MC74HC4851A, MC74HC4852A Analog Multiplexers/ Demultiplexers with Injection Current Effect Control http://onsemi.com MARKING DIAGRAMS Automotive Customized These devices are pin compatible to standard HC405x and MC1405xB analog mux/demux devices, but feature injection current effect control. This makes them especially suited for usage in automotive applications where voltages in excess of normal logic voltage are common. The injection current effect control allows signals at disabled analog input channels to exceed the supply voltage range without affecting the signal of the enabled analog channel. This eliminates the need for external diode/ resistor networks typically used to keep the analog channel signals within the supply voltage range. The devices utilize low power silicon gate CMOS technology. The Channel Select and Enable inputs are compatible with standard CMOS outputs. Features • • • • • • 16 PDIP−16 N SUFFIX CASE 648 16 1 1 16 SOIC−16 D SUFFIX CASE 751B 16 1 HC485xAG AWLYWW 1 16 SOIC−16 WIDE DW SUFFIX CASE 751G 16 Injection Current Cross−Coupling Less than 1mV/mA (See Figure 9) Pin Compatible to HC405X and MC1405XB Devices Power Supply Range (VCC − GND) = 2.0 to 6.0 V In Compliance With the Requirements of JEDEC Standard No. 7A Chip Complexity: 154 FETs or 36 Equivalent Gates Pb−Free Packages are Available* MC74HC485xAN AWLYYWWG 1 HC4851A AWLYWWG 1 16 16 1 TSSOP−16 DT SUFFIX CASE 948F HC48 5xA ALYWG G 1 x = 1 or 2 A = Assembly Location L, WL = Wafer Lot Y, YY = Year W, WW = Work Week G = Pb−Free Package G = Pb−Free Package (Note: Microdot may be in either location) ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 11 of this data sheet. *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. © Semiconductor Components Industries, LLC, 2005 June, 2005 − Rev. 6 1 Publication Order Number: MC74HC4851A/D MC74HC4851A, MC74HC4852A FUNCTION TABLE − MC74HC4851A Control Inputs 13 X0 14 X1 15 X2 ANALOG 12 MULTIPLEXER/ INPUTS/ X3 DEMULTIPLEXER OUTPUTS X4 1 5 X5 2 X6 4 X7 11 A CHANNEL 10 B SELECT 9 INPUTS C 6 ENABLE PIN 16 = VCC PIN 8 = GND 3 X Select B A Enable C L L L L L L L L H L L L L H H H H X L L H H L L H H X COMMON OUTPUT/ INPUT ON Channels L H L H L H L H X X0 X1 X2 X3 X4 X5 X6 X7 NONE VCC X2 X1 X0 X3 A B C 16 15 14 13 12 11 10 9 6 7 8 GND Figure 1. MC74HC4851A Logic Diagram Single−Pole, 8−Position Plus Common Off 1 2 3 4 5 X4 X6 X X7 X5 Enable NC Figure 2. MC74HC4851A 16−Lead Pinout (Top View) FUNCTION TABLE − MC74HC4852A Control Inputs Enable B Select A L L L L H L L H H X L H L H X ON Channels 12 ANALOG INPUTS/OUTPUTS CHANNEL-SELECT INPUTS X0 14 X1 15 X2 11 X3 Y0 Y1 Y2 Y3 A B ENABLE X SWITCH 13 X COMMON OUTPUTS/INPUTS 1 Y SWITCH 3 NONE Y 4 10 9 X0 X1 X2 X3 X = Don’t Care 5 2 Y0 Y1 Y2 Y3 PIN 16 = VCC PIN 8 = GND VCC X2 X1 X X0 X3 A B 16 15 14 13 12 11 10 9 6 