TOSHIBA TB6598FN

TB6598FN/FNG
TENTATIVE
TOSHIBA Bi-CMOS Integrated Circuit Silicon Monolithic
TB6598FN/FNG
Dual Full-Bridge Driver for Stepping Motors
The TB6598FN/FNG is a 2-phase bipolar stepping motor driver
employing an LDMOS structure with low ON-resistance for
output drive transistors. By applying four input signals (EN1,
EN2, IN1, IN2), it is possible to control the rotation direction
(forward/reverse) of 2-phase/1-2-phase stepper motor.
It is also possible to achieve constant-current drive (PWM
chopper drive).
Features
•
Motor supply voltage: VM ≤ 15 V (max)
•
Control supply voltage: VCC = 2.7 V to 6 V
•
Output current: Iout ≤ 0.8 A (max)
•
Low ON-resistance: 1.5 Ω (upper side + lower side typ. @ VM = 5 V)
•
Constant-current control (PWM chopper drive)
•
Standby (power-saving) mode
•
On-chip thermal shutdown circuit (TSD)
•
Compact package: SSOP-16
Weight: 0.07 g (typ.)
TB6598FNG:
TB6598FNG is a Pb-free product.
The following conditions apply to solderability:
*Solderability
1. Use of Sn-63Pb solder bath
*solder bath temperature = 230°C
*dipping time = 5 seconds
*number of times = once
*use of R-type flux
2. Use of Sn-3.0Ag-0.5Cu solder bath
*solder bath temperature=245°C
*dipping time = 5 seconds
*the number of times = once
*use of R-type flux
z
z
This product has a MOS structure and is sensitive to electrostatic discharge. When handling the product,
ensure that the environment is protected against electrostatic discharge by using an earth strap, a
conductive mat and an ionizer. Ensure also that the ambient temperature and relative humidity are
maintained at reasonable levels.
Install the product correctly. Otherwise, breakdown, damage and/or degradation in the product or
equipment may result.
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TB6598FN/FNG
Block Diagram
GND
VCC
5
6
13 VM
EN1 8
EN2 9
IN1 10
Control
Logic
3 AO1
IN2 11
Timing
Logic
OSC
Pre-Drive
H-Bridge
B
1 AO2
2 RFA
12
OSC
TSD
16 BO1
Timing
Logic
Vlim 7
Vref 4
Vref
0.6 V
Pre-Drive
H-Bridge
B
14 BO2
Band
Gap
15 RFB
Some functional blocks, circuits, or constants may be omitted or simplified in the block diagram for explanatory
purposes.
Pin Functions
Pin Name
Pin No.
Functional Description
Remarks
AO2
1
Output 2 (Ch. A)
RFA
2
Winding current detection pin
(Ch. A)
AO1
3
Output 1 (Ch. A)
Ch. A motor winding connection pin
+0.6 V (typ.)
Ch. A motor winding connection pin
Vref
4
Internal reference voltage
GND
5
Ground pin
VCC
6
Small-signal power supply pin
VCC (ope) = 2.7 V to 5.5 V
Vlim
7
Winding current setting pin
Icoil (A) = Vlimit (V)/external RF (Ω)
EN1
8
Enable input 1
EN2
9
Enable input 2
IN1
10
Control input 1
IN2
11
Control input 2
OSC
12
Internal oscillation frequency
setting pin
Connect an oscillator capacitor externally
VM
13
Motor power supply pin
VM (ope) = 4.5 V to 13.5 V
BO2
14
Output 2 (Ch. B)
Ch. B motor winding connection pin
RFB
15
Winding current detection pin
(Ch. B)
BO1
16
Output 1 (Ch. B)
Ch. B motor winding connection pin
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TB6598FN/FNG
Truth Table 1
EN1 (EN2)
IN1 (IN2)
AO1 (BO1)
AO2 (BO2)
Mode
L
*
OFF
OFF
ALL OFF
H
L
H
Reverse
L
H
L
Forward
H
“*” indicates “don’t care.”
