ONSEMI MC74VHC4053

MC74VHC4051,
MC74VHC4052,
MC74VHC4053
Analog Multiplexers /
Demultiplexers
High−Performance Silicon−Gate CMOS
The MC74VHC4051, MC74VHC4052 and MC74VHC4053 utilize
silicon−gate CMOS technology to achieve fast propagation delays,
low ON resistances, and low OFF leakage currents. These analog
multiplexers/demultiplexers control analog voltages that may vary
across the complete power supply range (from VCC to VEE).
The VHC4051, VHC4052 and VHC4053 are identical in pinout to
the high−speed HC4051A, HC4052A and HC4053A, and the
metal−gate MC14051B, MC14052B and MC14053B. The
Channel−Select inputs determine which one of the Analog
Inputs/Outputs is to be connected, by means of an analog switch, to the
Common Output/Input. When the Enable pin is HIGH, all analog
switches are turned off.
The Channel−Select and Enable inputs are compatible with standard
CMOS outputs; with pullup resistors they are compatible with LSTTL
outputs.
These devices have been designed so that the ON resistance (Ron) is
more linear over input voltage than Ron of metal−gate CMOS analog
switches.
• Fast Switching and Propagation Speeds
• Low Crosstalk Between Switches
• Diode Protection on All Inputs/Outputs
• Analog Power Supply Range (VCC − VEE) = 2.0 to 12.0 V
• Digital (Control) Power Supply Range (VCC − GND) = 2.0 to 6.0 V
• Improved Linearity and Lower ON Resistance Than Metal−Gate
Counterparts
• Low Noise
• Chip Complexity: VHC4051 — 184 FETs or 46 Equivalent Gates
VHC4052 — 168 FETs or 42 Equivalent Gates
VHC4053 — 156 FETs or 39 Equivalent Gates
• These Devices are Pb−Free and are RoHS Compliant
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MARKING
DIAGRAMS
16
9
VHC405xG
AWLYYWW
SOIC−16
D SUFFIX
CASE 751B
1
8
16
9
VHC
405x
ALYWG
G
TSSOP−16
DT SUFFIX
CASE 948F
1
8
16
SOIC EIAJ−16
M SUFFIX
CASE 966
9
VHC405x
ALYWG
1
8
VHC405x = Specific Device Code
(x = 1, 2 or 3)
A
= Assembly Location
L, WL
= Wafer Lot
Y, YY
= Year
W, WW
= Work Week
G or G
= Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 14 of this data sheet.
© Semiconductor Components Industries, LLC, 2011
May, 2011 − Rev. 6
1
Publication Order Number:
MC74VHC4051/D
MC74VHC4051, MC74VHC4052, MC74VHC4053
13
X0
14
X1
15
X2
ANALOG
12
MULTIPLEXER/
INPUTS/ X3
DEMULTIPLEXER
OUTPUTS X4 1
5
X5
2
X6
4
X7
11
A
CHANNEL
10
B
SELECT
9
INPUTS
C
6
ENABLE
PIN 16 = VCC
PIN 7 = VEE
PIN 8 = GND
3
X
COMMON
OUTPUT/
INPUT
MC74VHC4051
Single−Pole, 8−Position Plus Common Off
12
ANALOG
INPUTS/OUTPUTS
CHANNEL‐SELECT
INPUTS
X0
14
X1
15
X2
11
X3
Y0
Y1
Y2
Y3
A
B
ENABLE
13
X SWITCH
X
COMMON
OUTPUTS/INPUTS
1
5
2
3
Y SWITCH
Y
4
10
9
PIN 16 = VCC
PIN 7 = VEE
PIN 8 = GND
6
MC74VHC4052
Double−Pole, 4−Position Plus Common Off
12
X0
13
X1
14
X SWITCH
2
ANALOG
INPUTS/OUTPUTS
Y0
1
Y1
15
Y SWITCH
5
Z0
3
Z1
4
Z SWITCH
X
Y
COMMON
OUTPUTS/INPUTS
Z
11
A
10
B
9
C
6
ENABLE
PIN 16 = VCC
PIN 7 = VEE
PIN 8 = GND
CHANNEL‐SELECT
INPUTS
NOTE: This device allows independent control of each switch.
