VISHAY SIJ420DP

New Product
SiJ420DP
Vishay Siliconix
N-Channel 20 V (D-S) MOSFET
FEATURES
PRODUCT SUMMARY
RDS(on) (Ω)
ID (A)a, g
0.0026 at VGS = 10 V
50
0.0032 at VGS = 4.5 V
50
VDS (V)
20
Qg (Typ.)
28.7 nC
PowerPAK® SO-8L Single
• Halogen-free According to IEC 61249-2-21
Definition
• TrenchFET® Power MOSFET
• 100 % Rg Tested
• 100 % UIS Tested
• Compliant to RoHS Directive 2002/95/EC
APPLICATIONS
m
5m
6.1
• POL
• OR-ing
• DC/DC
5.1
3m
m
D
D
4
G
S
G
3
S
2
S
1
S
Ordering Information: SiJ420DP-T1-GE3 (Lead (Pb)-free and Halogen-free)
N-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS TA = 25 °C, unless otherwise noted
Parameter
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current (TJ = 150 °C)
Symbol
VDS
VGS
TC = 25 °C
TC = 70 °C
TA = 25 °C
TA = 70 °C
Single Pulse Avalanche Current
Single Pulse Avalanche Energy
Maximum Power Dissipation
ID
TC = 25 °C
TA = 25 °C
IS
L = 0.1 mH
IAS
EAS
TC = 25 °C
TC = 70 °C
TA = 25 °C
TA = 70 °C
PD
TJ, Tstg
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature)d, e
Unit
V
50g
50g
32b, c
25.3b, c
80
IDM
Pulsed Drain Current
Continuous Source-Drain Diode Current
Limit
20
± 20
50g
4.3b, c
30
45
62.5
40
A
mJ
4.8b, c
3.0b, c
- 55 to 150
260
W
°C
THERMAL RESISTANCE RATINGS
Parameter
Maximum Junction-to-Ambientb, f
Maximum Junction-to-Case (Drain)
t ≤ 10 s
Steady State
Symbol
RthJA
RthJC
Typical
22
1.4
Maximum
26
2.0
Unit
°C/W
Notes:
a. Based on TC = 25 °C.
b. Surface mounted on 1" x 1" FR4 board.
c. t = 10 s.
d. See solder profile (www.vishay.com/ppg?73257). The PowerPAK SO-8L is a leadless package. The end of the lead terminal is exposed copper
(not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not
required to ensure adequate bottom side solder interconnection.
e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.
f. Maximum under steady state conditions is 65 °C/W.
g. Package limited.
Document Number: 65707
S10-0463-Rev. A, 22-Feb-10
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New Product
SiJ420DP
Vishay Siliconix
SPECIFICATIONS TJ = 25 °C, unless otherwise noted
Parameter
Symbol
Test Conditions
Min.
VDS
VGS = 0 V, ID = 250 µA
20
Typ.
Max.