7 8 GND 6 Figure 3. MC74HC4852A Logic Diagram Double−Pole, 4−Position Plus Common Off 1 2 3 4 5 Y0 Y2 Y Y3 Y1 Enable NC Figure 4. MC74HC4852A 16−Lead Pinout (Top View) http://onsemi.com 2 MC74HC4851A, MC74HC4852A ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎ ÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎ ÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎ ÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎÎÎÎ ÎÎÎÎ ÎÎÎÎÎ ÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎ ÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎ ÎÎÎ MAXIMUM RATINGS Symbol Value Unit VCC Positive DC Supply Voltage (Referenced to GND) –0.5 to + 7.0 V Vin DC Input Voltage (Any Pin) (Referenced to GND) –0.5 to VCC + 0.5 V DC Current, Into or Out of Any Pin $25 mA PD Power Dissipation in Still Air, 750 500 450 mW Tstg Storage Temperature Range –65 to + 150 °C TL Lead Temperature, 1 mm from Case for 10 Seconds Plastic DIP, SOIC or TSSOP Package I Parameter Plastic DIP† SOIC Package† TSSOP Package† °C 260 Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. †Derating — Plastic DIP: – 10 mW/°C from 65° to 125°C SOIC Package: – 7 mW/°C from 65° to 125°C TSSOP Package: − 6.1 mW/°C from 65° to 125°C For high frequency or heavy load considerations, see Chapter 2 of the ON Semiconductor High−Speed CMOS Data Book (DL129/D). This device contains protection circuitry to guard against damage due to high static voltages or electric fields. However, precautions must be taken to avoid applications of any voltage higher than maximum rated voltages to this high−impedance circuit. For proper operation, Vin and Vout should be constrained to the range GND v (Vin or Vout) v VCC. Unused inputs must always be tied to an appropriate logic voltage level (e.g., either GND or VCC). Unused outputs must be left open. ÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ RECOMMENDED OPERATING CONDITIONS Symbol Parameter Min Max Unit VCC Positive DC Supply Voltage (Referenced to GND) 2.0 6.0 V Vin DC Input Voltage (Any Pin) (Referenced to GND) GND VCC V Static or Dynamic Voltage Across Switch 0.0 1.2 V TA Operating Temperature Range, All Package Types – 55 + 125 °C tr, tf Input Rise/Fall Time (Channel Select or Enable Inputs) 0 0 0 1000 500 400 ns VIO* VCC = 2.0 V VCC = 4.5 V VCC = 6.0 V *For voltage drops across switch greater than 1.2 V (switch on), excessive VCC current may be drawn; i.e., the current out of the switch may contain both VCC and switch input components. The reliability of the device will be unaffected unless the Maximum Ratings are exceeded. DC CHARACTERISTICS — Digital Section (Voltages Referenced to GND) VEE = GND, Except Where Noted Symbol Parameter Condition Guaranteed Limit VCC V −55 to 25°C ≤85°C ≤125°C Unit VIH Minimum High−Level Input Voltage, Channel−Select or Enable