TOSHIBA CUS15I30A

CUS15I30A
TOSHIBA Schottky Barrier Rectifier Schottky Barrier Type
CUS15I30A
Switching Mode Power Supply Applications
Portable Equipment Battery Applications
Unit: mm
1.25 +− 0.2
0.1
0.13 +− 0.05
0.03
0.88 ± 0.1
•
Forward current (AV): IF (AV) = 1.5 A
②
•
Repetitive peak reverse voltage: VRRM = 30 V
•
Suitable for high-density board assembly due to the use of a small
surface-mount package, “US-FLATTM”
1.9 ± 0.1
Forward voltage: VFM = 0.46 V (max) @ IF = 1.5 A
2.5 ± 0.2
•
①
0.6 ± 0.1
Unit
Repetitive peak reverse voltage
VRRM
30
V
Forward current (AV)
IF (AV)
Peak one cycle surge forward current
(non-repetitive)
1.5 (Note 1)
A
IFSM
20 (50 Hz)
A
Junction temperature
Tj
150
°C
Storage temperature
Tstg
−55 to 150
°C
Note 1: Ta = 68°C : Device mounted on a ceramic board
Board size : 50 mm × 50 mm
Soldering size : 2 mm ×2 mm
Rectangular waveform (α = 180°), VR = 15 V
0.6 ± 0.1
1.4 ± 0.2
Rating
0 ~ 0.05
Symbol
0.88 ± 0.1
① ANODE
② CATHODE
0.78 ± 0.1
0.5 ± 0.1
Characteristics
0.6 ± 0.1
Absolute Maximum Ratings (Ta = 25°C)
0.6 ± 0.1
JEDEC
⎯
JEITA
⎯
TOSHIBA
3-2B1A
Weight: 0.004 g (typ.)
Note 2: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly
even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute
maximum ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
1
2010-04-06
CUS15I30A
Electrical Characteristics (Ta = 25°C)
Characteristics
Peak forward voltage
Repetitive peak reverse current
Junction capacitance
Thermal resistance (junction to ambient)
Symbol
Test Condition
Min
Typ.
Max
VFM (1)
IFM = 0.1 A (pulse test)
⎯
0.27
⎯
VFM (2)
IFM = 1.0 A (pulse test)
⎯
0.37
⎯
VFM (3)
IFM = 1.5 A (pulse test)
⎯
0.40
0.46
IRRM (1) VRRM = 5.0 V (pulse test)
⎯
10
⎯
IRRM (2) VRRM = 30 V (pulse test)
⎯
20
60
VR = 10 V, f = 1.0 MHz
⎯
50
⎯
Device mounted on a ceramic board
(board size: 50 mm × 50 mm)
(soldering land: 2 mm × 2 mm)
(board thickness: 0.64 mm)
⎯
⎯
75
Cj
Rth (j-a)
(soldering land: 6 mm × 6 mm)
V
μA
pF
°C/W
Device mounted on a glass-epoxy board
(board size: 50 mm × 50 mm)
Unit
⎯
⎯
150
⎯
⎯
30
(board thickness: 1.6 mm)
Thermal resistance (junction to lead)
⎯
Rth (j-ℓ)
2
°C/W
2010-04-06
CUS15I30A
Marking
Part No.(or abbreviation code)
Abbreviation Code
Part No.
8
CUS15I30A
Anode
Cathode
8
Cathode mark and Lot code
Standard Soldering Pad
Unit: mm
2.0
0.5
0.8
0.8
1.1
Handling Precaution
Schottky barrier diodes have reverse current characteristics compared to other diodes.
There is a possibility SBD may cause thermal runaway when it is used under high temperature or high voltage.
Please take forward and reverse loss into consideration during design.
The absolute maximum ratings of a semiconductor device are a set of ratings that must not be exceeded,even for a
moment. Do not exceed any of these ratings. The following are the general derating methods that we recommend
when you design a circuit with a device.
VRRM:
Use this rating with reference to the above. VRRM has a temperature coefficient of 0.1%/°C. Take
this temperature coefficient into account designing a device at low temperature.
IF(AV) : We recommend that the worst case current be no greater than 80% of the absolute maximum rating
of IF(AV) and Tj be below 120°C. When using this device, take the margin into consideration by
using an allowable Ta max-IF(AV) curve.
IFSM:
This rating specifies the non-repetitive peak current. This is only applied for an abnormal operation,
which seldom occurs during the lifespan of the device.
Tj:
Derate this rating when using a device in order to ensure high reliability. We recommend that the
device be used at a Tj of below 120°C.
Thermal resistance between junction and ambient fluctuates depending on the device’s mounting condition. When
using a device, design a circuit board and a soldering land size to match the appropriate thermal resistance value.
Please refer to the Rectifiers databook for further information.
