TOSHIBA TPCA8109

TPCA8109
TOSHIBA Field Effect Transistor Silicon P Channel MOS Type (U-MOSⅥ)
TPCA8109
Lithium Ion Battery Applications
Power Management Switch Applications
Unit: mm
1.27 0.4 ± 0.1
8
0.95 ± 0.05
Absolute Maximum Ratings (Ta = 25°C)
Symbol
Rating
Unit
Drain-source voltage
VDSS
−30
V
Drain-gate voltage (RGS = 20 kΩ)
VDGR
−30
V
Gate-source voltage
VGSS
−25/+20
V
(Note 1)
ID
−24
Pulsed (Note 1)
IDP
−72
PD
30
W
PD
2.8
W
PD
1.6
W
EAS
75
mJ
Avalanche current
IAR
−24
A
TOSHIBA
Channel temperature
Tch
150
°C
Weight: 0.076 g (typ.)
Storage temperature range
Tstg
−55 to 150
°C
Drain current
DC
Drain power dissipation
Drain power dissipation
(Tc=25°C)
(t = 10 s)
(Note 2a)
Drain power dissipation
(t = 10 s)
(Note 2b)
Single pulse avalanche energy
(Note 3)
0.595
5.0 ± 0.2
0.05 S
S
4
1
0.6 ± 0.1
Characteristics
4
1
0.166 ± 0.05
Enhancement mode: Vth = −0.8 to −2.0 V (VDS = −10 V, ID = −0.5mA)
4.25 ± 0.2
A
Note: For Notes 1 to 3, refer to the next page.
A
1.1 ± 0.2
Low leakage current: IDSS = −10 μA (max) (VDS = −30 V)
•
3.5 ± 0.2
•
0.15 ± 0.05
8
5
0.8 ± 0.1
Low drain-source ON-resistance: RDS (ON) = 7 mΩ (typ.)
5.0 ± 0.2
Small footprint due to small and thin package
•
6.0 ± 0.3
•
0.05 M A
5
1,2,3：SOURCE
4：GATE
5,6,7,8：DRAIN
JEDEC
―
JEITA
―
2-5Q1A
Circuit Configuration
Using continuously under heavy loads (e.g. the application of high
temperature/current/voltage and the significant change in
temperature, etc.) may cause this product to decrease in the
reliability significantly even if the operating conditions (i.e.
operating temperature/current/voltage, etc.) are within the
absolute maximum ratings. Please design the appropriate
reliability upon reviewing the Toshiba Semiconductor Reliability
Handbook (“Handling Precautions”/“Derating Concept and
Methods”) and individual reliability data (i.e. reliability test report
and estimated failure rate, etc).
8
7
6
5
1
2
3
4
This transistor is an electrostatic sensitive device. Please handle with
caution.
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TPCA8109
Thermal Characteristics
Characteristics
Thermal resistance, channel to case
(Tc=25°C)
Thermal resistance, channel to ambient
(t = 10 s)
(Note 2a)
Thermal resistance, channel to ambient
(t = 10 s)
(Note 2b)
Symbol
Max
Unit
Rth (ch-c)
4.17
°C/W
Rth (ch-a)
44.6
°C/W
Rth (ch-a)
78.1
°C/W
Marking (Note 4)
TPCA
8109
Type
Lot No.
*
Note 1: Please use devices on condition that the channel temperature is below 150°C.
Note 2: (a) Device mounted on a glass-epoxy board (a)
(b) Device mounted on a glass-epoxy board (b)
FR-4
25.4 × 25.4 × 0.8
(Unit: mm)
FR-4
25.4 × 25.4 × 0.8
(Unit: mm)
(b)
(a)
Note 3: VDD = −24 V, Tch = 25°C (initial), L = 100μH, RG = 25 Ω, IAR = -24 A
Note 4: * Weekly code: (Three digits)
Week of manufacture
(01 for first week of year, continues up to 52 or 53)
Year of manufacture
(One low-order digits of calendar year)
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TPCA8109
Electrical Characteristics (Ta = 25°C)
Characteristics
Symbol
Test Condition
Min
Typ.