Channel−Select Input A controls the X−Switch, Input B controls
the Y−Switch and Input C controls the Z−Switch
MC74VHC4053
Triple Single−Pole, Double−Position Plus Common Off
Figure 1. Logic Diagrams
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2
MC74VHC4051, MC74VHC4052, MC74VHC4053
FUNCTION TABLE − MC74VHC4051
VCC
X2
X1
X0
X3
A
B
C
16
15
14
13
12
11
10
9
1
2
3
4
5
X4
X6
X
X7
X5
6
7
Enable VEE
Control Inputs
Enable
C
L
L
L
L
L
L
L
L
H
L
L
L
L
H
H
H
H
X
8
GND
Figure 2. Pinout: MC74VHC4051 (Top View)
Select
B
A
ON Channels
X0
X1
X2
X3
X4
X5
X6
X7
NONE
L
H
L
H
L
H
L
H
X
L
L
H
H
L
L
H
H
X
X = Don’t Care
VCC
X2
X1
X
X0
X3
A
B
16
15
14
13
12
11
10
9
1
2
3
4
5
Y0
Y2
Y
Y3
Y1
6
7
Enable VEE
FUNCTION TABLE − MC74VHC4052
Control Inputs
8
GND
Enable
B
L
L
L
L
H
L
L
H
H
X
Select
A
ON Channels
L
H
L
H
X
Y0
Y1
Y2
Y3
X0
X1
X2
X3
NONE
X = Don’t Care
Figure 3. Pinout: MC74VHC4052 (Top View)
FUNCTION TABLE − MC74VHC4053
VCC
Y
X
X1
X0
A
B
C
16
15
14
13
12
11
10
9
1
2
3
4
5
Y1
Y0
Z1
Z
Z0
6
7
Enable VEE
Control Inputs
8
GND
Figure 4. Pinout: MC74VHC4053 (Top View)
Enable
C
L
L
L
L
L
L
L
L
H
L
L
L
L
H
H
H
H
X
X = Don’t Care
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3
Select
B
A
L
L
H
H
L
L
H
H
X
L
H
L
H
L
H
L
H
X
ON Channels
Z0
Z0
Z0
Z0
Z1
Z1
Z1
Z1
Y0
Y0
Y1
Y1
Y0
Y0
Y1
Y1
NONE
X0
X1
X0
X1
X0
X1
X0
X1
MC74VHC4051, MC74VHC4052, MC74VHC4053
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎ
ÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
MAXIMUM RATINGS*
Symbol
Parameter
Value
Unit
– 0.5 to + 7.0
– 0.5 to + 14.0
V
Negative DC Supply Voltage (Referenced to GND)
– 7.0 to + 5.0
V
VIS
Analog Input Voltage
VEE − 0.5 to
VCC + 0.5
V
Vin
Digital Input Voltage (Referenced to GND)
– 0.5 to VCC + 0.5
V
± 25
mA
500
450
mW
– 65 to + 150
_C
VCC
Positive DC Supply Voltage
VEE
I
(Referenced to GND)
(Referenced to VEE)
DC Current, Into or Out of Any Pin
PD
Power Dissipation in Still Air
Tstg
Storage Temperature Range
SOIC Package†
TSSOP Package†
TL
Lead Temperature, 1 mm from Case for 10 Seconds
260
*Maximum Ratings are those values beyond which damage to the device may occur.
Functional operation should be restricted to the Recommended Operating Conditions.
†Derating — SOIC Package: – 7 mW/_C from 65_ to 125_C
TSSOP Package: − 6.1 mW/_C from 65_ to 125_C
This device contains protection
circuitry to guard against damage
due to high static voltages or electric
fields. However, precautions must
be taken to avoid applications of any
voltage higher than maximum rated
voltages to this high−impedance circuit. For proper operation, Vin and
Vout should be constrained to the
range GND v (Vin or Vout) v VCC.
Unused inputs must always be
tied to an appropriate logic voltage
level (e.g., either GND or V CC ).
Unused outputs must be left open.
_C
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
(Referenced to GND)
(Referenced to VEE)
Min
Max
Unit
2.0
2.0
6.0
12.0
V
VCC
Positive DC Supply Voltage
VEE
Negative DC Supply Voltage, Output (Referenced to GND)
− 6.0
GND
V
VIS
Analog Input Voltage
VEE
VCC
V
Vin
Digital Input Voltage (Referenced to GND)
GND
VCC
V
VIO*
Static or Dynamic Voltage Across Switch
1.2
V
– 55
+ 125
_C
0
0
0
0
1000
800
500
400
ns
TA
Operating Temperature Range, All Package Types
tr, tf
Input Rise/Fall Time
(Channel Select or Enable Inputs)
VCC = 2.0 V
VCC = 3.0 V
VCC = 4.5 V
VCC = 6.0 V
*For voltage drops across switch greater than 1.2V (switch on), excessive VCC current may be
drawn; i.e., the current out of the switch may contain both VCC and switch input components.
