BCP56T1 Series Preferred Devices NPN Silicon Epitaxial Transistor These NPN Silicon Epitaxial transistors are designed for use in audio amplifier applications. The device is housed in the SOT-223 package, which is designed for medium power surface mount applications. Features • Pb−Free Package is Available • High Current: 1.0 Amp • The SOT-223 package can be soldered using wave or reflow. The • • http://onsemi.com MEDIUM POWER NPN SILICON HIGH CURRENT TRANSISTOR SURFACE MOUNT formed leads absorb thermal stress during soldering, eliminating the possibility of damage to the die Available in 12 mm Tape and Reel Use BCP56T1 to order the 7 inch/1000 unit reel Use BCP56T3 to order the 13 inch/4000 unit reel PNP Complement is BCP53T1 COLLECTOR 2,4 BASE 1 EMITTER 3 MAXIMUM RATINGS (TC = 25°C unless otherwise noted) Symbol Value Unit Collector-Emitter Voltage VCEO 80 Vdc Collector-Base Voltage VCBO 100 Vdc Emitter-Base Voltage VEBO 5 Vdc Collector Current IC 1 Adc Total Power Dissipation @ TA = 25°C (Note 1) Derate above 25°C PD 1.5 12 Watts mW/°C Operating and Storage Temperature Range TJ, Tstg −65 to 150 °C Rating Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. THERMAL CHARACTERISTICS Characteristic Thermal Resistance Junction−to−Ambient (surface mounted) Maximum Temperature for Soldering Purposes Time in Solder Bath Symbol Max Unit RJA 83.3 °C/W 260 10 °C Sec TL 4 1 SOT−223 CASE 318E STYLE 1 2 3 MARKING DIAGRAM AWW xxxx xxxx A WW = Specific Device Code = Assembly Location = Work Week ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 2 of this data sheet. Preferred devices are recommended choices for future use and best overall value. 1. Device mounted on a FR-4 glass epoxy printed circuit board 1.575 in x 1.575 in x 0.0625 in; mounting pad for the collector lead = 0.93 sq in. Semiconductor Components Industries, LLC, 2004 June, 2004 − Rev. 3 1 Publication Order Number: BCP56T1/D BCP56T1 Series ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted) Characteristics Symbol Min Typ Max Unit Collector−Base Breakdown Voltage (IC = 100 Adc, IE = 0) V(BR)CBO 100 − − Vdc Collector−Emitter Breakdown Voltage (IC = 1.0 mAdc, IB = 0) V(BR)CEO 80 − − Vdc Emitter−Base Breakdown Voltage (IE = 10 Adc, IC = 0) V(BR)EBO 5.0 − − Vdc Collector−Base Cutoff Current (VCB = 30 Vdc, IE = 0) ICBO − − 100 nAdc Emitter-Base Cutoff Current (VEB = 5.0 Vdc, IC = 0) IEBO − − 10 Adc 25 40 63 100 25 − − − − − − 250 160 250 − OFF CHARACTERISTICS ON CHARACTERISTICS (Note 2) DC Current Gain (IC = 5.0 mA, VCE = 2.0 V) (IC = 150 mA, VCE = 2.0 V) (IC = 500 mA, VCE = 2.0 V) hFE All Part Types BCP56T1 BCP56-10T1 BCP56-16T1 All Types − Collector−Emitter Saturation Voltage (IC = 500 mAdc, IB = 50 mAdc) VCE(sat) − − 0.5 Vdc Base-Emitter On Voltage (IC = 500 mAdc, VCE = 2.0 Vdc) VBE(on) − − 1.0 Vdc fT − 130 − MHz DYNAMIC CHARACTERISTICS Current−Gain − Bandwidth Product (IC = 10 mAdc, VCE = 5.0 Vdc, f = 35 MHz) 2. Pulse Test: Pulse Width ≤ 300 s, Duty Cycle ≤ 2.0% ORDERING INFORMATION Device BCP56T1 BCP56T3 BCP56−10T1 Marking Package Shipping† BH SOT−223 1000 / Tape & Reel BH SOT−223 4000 / Tape & Reel BH−10 SOT−223 1000 / Tape & Reel SOT−223 1000 / Tape & Reel SOT−223 (Pb−Free) 1000 / Tape & Reel SOT−223 4000 / Tape & Reel BCP56−16T1 BCP56−16T1G BH−16 BCP56−16T3 †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. http://onsemi.com 2 BCP56T1 Series TYPICAL ELECTRICAL CHARACTERISTICS hFE, DC CURRENT GAIN 1000 TJ = 125°C TJ = 25°C 100 10 TJ = − 55°C 1 10 100 1000 IC, COLLECTOR CURRENT (mA) 1000 80 60 C, CAPACITANCE (pF) f, T CURRENT-GAIN BANDWIDTH PRODUCT (MHz) Figure 1. DC Current Gain 100 TJ = 25°C 40 Cibo 20 10 8.0 6.0 10 1.0 10 100 IC, COLLECTOR CURRENT (mA) Cobo 4.0 0.1 1000 0.2 0.5 1.0 2.0 5.0 10 20 VR, REVERSE VOLTAGE (VOLTS) 1.0 V, VOLTAGE (VOLTS) 0.8 TJ = 25°C VBE(sat) @ IC/IB = 10 0.6 VBE(on) @ VCE = 1.0 V 0.4 0.2 VCE(sat) @ IC/IB = 10 0 0.5 1.0 2.0 100 5.0 10 20 50 IC, COLLECTOR CURRENT (mA) 200 100 Figure 3. Capacitance VCE , COLLECTOR-EMITTER VOLTAGE (VOLTS) Figure 2. Current-Gain − Bandwidth Product 50 500 1.0 TJ = 25°C 0.8 0.6 IC = 10mA 50 mA 100mA 250mA 500mA 0.4 0.2 0 0.05 Figure 4. “On” Voltages 0.1 0.2 0.5 5.0 10 1.0 2.0 IC, COLLECTOR CURRENT (mA) 20 Figure 5. Collector Saturation Region http://onsemi.com 3 50 BCP56T1 Series PACKAGE DIMENSIONS SOT−223 (TO−261) CASE 318E−04 ISSUE K NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. A F INCHES DIM MIN MAX A 0.249 0.263 B 0.130 0.145 C 0.060 0.068 D 0.024 0.035 F 0.115 0.126 G 0.087 0.094 H 0.0008 0.0040 J 0.009 0.014 K 0.060 0.078 L 0.033 0.041 M 0 10 S 0.264 0.287 4 S 1 2 B 3 D L G J C 0.08 (0003) STYLE 1: PIN 1. 2. 3. 4. M H K MILLIMETERS MIN MAX 6.30 6.70 3.30 3.70 1.50 1.75 0.60 0.89 2.90 3.20 2.20 2.40 0.020 0.100 0.24 0.35 1.50 2.00 0.85 1.05 0 10 6.70 7.30 BASE COLLECTOR EMITTER COLLECTOR SOLDERING FOOTPRINT* 3.8 0.15 2.0 0.079 2.3 0.091 2.3 0.091 6.3 0.248 2.0 0.079 mm inches 1.5 SCALE 6:1 0.059 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 61312, Phoenix, Arizona 85082−1312 USA Phone: 480−829−7710 or 800−344−3860 Toll Free USA/Canada Fax: 480−829−7709 or 800−344−3867 Toll Free USA/Canada Email: [email protected] N. American Technical Support: 800−282−9855 Toll Free USA/Canada ON Semiconductor Website: http://onsemi.com Order Literature: http://www.onsemi.com/litorder Japan: ON Semiconductor, Japan Customer Focus Center 2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051 Phone: 81−3−5773−3850 http://onsemi.com 4 For additional information, please contact your local Sales Representative. BCP56T1/D