DIODES BS170

BS170
N-CHANNEL ENHANCEMENT MODE TRANSISTOR
Features
·
·
·
·
High Input Impedance
Fast Switching Speed
CMOS Logic Compatible Input
No Thermal Runaway or Secondary
Breakdown
E
A
B
·
·
Min
Max
A
4.45
4.70
B
4.46
4.70
C
12.7
—
D
0.41
0.63
E
3.43
3.68
G
2.42
2.67
H
1.14
1.40
C
Mechanical Data
·
·
TO-92
Dim
Case: TO-92, Plastic
Leads: Solderable per MIL-STD-202,
Method 208
Pin Connection: See Diagram
Weight: 0.18 grams (approx.)
Maximum Ratings
D
SG D
BOTTOM
VIEW
All Dimensions in mm
H
G
H
@ TA = 25°C unless otherwise specified
Characteristic
Symbol
Value
Unit
Drain-Source Voltage
VDSS
60
V
Drain-Gate Voltage
VDGS
60
V
Gate-Source-Voltage (pulsed)
VGS
±20
V
Drain Current (continuous)
ID
300
mA
Power Dissipation @TC = 25°C (Note 1)
Pd
830
mW
Tj
150
°C
Tj, TSTG
-55 to +150
°C
Symbol
Value
Unit
Maximum Forward Current (continuous)
IF
0.50
A
Forward Voltage Drop (typ.) @ VGS = 0, IF = 0.5A, Tj = 25°C
VF
0.85
V
Junction Temperature
Operating and Storage Temperature Range
Inverse Diode
@ TA = 25°C unless otherwise specified
Characteristic
Electrical Characteristics
@ TA = 25°C unless otherwise specified
Characteristic
Drain-Source Breakdown Voltage
Gate Threshold Voltage
Symbol
Min
Typ
Max
Unit
V(BR)DSS
60
90
—
V
Test Condition
VGS(th)
0.8
1.0
3.0
V
VGS = VDS, ID = 1.0mA
ID = 100µA, VGS = 0
Gate-Body Leakage Current
IGSS
—
—
10
nA
VGS = 15V, VDS = 0
Drain-Cutoff Current
IDSS
—
—
0.5
µA
VDS = 25V, VGS = 0
rDS (ON)
—
3.5
5.0
W
VGS = 10V, ID = 0.2mA
RqJA
—
—
150
K/W
Forward Transconductance
gFS
—
200
—
mm
VDS = 10V, ID = 0.2A, f = 1MHz
Input Capacitance
Ciss
—
60
—
pF
VDS = 10V, VGS = 0, f =1.0MHz
Turn On Time
Turn Off Time
ton
toff
—
5.0
15
—
ns
VGS = 10V, VDS = 10V,
RD = 100W
Drain-Source ON Resistance
Thermal Resistance, Junction to Ambient Air
Notes:
Note 1
1. Valid provided that leads are kept at ambient temperature at a distance of 2.0mm from case.
DS21802 Rev. D-3
1 of 2
BS170
0.8
ID (ON), DRAIN SOURCE ON CURRENT (A)
Pd, POWER DISSIPATION (W)
1
(See Note 1)
0.6
0.4
0.2
1
7V
0.8
VGS = 6V
0.6
Pulse test width 80µs;
pulse duty factor 1%
5V
0.4
4V
0.2
3V
0.1
0
0
100
0
200
40
60
1.0
TA = 25°C
0.8
Pulse test width 80µs;
pulse duty factor 1%
4.5V
200
4.0V
3.5V
100
100
TA = 25°C
400
300
80
VDS = 10V
VGS = 5V
ID, DRAIN CURRENT (A)
ID (ON), DRAIN SOURCE ON-CURRENT (mA)
500
20
VDS, DRAIN-SOURCE VOLTAGE (V)
Fig. 2. Output Characteristics
TA, AMBIENT TEMPERATURE (ºC)
Fig. 1. Power Derating Curve
Pulse test width 80µs;
pulse duty factor 1%
0.6
0.4
0.2
3.0V
0
0
2
0
4
6
8
0
10
gf s, FORWARD TRANSCONDUCTANCE (mm)
500
VDS = 10V
Pulse test width 80µs;
pulse duty factor 1%
400
2
4
6
10
8
VGS, GATE-SOURCE VOLTAGE (V)
Fig. 4. Drain Current vs Gate-Source Voltage
VDS, DRAIN-SOURCE VOLTAGE (V)
Fig. 3. Saturation Characteristics
gfs, FORWARD TRANSCONDUCTANCE (mm)
TA = 25°C
300
200
100
0
500
VDS = 10V
400
Pulse test width 80µs;
pulse duty factor 1%
300
200
100
0
0
2
4
6
8
0
10
VGS, GATE-SOURCE VOLTAGE (V)
Fig. 5. Transconductance vs Gate-Source Voltage
DS21802 Rev. D-3
100
200
300
400
500
ID, DRAIN CURRENT (mA)
Fig. 6 Transconductance vs. Drain Current
2 of 2
BS170