TPC6109-H TOSHIBA Field Effect Transistor Silicon P Channel MOS Type (Ultra-High-Speed U-MOSIII) TPC6109-H High-Efficiency DC-DC Converter Applications Unit: mm • Small footprint due to small and thin package • Low drain-source ON-resistance: RDS (ON) = 44 mΩ (typ.) (VDS = −10 V) • High forward transfer admittance: |Yfs| = 8.0 S (typ.) • Low leakage current: IDSS = −10 μA (max) (VDS = −30 V) • Enhancement mode: Vth = −0.8 to −2.0 V (VDS = −10 V, ID = −1 mA) Absolute Maximum Ratings (Ta = 25°C) Characteristics Symbol Rating Unit Drain-source voltage VDSS −30 V 1. Drain 4. Source Drain-gate voltage (RGS = 20 kΩ) VDGR −30 V 2. Drain 5. Drain V 3. Gate 6. Drain Gate-source voltage VGSS ±20 DC (Note 1) ID −5 Pulse (Note 1) IDP −20 Drain power dissipation (t = 5 s) (Note 2a) PD 2.2 Drain power dissipation (t = 5 s) (Note 2b) PD 0.7 (Note 3) EAS 16.3 mJ IAR −5 A EAR 0.055 mJ Channel temperature Tch 150 °C Storage temperature range Tstg −55 to150 °C Drain current Single-pulse avalanche energy Avalanche current Repetitive avalanche energy (Note 4) A W JEDEC ⎯ JEITA ⎯ TOSHIBA 2-3T1A Weight: 0.011 g (typ.) Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook (“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test report and estimated failure rate, etc). Thermal Characteristics Circuit Configuration Characteristics Symbol Max Unit Thermal resistance, channel to ambient (t = 5 s) (Note 2a) Rth (ch-a) 56.8 °C/W Thermal resistance, channel to ambient (t = 5 s) (Note 2b) Rth (ch-a) 178.5 °C/W Note: For Notes 1 to 5, see page 3. 6 5 4 1 2 3 Caution: This transistor is an electrostatic-sensitive device. Handle with care. 1 2010-02-01 TPC6109-H Marking (Note 5) Lot code (month) Lot No. (weekly code) S3J Part No. (or abbreviation code) Product-specific code Pin #1 Lot code (year) Note６ Note 1: Ensure that the channel temperature does not exceed 150℃. Note 2: (a) Device mounted on a glass-epoxy board (a) (t = 5 s) (b) Device mounted on a glass-epoxy board (b) (t = 5 s) FR-4 25.4 × 25.4 × 0.8 (Unit: mm) FR-4 25.4 × 25.4 × 0.8 (Unit: mm) (a) (b) Note 3: VDD = −24 V,Tch = 25°C (initial), L = 500 μH, RG = 25 Ω, IAR = -5 A Note 4: Repetitive rating: pulse width limited by max channel temperature Note 5: ● to the lower left of the Part No. marking indicates Pin 1. Note 6: A dot marking identifies the indication of product Labels. Without a dot: [[Pb]]/INCLUDES > MCV With a dot: [[G]]/RoHS COMPATIBLE or [[G]]/RoHS [[Pb]] Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product. The RoHS is the Directive 2002/95/EC of the European Parliament and of the Council of 27 January 2003 on the restriction of the use of certain hazardous substances in electrical and electronic equipment. 2 2010-02-01 TPC6109-H Electrical Characteristics (Ta = 25°C) Characteristic IGSS Drain cut-off current Drain-source breakdown voltage Gate threshold voltage Drain-source ON resistance Forward transfer admittance Max Unit ⎯ ⎯ ±10 μA μA VDS = −30 V, VGS = 0 V ⎯ ⎯ −10 ID = −10 mA, VGS = 0 V −30 ⎯ ⎯ V (BR) DSX ID = −10 mA, VGS = 20 V −15 ⎯ ⎯ Vth VDS = −10 V, ID = − 1 mA −0.8 ⎯ −2.0 RDS (ON) VGS = −4.5 V, ID = −2.5 A ⎯ 64 83 RDS (ON) VGS = −10 V, ID = −2.5 A ⎯ 44 59 |Yfs| VDS = −10 V, ID = −2.5 A 4.0 8.0 ⎯ ⎯ 490 ⎯ ⎯ 105 ⎯ ⎯ 150 ⎯ ID = −2.5 A VOUT ⎯ 5.1 ⎯ ⎯ 10.7 ⎯ ⎯ 8.0 ⎯ Duty ≤ 1%, tw = 10 μs ⎯ 33.5 ⎯ VDD ≈ −24 V, VGS = −10 V, ID = −5 A ⎯ 12.3 ⎯ VDD ≈ −24 V, VGS = −5 V, ID = −5 A ⎯ 7.2 ⎯ ⎯ 1.7 ⎯ ⎯ 3.6 ⎯ ⎯ 4.8 ⎯ Ciss Crss Output capacitance Coss tr ton VDS = −10 V, VGS = 0 V, f = 1 MHz VGS 0V −10 V 4.7 Ω Switching time Fall time Typ. IDSS Reverse transfer capacitance Turn-on time VGS = ±16 V, VDS = 0 V Min V (BR) DSS Input capacitance Rise