ONSEMI MRA4004T3G

MRA4003T3 Series
Surface Mount Standard
Recovery Power Rectifier
SMA Power Surface Mount Package
Features construction with glass passivation. Ideally suited for
surface mounted automotive applications.
Features
• Compact Package with J−Bend Leads Ideal for Automated Handling
• Stable, High Temperature, Glass Passivated Junction
• Pb−Free Packages are Available
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STANDARD RECOVERY
RECTIFIERS
1.0 AMPERES
300−1000 VOLTS
Mechanical Characteristics
• Case: Molded Epoxy
•
•
•
•
•
Epoxy meets UL 94 V−0 @ 0.125 in
Weight: 70 mg (Approximately)
Finish: All External Surfaces are Corrosion Resistant and Terminal
Leads are Readily Solderable
Lead and Mounting Surface Temperature for Soldering Purposes:
260°C Max. for 10 seconds in Solder Bath
Polarity: Band in Plastic Body Indicates Cathode Lead
Marking: MRA4003T3 = R13
Marking MRA4004T3 = R14
MRA4005T1 = R15
Marking: MRA4005T3 = R15
Marking: MRA4006T3 = R16
Marking: MRA4007T3 = R17
MAXIMUM RATINGS
Please See the Table on the Following Page
CASE 403D
SMA
PLASTIC
MARKING DIAGRAM
R1x
AYWWG
R1x
A
Y
WW
G
= Specific Device Code
= Assembly Location
= Year
= Work Week
= Pb−Free Package
ORDERING INFORMATION
See detailed ordering and shipping information in the ordering
information section on page 4 of this data sheet.
© Semiconductor Components Industries, LLC, 2006
May, 2006 − Rev. 5
1
Publication Order Number:
MRA4003T3/D
MRA4003T3 Series
MAXIMUM RATINGS
Value
Rating
Symbol
MRA4003T3
MRA4004T3
MRA4005T1,
MRA4005T3
VRRM
VRWM
VR
300
400
600
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
Avg. Rectified Forward Current
(At Rated VR, TL = 150°C)
MRA4006T3
MRA4007T3
Unit
800
1000
Volts
IO
1
Amp
Peak Repetitive Forward Current
(At Rated VR, Square Wave,
20 kHz, TL = 150°C)
IFRM
2
Amps
Non−Repetitive Peak Surge Current
(Surge applied at rated load conditions,
halfwave, single phase, 60 Hz)
IFSM
30
Amps
Tstg, TC
−55 to 150
°C
TJ
−55 to 175
°C
Storage/Operating Case Temperature
Operating Junction Temperature
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
THERMAL CHARACTERISTICS
Characteristic
Symbol
Value
Unit
RθJL
RθJA
16.2
88.3
°C/W
Thermal Resistance, Junction−to−Lead (Note 1)
Thermal Resistance, Junction−to−Ambient (Note 2)
ELECTRICAL CHARACTERISTICS
Value
Characteristic
Symbol
Maximum Instantaneous Forward Voltage (Note 3)
(IF = 1 A)
(IF = 2 A)
VF
Maximum Instantaneous Reverse Current (at rated DC voltage)
IR
TJ = 25°C
TJ = 100°C
1.1
1.18
1.04
1.12
10
50
Unit
Volts
mA
100E−6
10
TJ = 150°C
1.0
−40°C
0.1
100°C
25°C
IR , REVERSE CURRENT (AMPS)