Inputs Ron = Per Spec 2.0 3.0 4.5 6.0 1.50 2.10 3.15 4.20 1.50 2.10 3.15 4.20 1.50 2.10 3.15 4.20 V VIL Maximum Low−Level Input Voltage, Channel−Select or Enable Inputs Ron = Per Spec 2.0 3.0 4.5 6.0 0.50 0.90 1.35 1.80 0.50 0.90 1.35 1.80 0.50 0.90 1.35 1.80 V Iin Maximum Input Leakage Current on Digital Pins (Enable/A/B/C) Vin = VCC or GND 6.0 ± 0.1 ± 1.0 ± 1.0 mA ICC Maximum Quiescent Supply Current (per Package) Vin(digital) = VCC or GND Vin(analog) = GND 6.0 2 20 40 mA NOTE: Information on typical parametric values can be found in Chapter 2 of the ON Semiconductor High−Speed CMOS Data Book (DL129/D). http://onsemi.com 3 MC74HC4851A, MC74HC4852A DC CHARACTERISTICS — Analog Section Guaranteed Limit Symbol Ron DRon Ioff Ion Parameter Condition VCC −55 to 25°C ≤85°C ≤125°C Unit Maximum “ON” Resistance Vin = VIL or VIH;VIS = VCC to GND; IS ≤ 2.0 mA 2.0 3.0 4.5 6.0 1700 1100 550 400 1750 1200 650 500 1800 1300 750 600 W Delta “ON” Resistance Vin = VIL or VIH; VIS = VCC/2 IS ≤ 2.0 mA 2.0 3.0 4.5 6.0 300 160 80 60 400 200 100 80 500 240 120 100 W Maximum Off−Channel Leakage Current, Any One Channel Common Channel Vin = VCC or GND 6.0 ±0.1 ±0.2 ±0.5 ±2.0 ±1.0 ±4.0 6.0 ±0.2 ±2.0 ±4.0 VCC −55 to 25°C ≤85°C ≤125°C Unit Maximum Propagation Delay, Analog Input to Analog Output 2.0 3.0 4.5 6.0 160 80 40 30 180 90 45 35 200 100 50 40 ns Maximum Propagation Delay, Enable or Channel−Select to Analog Output 2.0 3.0 4.5 6.0 260 160 80 60 280 180 90 70 300 200 100 80 ns 10 35 130 10 35 130 10 35 130 pF Maximum On−Channel Leakage Vin = VCC or GND Channel−to−Channel mA mA AC CHARACTERISTICS (CL = 50 pF, Input tr = tf = 6 ns) Symbol tPHL, tPLH tPHL, tPHZ,PZH tPLH, tPLZ,PZL Parameter Cin Maximum Input Capacitance (All Switches Off) (All Switches Off) CPD Power Dissipation Capacitance Digital Pins Any Single Analog Pin Common Analog Pin Typical 5.0 20 pF INJECTION CURRENT COUPLING SPECIFICATIONS (VCC = 5V, TA = −55°C to +125°C) Symbol VDout Parameter Condition Maximum Shift of Output Voltage of Enabled Analog Channel Iin* ≤ 1 mA, RS ≤ 3,9 kW Iin* ≤ 10 mA, RS ≤ 3,9 kW Iin* ≤ 1 mA, RS ≤ 20 kW Iin* ≤ 10 mA, RS ≤ 20 kW * Iin = Total current injected into all disabled channels. http://onsemi.com 4 Typ Max Unit 0.1 1.0 0.5 5.0 1.0 5.0 2.0 20 mV MC74HC4851A, MC74HC4852A 900 −55°C 800 +25°C 700 +125°C 600 500 400 300 200 R on , ON RESISTANCE (OHMS) 1100 1000 R on , ON RESISTANCE (OHMS) 1100 1000 100 800 700 600 500 +25°C 300 +125°C 200 0.4 0.8 1.2 1.6 0 0.0 2.0 0.6 1.2 1.8 2.4 Vin, INPUT VOLTAGE (VOLTS), REFERENCED TO GND Vin, INPUT VOLTAGE (VOLTS), REFERENCED TO GND Figure 5. Typical On Resistance VCC = 2V Figure 6. Typical On Resistance VCC = 3V 660 440 600 400 540 360 480 420 360 −55°C 300 +25°C 240 +125°C 180 −55°C 280 160 120 40 2.7 3.6 +125°C 200 60 1.8 +25°C 240 80 0.9 0 0.0 4.5 1.2 2.4 3.6 4.8 