LED Drivers for LED Backlights
Backlight LED Driver
for Small LCD Panels (Charge Pump Type)
No.11040EAT24
BD1606MVV
●Description
The multi-level brightness control white LED driver not only ensures efficient boost by automatically changing the boost rate
but also works as a constant current driver in 64 steps, so that the driving current can be adjusted finely. This IC is best
suited to turn on white LEDs that require high-accuracy LED brightness control.
●Features
1) A 6 parallel LED driver is mounted
2) 64-step LED current adjust function
3) Inter-LED relative current accuracy: 3% or less
2
4) LED individual lighting/dimming control via a I C BUS interface
5) Automatic transition charge pump type DC/DC converter (×1,×1.5 and ×2)
6) High efficiency achieved (90% or more at maximum)
7) Various protection functions such as output voltage protection, overcurrent limiter and thermal shutdown circuit are mounted.
8) Small QFN package
●Applications
This driver is applicable for various fields such as mobile phones, portable game machines and white goods.
●Absolute Maximum Rating (Ta=25℃)
Parameter
Symbol
Limits
Unit
VMAX
7
V
Operating temperature range
Topr
-30 ~ +85
℃
Storage temperature range
Tstg
-55 ~ +150
℃
Pd
780 (*1)
mW
Power supply voltage
Power dissipation
(*1) When a glass epoxy substrate (70mm × 70mm × 1.6mm) has been mounted,
this loss will decrease 6.2mW/℃ if Ta is higher than or equal to 25℃.
●Recommended Operation Range (Ta=-30℃ to +85℃)
Parameter
Operating power supply voltage
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Symbol
Limits
Unit
VCC
2.7~5.5
V
1/11
2011.04 - Rev.A
BD1606MVV
Technical Note
●Electrical Characteristics (Unless otherwise stated, Ta is 25℃ and Vin is 3.6V)
Limits
Parameter
Symbol
Min.
Typ.
Max.
Unit
Condition
Input voltage range
Vin
2.7
3.6
5.5
V
Vin pin
Quiescent current
Iq
-
0
7
μA
EN=0V, Vin=3.6V
IDD1
-
1.0
2.6
mA
×1 mode, Iout=0mA, Vin =3,6V
Circuit current 1
[Charge pump]
Output current
IOUT
-
-
120
mA
VOUT =4.0V, Vin=3.6V
Oscillation frequency
fOSC
0.8
1.0
1.2
MHz
Add=0x03, D6=’0’
LED current absolute precision
ILED-ERR
-
-
±6.5
%
LED current relative precision
ILED-to-LED
-
0.5
±3.75*1)
%
VLED
-
0.2
0.25
V
ILEDA*/B*/C*
Input ‘L’ voltage
VIL
-
-
0.4
V
EN, SCL, SDA
Input ‘H’ voltage
VIH
1.6
-
-
V
EN, SCL, SDA
Input ‘H’ current
IIH
-
-
10
μA
EN, SCL, SDA=Vin
Input ‘L’ current
IIL
-10
-
-
μA
EN, SCL, SDA=GND
-
-
0.4
V
SDA, 3mA source
-
-
0.6
V
SDA, 6mA source
[LED driver]
LED control voltage
ILED =16.5mA(LEDxCNT=0x20),
LED pin voltage 1.0 V
ILED =16.5mA(LEDxCNT=0x20) ,
LED pin voltage 1.0V
[Logic interface]
‘L’ level SDA output
