PD - 97640 AUTOMOTIVE GRADE ● ● ● ● ● ● ● ● ● AUIRF7342Q Advanced Planar Technology Low On-Resistance Dual P-Channel MOSFET Dynamic dV/dT Rating 150°C Operating Temperature Fast Switching Fully Avalanche Rated Lead-Free, RoHS Compliant Automotive Qualified* HEXFET® Power MOSFET 1 8 D1 G1 2 7 D1 S2 3 6 D2 4 5 D2 S1 G2 Top View V(BR)DSS RDS(on) max. ID -55V 0.105Ω -3.4A Description Specifically designed for Automotive applications, this cellular design of HEXFET® Power MOSFETs utilizes the latest processing techniques to achieve low on-resistance per silicon area. This benefit combined with the fast switching speed and ruggedized device design that HEXFET power MOSFETs are well known for, provides the designer with an extremely efficient and reliable device for use in Automotive and a wide variety of other applications. SO-8 AUIRF7342Q Absolute Maximum Ratings Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only; and functional operation of the device at these or any other condition beyond those indicated in the specifications is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. The thermal resistance and power dissipation ratings are measured under board mounted and still air conditions. Ambient temperature (TA) is 25°C, unless otherwise specified. Max. Units VDS Drain-Source Voltage Parameter -55 V ID @ TA = 25°C Continuous Drain Current, VGS @ -10V -3.4 ID @ TA = 70°C Continuous Drain Current, VGS @ -10V -2.7 -27 c A IDM Pulsed Drain Current PD @TA = 25°C Power Dissipation PD @TA = 70°C Power Dissipation Linear Derating Factor 1.3 0.016 VGS Gate-to-Source Voltage ± 20 V VGSM Gate-to-Source Voltage Single Pulse tp<10μs 30 V 114 mJ 5.0 V/ns -55 to + 150 °C Max. Units 62.5 °C/W 2.0 e EAS Single Pulse Avalanche Energy dv/dt Peak Diode Recovery dv/dt TJ Operating Junction and TSTG Storage Temperature Range e d W mW/°C Thermal Resistance RθJA Junction-to-Ambient g Parameter HEXFET® is a registered trademark of International Rectifier. *Qualification standards can be found at http://www.irf.com/ www.irf.com 1 02/25/2011 AUIRF7342Q Static Electrical Characteristics @ TJ = 25°C (unless otherwise specified) Parameter Min. Typ. Max. Units V(BR)DSS Drain-to-Source Breakdown Voltage ΔV(BR)DSS/ΔTJ Breakdown Voltage Temp. Coefficient RDS(on) Static Drain-to-Source On-Resistance VGS(th) gfs IDSS Gate Threshold Voltage Forward Transconductance Drain-to-Source Leakage Current IGSS Gate-to-Source Forward Leakage Gate-to-Source Reverse Leakage -55 ––– ––– ––– -1.0 3.3 ––– ––– ––– ––– ––– -0.054 0.095 0.150 ––– ––– ––– ––– ––– ––– ––– ––– 0.105 0.170 -3.0 ––– -2.0 -25 -100 100 Conditions V VGS = 0V, ID = -250μA V/°C Reference to 25°C, ID = -1mA VGS = -10V, ID = -3.4A Ω VGS = -4.5V, ID = -2.7A VDS = VGS, ID = -250μA V S VDS = -10V, ID = -3.1A VDS = -55V, VGS = 0V μA VDS = -55V, VGS = 0V, TJ = 55°C VGS = -20V nA VGS = 20V f f Dynamic Electrical Characteristics @ TJ = 25°C (unless otherwise specified) Parameter Min. Typ. Max. Units Qg Qgs Qgd td(on) tr td(off) tf Ciss Coss Crss Total Gate Charge Gate-to-Source Charge Gate-to-Drain ("Miller") Charge Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time Input Capacitance Output Capacitance Reverse Transfer Capacitance ––– ––– ––– ––– ––– ––– ––– ––– ––– ––– 26 3.0 8.4 14 10 43 22 690 210 86 38 4.5 13 22 15 