The reliability of the device will be unaffected unless the Maximum Ratings are exceeded.
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4
MC74VHC4051, MC74VHC4052, MC74VHC4053
DC CHARACTERISTICS — Digital Section (Voltages Referenced to GND) VEE = GND, Except Where Noted
Symbol
Parameter
Condition
Guaranteed Limit
VCC
V
−55 to 25°C
≤85°C
≤125°C
Unit
VIH
Minimum High−Level Input
Voltage, Channel−Select or
Enable Inputs
Ron = Per Spec
2.0
3.0
4.5
6.0
1.50
2.10
3.15
4.20
1.50
2.10
3.15
4.20
1.50
2.10
3.15
4.20
V
VIL
Maximum Low−Level Input
Voltage, Channel−Select or
Enable Inputs
Ron = Per Spec
2.0
3.0
4.5
6.0
0.5
0.9
1.35
1.8
0.5
0.9
1.35
1.8
0.5
0.9
1.35
1.8
V
Iin
Maximum Input Leakage Current,
Channel−Select or Enable Inputs
Vin = VCC or GND,
VEE = − 6.0 V
6.0
± 0.1
± 1.0
± 1.0
μA
ICC
Maximum Quiescent Supply
Current (per Package)
Channel Select, Enable and
VIS = VCC or GND;
VEE = GND
VEE = − 6.0
VIO = 0 V
6.0
6.0
1
4
10
40
40
80
μA
ÎÎÎÎ
ÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎ
ÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
DC ELECTRICAL CHARACTERISTICS Analog Section
Guaranteed Limit
Symbol
Ron
Parameter
Maximum “ON” Resistance
VCC
V
VEE
V
– 55 to
25_C
v 85_C
v 125_C
Unit
Vin = VIL or VIH
VIS = VCC to VEE
IS v 2.0 mA
(Figures 5 through 11)
3.0
4.5
4.5
6.0
0.0
0.0
– 4.5
– 6.0
200
160
120
100
240
200
150
125
320
280
170
140
Ω
Vin = VIL or VIH
VIS = VCC or VEE (Endpoints)
IS v 2.0 mA
(Figures 5 through11)
3.0
4.5
4.5
6.0
0.0
0.0
– 4.5
– 6.0
150
110
90
80
180
140
120
100
230
190
140
115
3.0
4.5
4.5
6.0
0.0
0.0
– 4.5
– 6.0
40
20
10
10
50
25
15
12
80
40
18
14
Test Conditions
ΔRon
Maximum Difference in “ON”
Resistance Between Any Two
Channels in the Same Package
Vin = VIL or VIH
VIS = 1/2 (VCC − VEE)
IS v 2.0 mA
Ioff
Maximum Off−Channel Leakage
Current, Any One Channel
Vin = VIL or VIH;
VIO = VCC − VEE;
Switch Off (Figure 12)
6.0
− 6.0
0.1
0.5
1.0
Maximum Off−Channel VHC4051 Vin = VIL or VIH;
Leakage Current,
VHC4052 VIO = VCC − VEE;
Common Channel
VHC4053 Switch Off (Figure 13)
6.0
6.0
6.0
− 6.0
− 6.0
− 6.0
0.2
0.1
0.1
2.0
1.0
1.0
4.0
2.0
2.0
Maximum On−Channel VHC4051 Vin = VIL or VIH;
Leakage Current,
VHC4052 Switch−to−Switch =
Channel−to−Channel VHC4053 VCC − VEE; (Figure 14)
6.0
6.0
6.0
− 6.0
− 6.0
− 6.0
0.2
0.1
0.1
2.0
1.0
1.0
4.0
2.0
2.0
Ion
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5
Ω
μA
μA
MC74VHC4051, MC74VHC4052, MC74VHC4053
AC CHARACTERISTICS (CL = 50 pF, Input tr = tf = 6 ns)
Guaranteed Limit
VCC
V
−55 to 25°C
≤85°C
≤125°C
Unit
Symbol
Parameter
tPLH,
tPHL
Maximum Propagation Delay, Channel−Select to Analog Output
(Figures 18, 19)
2.0
3.0
4.5
6.0
270
90
59
45
320
110
79
65
350
125
85
75
ns
tPLH,
tPHL
Maximum Propagation Delay, Analog Input to Analog Output
(Figures 20, 21)
2.0
3.0
4.5
6.0
40
25
12
10
60
30
15
13
70
32
18
15
ns
tPLZ,
tPHZ
Maximum Propagation Delay, Enable to Analog Output
(Figures 22, 23)
2.0
3.0
4.5
6.0
160
70
48
39
200
95
63
55
220
110
76
63
ns
tPZL,
tPZH
Maximum Propagation Delay, Enable to Analog Output
(Figures 22, 23)
2.0
3.0
4.5
6.0
245
115
49
39
315
145
69
58
345
155
83
67
ns
Cin
Maximum Input Capacitance, Channel−Select or Enable Inputs
10
10
10
pF
CI/O
Maximum Capacitance
Analog I/O
35
35
35
pF
Common O/I: VHC4051
VHC4052
VHC4053
130
80
50
130
80
50
130
80
50
Feedthrough
1.0
1.0
1.0
(All Switches Off)
Typical @ 25°C, VCC = 5.0 V, VEE = 0 V
CPD
Power Dissipation Capacitance (Figure 25)*
VHC4051
VHC4052
VHC4053
* Used to determine the no−load dynamic power consumption: P D = CPD VCC 2 f + ICC VCC .