Vin, INPUT VOLTAGE (VOLTS), REFERENCED TO GND Vin, INPUT VOLTAGE (VOLTS), REFERENCED TO GND Figure 7. Typical On Resistance VCC = 4.5V Figure 8. Typical On Resistance VCC = 6V http://onsemi.com 5 3.0 320 120 0 0.0 −55°C 400 100 R on , ON RESISTANCE (OHMS) R on , ON RESISTANCE (OHMS) 0 0.0 900 6.0 MC74HC4851A, MC74HC4852A VCC = 5V Iin Vin2 < VSS or VCC < Vin2 Any Disabled Channel VSS < Vin1 < VCC Enabled Channel Vout = Vin1 ±VDout RS Figure 9. Injection Current Coupling Specification 5V 6V 5V HC4051A Sensor VCC VCC Microcontroller Channel 1 Channel 2 Channel 3 Channel 4 Channel 5 Channel 6 Channel 7 Channel 8 (8x Identical Circuitry) Common Out A/D − Input Figure 10. Actual Technology Requires 32 passive components and one extra 6V regulator to suppress injection current into a standard HC4051 multiplexer 5V VCC HC4851A Channel 1 Channel 2 Channel 3 Channel 4 Channel 5 Channel 6 Channel 7 Channel 8 Sensor (8x Identical Circuitry) VCC Common Out Microcontroller A/D − Input Figure 11. MC74HC4851A Solution Solution by applying the HC4851A multiplexer http://onsemi.com 6 MC74HC4851A, MC74HC4852A PLOTTER VCC PROGRAMMABLE POWER SUPPLY MINI COMPUTER DC ANALYZER 16 VEE VCC OFF − + VCC VCC A COMMON O/I OFF NC DEVICE UNDER TEST ANALOG IN VIH COMMON OUT 6 8 GND Figure 13. Maximum Off Channel Leakage Current, Any One Channel, Test Set−Up Figure 12. On Resistance Test Set−Up VCC 16 VEE ANALOG I/O 16 A OFF VCC OFF VIH VCC VCC VCC ON VEE COMMON O/I VCC N/C ANALOG I/O VIL 6 COMMON O/I OFF 6 8 8 Figure 14. Maximum Off Channel Leakage Current, Common Channel, Test Set−Up Figure 15. Maximum On Channel Leakage Current, Channel to Channel, Test Set−Up VCC VCC 16 VCC CHANNEL SELECT ON/OFF 50% OFF/ON GND tPLH ANALOG OUT COMMON O/I ANALOG I/O TEST POINT C L* tPHL 6 50% 8 CHANNEL SELECT *Includes all probe and jig capacitance Figure 16. Propagation Delays, Channel Select to Analog Out Figure 17. Propagation Delay, Test Set−Up Channel Select to Analog Out http://onsemi.com 7 MC74HC4851A, MC74HC4852A VCC 16 VCC ANALOG IN COMMON O/I ANALOG I/O ON 50% TEST POINT C L* GND tPLH tPHL ANALOG OUT 6 8 50% *Includes all probe and jig capacitance Figure 18. Propagation Delays, Analog In to Analog Out tf tr tPZL ANALOG OUT 2 GND tPLZ 16 HIGH IMPEDANCE 10% VCC VCC 1 TEST POINT ON/OFF C L* VOL tPHZ ENABLE VOH 90% 10kW ANALOG I/O 2 50% tPZH POSITION 1 WHEN TESTING tPHZ AND tPZH POSITION 2 WHEN TESTING tPLZ AND tPZL 1 VCC 90% 50% 10% ENABLE ANALOG OUT Figure 19. Propagation Delay, Test Set−Up Analog In to Analog Out 50% 8 HIGH IMPEDANCE Figure 20. Propagation Delays, Enable to Analog Out 6 Figure 21. Propagation Delay, Test Set−Up Enable to Analog Out VCC A VCC 16 ON/OFF COMMON O/I NC ANALOG I/O OFF/ON VCC 6 8 11 CHANNEL SELECT Figure 22. Power Dissipation Capacitance, Test Set−Up http://onsemi.com 8 MC74HC4851A, MC74HC4852A