VOL
2
[I C BUS interface (standard mode)]
SCL clock frequency
fSCLC
0
-
100
kHz
SCL Low duration
tLOW
4.7
-
-
μs
SCL High duration
tHIGH
4.0
-
-
μs
Data hold time
tHD;DAT
0
-
3.45
μs
Data setup time
tSU;DAT
250
-
-
ns
Setup time – restart condition
tSU;STA
4.7
-
-
μs
Hold time – restart condition
tHD;STA
4.0
-
-
μs
Setup time – stop condition
tSU;STO
4.0
-
-
μs
tBUF
4.7
-
-
μs
SCL clock frequency
fSCL
0
-
400
kHz
SCL Low duration
tLOW
1.3
-
-
μs
Bus free tine between start and stop
2
[I C BUS interface (fast mode)]
SCL High duration
tHIGH
0.6
-
-
μs
Data hold time
tHD;DAT
0
-
0.9
μs
Data setup time
tSU;DAT
100
-
-
ns
Setup time – restart condition
tSU;STA
0.6
-
-
μs
Hold time – restart condition
tHD;STA
0.6
-
-
μs
Setup time – stop condition
tSU;STO
0.6
-
-
μs
Bus free time between start and stop
tBUF
1.3
-
-
μs
Interface startup time
TEN
-
-
350
μs
*1)
Bus startup time (after En=‘H’)
The following expression is used for calculation:
ILED-match={(Imax-Imin)/(Imax+Imin)} × 100
Imax= Current value in a channel with the maximum current value among all channels
Imin=Current value in a channel with the minimum current value among all channels
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2/11
2011.04 - Rev.A
BD1606MVV
Technical Note
●Reference Data
3.0
100
1.6
2.5
90
2.0
Ta=25 ℃
0.8
IDD1[mA]
Iq [μA]
1.2
Ta=85 ℃
Ta=85℃
1.0
0.5
70
60
2
3
4
5
6
40
2
7
3
4
Vin[V]
5
6
7
2
Fig.2 Circuit Current
(Operation in ×1.0 Mode)
100
90
90
80
80
60
50
40
Ta=25 ℃
60
50
40
Ta=25 ℃
30
20
Ta=85 ℃
3
3.5
4
4.5 5 5.5
Vin[V]
6
6.5
0
2.5
7
Fig.4 Efficiency (3.5mA x 6 Lights)
1.5
15.0
1.0
DNL [LSB]
2.0
17.5
Ta=25 ℃
10.0
Ta=-30 ℃
Ta=85 ℃
7.5
3.5
4
4.5 5 5.5
Vin[V]
6
6.5
60
50
Ta=-30 ℃
0.5
0.0
-1.5
17.5
4.0
10
20
30
40
50
STATE[DEC]
60
0
Fig.8 LED Current Characteristics
(Differential Linearity Error)
20.0
7
Ta=85 ℃
-2.0
0
4.5
6.5
0.0
-2.0
5.0
6
-0.5
0.0
Fig.7 LED Current Characteristics
(LED current 16.5mA)
4.5 5 5.5
Vin[V]
0.5
-1.0
2.0
Ta=-30 ℃
1.0
-1.5
1.6
4
Ta=25 ℃
1.5
Ta=85 ℃
-1.0
1.2
VLED [V]
3.5
2.0
Ta=25 ℃
-0.5
0.8
3
Fig.6 Efficiency (20mA x 6 Lights)
2.5
0.4
Ta=85 ℃
30
5.0
0.0
Ta=25 ℃
40
0
2.5
7
Fig.5 Efficiency (10mA x 6 Lights)
20.0
12.5
3
70
10
INL [LSB]
0
2.5
7
20
Ta=85 ℃
10
10
6
Ta=-30 ℃
80
Ta=-30 ℃
70
EFFICIENCY [%]
Ta=-30 ℃
EFFICIENCY [%]
EFFICIENCY [%]
100
90
20
4
5
Vin[V] (Ta=25oC)
Fig.3 Efficiency Hysteresis
(13mA × 6 Lights)
100
30
3
Vin[V]
Fig.1 Circuit Current (Standby)
70
UP
50
0.0
0.0
LED current [mA]
Ta=-30℃
Ta=25℃
1.5
DOWN
80
Ta=-30℃
0.4
10
20
30
40
50
STATE[DEC]
60
Fig.9 LED Current Characteristics
(Integral Linearity Error)
15.0
LED current [mA]
3.5
12.5
