VISHAY SQV90N06-05

SQV90N06-05
www.vishay.com
Vishay Siliconix
Automotive N-Channel 60 V (D-S) 175 °C MOSFET
FEATURES
• Halogen-free According to IEC 61249-2-21
Definition
PRODUCT SUMMARY
VDS (V)
60
RDS(on) () at VGS = 10 V
0.005
RDS(on) () at VGS = 4.5 V
0.007
ID (A)
• TrenchFET® Power MOSFET
• Package with Low Thermal Resistance
• AEC-Q101 Qualifiedd
90
Configuration
• 100 % Rg and UIS Tested
Single
• Compliant to RoHS Directive 2002/95/EC
TO-262
D
1
2 3
G
S
G
D S
Top View
N-Channel MOSFET
ORDERING INFORMATION
Package
TO-262
Lead (Pb)-free and Halogen-free
SQV90N06-05-GE3
ABSOLUTE MAXIMUM RATINGS (TC = 25 °C, unless otherwise noted)
PARAMETER
SYMBOL
LIMIT
Drain-Source Voltage
VDS
60
Gate-Source Voltage
VGS
± 20
Continuous Drain Currenta
TC = 25 °C
ID
TC = 125 °C
Continuous Source Current (Diode Conduction)a
Pulsed Drain
Currentb
Single Pulse Avalanche Current
Single Pulse Avalanche Energy
Maximum Power Dissipationb
L = 0.1 mH
TC = 25 °C
Operating Junction and Storage Temperature Range
V
120
94
IS
120
IDM
480
IAS
75
EAS
280
PD
TC = 125 °C
UNIT
250
83
A
mJ
W
TJ, Tstg
- 55 to + 175
°C
SYMBOL
LIMIT
UNIT
THERMAL RESISTANCE RATINGS
PARAMETER
Junction-to-Ambient
PCB
Mountc
Junction-to-Case (Drain)
RthJA
40
RthJC
0.6
°C/W
Notes
a. Package limited.
b. Pulse test; pulse width  300 μs, duty cycle  2 %.
c. When mounted on 1" square PCB (FR-4 material).
d. Parametric verification ongoing.
S11-2028-Rev. B, 17-Oct-11
1
Document Number: 68874
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
SQV90N06-05
www.vishay.com
Vishay Siliconix
SPECIFICATIONS (TC = 25 °C, unless otherwise noted)
PARAMETER
SYMBOL
TEST CONDITIONS
MIN.
TYP.
MAX.
VDS
VGS = 0 V, ID = 250 μA
60
-
-
VGS(th)
VDS = VGS, ID = 250 μA
1.5
2.0
2.5
VDS = 0 V, VGS = ± 20 V
UNIT
Static
Drain-Source Breakdown Voltage
Gate-Source Threshold Voltage
Gate-Source Leakage
IGSS
Zero Gate Voltage Drain Current
IDSS
On-State Drain Currenta
ID(on)
Drain-Source On-State Resistancea
Forward
Transconductanceb
RDS(on)
-
-
± 100
VGS = 0 V
VDS = 60 V
-
-
1
VGS = 0 V
VDS = 60 V, TJ = 125 °C
-
-
50
VGS = 0 V
VDS = 60 V, TJ = 175 °C
-
-
250
VGS = 10 V
VDS5 V
120
-
-
VGS = 10 V
ID = 30 A
-
0.003
0.005
VGS = 10 V
ID = 30 A, TJ = 125 °C
-
-
0.008
VGS = 10 V
ID = 30 A, TJ = 175 °C
-
-
0.0095
VGS = 4.5 V
ID = 30 A
-
0.004
0.007
-
110
-
-
7190
8990
gfs
VDS = 15 V, ID = 30 A
V
nA
μA
A

S
Dynamicb
Input Capacitance
Ciss
Output Capacitance
Coss
Reverse Transfer Capacitance
Crss
Total Gate Chargec
Qg
Gate-Source Chargec
Qgs
Gate-Drain Chargec
Qgd
Gate Resistance
Turn-On Delay Timec
Rise Timec
Turn-Off Delay Timec
Fall Timec
Source-Drain Diode Ratings and
VGS = 0 V
VGS = 10 V
Rg
VDS = 25 V, f = 1 MHz
VDS = 30 V, ID = 90 A
f = 1 MHz
td(on)
tr
td(off)
VDD = 30 V, RL = 0.33 
ID  90 A, VGEN = 10 V, Rg = 2.5 
tf
-
830
1035
-
580
725
pF
-
175
210
-
35
42
-
34
44
0.5
1.7
2.8
-
18
27
-
18
27
-
84
126
-
28
42
-
-
480
A
-
1.1
1.4
V
nC

ns
Characteristicsb
Pulsed Currenta
ISM
Forward Voltage
VSD
IF = 90 A, VGS = 0 V
Notes
a. Pulse test; pulse width  300 μs, duty cycle  2 %.