Unit
Static
Drain-Source Breakdown Voltage
ΔVDS/TJ
VDS Temperature Coefficient
V
20
ID = 250 µA
mV/°C
VGS(th) Temperature Coefficient
ΔVGS(th)/TJ
Gate-Source Threshold Voltage
VGS(th)
VDS = VGS, ID = 250 µA
2.4
V
Gate-Source Leakage
IGSS
VDS = 0 V, VGS = ± 20 V
± 100
nA
Zero Gate Voltage Drain Current
IDSS
VDS = 20 V, VGS = 0 V
1
VDS = 20 V, VGS = 0 V, TJ = 55 °C
10
On-State Drain Currenta
ID(on)
Drain-Source On-State Resistancea
Forward Transconductancea
RDS(on)
gfs
VDS ≥ 5 V, VGS = 10 V
- 6.7
1.2
30
µA
A
VGS = 10 V, ID = 15 A
0.0021
0.0026
VGS = 4.5 V, ID = 10 A
0.0026
0.0032
VDS = 10 V, ID = 15 A
63
Ω
S
b
Dynamic
Input Capacitance
Ciss
Output Capacitance
Coss
Reverse Transfer Capacitance
Crss
Total Gate Charge
Qg
Gate-Source Charge
Qgs
Gate-Drain Charge
Qgd
Gate Resistance
Rg
3630
VDS = 10 V, VGS = 0 V, f = 1 MHz
453
VDS = 10 V, VGS = 10 V, ID = 10 A
VDS = 10 V, VGS = 4.5 V, ID = 10 A
tr
Rise Time
td(off)
Turn-Off Delay Time
Fall Time
Turn-On Delay Time
f = 1 MHz
VDD = 10 V, RL = 1 Ω
ID ≅ 10 A, VGEN = 4.5 V, Rg = 1 Ω
44
8.9
0.3
1.2
2.4
29
55
16
30
40
75
26
td(on)
12
24
VDD = 10 V, RL = 1 Ω
ID ≅ 10 A, VGEN = 10 V, Rg = 1 Ω
tf
Fall Time
28.7
13
td(off)
Turn-Off Delay Time
90
tf
tr
Rise Time
60
nC
7.4
td(on)
Turn-On Delay Time
pF
1085
9
18
32
60
9
18
Ω
ns
Drain-Source Body Diode Characteristics
Continuous Source-Drain Diode Current
a
IS
Pulse Diode Forward Current
ISM
Body Diode Voltage
VSD
Body Diode Reverse Recovery Time
trr
Body Diode Reverse Recovery Charge
Qrr
Reverse Recovery Fall Time
ta
Reverse Recovery Rise Time
tb
TC = 25 °C
50
80
IS = 4 A
IF = 10 A, dI/dt = 100 A/µs, TJ = 25 °C
A
0.74
1.1
V
30
60
ns
20
40
nC
16
14
ns
Notes:
a. Pulse test; pulse width ≤ 300 µs, duty cycle ≤ 2 %.
b. Guaranteed by design, not subject to production testing.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
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Document Number: 65707
S10-0463-Rev. A, 22-Feb-10
New Product
SiJ420DP
Vishay Siliconix
TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted
70
10
VGS = 10 V thru 4 V
8
ID - Drain Current (A)
ID - Drain Current (A)
56
42
28
14
6
TC = 25 °C
4
TC = 125 °C
2
TC = - 55 °C
3V
0
0
0.5
1.0
1.5
2.0
0
2.5
0
1
VDS - Drain-to-Source Voltage (V)
2
3
4
5
VGS - Gate-to-Source Voltage (V)
Output Characteristics
Transfer Characteristics
0.0035
4500
0.0031
3600
C - Capacitance (pF)
RDS(on) - On-Resistance (Ω)
Ciss
VGS = 4.5 V
0.0027
0.0023
VGS = 10 V
0.0019
2700
1800
Coss
900
Crss
0.0015
0
0
14
28
42
56
70
0
8
12
16
ID - Drain Current (A)
VDS - Drain-to-Source Voltage (V)
On-Resistance vs. Drain Current and Gate Voltage
Capacitance
10
20
1.8
ID = 10 A
ID = 15 A
8
VDS = 5 V
1.5
RDS(on) - On-Resistance
(Normalized)
VGS - Gate-to-Source Voltage (V)
4
6
VDS = 10 V
4
VDS = 15 V
VGS = 10 V
1.2
VGS = 4.5 V
0.9
2
0
0
13
26
39
52
65
0.6
- 50
- 25
0
25
50
75
100
125
Qg - Total Gate Charge (nC)
TJ - Junction Temperature (°C)
Gate Charge
On-Resistance vs. Junction Temperature
Document Number: 65707
S10-0463-Rev. A, 22-Feb-10
150
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New Product
SiJ420DP
Vishay Siliconix
TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted
0.015
100
ID = 15 A
0.012
RDS(on) - On-Resistance (Ω)
IS - Source Current (A)
10
TJ = 150 °C
1
TJ = 25 °C
0.1
0.01
0.001
0.0
0.009
0.006
TJ = 125 °C
0.003
TJ = 25 °C
0.000
0.2
0.4
0.6
0.8
1.0
0
1.2
2
6
8
10
VGS - Gate-to-Source Voltage (V)
VSD - Source-to-Drain Voltage (V)
Source-Drain Diode Forward Voltage
On-Resistance vs. Gate-to-Source Voltage
0.5
200
0.2
160
- 0.1
Power (W)
VGS(th) - Variance (V)
4
ID = 5 mA
- 0.4
