TLP525G,TLP525G−2,TLP525G−4 TOSHIBA Photocoupler GaAs IRed & Photo−Triac TLP525G,TLP525G−2,TLP525G−4 Triac Drive Programmable Controllers AC−Output Module Solid State Relay Unit in mm The TOSHIBA TLP525G, −2 and −4 consist of a photo−triac optically coupled to a gallium arsenide infrared emitting diode. The TLP525G−2 offers two isolated channels in an eight lead plastic DIP package, while the TLP525G−4 provides four isolated channels in a sixteen lead plastic DIP package. • Peak off−stage voltage: 400V (min.) • Trigger LED current: 10mA (max.) • Peak on−stage current: 2Apk (max.) • Isolation voltage: 2500Vrms (min.) • UL recognized: File no.E67349 TOSHIBA 11−5B2 Weight: 0.26g Pin Configurations (top view) TOSHIBA 11−10C4 Weight: 0.54g TOSHIBA 11−20A3 Weight: 1.1g 1 2007-10-01 TLP525G,TLP525G−2,TLP525G−4 Absolute Maximum Ratings (Ta = 25°C) Rating Characteristic Symbol Forward current LED Forward current derating Unit IF 50 50 mA IF / °C −0.7 (Ta ≥ 53°C) −0.5 (Ta ≥ 25°C) mA / °C Pulse forward current IFP 1 (100μs pulse, 100pps) A Reverse voltage VR 5 V Junction temperature Tj 125 °C VDRM 400 V Off−state output terminal voltage On−state RMS current Detector TLP525G−2 TLP525G−4 TLP525G Ta = 25°C IT (RMS) Ta = 70°C On−state current derating (Ta≥25°C) IT / °C Peak on state current 100 80 50 40 −1.1 −0.9 mA mA / °C ITP 2 (100μs pulse, 120pps) A ITSM 1.2 A Tj 115 °C Storage temperature range Tstg −55~125 °C Operating temperature range Topr −40~100 °C Lead soldering temperature Tsol 260 (10s) °C BVS 2500 (AC, 1min., R.H. ≤ 60%) V rms Peak nonrepetitive surge current (PW = 10ms, DC = 10%) Junction temperature Isolation voltage (Note) Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook (“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test report and estimated failure rate, etc). Note: Device considered a two terminal device: LED side pins shorted together and detector side pins shorted together. Recommended Operating Conditions Characteristic Symbol Min. Typ. Max. Unit Supply voltage VAC ― ― 120 Vac Forward current IF 15 20 25 mA Peak on−state current ITP ― ― 1 A Operating temperature Topr −25 ― 85 °C Note: Recommended operating conditions are given as a design guideline to obtain expected performance of the device. Additionally, each item is an independent guideline respectively. In developing designs using this product, please confirm specified characteristics shown in this document. 2 2007-10-01 TLP525G,TLP525G−2,TLP525G−4 Individual Electrical Characteristics (Ta = 25°C) Detector LED Characteristic Symbol Test Condition Min. Typ. Max. Unit Forward voltage VF IF = 10mA 1.0 1.15 1.3 V Reverse current IR VR = 5V ― ― 10 μA Capacitance CT V = 0, f = 1MHz ― 30 ― pF Peak off−state current IDRM VDRM = 400V ― 10 100 nA Peak on−state voltage VTM ITM = 100mA ― 1.7 3.0 V ― mA Holding current Critical rate of rise of off−state voltage Critical rate of rise of commutating voltage IH ⎯ ― 0.2 dv / dt Vin = 120Vrms, Ta = 85°C (Figure 1) 200 500 dv / dt (c) Vin = 30Vrms, IT = 15mA (Figure 1) ― 0.2 ― V / μs Min. Typ. Max. Unit 5 10 mA 0.8 ― pF ― Ω ― V / μs Coupled Electrical Characteristics (Ta = 25°C) Characteristic Symbol Test Condition Trigger LED current IFT VT = 3V ― Capacitance input to output CS VS = 0, f = 1MHz ― Isolation resistance RS VS = 500V, R.H. ≤ 60% AC, 1 minute Isolation voltage BVS 5×10 10 10 14 2500 ― ― AC, 1 second, in oil ― 5000 ― DC, 1 minute, in oil ― 5000 ― Vrms Vdc Fig.1 dv / dt Test Circuit 3 2007-10-01 TLP525G,TLP525G−2,TLP525G−4 4 2007-10-01 TLP525G,TLP525G−2,TLP525G−4 5 2007-10-01 TLP525G,TLP525G−2,TLP525G−4 RESTRICTIONS ON PRODUCT USE 20070701-EN • The information contained herein is subject to change without notice. • TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability Handbook” etc. • The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.).These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in his document shall be made at the customer’s own risk. • The products described in this document shall not be used or embedded to any downstream products of which manufacture, use and/or sale are prohibited under any applicable laws and regulations. • The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any patents or other rights of TOSHIBA or the third parties. • GaAs(Gallium Arsenide) is used in this product. The dust or vapor is harmful to the human body. Do not break, cut, crush or dissolve chemically. • Please contact your sales representative for product-by-product details in this document regarding RoHS compatibility. Please use these products in this document in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances. Toshiba assumes no liability for damage or losses occurring as a result of noncompliance with applicable laws and regulations. 6 2007-10-01