Truth Table 2
EN1
L
EN2
(Note)
L
L
Mode
(Note)
Standby
H
H
L
H
H
Operation
Note: VINL (EN1 = EN2) <
= 0.5 V.
Operating Description
The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory purposes.
115uA
20 uA
VCC
t2
1.2 V
Charge
ON
Discharge
ON
0.8 V
Cosc
115 uA
20 kΩ
40 kΩ
OSC
Oscillator circuit
t1
Vosc waveform
• The internal oscillation frequency is determined by charging and discharging an external capacitor (Cosc).
Vosc =
1
∫ i dt ,
Cosc
∆Vosc = I× (t1 − t2)/Cosc,
I
,
∆Vosc・Cosc
1
I
fosc =
=
,
2 (t1 − t2) 2 ・∆Vosc・Cosc
1
1
(theoretical formula).
=
=
2 × 0.4/115 µA × Cosc
6.957 × 10 3 × Cosc
1
t1 − t2
=
3
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TB6598FN/FNG
• Chopper control
The winding current flows while the output drive transistor is On. When the VRF reaches the limit voltage
level (Vlimit), the comparator detects it and turns off the output drive transistor.
The oscillator output is squared to generate an internal clock. The off timer starts on the edge of the
internal clock and is active for two internal clocks. When the off timer stops, the PWM goes high.
osc
Internal clock
Off timer
2-bit counter
PWM output
V limit
Winding current
*2
chop on
*1
*2
*1
*2
*1
*2
*1
*1: Increase of current
*2: Chopping of current
The PWM control limits the winding current to a level determined by the current value (IO) as expressed in
the equation below:
IO = Vlimt/RNF.
• PWM control function
When PWM control is provided, normal operation and short brake operation are repeated.
To prevent penetrating current, dead time t2 and t4 are provided in the IC.
VM
M
M
M
<PWM ON>
t1
<PWM ON → OFF>
t2 = 400 ns (typ.)
<PWM OFF>
t3
RF
M
M
<PWM OFF → ON>
t4 = 400 ns (typ.)
<PWM ON>
t5
4
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TB6598FN/FNG
Maximum Ratings (Ta = 25°C)
Characteristics
Symbol
Rating
VM
15
VCC
6
Input voltage
VIN
−0.2 to 6
V
Output current
IOUT
0.8
A
Power supply voltage
Unit
Remarks
V
Power dissipation
PD
0.78 (Note 1)
Operating temperature
Topr
−20 to 85
°C
Storage temperature
Tstg
−55 to 150
°C
IN1, IN2, EN1 and EN2
pins
W
Note 1: When mounted on a glass-epoxy PCB (50 mm × 30 mm × 1.6 mm, Cu area: 40%)
The absolute maximum ratings of a semiconductor device are a set of specified parameter values that must not be
exceeded during operation, even for an instant.
If any of these ratings are exceeded during operation, the electrical characteristics of the device may be
irreparably altered, in which case the reliability and lifetime of the device can no longer be guaranteed.
Moreover, any exceeding of the ratings during operation may cause breakdown, damage and/or degradation in
other equipment. Applications using the device should be designed so that no maximum rating will ever be
exceeded under any operating conditions.
Before using, creating and/or producing designs, refer to and comply with the precautions and conditions set forth
in this document.
Operating Range (Ta = −20 to 85°C)
Characteristics
Power supply voltage (VCC)
Power supply voltage (VM)
Symbol
Min
Typ.
Max
Unit
VCC
2.7
3
5.5
V
VM
2.5
5
13.5
V
Output current
IOUT
⎯
⎯
0.6
A
Limit voltage
Vlimit
GND
⎯
Vref
V
OSC frequency
f osc
⎯
⎯
1
MHz
Chopping frequency
fchop
20
⎯
250
kHz
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TB6598FN/FNG
Electrical Characteristics (unless otherwise specified, VCC = 3 V, VM = 12 V, Ta = 25°C)
Characteristics
Symbol
ICC1
ICC2
ICC3
Test
Circuit
IM2
IM3
Input voltage
Control circuit
Hysteresis
voltage
Input current
Output saturating voltage
Typ.
