VISHAY SUD50P04-40P

New Product
SUD50P04-40P
Vishay Siliconix
P-Channel 40-V (D-S) MOSFET
FEATURES
PRODUCT SUMMARY
rDS(on) (Ω)
ID (A)a
0.040 at VGS = - 10 V
-8
0.050 at VGS = - 4.5 V
-8
VDS (V)
- 40
Qg (Typ.)
• TrenchFET® Power MOSFET
• 100 % UIS Tested
RoHS
17 nC
COMPLIANT
APPLICATIONS
• Backlight Inverter for LCD Display
• Full Bridge DC/DC Converter
S
TO-252
G
Drain Connected to Tab
G
D
S
Top View
D
Ordering Information:
SUD50P04-40P-E3 (Lead (Pb)-free)
P-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS TA = 25 °C, unless otherwise noted
Parameter
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current (TJ = 150 °C)
Symbol
VDS
VGS
TC = 25 °C
TC = 70 °C
TA = 25 °C
TA = 70 °C
ID
IDM
Pulsed Drain Current
TC = 25 °C
TA = 25 °C
IS
Single Pulse Avalanche Current
Avalanche Energy
L = 0.1 mH
IAS
EAS
Maximum Power Dissipation
TC = 25 °C
TC = 70 °C
TA = 25 °C
TA = 70 °C
PD
Continuous Source-Drain Diode Current
Limit
- 40
± 20
- 8a
- 8a
V
- 6b
- 4.8b
- 30
- 8a
A
- 2.0b
15
11.25
24
15.3
mJ
W
2.4b
1.5b
- 55 to 150
TJ, Tstg
Operating Junction and Storage Temperature Range
Unit
°C
THERMAL RESISTANCE RATINGS
Parameter
Maximum
Steady State
Symbol
RthJA
Typical
Maximum Junction-to-Ambientb
43
52
Maximum Junction-to-Case
Steady State
RthJC
4.3
5.2
Unit
°C/W
Notes:
a. Package limited.
b. Surface mounted on 1" x 1" FR4 board.
Document Number: 69731
S-80109-Rev. B, 21-Jan-08
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New Product
SUD50P04-40P
Vishay Siliconix
SPECIFICATIONS TJ = 25 °C, unless otherwise noted
Parameter
Symbol
Test Conditions
Min.
VDS
VGS = 0 V, ID = - 250 µA
- 40
Typ.
Max.
Unit
Static
Drain-Source Breakdown Voltage
VDS Temperature Coefficient
ΔVDS/TJ
VGS(th) Temperature Coefficient
ΔVGS(th)/TJ
ID = - 250 µA
Gate-Source Threshold Voltage
VGS(th)
VDS = VGS, ID = - 250 µA
Gate-Source Leakage
IGSS
VDS = 0 V, VGS = ± 20 V
Zero Gate Voltage Drain Current
IDSS
On-State Drain Currenta
ID(on)
Drain-Source On-State
Resistancea
mV/°C
4.3
- 1.4
- 2.7
V
± 100
nA
VDS = - 40 V, VGS = 0 V
-1
VDS = - 40 V, VGS = 0 V, TJ = 70 °C
- 20
VDS ≥ - 5 V, VGS = - 10 V
rDS(on)
Forward Transconductancea
V
- 41
gfs
- 10
µA
A
VGS = - 10 V, ID = - 5 A
0.030
0.040
VGS = - 4.5 V, ID = - 4 A
0.036
0.050
VDS = - 15 V, ID = - 5 A
20
Ω
S
Dynamicb
Input Capacitance
Ciss
Output Capacitance
Coss
Reverse Transfer Capacitance
Crss
Total Gate Charge
Qg
Gate-Source Charge
Qgs
Gate-Drain Charge
Qgd
Gate Resistance
Rg
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
1555
VDS = - 20 V, VGS = 0 V, f = 1 MHz
tr
pF
142
VDS = - 20 V, VGS = - 10 V, ID = - 5 A
VDS = - 20 V, VGS = - 4.5 V, ID = - 5 A
38.5
60
17
27
4.2
nC
7.0
f = 1 MHz
td(on)
td(off)
176
VDD = - 20 V, RL = 4 Ω
ID ≅ - 5 A, VGEN = - 4.5 V, Rg = 1 Ω
Ω
3
47
80
60
110
35
60
tf
13
25
td(on)
10
20
VDD = - 20 V, RL = 4 Ω
ID ≅ - 5 A, VGEN = - 10 V, Rg = 1 Ω
tr
td(off)
tf
14
25
36
60
10
20
ns
Drain-Source Body Diode Characteristics
Continuous Source-Drain Diode Current
TC = 25 °C
IS
Pulse Diode Forward Currenta
ISM
Body Diode Voltage
VSD
Body Diode Reverse Recovery Time
trr
Body Diode Reverse Recovery Charge
Qrr
Reverse Recovery Fall Time
ta
Reverse Recovery Rise Time
tb
-8
- 30
IS = - 2 A
IF = 20 A, di/dt = 100 A/µs, TJ = 25 °C
A
- 0.76
- 1.2
V
22
40
ns
22
40
nC
15
7
ns
Notes:
a. Pulse test; pulse width ≤ 300 µs, duty cycle ≤ 2 %.