IF, INSTANTANEOUS FORWARD CURRENT (AMPS
1. Minimum Pad Size
2. 1 inch Pad Size
3. Pulse Test: Pulse Width ≤ 250 μs, Duty Cycle ≤ 2%.
TJ = 150°C
10E−6
1.0E−6
100°C
100E−9
0.01
25°C
10E−9
1.0E−9
0.4
0.6
0.8
1.0
1.2
VF, INSTANTANEOUS FORWARD VOLTAGE (VOLTS)
0
Figure 1. Typical Forward Voltage
50
100
150
200
250 300
350
VR, REVERSE VOLTAGE (VOLTS)
Figure 2. Typical Reverse Current
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2
400
1.6
PFO , AVERAGE POWER DISSIPATION (WATTS)
IO, AVERAGE FORWARD CURRENT (AMPS)
MRA4003T3 Series
dc
1.4
Square Wave
1.2
1.0
Ipk/IO = p
0.8
5
10
0.6
20
0.4
Freq = 20 kHz
0.2
0
0
20
80
40
60
100
120
TL, LEAD TEMPERATURE (°C)
140
1.8
dc
1.6
1.4
Square Wave
1.2
Ipk/IO = p
1.0
5
0.8
10
0.6
20
0.4
0.2
0
0
160
Figure 3. Current Derating per Leg
0.5
1.0
1.5
IO, AVERAGE FORWARD CURRENT (AMPS)
2.0
Figure 4. Forward Power Dissipation per Leg
C, CAPACITANCE (pF)
100
TJ = 25°C
10
1
0
20
40 60 80 100 120 140 160 180 200
VR, REVERSE VOLTAGE (VOLTS)
r(t), TRANSIENT THERMAL RESISTANCE
(NORMALIZED)
Figure 5. Capacitance
1.0
RqJL (Min Pad Board)
RqJA (1 inch Pad Board)
0.1
RqJL(t) = RqJL * r(t)
0.01
0.001
10E−6
100E−6
1E−3
10E−3
100E−3
1E+0
t, TIME (s)
Figure 6. Thermal Response
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3
10E+0
100E+0
1E+3
10E+3
MRA4003T3 Series
ORDERING INFORMATION
Device
MRA4003T3
MRA4003T3G
MRA4004T3
MRA4004T3G
MRA4005T1
MRA4005T1G
MRA4005T3
MRA4005T3G
MRA4006T3
MRA4006T3G
MRA4007T3
MRA4007T3G
Package
Shipping†
SMA
5000/Tape & Reel
SMA
(Pb−Free)
5000/Tape & Reel
SMA
5000/Tape & Reel
SMA
(Pb−Free)
5000/Tape & Reel
SMA
1500/Tape & Reel
SMA
(Pb−Free)
1500/Tape & Reel
SMA
5000/Tape & Reel
SMA
(Pb−Free)
5000/Tape & Reel
SMA
5000/Tape & Reel
SMA
(Pb−Free)
5000/Tape & Reel
SMA
5000/Tape & Reel
SMA
(Pb−Free)
5000/Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
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4
MRA4003T3 Series
PACKAGE DIMENSIONS
SMA
CASE 403D−02
ISSUE C
HE
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. 403D−01 OBSOLETE, NEW STANDARD IS 403D−02.
E
b
DIM
A
A1
b
c
D
E
HE
L
D
POLARITY INDICATOR
OPTIONAL AS NEEDED
(SEE STYLES)
MIN
1.91
0.05
1.27
0.15
2.29
4.06
4.83
0.76
MILLIMETERS
NOM
MAX
2.16
2.41
0.10
0.15
1.45
1.63
0.28
0.41
2.60
2.92
4.32
4.57
5.21
5.59
1.14
1.52
MIN
0.075
0.002
0.050
0.006
0.090
0.160
0.190
0.030
INCHES
NOM
0.085
0.004
0.057
0.011
0.103
0.170
0.205
0.045
MAX
0.095
0.006
0.064
0.016
0.115
0.180
0.220
0.060
A
L
A1
c
SOLDERING FOOTPRINT*
4.0
0.157
2.0
0.0787
2.0
0.0787
SCALE 8:1
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
P.O. Box 5163, Denver, Colorado 80217 USA
Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada
Email: [email protected]
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81−3−5773−3850
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ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
MRA4003T3/D