120
80
ID = 250 μA
- 0.7
- 1.0
- 50
40
- 25
0
25
50
75
100
125
0
0.001
150
0.01
TJ - Junction Temperature (°C)
0.1
1
10
Time (s)
Threshold Voltage
Single Pulse Power, Junction-to-Ambient
100
Limited by RDS(on)*
1 ms
ID - Drain Current (A)
10
10 ms
100 ms
1
1s
10 s
0.1
DC
BVDSS Limited
TA = 25 °C
Single Pulse
0.01
0.01
0.1
1
10
100
VDS - Drain-to-Source Voltage (V)
* VGS > minimum VGS at which RDS(on) is specified
Safe Operating Area, Junction-to-Ambient
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Document Number: 65707
S10-0463-Rev. A, 22-Feb-10
New Product
SiJ420DP
Vishay Siliconix
TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted
135
ID - Drain Current (A)
108
81
Package Limited
54
27
0
0
25
50
75
100
125
150
TC - Case Temperature (°C)
90
2.5
72
2.0
54
1.5
Power (W)
Power (W)
Current Derating*
36
18
1.0
0.5
0
0
0
25
50
75
100
125
150
0
25
50
75
100
125
TC - Case Temperature (°C)
TA - Ambient Temperature (°C)
Power, Junction-to-Case
Power, Junction-to-Ambient
150
* The power dissipation PD is based on TJ(max) = 150 °C, using junction-to-case thermal resistance, and is more useful in settling the upper
dissipation limit for cases where additional heatsinking is used. It is used to determine the current rating, when this rating falls below the package
limit.
Document Number: 65707
S10-0463-Rev. A, 22-Feb-10
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New Product
SiJ420DP
Vishay Siliconix
TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted
1
Normalized Effective Transient
Thermal Impedance
Duty Cycle = 0.5
0.2
Notes:
0.1
PDM
0.1
t1
0.05
t2
1. Duty Cycle, D =
t1
t2
2. Per Unit Base = RthJA = 65 °C/W
0.02
3. TJM - TA = PDMZthJA (t)
Single Pulse
4. Surface Mounted
0.01
10-4
10-3
10-2
10-1
1
10
100
1000
Square Wave Pulse Duration (s)
Normalized Thermal Transient Impedance, Junction-to-Ambient
1
Normalized Effective Transient
Thermal Impedance
Duty Cycle = 0.5
0.2
0.1
0.1
0.05
0.02
Single Pulse
0.01
10-4
10-3
10-2
10-1
1
10
Square Wave Pulse Duration (s)
Normalized Thermal Transient Impedance, Junction-to-Case
Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon
Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and
reliability data,see www.vishay.com/ppg?65707.
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Document Number: 65707
S10-0463-Rev. A, 22-Feb-10
Legal Disclaimer Notice
Vishay
Disclaimer
All product specifications and data are subject to change without notice.
Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf
(collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained herein
or in any other disclosure relating to any product.
Vishay disclaims any and all liability arising out of the use or application of any product described herein or of any
information provided herein to the maximum extent permitted by law. The product specifications do not expand or
otherwise modify Vishay’s terms and conditions of purchase, including but not limited to the warranty expressed
therein, which apply to these products.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this
document or by any conduct of Vishay.
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications unless
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applications do so entirely at their own risk and agree to fully indemnify Vishay for any damages arising or resulting
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Product names and markings noted herein may be trademarks of their respective owners.
Document Number: 91000
Revision: 18-Jul-08
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