time Test Condition RL = 6 Ω Gate leakage current Symbol tf V V mΩ S pF ns VDD ≈ −15 V Turn-off time Total gate charge (gate-source plus gate-drain) toff Qg Gate-source charge1 Qgs1 Gate-drain (“Miller”) charge Qgd Gate switch charge QSW VDD ≈ −24 V, VGS = −10 V, ID = −5 A nC Source-Drain Ratings and Characteristics (Ta = 25°C) Characteristic Drain reverse current Forward voltage (diode) Pulse (Note 1) Symbol Test Condition Min Typ. Max Unit IDRP ⎯ ⎯ ⎯ −20 A ⎯ ⎯ 1.2 V VDSF IDR = −5 A, VGS = 0 V 3 2010-02-01 TPC6109-H ID – VDS −10 −5 −4 −3.5 −3.2 −3 (A) −6 Common source Ta = 25°C Pulse test −3 −2.8 −2 Drain Current Drain Current ID (A) −8 −4 ID – VDS −10 ID −5 −2.6 −2.4 −1 −8 −4 Common source Ta = 25°C Pulse test −3.5 −6 −8 −3.2 −10 −3 −6 −2.8 −4 −2.6 −2 −2.4 VGS = −2.2 V 0 0 −0.2 −0.4 −0.6 −0.8 Drain-source voltage VDS VGS = −2.2 V 0 0 −1 (V) −2 −4 Drain-source voltage ID – VGS VDS −10 (V) VDS – VGS (V) Common source VDS = −10 V Pulse test Common source Ta = 25°C Pulse test −0.4 VDS −8 −8 −0.5 −6 Drain-source voltage Drain Current ID (A) −10 −6 −4 −2 100°C 25°C −0.3 −0.2 ID = −5 A −2.5 A −0.1 −1.2A Ta = −55°C 0 −1 −1.5 −2 −3 −2.5 Gate-source voltage −3.5 VGS 0 0 −4 (V) |Yfs| – ID −15 VGS Ta = −55°C 25°C 10 100°C 1 Common source VDS = −10 V Pulse test −1 Drain Current −20 (V) RDS (ON) – ID 1000 −10 ID Drain-source ON-resistance RDS (ON) (mΩ) Forward transfer admittance |Yfs| (S) −10 Gate-source voltage 100 0.1 −0.1 −5 100 −4.5 V VGS = −10 V 10 −0.1 −100 Common source Ta = 25°C Pulse test −1 Drain Current (A) 4 −10 ID (A) 2010-02-01 TPC6109-H RDS (ON) – Ta IDR – VDS −100 100 −2.5 A IDR ID = −5 A −1.2A 60 VGS = −4.5 ID = −5 , −2.5 , −1.2 A VGS = −10 V 0 −80 −40 0 40 Ambient temperature 80 120 Ta −3 V Common source Ta = 25°C Pulse test 0.2 (°C) 0.4 Capacitance – VDS Vth (V) Gate threshold voltage (pF) C Capacitance Coss Crss Common source VGS = 0 V f = 1 MHz Ta = 25°C −1 −10 Drain-source voltage VDS −1.5 −1 −0.5 0 40 80 Ambient temperature Ta 120 160 (°C) Dynamic Input/Output Characteristics −40 VDS 2 (V) (1) Device mounted on a glass-epoxy board (a) (Note 2a) (2) Device mounted on a glass-epoxy board (b) (Note 2b) (1) t = 5 s (W) −40 (V) PD – Ta 1.5 Drain-source voltage PD (V) Common source VDS = −10 V ID = −1mA Pulse test 0 −80 −100 2.5 Drain power dissipation 1.2 Vth – Ta 100 10 −0.1 1 VDS −2 Ciss (1) DC 1 (2) t = 5 s 0 0 0.8 0.6 Drain-source voltage 1000 0.5 VGS = 0 V −1 −0.1 0 160 −1 V (2) DC 40 80 Ambient temperature 120 Ta (°C) −14 −12 VDD = −24 V −25 −6V −20 −15 VDD = −24 V −10 −8 −6 −12 V VGS −10 −4 −6 V −5 −2 2 4 6 8 Total gate charge 5 −12V VDS 0 0 160 −16 Common source ID = −5A −35 Ta = 25°C Pulse test −30 (V) 20 −10 VGS 40 −5 V −10 V Gate-source voltage 80 Drain reverse current Drain-source ON-resistance RDS (ON) (mΩ) Pulse test (A) Common source 0 10 12 Qg (nC) 14 16 2010-02-01 TPC6109-H rth – tw 1000 (1) Device mounted on a glass-epoxy board (a) (Note 2a) (2) Transient thermal impedance rth (°C/W) (2) Device mounted on a glass-epoxy board (b) (Note 2b) (1) 100 10 1 Single pulse 0.1 0.001 0.01 0.1 1 Pulse width 10 tw 100 1000 (s) Safe Operating Area −100 (A) ID max (Pulse)* 1 ms* −10 Drain Current ID 10 ms* −1 *: Single pulse Ta = 25°C Curves must be derated linearly with increase in temperature. −0.1 −0.1 −1 Drain-source voltage VDSS max −10 VDS −100 (V) 6 2010-02-01 TPC6109-H RESTRICTIONS ON PRODUCT USE • Toshiba Corporation, and its subsidiaries and affiliates (collectively “TOSHIBA”), reserve the right to make changes to the information in this document, and related hardware, software and systems (collectively “Product”) without notice. • This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with