Max
Unit
Gate leakage current
IGSS
VGS = ±20 V, VDS = 0 V
⎯
⎯
±100
nA
Drain cut-OFF current
IDSS
VDS = −30 V, VGS = 0 V
⎯
⎯
−10
μA
V (BR) DSS
ID = −10 mA, VGS = 0 V
−30
⎯
⎯
V (BR) DSX
ID = −10 mA, VGS = 10 V (Note5)
−21
⎯
⎯
VDS = −10 V, ID = − 0.5 mA
−0.8
⎯
−2.0
VGS = −4.5V, ID = −12 A
⎯
10
13
VGS = −10 V, ID = −12 A
⎯
7
9
⎯
2400
⎯
⎯
400
⎯
⎯
460
⎯
⎯
9.2
⎯
⎯
16
⎯
⎯
58
⎯
⎯
172
⎯
⎯
56
⎯
⎯
5.6
⎯
⎯
15
⎯
Vth
Drain-source ON resistance
RDS (ON)
Input capacitance
Ciss
Reverse transfer capacitance
Crss
Output capacitance
Coss
Rise time
tr
Turn-on time
ton
VDS = −10 V, VGS = 0 V, f = 1 MHz
0V
VGS
−10 V
Switching time
Fall time
ID = −12 A
VOUT
RL = 1.25 Ω
Gate threshold voltage
4.7 Ω
Drain-source breakdown voltage
tf
V
V
mΩ
pF
ns
VDD ≈ −15 V
Turn-off time
toff
Total gate charge
(gate-source plus gate-drain)
Duty ≤ 1%, tw = 10 μs
Qg
Gate-source charge 1
Qgs1
Gate-drain (“miller”) charge
Qgd
VDD ≈ −24 V, VGS = −10 V,
ID = −24 A
nC
Source-Drain Ratings and Characteristics (Ta = 25°C)
Characteristics
Drain reverse current
Forward voltage (diode)
Pulse
(Note 1)
Symbol
Test Condition
Min
Typ.
Max
Unit
IDRP
⎯
⎯
⎯
−72
A
⎯
⎯
1.2
V
VDSF
IDR = −24 A, VGS = 0 V
Note 5: V(BR)DSX mode (the application of a plus voltage between gate and source) may cause decrease in maximum
rating of drain-source voltage.
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TPCA8109
ID – VDS
−10 −6 −4.5
−10
−2.6
−3
ID – VDS
−8
(A)
ID
−6
−10
−3.6
−3.2
−6
−2.3
(A)
−2.2
Drain current
ID
Drain current
−50
Common source
−2.4
Ta = 25°C
Pulse test
−4
−2.1
−2
−40
−3
Common source
Ta = 25°C
Pulse test
−4.5
−2.8
−30
−2.6
−20
−2.4
−10
−2
−2.2
VGS = −1.9 V
0
0
−0.2
−0.4
−0.6
−0.8
Drain−source voltage
VDS
0
0
−1
(V)
−0.4
−20
VDS (V)
25
Ta = −55°C
100
−10
0
0
−1
(V)
VDS – VGS
Drain−source voltage
Drain current
(A)
ID
−30
VDS
−0.5
Common source
VDS = −10 V
Pulse test
−40
VGS = −2 V
−1.6
−2
−1.2
Drain-source voltage
ID – VGS
−50
−0.8
−2
−3
Gate−source voltage
VGS
−0.4
−0.3
−0.2
(V)
ID = −24 A
−0.1
−12
−6
0
0
−4
Common source
Ta = 25°C
Pulse test
−4
−8
−12
Gate−source voltage
−16
VGS
−20
(V)
RDS (ON) – ID
Drain−source ON-resistance
RDS (ON) (mΩ)
100
Common source
Ta = 25°C
Pulse test
−4.5
10
VGS = −10 V
1
−0.1
−1
Drain current
−10
ID
−100
(A)
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TPCA8109
RDS (ON) – Ta
IDR – VDS
−100
20
IDR
ID = −6, −12, −24 A
12
VGS = −4.5 V
8
ID = −6, −12, −24 A
VGS = −10 V
4
0
−80
−40
−10
(A)
16
Drain reverse current
Drain-source ON-resistance
RDS (ON) (mΩ)
Common source
Pulse test
0
40
80
Ambient temperature
120
Ta
−1
−10
VGS = 0 V
−1
Common source
Ta = 25°C
Pulse test
−0.1
0
160
−3
−4.5
(°C)
0.2
0.4
Drain−source voltage
Capacitance – VDS
0.8
VDS
1
1.2
(V)
Vth – Ta
−2
(pF)
Vth (V)
10000
Gate threshold voltage
Ciss
C
Capacitance
0.6
1000
Coss
Crss
Common source
VGS = 0 V
f = 1 MHz
Ta = 25°C
100
−0.1
−1
−10
Drain−source voltage
−1.2
−0.8
−0.4
0
−80
−100
VDS
−1.6
Common source
VDS = −10 V
ID = −0.5mA
Pulse test
−40
0
40
Ambient temperature
(V)
80
Ta
120
160
(°C)
VDD = −24 V
VDS
−20
−20
−15
−15
−6
−12
VDD = −24 V
−10
−12
−6
−5
−5
0
0
−10
VGS
20
40
Total gate charge
60
Qg
80
100
VGS
−25
−30
Common source
ID = −24 A
Ta = 25°C
−25
Pulse test
Gate−source voltage
Drain−source voltage
VDS (V)
−30
(V)
Dynamic input/output
characteristics
0
(nC)
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TPCA8109
rth − tw
Transient thermal impedance
rth (°C/W)
1000
100
(1) Device mounted on a glass-epoxy board (a) (Note 2a)
(2) Device mounted on a glass-epoxy board (b) (Note 2b)
(3) Tc = 25℃
(2)
(1)
10
(3)
1
0.1
Single Pulse
0.01
0.0001
0.001
0.01
0.1
1
Pulse width
tw
10
100
(s)
PD – Tc
PD – Ta
(Note 2a)
(W)
board(a)
(1)
(2)Device mounted on a glass-epoxy
board(b)
(Note 2b)
PD
2.5
t = 10 s
2
Drain power dissipation
Drain power dissipation
40
(1)Device mounted on a glass-epoxy
PD
(W)
3
(2)
1.5
1
0.5
0
0
40
80
Ambient temperature
1000
120
Ta
30
20
10
0
160
0
40
80
Case temperature
(°C)
120
Tc
160
(°C)
Safe operating area
−100 ID max (Pulse) *
Drain current
ID
(A)
−1000
1 ms *
t = 10 ms *
−10
−1
*: Single pulse
Ta = 25°C
Curves must be derated
linearly with increase in
temperature.
−0.1
−0.1
−1
Drain−source voltage
VDSS max
−10
VDS
−100
(V)
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TPCA8109
RESTRICTIONS ON PRODUCT USE