Ta=-30 ℃
3.0
[%]
EFFICIENCY [%]
2.0
2.5
2.0
1.5
Ta=-30 ℃
10.0
Ta=85 ℃
Ta=25 ℃
7.5
Ta=25 ℃
5.0
1.0
2.5
0.5
0.0
Ta=85 ℃
0.0
0
10
20
30
40
50
STATE[DEC]
60
Fig.10 LED Current matching
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0
1
2
3
4
Vin[V]
5
6
7
Fig.11 LED Current vs. VIN
(LED current 16.5mA)
3/11
2011.04 - Rev.A
BD1606MVV
Technical Note
●Block Diagram and Recommended Circuit Example
C2 = 1μF
C2P
C1N
C1P
C2N
C1 = 1μF
Battery
×1, ×1.5, ×2
Charge Pump
VIN
Cin
= 1μF
VOUT
COUT = 1μF
Over Voltage
Protect
Charge Pump
Mode Control
OSC
EN
VOUT Control
TSD
ILEDA1
LEDA1
SCL
2
I C I/F
&
Control
Logic
SDA
ILEDA2
LEDACNT Current
DAC
6
LEDA1
ILEDB1
ILEDB2
LEDBCNT Current
DAC
6
ILEDC2
ILEDC2
LEDCCNT Current
6
DAC
LEDB1
LEDB2
LEDC1
LEDC2
GND
Fig.12 Block Diagram and Recommended Circuit Example
●Pin Table
Pin
Pin name
number
In/Out
1
LEDA1
Out
2
SDA
3
Pin
Pin name
number
Function
In/Out
Function
Flying capacitor pin negative
(-) side
Flying capacitor pin positive
In/Out
(+) side
LED current driver output
9
C2N
In
I2C BUS control pin
10
C2P
SCL
In
I2C BUS control pin
11
GND
-
4
EN
In
ON/OFF control
12
LEDC2
Out
LED current driver output
5
VOUT
Out
Charge pump output
13
LEDC1
Out
LED current driver output
6
VIN
-
Power supply
14
LEDB2
Out
LED current driver output
7
C1N
15
LEDB1
Out
LED current driver output
8
C1P
16
LEDA2
Out
LED current driver output
Flying capacitor pin negative
(-) side
Flying capacitor pin positive
In/Out
(+) side
In/Out
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In/Out
GND
2011.04 - Rev.A
BD1606MVV
Technical Note
●Description of Operations
(1) LED driver
2
・I C BUS interface
BD1606MVV can control the LED ON/OFF, brightness and charge pump switching frequency change by writing to the
2
2
register via the I C BUS interface. Control by the I C BUS interface is effective when EN is at ‘H’ kevel. When EN is at ‘L’
level, this LSI is completely shut down and control and associated functions via the I2C BUS interface are all stopped.
2
As shown in Fig.13 below, the I C BUS interface of BD1606MVV operates using the Ven voltage (buffering the EN pin
2
voltage) as supply voltage. For this reason, it is desirable that the ‘H’ voltage in the I C BUS interface is equal to the EN
pin voltage.
Ven
Ven
EN
I2C interface buffer
SDA
SCL
Fig.13 I2C BUS Interface Buffer
SDA
tf
t
t LOW
t BUF
tr
t HD;STA
SU;DAT
SCL
t HD;STA
t SU;STA
t HD;DAT
S
t
SU;STO
Sr
t HIGH
P
S
Fig.14 I2C BUS Interface Timing
BD1606MVV operates as a slave device for the I2C BUS interface.
a) Slave address
A7
A6
1
1
A5
A4
A3
A2
A1
R/W
0
0
1
1
0
1/0
b) Data format
The data format is shown below.
