MRA4003T3 Series Surface Mount Standard Recovery Power Rectifier SMA Power Surface Mount Package Features construction with glass passivation. Ideally suited for surface mounted automotive applications. Features • Compact Package with J−Bend Leads Ideal for Automated Handling • Stable, High Temperature, Glass Passivated Junction • Pb−Free Packages are Available http://onsemi.com STANDARD RECOVERY RECTIFIERS 1.0 AMPERES 300−1000 VOLTS Mechanical Characteristics • Case: Molded Epoxy • • • • • Epoxy meets UL 94 V−0 @ 0.125 in Weight: 70 mg (Approximately) Finish: All External Surfaces are Corrosion Resistant and Terminal Leads are Readily Solderable Lead and Mounting Surface Temperature for Soldering Purposes: 260°C Max. for 10 seconds in Solder Bath Polarity: Band in Plastic Body Indicates Cathode Lead Marking: MRA4003T3 = R13 Marking MRA4004T3 = R14 MRA4005T1 = R15 Marking: MRA4005T3 = R15 Marking: MRA4006T3 = R16 Marking: MRA4007T3 = R17 MAXIMUM RATINGS Please See the Table on the Following Page CASE 403D SMA PLASTIC MARKING DIAGRAM R1x AYWWG R1x A Y WW G = Specific Device Code = Assembly Location = Year = Work Week = Pb−Free Package ORDERING INFORMATION See detailed ordering and shipping information in the ordering information section on page 4 of this data sheet. © Semiconductor Components Industries, LLC, 2006 May, 2006 − Rev. 5 1 Publication Order Number: MRA4003T3/D MRA4003T3 Series MAXIMUM RATINGS Value Rating Symbol MRA4003T3 MRA4004T3 MRA4005T1, MRA4005T3 VRRM VRWM VR 300 400 600 Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage Avg. Rectified Forward Current (At Rated VR, TL = 150°C) MRA4006T3 MRA4007T3 Unit 800 1000 Volts IO 1 Amp Peak Repetitive Forward Current (At Rated VR, Square Wave, 20 kHz, TL = 150°C) IFRM 2 Amps Non−Repetitive Peak Surge Current (Surge applied at rated load conditions, halfwave, single phase, 60 Hz) IFSM 30 Amps Tstg, TC −55 to 150 °C TJ −55 to 175 °C Storage/Operating Case Temperature Operating Junction Temperature Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. THERMAL CHARACTERISTICS Characteristic Symbol Value Unit RθJL RθJA 16.2 88.3 °C/W Thermal Resistance, Junction−to−Lead (Note 1) Thermal Resistance, Junction−to−Ambient (Note 2) ELECTRICAL CHARACTERISTICS Value Characteristic Symbol Maximum Instantaneous Forward Voltage (Note 3) (IF = 1 A) (IF = 2 A) VF Maximum Instantaneous Reverse Current (at rated DC voltage) IR TJ = 25°C TJ = 100°C 1.1 1.18 1.04 1.12 10 50 Unit Volts mA 100E−6 10 TJ = 150°C 1.0 −40°C 0.1 100°C 25°C IR , REVERSE CURRENT (AMPS) IF, INSTANTANEOUS FORWARD CURRENT (AMPS 1. Minimum Pad Size 2. 1 inch Pad Size 3. Pulse Test: Pulse Width ≤ 250 μs, Duty Cycle ≤ 2%. TJ = 150°C 10E−6 1.0E−6 100°C 100E−9 0.01 25°C 10E−9 1.0E−9 0.4 0.6 0.8 1.0 1.2 VF, INSTANTANEOUS FORWARD VOLTAGE (VOLTS) 0 Figure 1. Typical Forward Voltage 50 100 150 200 250 300 350 VR, REVERSE VOLTAGE (VOLTS) Figure 2. Typical Reverse Current http://onsemi.com 2 400 1.6 PFO , AVERAGE POWER DISSIPATION (WATTS) IO, AVERAGE FORWARD CURRENT (AMPS) MRA4003T3 Series dc 1.4 Square Wave 1.2 1.0 Ipk/IO = p 0.8 5 10 0.6 20 0.4 Freq = 20 kHz 0.2 0 0 20 80 40 60 100 120 TL, LEAD TEMPERATURE (°C) 140 1.8 dc 1.6 1.4 Square Wave 1.2 Ipk/IO = p 1.0 5 0.8 10 0.6 20 0.4 0.2 0 0 160 Figure 3. Current Derating per Leg 0.5 1.0 1.5 IO, AVERAGE FORWARD CURRENT (AMPS) 2.0 Figure 4. Forward Power Dissipation per Leg C, CAPACITANCE (pF) 100 TJ = 25°C 10 1 0 20 40 60 80 100 120 140 160 180 200 VR, REVERSE VOLTAGE (VOLTS) r(t), TRANSIENT THERMAL RESISTANCE (NORMALIZED) Figure 5. Capacitance 1.0 RqJL (Min Pad Board) RqJA (1 inch Pad Board) 0.1 RqJL(t) = RqJL * r(t) 0.01 0.001 10E−6 100E−6 1E−3 10E−3 100E−3 1E+0 t, TIME (s) Figure 6. Thermal Response http://onsemi.com 3 10E+0 100E+0 1E+3 10E+3 MRA4003T3 Series ORDERING INFORMATION Device MRA4003T3 MRA4003T3G MRA4004T3 MRA4004T3G MRA4005T1 MRA4005T1G MRA4005T3 MRA4005T3G MRA4006T3 MRA4006T3G MRA4007T3 MRA4007T3G Package Shipping† SMA 5000/Tape & Reel SMA (Pb−Free) 5000/Tape & Reel SMA 5000/Tape & Reel SMA (Pb−Free) 5000/Tape & Reel SMA 1500/Tape & Reel SMA (Pb−Free) 1500/Tape & Reel SMA 5000/Tape & Reel SMA (Pb−Free) 5000/Tape & Reel SMA 5000/Tape & Reel SMA (Pb−Free) 5000/Tape & Reel SMA 5000/Tape & Reel SMA (Pb−Free) 5000/Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. http://onsemi.com 4 MRA4003T3 Series PACKAGE DIMENSIONS SMA CASE 403D−02 ISSUE C HE NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. 403D−01 OBSOLETE, NEW STANDARD IS 403D−02. E b DIM A A1 b c D E HE L D POLARITY INDICATOR OPTIONAL AS NEEDED (SEE STYLES) MIN 1.91 0.05 1.27 0.15 2.29 4.06 4.83 0.76 MILLIMETERS NOM MAX 2.16 2.41 0.10 0.15 1.45 1.63 0.28 0.41 2.60 2.92 4.32 4.57 5.21 5.59 1.14 1.52 MIN 0.075 0.002 0.050 0.006 0.090 0.160 0.190 0.030 INCHES NOM 0.085 0.004 0.057 0.011 0.103 0.170 0.205 0.045 MAX 0.095 0.006 0.064 0.016 0.115 0.180 0.220 0.060 A L A1 c SOLDERING FOOTPRINT* 4.0 0.157 2.0 0.0787 2.0 0.0787 SCALE 8:1 mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. 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