b. Guaranteed by design, not subject to production testing.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
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Document Number: 69731
S-80109-Rev. B, 21-Jan-08
New Product
SUD50P04-40P
Vishay Siliconix
TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted
30
5
VGS = 10 thru 4 V
4
I D - Drain Current (A)
I D - Drain Current (A)
24
18
12
3V
3
TJ = 25 °C
2
6
1
TJ = 125 °C
0
0.0
0.5
1.0
1.5
2.0
TJ = - 55 °C
0
0.0
2.5
0.8
VDS - Drain-to-Source Voltage (V)
3.2
4.0
Transfer Characteristics
0.050
2500
0.044
2000
Ciss
C - Capacitance (pF)
r DS(on) - On-Resistance (Ω)
2.4
VGS - Gate-to-Source Voltage (V)
Output Characteristics
VGS = 4.5 V
0.038
1.6
0.032
VGS = 10 V
1500
1000
Coss
0.026
500
0.020
0
Crss
0
6
12
18
24
0
30
6
12
24
30
VDS - Drain-to-Source Voltage (V)
ID - Drain Current (A)
Capacitance
On-Resistance vs. Drain Current
10
1.8
ID = 5 A
ID = 5 A
VDS = 10 V
VGS = 10 V
1.6
8
VDS = 20 V
6
VDS = 30 V
4
2
1.4
(Normalized)
r DS(on) - On-Resistance
VGS - Gate-to-Source Voltage (V)
18
VGS = 4.5 V
1.2
1.0
0.8
0
0
8
16
24
Qg - Total Gate Charge (nC)
Gate Charge
Document Number: 69731
S-80109-Rev. B, 21-Jan-08
32
40
0.6
- 50
- 25
0
25
50
75
100
125
150
TJ - Junction Temperature (°C)
On-Resistance vs. Junction Temperature
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New Product
SUD50P04-40P
Vishay Siliconix
TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted
0.12
100
TJ = 150 °C
r DS(on) - On-Resistance (Ω)
I S - Source Current (A)
ID = 5 A
TJ = 25 °C
10
0.09
0.06
TA = 125 °C
0.03
TA = 25 °C
0
1
0.0
0.3
0.6
0.9
1.2
0
1.5
2
VSD - Source-to-Drain Voltage (V)
6
8
10
VGS - Gate-to-Source Voltage (V)
Source-Drain Diode Forward Voltage
On-Resistance vs. Gate-to-Source Voltage
0.7
120
0.5
96
ID = 250 µA
Power (W)
V GS(th) Variance (V)
4
0.3
ID = 5 mA
0.1
- 0.1
- 0.3
- 50
72
48
24
- 25
0
25
50
75
100
125
0
0.001
150
0.01
0.1
1
10
100
TJ - Temperature (°C)
Time (s)
Threshold Voltage
Single Pulse Power, Junction-to-Ambient
100
120
Limited by rDS(on)*
96
I D - Drain Current (A)
Power (W)
10
72
48
1 ms
10 ms
100 ms
1
1s
10 s
0.1
24
DC
TA = 25 °C
Single Pulse
0
0. 00 1
0.01
0.1
1
Time (s)
Single Pulse Power, Junction-to-Case
10
0.01
0.01
0.1
1
10
100
VDS - Drain-to-Source Voltage (V)
* VGS > minimum VGS at which rDS(on) is specified
Safe Operating Area, Junction-to-Ambient
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Document Number: 69731
S-80109-Rev. B, 21-Jan-08
New Product
SUD50P04-40P
Vishay Siliconix
TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted
100
7
Limited by rDS(on)*
1 ms
10 ms
100 ms
DC
1
I D - Drain Current (A)
I D - Drain Current (A)
6
100 µs
10
0.1
4
3
1
TC = 25 °C
Single Pulse
0
0.01
0.01
0.1
1
0
100
10
VDS - Drain-to-Source Voltage (V)
* VGS > minimum VGS at which rDS(on) is specified
50
75
100
125
150
TA - Ambient Temperature (°C)
Current Derating*, Junction-to-Ambient
Safe Operating Area, Junction-to-Case
22
3.5
18
2.8
13
2.1
Power (W)