3
2010-04-06
CUS15I30A
PF (AV) – IF (AV)
1.0
Pulse test
Average forward power dissipation
PF (AV) (W)
Instantaneous forward current
iF
(A)
iF – vF
10
3
Tj = 150°C
125°C
1
75°C
0.3
25°C
0.1
0.03
0.01
0
0.2
0.4
0.6
0.8
Instantaneous forward voltage vF
DC
0.8
180°
120°
0.6
α = 60°
0.4
Rectangular
waveform
0.2
0° α 360°
0
0.0
1.0
(V)
160
140
140
Maximum allowable temperature
Ta max (°C)
Maximum allowable temperature
Ta max (°C)
50 mm × 50 mm, soldering land: 2 mm × 2 mm)
120
100
80
α = 60°
120°
180°
DC
40
0° α 360°
IF (AV)
20
1.5
2.0
2.5
IF (AV) (A)
Ta max – IF (AV)
Glass-epoxy substrate (substrate size:
50 mm × 50 mm, soldering land: 6 mm × 6 mm)
160
Rectangular waveform
1.0
Average forward current
Ta max – IF (AV)
Ceramic substrate (substrate size:
60
Conduction angle α
0.5
Rectangular waveform
0° α 360°
IF (AV)
120
Conduction angle α
VR = 15 V
100
80
60
40
α = 60°
20
120°
180°
DC
Conduction angle α
0
0.0
VR = 15 V
0.5
1.0
1.5
Average forward current
2.0
0
0.0
2.5
IF (AV) (A)
0.5
1.0
Average forward current
Transient thermal impedance
rth (j-a) (°C/W)
Maximum allowable lead temperature
Tℓ max (°C)
10000
140
120
100
α = 60°
60
120°
180°
DC
Rectangular waveform
40
0° α 360°
IF (AV)
20
Conduction angle α
0
0.0
1.0
1.5
Average forward current
2.5
IF (AV) (A)
2.0
1000
(2) Device mounted on a glass-epoxy board:
board size:50 mm × 50 mm
Soldering land: 6.0 mm × 6.0 mm
board thickness:1.6 mm
(3) Device mounted on a glass-epoxy board:
Board size: 50 mm × 50 mm
Standard Soldering pad
board thickness:1.6 mm
2.5
(3)
(2)
(1)
100
(1) Device mounted on a ceramic board:
board size:50 mm × 50 mm
Soldering land: 2.0 mm × 2.0 mm
board thickness : 0.64 mm
10
1
0.001
VR = 15 V
0.5
2.0
rth (j-a) – t
Tℓ max – IF (AV)
160
80
1.5
0.01
0.1
1
10
100
1000
Time t (s)
IF (AV) (A)
4
2010-04-06
CUS15I30A
Surge forward current
(non-repetitive)
Cj – VR
f = 1 MHz
(pF)
Ta = 25°C
f = 50 Hz
16
12
8
4
1
3
5
10
30
50
Ta = 25°C
500
Cj
20
0
300
100
50
30
10
1
100
3
Number of cycles
IR – Tj
(typ.)
3V
20 V
1
5V
10 V
0.1
0.01
0.001
0
20
40
60
80
100
Junction temperature
120
Tj
30
VR
50
140
0°
(V)
(°C)
Rectangular
waveform
360°
DC
0.4
300°
Conduction angle α
Tj = 150°C
240°
180°
0.3
120°
60°
0.2
0.1
0
10
Reverse voltage
5
(typ.)
VR
0.5
0
160
100
0.6
(W)
VR = 30 V
0.7
PR (AV)
Average reverse power dissipation
(mA)
Pulse test
15 V
10
PR (AV) – VR
0.8
10
5
Reverse voltage
100
Reverse current IR
(typ.)
1000
Junction capacitance
Peak surge forward current
IFSM (A)
24
20
VR
30
(V)
2010-04-06
CUS15I30A
RESTRICTIONS ON PRODUCT USE
• Toshiba Corporation, and its subsidiaries and affiliates (collectively “TOSHIBA”), reserve the right to make changes to the information
in this document, and related hardware, software and systems (collectively “Product”) without notice.
• This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with
TOSHIBA’s written permission, reproduction is permissible only if reproduction is without alteration/omission.
• Though TOSHIBA works continually to improve Product’s quality and reliability, Product can malfunction or fail. Customers are
responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and
systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily
injury or damage to property, including data loss or corruption. Before customers use the Product, create designs including the
Product, or incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions of
all relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes
for Product and the precautions and conditions set forth in the “TOSHIBA Semiconductor Reliability Handbook” and (b) the
instructions for the application with which the Product will be used with or for. Customers are solely responsible for all aspects of their
own product design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such
design or applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts,
diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating
parameters for such designs and applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS’ PRODUCT DESIGN OR
APPLICATIONS.
• Product is intended for use in general electronics applications (e.g., computers, personal equipment, office equipment, measuring
equipment, industrial robots and home electronics appliances) or for specific applications as expressly stated in this document.
Product is neither intended nor warranted for use in equipment or systems that require extraordinarily high levels of quality and/or
reliability and/or a malfunction or failure of which may cause loss of human life, bodily injury, serious property damage or serious
public impact (“Unintended Use”). Unintended Use includes, without limitation, equipment used in nuclear facilities, equipment used
in the aerospace industry, medical equipment, equipment used for automobiles, trains, ships and other transportation, traffic signaling
equipment, equipment used to control combustions or explosions, safety devices, elevators and escalators, devices related to electric
power, and equipment used in finance-related fields. Do not use Product for Unintended Use unless specifically permitted in this
document.
• Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part.
• Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any
applicable laws or regulations.
• The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any
infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to
any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise.
• ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE
FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY
WHATSOEVER, INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR
LOSS, INCLUDING WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND
LOSS OF DATA, AND (2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO
SALE, USE OF PRODUCT, OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS
FOR A PARTICULAR PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT.
• Do not use or otherwise make available Product or related software or technology for any military purposes, including without
limitation, for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile
technology products (mass destruction weapons). Product and related software and technology may be controlled under the
Japanese Foreign Exchange and Foreign Trade Law and the U.S. Export Administration Regulations. Export and re-export of Product
or related software or technology are strictly prohibited except in compliance with all applicable export laws and regulations.
• Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product.
Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances,
including without limitation, the EU RoHS Directive. TOSHIBA assumes no liability for damages or losses occurring as a result of
noncompliance with applicable laws and regulations.
6
2010-04-06