TOSHIBA TIM8596-15

MICROWAVE POWER GaAs FET
TIM8596-15
PRELIMINARY
MICROWAVE SEMICONDUCTOR
TECHNICAL DATA
FEATURES
n HIGH POWER
n BROAD BAND INTERNALLY MATCHED
P1dB=42.0dBm at 8.5GHz to 9.6GHz
n HIGH GAIN
G1dB=7.0dB at 8.5GHz to 9.6GHz
n HERMETICALLY SEALED PACKAGE
RF PERFORMANCE SPECIFICATIONS ( Ta= 25° C )
CHARACTERISTICS
SYMBOL
CONDITION
UNIT
MIN.
TYP. MAX.

42.0
dBm
41.0
dB
6.0
7.0

Output Power at 1dB
Compression Point
P1dB
Power Gain at 1dB
Compression Point
Drain Current
G1dB
IDS
A

4.5
Power Added Efficiency
ηadd
%

31
5.5

Channel Temperature Rise
∆Tch
°C


100
UNIT
mS
MIN.

TYP.
3000
MAX.

V
-1.5
-3.0
-4.5
A

10.0
11.5
V
-5


°C/W

2.0
2.5
VDS = 9 V
f = 8.5 – 9.6GHz
VDS×IDS×Rth(c-c)
ELECTRICAL CHARACTERISTICS ( Ta= 25° C )
CHARACTERISTICS
Transconductance
Pinch-off Voltage
SYMBOL
gm
VGSoff
Saturated Drain Current
IDSS
Gate-Source Breakdown
Voltage
Thermal Resistance
VGSO
CONDITION
VDS = 2V
IDS = 4.8A
VDS = 2V
IDS = 145mA
VDS = 3 V
VGS= 0V
IGS= -145 µA
Rth(c-c) Channel to Case
u The information contained herein is presented only as a guide for the applications of our products. No responsibility is
assumed by TOSHIBA for any infringements of patents or other rights of the third parties which may results from its use,
No license is granted by implication or otherwise under any patent or patent rights of TOSHIBA or others.
The information contained herein is subject to change without prior notice. It is therefor advisable to contact TOSHIBA
before proceeding with design of equipment incorporating this product.
Jun. 2002
TIM8596-15
ABSOLUTE MAXIMUM RATINGS ( Ta= 25° C )
CHARACTERISTICS
SYMBOL
UNIT
RATING
Drain-Source Voltage
VDS
V
15
Gate-Source Voltage
VGS
V
-5
Drain Current
IDS
A
11.5
Total Power Dissipation (Tc= 25 °C)
PT
W
60
Channel Temperature
Tch
°C
175
Storage
Tstg
°C
-65 ∼ +175
•
Unit in mm
• Gate
‚ Source
ƒ Drain
‚
ƒ
2.0 MIN.
3.2±0.3
‚
12.9±0.2
4-R3.0
2.0 MIN.
PACKAGE OUTLINE (2-11C1B)
0.6±0.15
17.0±0.3
.
5.0 MAX.
2.6±0.3
0.2 MAX.
11.0 MAX.
1.7±0.3
0.1
+0.1
-0.05
21.5 MAX.
HANDLING PRECAUTIONS FOR PACKAGED TYPE
Soldering iron should be grounded and the operating time should not exceed 10 seconds at
260°C.
2