Write format:
S
Slave address
W As
7 bit
One-byte register
address
Slave address
R As One-byte register data As P
8 bit
7 bit
8 bit
One-byte register
address
As One-byte register data As P
As Sr
Or
S
Slave address
W As
7 bit
8 bit
8 bit
Read format:
S
Slave address
W As
7 bit
Note)
One-byte register
address
As Sr
8 bit
Slave address
R As One-byte register data Am P
7 bit
8 bit
S: Start condition
W: ‘0=Write
R: ‘1=Read
As: Acknowledge (slave -> master)
Am: No acknowledge
Sr: Repeated start condition
P: Stop condition
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5/11
2011.04 - Rev.A
BD1606MVV
Technical Note
・Register table
a) Register map
Address
Register
Hex
name
D7
D6
D5
D4
D3
D2
D1
D0
Function
0x00
LEDACNT
-
-
LEDACNT
Current setting of ILEDA1/2
0x01
LEDBCNT
-
-
LEDBCNT
Current setting of ILEDA1/2
0x02
LEDCCNT
-
-
LEDCCNT
Current setting of ILEDA1/2
0x03
LEDPWR
CNT
-
Note)
FREQNT
Current driver
LEDC2 LEDC1 LEDB2 LEDB1 LEDA2 LEDA1
1/0
ON/OFF control
‘-’ : Invalid at write time
‘-’ : ‘L’ at read time
b) Description of registers
* LEDACNT (initial value: undefined) --- <Address: 0x00, Data: [D5:D0]>
* LEDBCNT (initial value: undefined) --- <Address: 0x01, Data: [D5: D0]>
* LEDCCNT (initial value: undefined) --- <Address: 0x02, Data: [D5: D0]>
LED current values are controlled. LEDA1/A2, LEDB1/B2 and LEDC1/C2 are controlled via the registers LEDACNT,
LEDBCNT and LEDCCNT respectively, and the current setting can be switched every 2 channels.
For the current setting value in each register setting, refer to ‘LED Current Setting Table’ on page 11.
*
*
*
*
*
*
LEDA1 (initial value: ‘0) --- <Address: 0x03, Data: D0>
LEDA2 (initial value: ‘0) --- <Address: 0x03, Data: D1>
LEDB1 (initial value: ‘0) --- <Address: 0x03, Data: D2>
LEDB2 (initial value: ‘0) --- <Address: 0x03, Data: D3>
LEDC1 (initial value: ‘0) --- <Address: 0x03, Data: D4>
LEDC2 (initial value: ‘0) --- <Address: 0x03, Data: D5>
The ON/OFF setting of each LED driver channel is as follows:
’0’: OFF
‘1’ :ON
*FREQCNT (initial value: ‘0) --- <Address: 0x03, Data: D6>
The switching frequency of a charge pump is set as follows:
’0’: 1MHz
‘1’ :250kHz
When ‘250kHz’ is selected, the flying capacitor of C1, C2 and Cout must be set to 10µF.
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6/11
2011.04 - Rev.A
BD1606MVV
Technical Note
c) LED current setting table
The following table lists the current setting values in respective register settings.
Initially, these registers have not been initialized. For this reason, they are not initialized under EN= ‘0.
D5
D4
D3
D2
D1
D0
Output current (mA)
D5
D4
D3
D2
D1
D0
Output current (mA)
0
0
0
0
0
0
0.5
1
0
0
0
0
0
16.5
0
0
0
0
0
1
1.0
1
0
0
0
0
1
17.0
0
0
0
0
1
0
1.5
1
0
0
0
1
0
17.5
0
0
0
0
1
1
2.0
1
0
0
0
1
1
18.0
0
0
0
1
0
0
2.5
1
0
0
1
0
0
18.5
0
0
0
1
0
1
3.0
1
0
0
1
0
1
19.0
0
0
0
1
1
0
3.5
1
0
0
1
1
0
19.5
0
0
0
1
1
1
4.0
1
0
0
1
1
1
20.0
0
0
1
0
0
0
4.5
1
0
1
0
0
0
20.5
0
0
1
0
0
1
5.0
1
0
1
0
0
1
21.0
0
0
1
0
1
0
5.5
1
0
1
0
1
0
21.5
0
0
1
0
1
1
6.0
1
0
1
0
1
1
22.0
0
0
1
1
0
0
6.5
1
0
1
1
0
0
22.5
0
0
1
1
0
1
7.0
1
0
1
1
0
1
23.0
0
0
1
1
1
0
7.5
1
0
1
1
1
0
23.5
0
