DIODES DMP2004K

DMP2004K
P-CHANNEL ENHANCEMENT MODE FIELD EFFECT TRANSISTOR
Features
Mechanical Data
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•
•
•
•
•
•
•
•
•
•
Low On-Resistance
Very Low Gate Threshold Voltage VGS(TH) <1V
Low Input Capacitance
Fast Switching Speed
Low Input/Output Leakage
Lead Free By Design/RoHS Compliant (Note 2)
ESD Protected Gate
"Green" Device (Note 3)
Qualified to AEC-Q101 standards for High Reliability
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•
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Case: SOT-23
Case Material: Molded Plastic, “Green” Molding
Compound. UL Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020
Terminals: Finish ⎯ Matte Tin annealed over Copper leadframe.
Solderable per MIL-STD-202, Method 208
Terminal Connections: See Diagram
Marking Information: See Page 3
Ordering Information: See Page 3
Weight: 0.008 grams (approximate)
Drain
SOT-23
D
Gate
Gate
Protection
Diode
TOP VIEW
ESD protected
Maximum Ratings
Source
Equivalent Circuit
S
G
TOP VIEW
@TA = 25°C unless otherwise specified
Characteristic
Drain-Source Voltage
Gate-Source Voltage
Drain Current (Note 1) VGS = -4.5V
Pulsed Drain Current
Symbol
VDSS
VGSS
ID
IDM
Value
-20
±8
-600
-1.9
Units
V
V
mA
A
Characteristic
Total Power Dissipation (Note 1)
Thermal Resistance, Junction to Ambient
Symbol
PD
RθJA
Value
550
227
Units
mW
°C/W
Operating and Storage Temperature Range
TJ, TSTG
-55 to +150
°C
Thermal Characteristics
@TA = 25°C unless otherwise specified
Electrical Characteristics @TA = 25°C unless otherwise specified
Characteristic
OFF CHARACTERISTICS (Note 4)
Drain-Source Breakdown Voltage
Zero Gate Voltage Drain Current
Gate-Source Leakage
ON CHARACTERISTICS (Note 4)
Gate Threshold Voltage
Static Drain-Source On-Resistance
Forward Transfer Admittance
Diode Forward Voltage (Note 4)
DYNAMIC CHARACTERISTICS
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Notes:
Symbol
Min
Typ
Max
Unit
BVDSS
IGSS
-20
⎯
⎯
⎯
⎯
⎯
⎯
-1.0
±1.0
V
μA
μA
VGS = 0V, ID = -250mA
VDS = -20V, VGS = 0V
VGS = ±4.5V, VDS = 0V
VGS(th)
-0.5
⎯
-1.0
V
RDS (ON)
⎯
0.7
1.1
1.7
0.9
1.4
2.0
Ω
|Yfs|
VSD
200
-0.5
⎯
⎯
⎯
-1.2
mS
V
VDS = VGS, ID = -250μA
VGS = -4.5V, ID = -430mA
VGS = -2.5V, ID = -300mA
VGS = -1.8V, ID = -150mA
VDS = -10V, ID = -0.2A
VGS = 0V, IS = -115mA
Ciss
Coss
Crss
⎯
⎯
⎯
⎯
⎯
⎯
175
30
20
pF
pF
pF
IDSS
Test Condition
VDS = -16V, VGS = 0V
f = 1.0MHz
1. Device mounted on FR-4 PCB.
2. No purposefully added lead.
3. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.
4. Short duration pulse test used to minimize self-heating effect.
DMP2004K
Document number: DS30933 Rev. 4 - 2
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© Diodes Incorporated
-ID, DRAIN CURRENT (A)
-ID, DRAIN CURRENT (A)
DMP2004K
0
0
-VDS, DRAIN-SOURCE VOLTAGE (V)
Fig. 1 Typical Output Characteristics
-VGS(th), GATE THRESHOLD VOLTAGE (V)
-VGS, GATE-SOURCE VOLTAGE (V)
Fig. 2 Typical Transfer Characteristics
TA, AMBIENT TEMPERATURE (°C)
Fig. 3 Gate Threshold Voltage vs. Ambient Temperature
-ID, DRAIN-SOURCE CURRENT (A)
Fig. 4 Static Drain-Source On-Resistance vs. Drain Current
10
-ID, DRAIN-SOURCE CURRENT (A)
Fig. 5 Static Drain-Source On-Resistance
vs. Drain Current
DMP2004K
Document number: DS30933 Rev. 4 - 2
-ID, DRAIN-SOURCE CURRENT (A)
Fig. 6 Static Drain-Source On-Resistance vs.
Drain-Source Current
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DMP2004K
-VDS, SOURCE-DRAIN VOLTAGE (V)
Fig. 8 Reverse Drain Current vs. Source-Drain Voltage
TA, AMBIENT TEMPERATURE (°C)
Fig. 7 Static Drain-Source On-State Resistance
vs. Ambient Temperature
150
120
90
60
30
0
-VDS, DRAIN-SOURCE VOLTAGE (V)
Fig. 10 Typical Capacitance
-ID, DRAIN CURRENT (A)
Fig. 9 Forward Transfer Admittance vs. Drain Current
Ordering Information
(Note 5)
Part Number
DMP2004K-7
Notes:
Case
SOT-23
Packaging
3000/Tape & Reel
5. For packaging details, go to our website at http://www.diodes.com/datasheets/ap02007.pdf.
PAB
Date Code Key
Year
Code
Month
Code
2007
U
Jan
1
YW
Marking Information
PAB = Product Type Marking Code
YM = Date Code Marking
Y = Year (ex: U = 2007)
M = Month (ex: 9 = September)
2008
V
Feb
2
DMP2004K
Document number: DS30933 Rev. 4 - 2
Mar
3
2009
W
Apr
4
May
5
2010
X
Jun
6
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Jul
7
2011
Y
Aug
8
Sep
9
2012
Z
Oct
O
Nov
N
Dec
D
June 2010
© Diodes Incorporated
DMP2004K
Package Outline Dimensions
A
B C
H
K
M
K1
D
J
F
L
G
SOT-23
Dim
Min
Max
Typ
A
0.37
0.51
0.40
B
1.20
1.40
1.30
C
2.30
2.50
2.40
D
0.89
1.03 0.915
F
0.45
0.60 0.535
G
1.78
2.05
1.83
H
2.80
3.00
2.90
J
0.013 0.10
0.05
K
0.903 1.10
1.00
K1
0.400
L
0.45
0.61
0.55
M
0.085 0.18
0.11
0°
8°
α
All Dimensions in mm
Suggested Pad Layout
Y
Z
C
X
DMP2004K
Document number: DS30933 Rev. 4 - 2
Dimensions Value (in mm)
Z
2.9
X
0.8
Y
0.9
C
2.0
E
1.35
E
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DMP2004K
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INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
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written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
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labeling can be reasonably expected to result in significant injury to the user.
B.
A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
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information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2010, Diodes Incorporated
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DMP2004K
Document number: DS30933 Rev. 4 - 2
5 of 5
www.diodes.com
June 2010
© Diodes Incorporated