Gate = VCC (Disabled) Disabled Analog Mux Input Vin > VCC + 0.7V P+ Common Analog Output Vout > VCC P+ + + + N − Substrate (on VCC potential) Figure 23. Diagram of Bipolar Coupling Mechanism Appears if Vin exceeds VCC, driving injection current into the substrate A B C ENABLE 11 10 9 6 Figure 24. Function Diagram, HC4851A http://onsemi.com 9 INJECTION CURRENT CONTROL 13 INJECTION CURRENT CONTROL 14 INJECTION CURRENT CONTROL 15 INJECTION CURRENT CONTROL 12 INJECTION CURRENT CONTROL 1 INJECTION CURRENT CONTROL 5 INJECTION CURRENT CONTROL 2 INJECTION CURRENT CONTROL 4 INJECTION CURRENT CONTROL 3 X0 X1 X2 X3 X4 X5 X6 X7 X MC74HC4851A, MC74HC4852A A B ENABLE 10 9 6 Figure 25. Function Diagram, HC4852A http://onsemi.com 10 INJECTION CURRENT CONTROL 13 INJECTION CURRENT CONTROL 14 INJECTION CURRENT CONTROL 15 INJECTION CURRENT CONTROL 12 INJECTION CURRENT CONTROL 13 INJECTION CURRENT CONTROL 1 INJECTION CURRENT CONTROL 5 INJECTION CURRENT CONTROL 2 INJECTION CURRENT CONTROL 4 INJECTION CURRENT CONTROL 3 X0 X1 X2 X3 X Y0 Y1 Y2 Y3 Y MC74HC4851A, MC74HC4852A ORDERING INFORMATION Package Shipping † MC74HC4851AN PDIP−16 500 Units / Box MC74HC4851ANG PDIP−16 (Pb−Free) 500 Units / Box MC74HC4851AD SOIC−16 48 Units / Rail MC74HC4851ADG SOIC−16 (Pb−Free) 48 Units / Rail MC74HC4851ADR2 SOIC−16 2500 Units / Tape & Reel MC74HC4851ADR2G SOIC−16 (Pb−Free) 2500 Units / Tape & Reel MC74HC4851ADTR2 TSSOP−16* 2500 Units / Tape & Reel MC74HC4851ADTR2G TSSOP−16* 2500 Units / Tape & Reel MC74HC4851ADW SOIC−16 WIDE 48 Units / Rail MC74HC4851ADWG SOIC−16 WIDE (Pb−Free) 48 Units / Rail MC74HC4851ADWR2 SOIC−16 WIDE 1000 Units / Tape & Reel MC74HC4851ADWR2G SOIC−16 WIDE (Pb−Free) 1000 Units / Tape & Reel MC74HC4852AN PDIP−16 500 Units / Box MC74HC4852ANG PDIP−16 (Pb−Free) 500 Units / Box MC74HC4852AD SOIC−16 48 Units / Rail MC74HC4852ADG SOIC−16 (Pb−Free) 48 Units / Rail MC74HC4852ADR2 SOIC−16 2500 Units / Tape & Reel MC74HC4852ADR2G SOIC−16 (Pb−Free) 2500 Units / Tape & Reel MC74HC4852ADTR2 TSSOP−16* 2500 Units / Tape & Reel MC74HC4852ADTR2G TSSOP−16* 2500 Units / Tape & Reel Device †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *This package is inherently Pb−Free. http://onsemi.com 11 MC74HC4851A, MC74HC4852A PACKAGE DIMENSIONS PDIP−16 N SUFFIX CASE 648−08 ISSUE T NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL. 4. DIMENSION B DOES NOT INCLUDE MOLD FLASH. 5. ROUNDED CORNERS OPTIONAL. −A− 16 9 1 8 B F C L DIM A B C D F G H J K L M S S −T− SEATING PLANE K H D M J G 16 PL 0.25 (0.010) T A M M INCHES MIN MAX 0.740 0.770 0.250 0.270 0.145 0.175 0.015 0.021 0.040 0.70 0.100 BSC 0.050 BSC 0.008 0.015 0.110 0.130 0.295 0.305 0_ 10 _ 0.020 0.040 MILLIMETERS MIN MAX 18.80 19.55 6.35 6.85 3.69 4.44 0.39 0.53 1.02 1.77 2.54 BSC 1.27 BSC 0.21 0.38 2.80 3.30 7.50 7.74 0_ 10 _ 0.51 1.01 SOIC−16 