0
1
1
1
1
8.0
1
0
1
1
1
1
24.0
0
1
0
0
0
0
8.5
1
1
0
0
0
0
24.5
0
1
0
0
0
1
9.0
1
1
0
0
0
1
25.0
0
1
0
0
1
0
9.5
1
1
0
0
1
0
25.5
0
1
0
0
1
1
10.0
1
1
0
0
1
1
26.0
0
1
0
1
0
0
10.5
1
1
0
1
0
0
26.5
0
1
0
1
0
1
11.0
1
1
0
1
0
1
27.0
0
1
0
1
1
0
11.5
1
1
0
1
1
0
27.5
0
1
0
1
1
1
12.0
1
1
0
1
1
1
28.0
0
1
1
0
0
0
12.5
1
1
1
0
0
0
28.5
0
1
1
0
0
1
13.0
1
1
1
0
0
1
29.0
0
1
1
0
1
0
13.5
1
1
1
0
1
0
29.5
0
1
1
0
1
1
14.0
1
1
1
0
1
1
30.0
0
1
1
1
0
0
14.5
1
1
1
1
0
0
30.5
0
1
1
1
0
1
15.0
1
1
1
1
0
1
31.0
0
1
1
1
1
0
15.5
1
1
1
1
1
0
31.5
0
1
1
1
1
1
16.0
1
1
1
1
1
1
32.0
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7/11
2011.04 - Rev.A
BD1606MVV
Technical Note
(2) Charge pump
a) Description of operations
Pin voltage comparison takes place at Vout control section, and then Vout generaton takes place so that the LED
cathode voltage with the highest Vf is set to 0.1V. A boost rate is changed automatically to a proper one at the Charge
Pump Mode Control section so that operation can take place at possible low boost rate. When the current taken from
VBAT exceeds 600mA, the overcurrent limiter is activated and this IC is reset. In addition, if the output voltage falls
below 1.5V, this IC is reset for short-circuit at output.
b) Soft start function
BD1606MVV have a soft start function that prevents the rush current.
TOFF
EN/LED*
VOUT
ILED
Soft Start
Ordinal mode
Fig.15 Soft Start
c) Automatic boost rate change
The boost rate automatically switches to the best mode.
* (×1 mode -> ×1.5 mode) or (×1.5 mode -> ×2 mode)
If a battery voltage drop occurs BD1606MVV cannot maintain the LED constant current, and then mode
transition begins.
* (×1.5 mode -> ×1 mode) or (×2 mode -> ×1.5 mode)
If a battery voltage rise occurs, VOUT and VIN detection are activated, and then mode transition begins.
(3) UVLO (Ultra low Voltage Lock Out)
If the input voltage falls below 2.2V, BD1606MVV is shut down to prevent malfunction due to ultra-low voltage.
(4) OVP (Over Voltage Protection)
This circuit protects this IC against damage when the C/P output voltage (Vout) rises extremely for some external factors.
(5) Thermal shutdown (TSD)
To protect this IC against thermal damage or heat-driven uncontrolled operations, this circuit turns off the output if the
chip temperature rises over 150℃. In addition, it turns on the output if the temperature returns to the normal temperature.
Because the built-in thermal protection circuit is intended to protect the IC itself, the thermal shutdown detection
temperature must be set to below 150℃ in thermal design.
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8/11
2011.04 - Rev.A
BD1606MVV
Technical Note
●Recommended PCB layout
In PCB design, wire the power supply line in a way that the PCB impedance goes low and provide a bypass capacitor if needed.
C2
To substrate
GND
GND
SDA
SDA
EN
VBAT
C2
SCL
VOUT
C1
Cin
Cout
C1
Cin
Cout
EN
VOUT
SCL
VCC
Rear-side GND
To substrate
VCC
Fig.16 Application Layout Image (Top View)
Fig.17 Front (Top View)
●Application Parts Selection Method
Capacitor (Use a ceramics capacitor with good frequency and temperature characteristics.)