TOSHIBA’s written permission, reproduction is permissible only if reproduction is without alteration/omission. • Though TOSHIBA works continually to improve Product’s quality and reliability, Product can malfunction or fail. Customers are responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily injury or damage to property, including data loss or corruption. Before customers use the Product, create designs including the Product, or incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions of all relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes for Product and the precautions and conditions set forth in the “TOSHIBA Semiconductor Reliability Handbook” and (b) the instructions for the application with which the Product will be used with or for. Customers are solely responsible for all aspects of their own product design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such design or applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts, diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating parameters for such designs and applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS’ PRODUCT DESIGN OR APPLICATIONS. • Product is intended for use in general electronics applications (e.g., computers, personal equipment, office equipment, measuring equipment, industrial robots and home electronics appliances) or for specific applications as expressly stated in this document. Product is neither intended nor warranted for use in equipment or systems that require extraordinarily high levels of quality and/or reliability and/or a malfunction or failure of which may cause loss of human life, bodily injury, serious property damage or serious public impact (“Unintended Use”). Unintended Use includes, without limitation, equipment used in nuclear facilities, equipment used in the aerospace industry, medical equipment, equipment used for automobiles, trains, ships and other transportation, traffic signaling equipment, equipment used to control combustions or explosions, safety devices, elevators and escalators, devices related to electric power, and equipment used in finance-related fields. Do not use Product for Unintended Use unless specifically permitted in this document. • Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part. • Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any applicable laws or regulations. • The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise. • ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY WHATSOEVER, INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR LOSS, INCLUDING WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND LOSS OF DATA, AND (2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO SALE, USE OF PRODUCT, OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT. • Do not use or otherwise make available Product or related software or technology for any military purposes, including without limitation, for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile technology products (mass destruction weapons). Product and related software and technology may be controlled under the Japanese Foreign Exchange and Foreign Trade Law and the U.S. Export Administration Regulations. Export and re-export of Product or related software or technology are strictly prohibited except in compliance with all applicable export laws and regulations. • Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product. Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS Directive. TOSHIBA assumes no liability for damages or losses occurring as a result of noncompliance with applicable laws and regulations. 7 2010-02-01