D SUFFIX CASE 751B−05 ISSUE J NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. −A− 16 9 −B− 1 P 8 PL 0.25 (0.010) 8 M B S G R K F X 45 _ C −T− SEATING PLANE J M D 16 PL 0.25 (0.010) M T B S A S http://onsemi.com 12 DIM A B C D F G J K M P R MILLIMETERS MIN MAX 9.80 10.00 3.80 4.00 1.35 1.75 0.35 0.49 0.40 1.25 1.27 BSC 0.19 0.25 0.10 0.25 0_ 7_ 5.80 6.20 0.25 0.50 INCHES MIN MAX 0.386 0.393 0.150 0.157 0.054 0.068 0.014 0.019 0.016 0.049 0.050 BSC 0.008 0.009 0.004 0.009 0_ 7_ 0.229 0.244 0.010 0.019 MC74HC4851A, MC74HC4852A SOIC−16 WIDE DW SUFFIX CASE 751G−03 ISSUE C A D 9 h X 45 _ E 0.25 H 8X M B M 16 NOTES: 1. DIMENSIONS ARE IN MILLIMETERS. 2. INTERPRET DIMENSIONS AND TOLERANCES PER ASME Y14.5M, 1994. 3. DIMENSIONS D AND E DO NOT INLCUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE. 5. DIMENSION B DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.13 TOTAL IN EXCESS OF THE B DIMENSION AT MAXIMUM MATERIAL CONDITION. q 1 MILLIMETERS DIM MIN MAX A 2.35 2.65 A1 0.10 0.25 B 0.35 0.49 C 0.23 0.32 D 10.15 10.45 E 7.40 7.60 e 1.27 BSC H 10.05 10.55 h 0.25 0.75 L 0.50 0.90 q 0_ 7_ 8 B B 16X M T A 14X e S B S L A 0.25 A1 SEATING PLANE C T TSSOP−16 DT SUFFIX CASE 948F−01 ISSUE A 16X K REF 0.10 (0.004) 0.15 (0.006) T U M T U V S S S K ÉÉÉ ÇÇÇ ÇÇÇ ÉÉÉ ÇÇÇ K1 2X L/2 16 9 J1 B −U− L SECTION N−N J PIN 1 IDENT. 8 1 N 0.25 (0.010) 0.15 (0.006) T U S A −V− NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH. PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5. DIMENSION K DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE K DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 7. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE −W−. M N F DETAIL E −W− C 0.10 (0.004) −T− SEATING PLANE H D DETAIL E G http://onsemi.com 13 DIM A B C D F G H J J1 K K1 L M MILLIMETERS MIN MAX 4.90 5.10 4.30 4.50 −−− 1.20 0.05 0.15 0.50 0.75 0.65 BSC 0.18 0.28 0.09 0.20 0.09 0.16 0.19 0.30 0.19 0.25 6.40 BSC 0_ 8_ INCHES MIN MAX 0.193 0.200 0.169 0.177 −−− 0.047 0.002 0.006 0.020 0.030 0.026 BSC 0.007 0.011 0.004 0.008 0.004 0.006 0.007 0.012 0.007 0.010 0.252 BSC 0_ 8_ MC74HC4851A, MC74HC4852A ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: N. American Technical Support: 800−282−9855 Toll Free Literature Distribution Center for ON Semiconductor USA/Canada P.O. Box 61312, Phoenix, Arizona 85082−1312 USA Phone: 480−829−7710 or 800−344−3860 Toll Free USA/Canada Japan: ON Semiconductor, Japan Customer Focus Center 2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051 Fax: 480−829−7709 or 800−344−3867 Toll Free USA/Canada Phone: 81−3−5773−3850 Email: [email protected] http://onsemi.com 14 ON Semiconductor Website: http://onsemi.com Order Literature: http://www.onsemi.com/litorder For additional information, please contact your local Sales Representative. MC74HC4851A/D