• Toshiba Corporation, and its subsidiaries and affiliates (collectively “TOSHIBA”), reserve the right to make changes to the information
in this document, and related hardware, software and systems (collectively “Product”) without notice.
• This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with
TOSHIBA’s written permission, reproduction is permissible only if reproduction is without alteration/omission.
• Though TOSHIBA works continually to improve Product’s quality and reliability, Product can malfunction or fail. Customers are
responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and
systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily
injury or damage to property, including data loss or corruption. Before customers use the Product, create designs including the
Product, or incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions of
all relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes
for Product and the precautions and conditions set forth in the “TOSHIBA Semiconductor Reliability Handbook” and (b) the
instructions for the application with which the Product will be used with or for. Customers are solely responsible for all aspects of their
own product design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such
design or applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts,
diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating
parameters for such designs and applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS’ PRODUCT DESIGN OR
APPLICATIONS.
• Product is intended for use in general electronics applications (e.g., computers, personal equipment, office equipment, measuring
equipment, industrial robots and home electronics appliances) or for specific applications as expressly stated in this document.
Product is neither intended nor warranted for use in equipment or systems that require extraordinarily high levels of quality and/or
reliability and/or a malfunction or failure of which may cause loss of human life, bodily injury, serious property damage or serious
public impact (“Unintended Use”). Unintended Use includes, without limitation, equipment used in nuclear facilities, equipment used
in the aerospace industry, medical equipment, equipment used for automobiles, trains, ships and other transportation, traffic signaling
equipment, equipment used to control combustions or explosions, safety devices, elevators and escalators, devices related to electric
power, and equipment used in finance-related fields. Do not use Product for Unintended Use unless specifically permitted in this
document.
• Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part.
• Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any
applicable laws or regulations.
• The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any
infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to
any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise.
• ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE
FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY
WHATSOEVER, INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR
LOSS, INCLUDING WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND
LOSS OF DATA, AND (2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO
SALE, USE OF PRODUCT, OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS
FOR A PARTICULAR PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT.
• Do not use or otherwise make available Product or related software or technology for any military purposes, including without
limitation, for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile
technology products (mass destruction weapons). Product and related software and technology may be controlled under the
Japanese Foreign Exchange and Foreign Trade Law and the U.S. Export Administration Regulations. Export and re-export of Product
or related software or technology are strictly prohibited except in compliance with all applicable export laws and regulations.
• Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product.
Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances,
including without limitation, the EU RoHS Directive. TOSHIBA assumes no liability for damages or losses occurring as a result of
noncompliance with applicable laws and regulations.
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