Symbol
Recommended value
Recommended parts
Cout,Cin,C1,C2
1μF
GRM188B11A105KA61B(MURATA)
Type
Ceramics capacitor
Connect an input bypass capacitor CIN between VBAT/VIN and GND pin and an output capacitor between VOUT and GND
pin in proximity. Place both C1P-C1N and C2P-C2N capacitors in proximity to the chip Furthermore, select a ceramics
capacitor with a sufficient rating for voltage to be applied.
When other than these parts are used, the equivalent parts must be used.
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9/11
2011.04 - Rev.A
BD1606MVV
Technical Note
●N otes for Use
(1) Absolute Maximum Ratings
An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc.,
can break down devices, thus making impossible to identify breaking mode such as a short circuit or an open circuit. If
any special mode exceeding the absolute maximum ratings is assumed, consideration should be given to take physical
safety measures including the use of fuses, etc.
(2) Operating conditions
These conditions represent a range within which characteristics can be provided approximately as expected. The
electrical characteristics are guaranteed under the conditions of each parameter.
(3) Reverse connection of power supply connector
The reverse connection of power supply connector can break down ICs. Take protective measures against the
breakdown due to the reverse connection, such as mounting an external diode between the power supply and the IC’s
power supply terminal.
(4) Power supply line
Design PCB pattern to provide low impedance for the wiring between the power supply and the GND lines. Furthermore,
for all power supply terminals to ICs, mount a capacitor between the power supply and the GND terminal. At the same
time, in order to use an electrolytic capacitor, thoroughly check to be sure the characteristics of the capacitor to be used
present no problem including the occurrence of capacity dropout at a low temperature, thus determining the constant.
(5) GND voltage
Make setting of the potential of the GND terminal so that it will be maintained at the minimum in any operating state.
Furthermore, check to be sure no terminals are at a potential lower than the GND voltage including an actual electric
transient.
(6) Short circuit between terminals and erroneous mounting
In order to mount ICs on a set PCB, pay thorough attention to the direction and offset of the ICs. Erroneous mounting
can break down the ICs. Furthermore, if a short circuit occurs due to foreign matters entering between terminals or
between the terminal and the power supply or the GND terminal, the ICs can break down.
(7) Operation in strong electromagnetic field
Be noted that using ICs in the strong electromagnetic field can malfunction them.
(8) Inspection with set PCB
On the inspection with the set PCB, if a capacitor is connected to a low-impedance IC terminal, the IC can suffer stress.
Therefore, be sure to discharge from the set PCB by each process. Furthermore, in order to mount or dismount the set
PCB to/from the jig for the inspection process, be sure to turn OFF the power supply and then mount the set PCB to the
jig. After the completion of the inspection, be sure to turn OFF the power supply and then dismount it from the jig. In
addition, for protection against static electricity, establish a ground for the assembly process and pay thorough attention
to the transportation and the storage of the set PCB.
(9) Input terminals
In terms of the construction of IC, parasitic elements are inevitably formed in relation to potential. The operation of the
parasitic element can cause interference with circuit operation, thus resulting in a malfunction and then breakdown of
the input terminal. Therefore, pay thorough attention not to handle the input terminals, such as to apply to the input
terminals a voltage lower than the GND respectively, so that any parasitic element will operate. Furthermore, do not
apply a voltage to the input terminals when no power supply voltage is applied to the IC. In addition, even if the power
supply voltage is applied, apply to the input terminals a voltage lower than the power supply voltage or within the
guaranteed value of electrical characteristics.
(10) Ground wiring pattern
If small-signal GND and large-current GND are provided, It will be recommended to separate the large-current GND
pattern from the small-signal GND pattern and establish a single ground at the reference point of the set PCB so that
resistance to the wiring pattern and voltage fluctuations due to a large current will cause no fluctuations in voltages of
the small-signal GND. Pay attention not to cause fluctuations in the GND wiring pattern of external parts as well.
(11) External capacitor
In order to use a ceramic capacitor as the external capacitor, determine the constant with consideration given to a
degradation in the nominal capacitance due to DC bias and changes in the capacitance due to temperature, etc.