Max
Unit
1ch ON
EN1 = 0.8 V, EN2 = 2.0 V
⎯
1.4
3
mA
1
2ch ON
EN1 = EN2 = 2.0 V
⎯
1.4
3
mA
1
Standby mode
EN1 = EN2 = 0.5 V
⎯
7
15
µA
1
1ch ON, Output open
EN1 = 0.8 V, EN2 = 2.0 V
⎯
1.9
3.0
1
2ch ON, Output open
EN1 = EN2 = 2.0 V
⎯
1.9
3.0
1
Standby mode
EN1 = EN2 = 0.5 V
⎯
⎯
1
mA
µA
VINH
2
2
⎯
VCC +
0.2
VINL1
2
−0.2
⎯
0.8
VINL2
2
Standby mode
−0.2
⎯
0.5
VIN (HIS)
⎯
(Design target value)
⎯
0.2
⎯
IINH
2
VIN = 3 V
5
15
30
µA
IINL
2
VIN = GND
⎯
⎯
1
µA
Vsat (U + L)
3
IO = 0.2 A
⎯
0.3
0.4
IO = 0.6 A
⎯
0.9
1.2
Output constant-current
detection level
VRF
Reference voltage
Vref
Reference voltage current
capacity
Iref
Input current at winding current
setting pin
Min
1
Supply current
IM1
Test Condition
IIN (limit)
V
V
4
RRF = 0.1 Ω, Vref = 0.6 V
0.565
0.6
0.635
V
5
No load
0.57
0.6
0.63
V
5
Source (∆Vref = 50 mV)
⎯
⎯
100
µA
6
Vlimit = GND
⎯
⎯
1
µA
⎯
⎯
1
⎯
⎯
1
IL (U)
7
IL (L)
7
VF (U)
8
IO = 0.6 A
⎯
1
1.2
VF (L)
9
IO = 0.6 A
⎯
1
1.2
f osc
10
Cosc = 220 pF
430
530
630
kHz
Capacitor charge current
IC1
11
Vosc = 0 V
⎯
115
⎯
µA
Capacitor discharge current
IC2
11
Vosc = 2 V
⎯
115
⎯
µA
⎯
170
⎯
°C
⎯
20
⎯
°C
Output leakage current
Diode forward voltage
Oscillation frequency
Thermal shutdown circuit
operating temperature
Thermal shutdown hysterisis
TSD
∆TSD
VM = 15 V
⎯
(Design target value)
⎯
6
µA
V
2005-01-19
TB6598FN/FNG
Test Circuit 1: ICC1, ICC2, ICC3, IM1, IM2, IM3
1 AO2
BO1 16
2 RFA
RFB 15
3 AO1
BO2 14
IM
ICC
5 GND
OSC 12
6 VCC
IN2 11
7 Vlim
IN1 10
8 EN1
EN2 9
0.8 V, 2.0 V, 0.5 V
2.0 V, 2.0 V, 0.5 V
A
1Ω
VM 13
12 V
1Ω
4 Vref
3.0 V
A
ICC1, IM1: EN1 = 0.8 V, EN2 = 2.0 V
ICC2, IM2: EN1 = 2.0 V, EN2 = 2.0 V
ICC3, IM3: EN1 = 0.5 V, EN2 = 0.5 V
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TB6598FN/FNG
RFB 15
3 AO1
BO2 14
VM 13
OSC 12
6 VCC
IN2 11
7 Vlim
IN1 10
8 EN1
EN2 9
100 kΩ
IINL
5 GND
VINL
3.0 V
1Ω
4 Vref
8
A
A
IINH
2 RFA
VINH
BO1 16
1Ω
1 AO2
100 kΩ
VB02
100 kΩ
VB01
100 kΩ
VA02
12 V
100 kΩ
VA01
100 kΩ
100 kΩ
100 kΩ
Test Circuit 2: VINH, VINL1, VINL2, IINH, IINL
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TB6598FN/FNG
2 RFA
RFB 15
3 AO1
BO2 14
4 Vref
VM 13
OSC 12
6 VCC
IN2 11
7 Vlim
IN1 10
8 EN1
EN2 9
1 AO2
BO1 16
2 RFA
RFB 15
3 AO1
BO2 14
3V
5 GND
V
VO (Note1)
BO1 16
12 V
V
1 AO2
RL (Note2)
RL (Note2)
VO (Note1)
Test Circuit 3: VSAT (U + L)
Note1: VSAT (U + L) =12 − VO
Note2: Calibrate IO to 0.2 A / 0.6 A by RL.