b. Guaranteed by design, not subject to production testing.
c. Independent of operating temperature.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
S11-2028-Rev. B, 17-Oct-11
2
Document Number: 68874
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
SQV90N06-05
www.vishay.com
Vishay Siliconix
TYPICAL CHARACTERISTICS (TA = 25 °C, unless otherwise noted)
250
180
V GS = 10 V thru 5 V
150
I D - Drain Current (A)
I D - Drain Current (A)
200
150
V GS = 4 V
100
50
120
T C = 25 °C
90
60
30
T C = 125 °C
V GS = 3 V
0
T C = - 55 °C
0
0
4
8
12
16
20
0
1
V DS - Drain-to-Source Voltage (V)
Output Characteristics
4
5
0.010
R DS(on) - On-Resistance (Ω)
200
g fs - Transconductance (S)
3
Transfer Characteristics
250
T C = - 55 °C
150
T C = 25 °C
100
T C = 125 °C
0.008
0.006
V GS = 4.5 V
0.004
V GS = 10 V
0.002
50
0.000
0
0
16
32
48
64
0
80
20
ID - Drain Current (A)
40
60
80
100
120
ID - Drain Current (A)
Transconductance
On-Resistance vs. Drain Current
12
11 000
10 000
VGS - Gate-to-Source Voltage (V)
ID = 90 A
9000
C - Capacitance (pF)
2
V GS - Gate-to-Source Voltage (V)
8000
Ciss
7000
6000
5000
4000
3000
Coss
2000
1000
Crss
10
8
V DS = 30 V
6
4
2
0
0
0
10
20
30
40
50
0
60
V DS - Drain-to-Source Voltage (V)
40
60
80
100 120 140 160 180 200
Qg - Total Gate Charge (nC)
Capacitance
S11-2028-Rev. B, 17-Oct-11
20
Gate Charge
3
Document Number: 68874
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
SQV90N06-05
www.vishay.com
Vishay Siliconix
TYPICAL CHARACTERISTICS (TA = 25 °C, unless otherwise noted)
80
100
ID = 10 mA
T J = 25 °C
10
I S - Source Current (A)
Breakdown Voltage BVDSS
77
74
71
68
T J = 150 °C
1
T J = - 50 °C
0.1
0.01
65
- 50
- 25
0
25
50
75
100
125
150
0.001
0.0
175
0.2
T J - Junction Temperature (°C)
0.6
0.8
1.0
1.2
V SD - Source-to-Drain Voltage (V)
BVDSS vs. Junction Temperature
Source Drain Diode Forward Voltage
0.05
0.8
0.4
0.04
VGS(th) Variance (V)
R DS(on) - On-Resistance (Ω)
0.4
0.03
0.02
0
- 0.4
ID = 5 mA
- 0.8
T J = 150 °C
ID = 250 μA
0.01
- 1.2
T J = 25 °C
0.00
0
2
4
6
8
- 1.6
- 50
10
- 25
0
25
50
75
100
125
150
175
T J - Temperature (°C)
V GS - Gate-to-Source Voltage (V)
On-Resistance vs. Gate-to-Source Voltage
Threshold Voltage
2.1
ID = 30 A
10 V
(Normalized)
R DS(on) - On-Resistance
1.8
1.5
4.5 V
1.2
0.9
0.6
- 50
- 25
0
25
50
75
100
125
150
175
T J - Junction Temperature (°C)
On-Resistance vs. Junction Temperature
S11-2028-Rev. B, 17-Oct-11
4
Document Number: 68874
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
SQV90N06-05
www.vishay.com
Vishay Siliconix
THERMAL RATINGS (TA = 25 °C, unless otherwise noted)
IDM Limited
100 µs
I D - Drain Current (A)
