9100 0.6600 0.1495 0.0540 0.4865 0.0015 0.0005 0.6220 0.0815 0.0300 0.0270 0.0115 5.7910 2.3868 0.0002 16.3100 0.6800 0.6125 0.5225 0.0633 0.1927 46.5930 % Weight of substance per Homogeneous material 95.4004% 3.5156% 0.7963% 0.2876% 99.5906% 0.3071% 0.1024% 80.5699% 10.5570% 3.8860% 3.4974% 1.4896% 100.0000% 99.9916% 0.0084% 88.7329% 3.6995% 3.3322% 2.8426% 0.3444% 1.0484% PPM 384,393 14,165 3,209 1,159 10,441 32 11 13,350 1,749 644 579 247 124,289 51,227 4 350,053 14,594 13,146 11,214 1,359 4,136 % Total: % weight of substance per package 38.4393% 1.4165% 0.3209% 0.1159% 1.0441% 0.0032% 0.0011% 1.3350% 0.1749% 0.0644% 0.0579% 0.0247% 12.4289% 5.1227% 0.0004% 35.0053% 1.4594% 1.3146% 1.1214% 0.1359% 0.4136% 100.0000 DECLARATION OF PACKAGING / INDIRECT MATERIALS Material Tape & Reel Tray Others Substance Composition Cover tape Carrier tape Plastic Reel Tray Shielding bag Lead PPM < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 Cadmium PPM < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 Cr VI PPM < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 Mercury PPM < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 PBB PPM <5.0 <5.0 <5.0 <5.0 <5.0 PBDE PPM <5.0 <5.0 <5.0 <5.0 <5.0 Analysis Report (Note2) CoA-COVT-R CoA-CART-R CoA-PLRL-R CoA-TRAY-R CoA-SBAG –R Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-75797 Rev. *E Page 7 of 8 44L – QFN 5X5X0.6 mm (Saw Version) Pb-Free Document History Page Document Title: 44L – QFN 5X5X0.6MM (SAW VERSION) PB-FREE PACKAGE MATERIAL DECLARATION DATASHEET Document Number: 001-75797 Rev. ** *A ECN No. Orig. of Change 3474792 JVP 4064282 YUM *B 4159219 AWP *C 4291871 MRB *D 4360843 HLR *E 4463063 HLR Description of Change Initial spec release. Added assembly site name in the assembly heading. Changed Assembly code to assembly site name. Removed Tube material in the Indirect Materials section. Added Site 2 – CML – PMDD with reference QTP# 131701 – Autoline Copper-Palladium (Cu-Pd) Wire Qualification. Update material composition in site 1 to reflect 4 decimal values on % weight substance homogenous material Added B2 Material Composition on Assembly Site 1 for CuPd wire. Added B3 Material Composition on Assembly Site 1 for CuPd wire using Sumitomo G700LA Mold Compound. Reference QTP No. 140905 Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-75797 Rev. *E Page 8 of 8