Test Circuit 4: VRF
4 Vref
1Ω
V
VM 13
5 GND
OSC 12
6 VCC
IN2 11
7 Vlim
IN1 10
8 EN1
EN2 9
9
12 V
1Ω
220 pF
1Ω
V
1Ω
5 mH
5 mH
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TB6598FN/FNG
1 AO2
BO1 16
2 RFA
RFB 15
3 AO1
BO2 14
4 Vref
OSC 12
6 VCC
IN2 11
7 Vlim
IN1 10
8 EN1
EN2 9
12 V
5 GND
220 pF
VM 13
3V
100 µA
V
0.1 µF
SW (Note)
Vref
Test Circuit 5: Vref, Iref
Note: 1. Vref: SW = OFF
2. Iref: The Vref voltage descent at the time of SW = ON checks below 50 mV.
Test Circuit 6: IIN (limit)
1 AO2
BO1 16
2 RFA
RFB 15
3 AO1
BO2 14
4 Vref
OSC 12
6 VCC
IN2 11
7 Vlim
IN1 10
8 EN1
EN2 9
12 V
5 GND
3V
A
VM 13
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TB6598FN/FNG
RFB 15
3 AO1
BO2 14
4 Vref
A
A
15 V
2 RFA
IL (U)
BO1 16
A
IL (L)
1 AO2
IL (U)
IL (U)
A
A
IL (L)
A
IL (L)
A
IL (U)
A
IL (L)
Test Circuit 7: IL (U), IL (L)
VM 13
220 pF
5 GND
OSC 12
6 VCC
IN2 11
7 Vlim
IN1 10
8 EN1
EN2 9
1 AO2
BO1 16
2 RFA
RFB 15
3 AO1
BO2 14
V
0.6 A
Test Circuit 8: VF (U)
4 Vref
0.6 A
VM 13
5 GND
OSC 12
6 VCC
IN2 11
7 Vlim
IN1 10
8 EN1
EN2 9
11
V
2005-01-19
TB6598FN/FNG
Test Circuit 9: VF (L)
1 AO2
BO1 16
2 RFA
RFB 15
3 AO1
BO2 14
0.6 A
0.6 A
V
VF (L)
4 Vref
V
VF (L)
VM 13
5 GND
OSC 12
6 VCC
IN2 11
7 Vlim
IN1 10
8 EN1
EN2 9
1 AO2
BO1 16
2 RFA
RFB 15
3 AO1
BO2 14
Test Circuit 10: fOSC
4 Vref
6 VCC
IN2 11
7 Vlim
IN1 10
8 EN1
EN2 9
F.C
12 V
OSC 12
3V
5 GND
220 pF
VM 13
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TB6598FN/FNG
RFB 15
3 AO1
BO2 14
4 Vref
5 GND
OSC 12
6 VCC
IN2 11
7 Vlim
IN1 10
8 EN1
EN2 9
13
A
A
0.65 V
VM 13
1.35 V
2 RFA
IC2
BO1 16
IC1
1 AO2
12 V
Test Circuit 11: IC1, IC2
2005-01-19
TB6598FN/FNG
Application Circuit Example
3V
3 V to 5 V
(Note 1)
VCC
VDD
VM
(Note 1)
VM
AO1
M
AO2
EN1
RFA
EN2
MCU
IN1
TB6598FNG
BO1
IN2
M
BO2
RFB
GND
GND
Vref
Vlim
OSC
(Note 1)
(Note 1)
Note 1: Noise suppression capacitors and oscillator capacitors should be connected as close as possible to the IC.