(12) Thermal shutdown circuit (TSD)
When junction temperatures become 175°C (typ) or higher, the thermal shutdown circuit operates and turns a switch
OFF. The thermal shutdown circuit, which is aimed at isolating the LSI from thermal runaway as much as possible, is
not aimed at the protection or guarantee of the LSI. Therefore, do not continuously use the LSI with this circuit
operating or use the LSI assuming its operation
(13) Thermal design
Perform thermal design in which there are adequate margins by taking into account the permissible dissipation (Pd) in
actual states of use.
(14) Coil selection
To reduce the loss, select a coil with a small wound resistor for DC/DC converter output.
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© 2011 ROHM Co., Ltd. All rights reserved.
10/11
2011.04 - Rev.A
BD1606MVV
Technical Note
●Ordering part number
B
D
1
Part No.
6
0
6
Part No.
1606
M
V
V
-
Package
MVV: SQFN016V4040
E
2
Packaging and forming specification
E2: Embossed tape and reel
SQFN016V4040
<Tape and Reel information>
4.0±0.1
4.0±0.1
The direction is the 1pin of product is at the upper left when you hold
( reel on the left hand and you pull out the tape on the right hand
)
1
4
5
16
13
8
12
9
2.1±0.1
0.55±0.1
E2
0.65
C0.2
1.025
2500pcs
(0.22)
+0.03
0.02 −0.02
1.0MAX
S
2.1±0.1
Embossed carrier tape
Quantity
Direction
of feed
1PIN MARK
0.08 S
Tape
+0.05
0.3 −0.04
1pin
Reel
(Unit : mm)
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© 2011 ROHM Co., Ltd. All rights reserved.
11/11
Direction of feed
∗ Order quantity needs to be multiple of the minimum quantity.
2011.04 - Rev.A
Notice
Notes
No copying or reproduction of this document, in part or in whole, is permitted without the
consent of ROHM Co.,Ltd.
The content specified herein is subject to change for improvement without notice.
The content specified herein is for the purpose of introducing ROHM's products (hereinafter
"Products"). If you wish to use any such Product, please be sure to refer to the specifications,
which can be obtained from ROHM upon request.
Examples of application circuits, circuit constants and any other information contained herein
illustrate the standard usage and operations of the Products. The peripheral conditions must
be taken into account when designing circuits for mass production.
Great care was taken in ensuring the accuracy of the information specified in this document.
However, should you incur any damage arising from any inaccuracy or misprint of such
information, ROHM shall bear no responsibility for such damage.
The technical information specified herein is intended only to show the typical functions of and
examples of application circuits for the Products. ROHM does not grant you, explicitly or
implicitly, any license to use or exercise intellectual property or other rights held by ROHM and
other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the
use of such technical information.
The Products specified in this document are intended to be used with general-use electronic
equipment or devices (such as audio visual equipment, office-automation equipment, communication devices, electronic appliances and amusement devices).
The Products specified in this document are not designed to be radiation tolerant.
While ROHM always makes efforts to enhance the quality and reliability of its Products, a
Product may fail or malfunction for a variety of reasons.
Please be sure to implement in your equipment using the Products safety measures to guard
against the possibility of physical injury, fire or any other damage caused in the event of the
failure of any Product, such as derating, redundancy, fire control and fail-safe designs. ROHM
shall bear no responsibility whatsoever for your use of any Product outside of the prescribed
scope or not in accordance with the instruction manual.
The Products are not designed or manufactured to be used with any equipment, device or
system which requires an extremely high level of reliability the failure or malfunction of which
may result in a direct threat to human life or create a risk of human injury (such as a medical
instrument, transportation equipment, aerospace machinery, nuclear-reactor controller, fuelcontroller or other safety device). ROHM shall bear no responsibility in any way for use of any
of the Products for the above special purposes. If a Product is intended to be used for any
such special purpose, please contact a ROHM sales representative before purchasing.
If you intend to export or ship overseas any Product or technology specified herein that may
be controlled under the Foreign Exchange and the Foreign Trade Law, you will be required to
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Thank you for your accessing to ROHM product informations.
More detail product informations and catalogs are available, please contact us.
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© 2011 ROHM Co., Ltd. All rights reserved.
R1120A