I D - Drain Current (A)
25
Package Limited
9
1.4
0.7
4
0
0
0
25
50
75
100
125
150
0
25
50
75
100
125
150
175
TA - Ambient Temperature (°C)
TC - Case Temperature (°C)
Power Derating*, Junction-to-Ambient
Current Derating*, Junction-to-Case
35
Power (W)
28
21
14
* The power dissipation PD is based on TJ(max) = 175 °C, using
7
junction-to-case thermal resistance, and is more useful in settling the
upper dissipation limit for cases where additional heatsinking is
used. It is used to determine the current rating, when this rating falls
0
0
25
50
75
100
125
150
175
below the package limit.
TC - Case Temperature (°C)
Power Derating*, Junction-to-Case
Document Number: 69731
S-80109-Rev. B, 21-Jan-08
www.vishay.com
5
New Product
SUD50P04-40P
Vishay Siliconix
TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted
Normalized Effective Transient
Thermal Impedance
1
Duty Cycle = 0.5
0.2
Notes:
0.1
0.1
PDM
t1
0.05
t2
1. Duty Cycle, D =
t1
t2
2. Per Unit Base = RthJA = 52 °C/W
0.02
3. TJM - TA = PDMZthJA(t)
Single Pulse
0.01
10 -4
10 -3
4. Surface Mounted
10 -2
10 -1
1
Square Wave Pulse Duration (s)
100
10
1000
Normalized Thermal Transient Impedance, Junction-to-Ambient
1
Normalized Effective Transient
Thermal Impedance
Duty Cycle = 0.5
0.2
0.1
0.1
0.05
0.02
Single Pulse
0.01
10 -4
10 -3
10 -2
10 -1
Square Wave Pulse Duration (s)
1
10
Normalized Thermal Transient Impedance, Junction-to-Case
Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon
Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and
reliability data, see http://www.vishay.com/ppg?69731.
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Document Number: 69731
S-80109-Rev. B, 21-Jan-08
Legal Disclaimer Notice
Vishay
Disclaimer
All product specifications and data are subject to change without notice.
Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf
(collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained herein
or in any other disclosure relating to any product.
Vishay disclaims any and all liability arising out of the use or application of any product described herein or of any
information provided herein to the maximum extent permitted by law. The product specifications do not expand or
otherwise modify Vishay’s terms and conditions of purchase, including but not limited to the warranty expressed
therein, which apply to these products.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this
document or by any conduct of Vishay.
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications unless
otherwise expressly indicated. Customers using or selling Vishay products not expressly indicated for use in such
applications do so entirely at their own risk and agree to fully indemnify Vishay for any damages arising or resulting
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Product names and markings noted herein may be trademarks of their respective owners.
Document Number: 91000
Revision: 18-Jul-08
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