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TB6598FN/FNG
Package Dimensions
Weight: 0.07 g (typ.)
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TB6598FN/FNG
Notes on Contents
1. Block Diagrams
Some of the functional blocks, circuits, or constants in the block diagram may be omitted or simplified for
explanatory purposes.
2. Equivalent Circuits
The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory
purposes.
3. Timing Charts
Timing charts may be simplified for explanatory purposes.
4. Maximum Ratings
The absolute maximum ratings of a semiconductor device are a set of specified parameter values that must not
be exceeded during operation, even for an instant.
If any of these ratings are exceeded during operation, the electrical characteristics of the device may be
irreparably altered, in which case the reliability and lifetime of the device can no longer be guaranteed.
Moreover, any exceeding of the ratings during operation may cause breakdown, damage and/or degradation in
other equipment. Applications using the device should be designed so that no maximum rating will ever be
exceeded under any operating conditions.
Before using, creating and/or producing designs, refer to and comply with the precautions and conditions set
forth in this document.
5. Application Circuits
The application circuits shown in this document are provided for reference purposes only. Thorough evaluation
is required in the mass production design phase.
In furnishing these examples of application circuits, Toshiba does not grant the use of any industrial property
rights.
6. Test Circuits
Components in test circuits are used only to obtain and confirm device characteristics. These components and
circuits are not guaranteed to prevent malfunction or failure in application equipment.
Handling of the IC
Ensure that the product is installed correctly to prevent breakdown, damage and/or degradation in the product
or equipment.
Overcurrent Protection and Heat Protection Circuits
These protection functions are intended only as a temporary means of preventing output short circuits or other
abnormal conditions and are not guaranteed to prevent damage to the IC.
If the guaranteed operating ranges of this product are exceeded, these protection features may not operate
and some output short circuits may result in the IC being damaged.
The over-current protection feature is intended to protect the IC from temporary short circuits only.
Short circuits persisting over long periods may cause excessive stress and damage the IC. Systems should
be configured so that any over-current condition will be eliminated as soon as possible.
Counter-Electromotive force
When the motor reverses or stops, the effect of counter-electromotive force may cause the current to flow to the
power source.
If the power supply is not equipped with sink capability, the power and output pins may exceed the maximum
rating.
The counter-electromotive force of the motor will vary depending on the conditions of use and the features of
the motor. Therefore make sure there will be no damage to or operational problem in the IC, and no damage to
or operational errors in peripheral circuits caused by counter-electromotive force.
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TB6598FN/FNG
RESTRICTIONS ON PRODUCT USE
030619EBA
• The information contained herein is subject to change without notice.
• The information contained herein is presented only as a guide for the applications of our products. No
responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which
may result from its use. No license is granted by implication or otherwise under any patent or patent rights of
TOSHIBA or others.
• TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor
devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical
stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of
safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of
such TOSHIBA products could cause loss of human life, bodily injury or damage to property.
In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as
set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and
conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability
Handbook” etc..
• The TOSHIBA products listed in this document are intended for usage in general electronics applications
(computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances,
etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires
extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or
bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or
spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments,
medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in this
document shall be made at the customer’s own risk.
• The products described in this document are subject to the foreign exchange and foreign trade laws.
• TOSHIBA products should not be embedded to the downstream products which are prohibited to be produced
and sold, under any law and regulations.
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