100
10
1 ms
10 ms
100 ms
1s 10 s, DC
Limited
by R DS(on)*
1
TC = 25 °C
Single Pulse
0.1
0.01
0.01
0.1
1
BVDSS Limited
10
100
VDS - Drain-to-Source Voltage (V)
* VGS > minimum VGS at which RDS(on) is specified
Safe Operating Area
Normalized Effective Transient
Thermal Impedance
1
10 -1
10 -2
10 -3
10 -4
10 -4
10 -3
10 -2
10 -1
1
10
100
1000
Square Wave Pulse Duration (s)
Normalized Thermal Transient Impedance, Junction-to-Ambient
S11-2028-Rev. B, 17-Oct-11
5
Document Number: 68874
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
SQV90N06-05
www.vishay.com
Vishay Siliconix
THERMAL RATINGS (TA = 25 °C, unless otherwise noted)
2
Normalized Effective Transient
Thermal Impedance
1
Duty Cycle = 0.5
0.2
0.1
0.1
0.05
0.02
Single Pulse
0.01
10 -4
10 -3
10 -2
10 -1
1
10
Square Wave Pulse Duration (s)
Normalized Thermal Transient Impedance, Junction-to-Case
Note
• The characteristics shown in the two graphs
- Normalized Transient Thermal Impedance Junction to Ambient (25 °C)
- Normalized Transient Thermal Impedance Junction to Case (25 °C)
are given for general guidelines only to enable the user to get a “ball park” indication of part capabilities. The data are extracted from single
pulse transient thermal impedance characteristics which are developed from empirical measurements. The latter is valid for the part
mounted on printed circuit board - FR4, size 1" x 1" x 0.062", double sided with 2 oz. copper, 100 % on both sides. The part capabilities
can widely vary depending on actual application parameters and operating conditions.
Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon
Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and
reliability data, see www.vishay.com/ppg?68874.
S11-2028-Rev. B, 17-Oct-11
6
Document Number: 68874
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Package Information
Vishay Siliconix
TO−262:
3−LEAD
A
E
E1
D
D1
L2
F
2
E2
3
L1
1
L
b(1)
J1
e
b
e(1)
c
MILLIMETERS*
Dim
A
b
b(1)
c
D
D1
e
e(1)
E
E1
E2
F
J1
L
L1
L2
INCHES
Min
Max
Min
Max
4.32
4.70
0.170
0.185
0.64
1.00
0.025
0.039
1.14
1.40
0.045
0.055
0.36
0.50
0.014
0.020
8.64
9.65
0.340
0.380
5.59
6.10
0.220
0.240
2.41
2.67
0.095
0.105
4.95
5.33
0.195
0.210
10.03
10.41
0.395
0.410
7.87
8.64
0.310
0.340
9.02
9.53
0.355
0.375
1.14
1.40
0.045
0.055
2.41
2.79
0.095
0.110
13.08
14.22
0.515
0.560
-
3.81
-
0.150
1.02
1.40
0.040
0.055
ECN: T-02234—Rev. C, 14-Oct-02
DWG: 5855
*Use millimeters as the primary measurement
Document Number: 71769
15-Oct-02
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1
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Revision: 12-Mar-12
1
Document Number: 91000