64 32 ––– ––– ––– Min. Typ. Max. nC ns pF Conditions ID = -3.1A VDS = -44V VGS = -10V, See Fig. 10 VDD = -28V ID = -1.0A RG = 6.0Ω RD = 16Ω VGS = 0V VDS = -25V ƒ = 1.0MHz, See Fig. 9 f f Diode Characteristics Parameter IS Continuous Source Current (Body Diode) Pulsed Source Current (Body Diode) Diode Forward Voltage Reverse Recovery Time Reverse Recovery Charge ISM c VSD trr Qrr Notes: Repetitive rating; pulse width limited by max. junction temperature. ( See fig. 11 ) Starting TJ = 25°C, L = 20mH, RG = 25Ω, IAS = -3.4A. (See Figure 8) ISD ≤ -3.4A, di/dt ≤ -150A/μs, VDD ≤ V(BR)DSS, TJ ≤ 150°C. 2 ––– ––– Units -2.0 A ––– ––– -27 ––– ––– ––– ––– 54 85 -1.2 80 130 Conditions MOSFET symbol V ns nC showing the integral reverse D G S p-n junction diode. TJ = 25°C, IS = -2.0A, VGS = 0V TJ = 25°C,IF = -2.0A di/dt = 100A/μs e Pulse width ≤ 300μs; duty cycle ≤ 2%. When mounted on 1 inch square copper board, t<10 sec. www.irf.com e AUIRF7342Q Qualification Information † Automotive (per AEC-Q101) Qualification Level Moisture Sensitivity Level ESD †† Comments: This part number(s) passed Automotive qualification. IR’s Industrial and Consumer qualification level is granted by extension of the higher Automotive level. SO-8 MSL1 Machine Model Class M2 (+/- 200V) AEC-Q101-002 Human Body Model Class H1A (+/- 500V) AEC-Q101-001 Charged Device Model Class C5 (+/- 1125V) AEC-Q101-005 RoHS Compliant ††† ††† ††† Yes Qualification standards can be found at International Rectifiers web site: http//www.irf.com/ Exceptions to AEC-Q101 requirements are noted in the qualification report. Highest passing voltage. www.irf.com 3 AUIRF7342Q 100 100 10 BOTTOM -3.0V 1 ≤60μs PULSE WIDTH 10 BOTTOM -3.0V 1 ≤60μs PULSE WIDTH Tj = 25°C Tj = -40°C 0.1 0.1 0.1 1 10 100 0.1 1000 1 10 100 1000 -V DS, Drain-to-Source Voltage (V) -V DS, Drain-to-Source Voltage (V) Fig 1. Typical Output Characteristics Fig 2. Typical Output Characteristics 100 10 BOTTOM VGS -15V -12V -10V -8.0V -4.5V -4.0V -3.5V -3.0V -3.0V 1 ≤60μs PULSE WIDTH Tj = 150°C 0.1 0.1 1 10 100 -V DS, Drain-to-Source Voltage (V) Fig 3. Typical Output Characteristics 4 1000 -I D, Drain-to-Source Current (A) 100 TOP -ID, Drain-to-Source Current (A) VGS -15V -12V -10V -8.0V -4.5V -4.0V -3.5V -3.0V TOP -ID, Drain-to-Source Current (A) -ID, Drain-to-Source Current (A) TOP VGS -15V -12V -10V -8.0V -4.5V -4.0V -3.5V -3.0V T J = -40°C T J = 25°C T J = 150°C 10 1 VDS = -25V ≤60μs PULSE WIDTH 0.1 1 2 3 4 5 6 -VGS, Gate-to-Source Voltage (V) Fig 4. Typical Transfer Characteristics www.irf.com 7 RDS(on) , Drain-to-Source On Resistance (Normalized) 2.0 R DS (on) , Drain-to-Source On Resistance (Ω) AUIRF7342Q ID = -3.4 A 1.5 1.0 0.5 0.0 -60 -40 -20 VGS = -10V 0 20 40 60 80 100 120 140 160 0.240 0.200 VGS = -4.5V 0.160 0.120 VGS = -10V 0.080 0 2 0.45 0.35 0.25 I D = -3.4 A 0.15 0.05 5 8 11 -V GS , Gate-to-Source Voltage (V) Fig 7. Typical On-Resistance vs. Gate Voltage www.irf.com 6 8 10 12 Fig 6. Typical On-Resistance Vs. Drain Current EAS , Single Pulse Avalanche Energy (mJ) RDS(on) , Drain-to-Source On Resistance ( Ω ) Fig 5. Normalized On-Resistance vs. Temperature 2 4 -ID , Drain Current (A) TJ , Junction Temperature ( °C) 14 A 300 ID -1.5A -2.7A BOTTOM -3.4A TOP 250 200 150 100 50 0 25 50 75 100 125 Starting TJ , Junction Temperature ( °C) Fig 8. Maximum Avalanche Energy vs. Drain Current 5 150 AUIRF7342Q VGS = 0V, f = 1MHz Ciss = Cgs + Cgd , Cds SHORTED Crss = Cgd Coss = Cds + Cgd C, Capacitance (pF) 960 Ciss 720 480 Coss 240 Crss 0 1 10 20 -VGS , Gate-to-Source Voltage (V) 1200 ID = -3.1A 16 12 8 4 0 100 0 -VDS , Drain-to-Source Voltage (V) 20 30 40 Fig 10. Typical Gate Charge vs. Gate-to-Source Voltage 100 T J = -40°C T J = 25°C T J = 150°C 10 VGS = 0V 1.0 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 1.3 1.4 -VSD, Source-to-Drain Voltage (V) Fig 11. Typical Source-Drain Diode Forward Voltage 6 -I D , Drain-to-Source Current (A) -I SD, Reverse Drain Current (A) 10 QG , Total Gate Charge (nC) Fig 9. Typical Capacitance vs. Drain-to-Source Voltage 100 VDS =-48V VDS =-30V VDS =-12V OPERATION IN THIS AREA LIMITED BY R DS(on) 10 100μsec 1msec 1 10msec Tc = 25°C Tj = 150°C Single Pulse 0.1 1 10 100 -V DS , Drain-toSource Voltage (V) Fig 12. Maximum Safe Operating Area www.irf.com AUIRF7342Q 3.5 -I D, Drain Current (A) 3.0 2.5 2.0 1.5 1.0 0.5 0.0 25 50 75 100 125 150 T A , Ambient Temperature (°C) Fig 13. Maximum Drain Current vs. Ambient Temperature Thermal Response (Z thJA ) 100 D = 0.50 0.20 10 0.10 0.05 0.02 1 PDM 0.01 t1 SINGLE PULSE (THERMAL RESPONSE) t2 Notes: 1. Duty factor D = t 1 / t 2 2. Peak T J = P DM x Z thJA + TA 0.1 0.0001 0.001 0.01 0.1 1 10 100 t1, Rectangular Pulse Duration (sec) Fig 14. Maximum Effective Transient Thermal Impedance, Junction-to-Ambient www.irf.com 7 AUIRF7342Q SO-8 Package Outline Dimensions are shown in millimeters (inches) ' ,1&+(6 0,1 0$; $ $ E F ' ( H %$6,& H %$6,& + . / \ ',0 % $ + >@ ( $ ; H H ;E >@ $ $ 0,//,0(7(56 0,1 0$; %$6,& %$6,& .[ & \ >@ ;/ ;F & $ % 127(6 ',0(16,21,1*72/(5$1&,1*3(5$60(<0 &21752//,1*',0(16,210,//,0(7(5 ',0(16,216$5(6+2:1,10,//,0(7(56>,1&+(6@ 287/,1(&21)250672-('(&287/,1(06$$ ',0(16,21'2(6127,1&/8'(02/'3527586,216 02/'3527586,21612772(;&(('>@ ',0(16,21'2(6127,1&/8'(02/'3527586,216 02/'3527586,21612772(;&(('>@ ',0(16,21,67+(/(1*7+2)/($')2562/'(5,1*72 $68%675$7( )22735,17 ;>@ >@ ;>@ ;>@ SO-8 Part Marking F7342Q Note: For the most current drawing please refer to IR website at http://www.irf.com/package/ 8 www.irf.com AUIRF7342Q SO-8 Tape and Reel Dimensions are shown in millimeters (inches) TERMINAL NUMBER 1 12.3 ( .484 ) 11.7 ( .461 ) 8.1 ( .318 ) 7.9 ( .312 ) FEED DIRECTION NOTES: 1. CONTROLLING DIMENSION : MILLIMETER. 2. ALL DIMENSIONS ARE SHOWN IN MILLIMETERS(INCHES). 3. OUTLINE CONFORMS TO EIA-481 & EIA-541. 330.00 (12.992) MAX. 14.40 ( .566 ) 12.40 ( .488 ) NOTES : 1. CONTROLLING DIMENSION : MILLIMETER. 2. OUTLINE CONFORMS TO EIA-481 & EIA-541. www.irf.com 9 AUIRF7342Q Ordering Information Base part number AUIRF7342Q 10 Package Type Standard Pack SO-8 Form Tube Tape and Reel Complete Part Number Quantity 95 2500 AUIRF7342Q AUIRF7342QTR www.irf.com AUIRF7342Q IMPORTANT NOTICE Unless specifically designated for the automotive market, International Rectifier Corporation and its subsidiaries (IR) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or services without notice. Part numbers designated with the “AU” prefix follow automotive industry and / or customer specific requirements with regards to product discontinuance and process change notification. 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