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6
45
80
45
pF
MC74VHC4051, MC74VHC4052, MC74VHC4053
ADDITIONAL APPLICATION CHARACTERISTICS (GND = 0 V)
VCC
V
Symbol
Parameter
Condition
BW
Maximum On−Channel Bandwidth
or Minimum Frequency Response
(Figure 15)
fin = 1MHz Sine Wave; Adjust fin Voltage to
Obtain 0dBm at VOS; Increase fin
Frequency Until dB Meter Reads −3dB;
RL = 50Ω, CL = 10pF
Off−Channel Feedthrough Isolation
(Figure 16)
—
—
Feedthrough Noise.
Channel−Select Input to Common
I/O (Figure 17)
—
Crosstalk Between Any Two
Switches (Figure 24)
(Test does not apply to VHC4051)
THD
25°C
Unit
‘51
‘52
‘53
80
80
80
95
95
95
120
120
120
2.25
4.50
6.00
−2.25
−4.50
−6.00
fin = Sine Wave; Adjust fin Voltage to
Obtain 0dBm at VIS
fin = 10kHz, RL = 600Ω, CL = 50pF
2.25
4.50
6.00
−2.25
−4.50
−6.00
−50
−50
−50
fin = 1.0MHz, RL = 50Ω, CL = 10pF
2.25
4.50
6.00
−2.25
−4.50
−6.00
−40
−40
−40
Vin ≤ 1MHz Square Wave (tr = tf = 6ns);
Adjust RL at Setup so that IS = 0A;
Enable = GND
RL = 600Ω, CL = 50pF
2.25
4.50
6.00
−2.25
−4.50
−6.00
25
105
135
RL = 10kΩ, CL = 10pF
2.25
4.50
6.00
−2.25
−4.50
−6.00
35
145
190
fin = Sine Wave; Adjust fin Voltage to
Obtain 0dBm at VIS
fin = 10kHz, RL = 600Ω, CL = 50pF
2.25
4.50
6.00
−2.25
−4.50
−6.00
−50
−50
−50
fin = 1.0MHz, RL = 50Ω, CL = 10pF
2.25
4.50
6.00
−2.25
−4.50
−6.00
−60
−60
−60
fin = 1kHz, RL = 10kΩ, CL = 50pF
THD = THDmeasured − THDsource
VIS = 4.0VPP sine wave
VIS = 8.0VPP sine wave
VIS = 11.0VPP sine wave
*Limits not tested. Determined by design and verified by qualification.
MHz
dB
mVPP
dB
Total Harmonic Distortion
(Figure 26)
%
2.25
4.50
6.00
−2.25
−4.50
−6.00
0.10
0.08
0.05
180
300
160
250
Ron , ON RESISTANCE (OHMS)
Ron , ON RESISTANCE (OHMS)
Limit*
VEE
V
200
125°C
150
25°C
-55°C
100
50
140
120
125°C
100
80
25°C
60
-55°C
40
20
0
0
0.25
0.5
0.75
1.0
1.25
1.5
1.75
2.0
0
2.25
0
VIS, INPUT VOLTAGE (VOLTS), REFERENCED TO VEE
0.25 0.5 0.75 1.0 1.25 1.5 1.75 2.0 2.25 2.5 2.75 3.0
VIS, INPUT VOLTAGE (VOLTS), REFERENCED TO VEE
Figure 5. Typical On Resistance, VCC − VEE = 2.0 V
Figure 6. Typical On Resistance, VCC − VEE = 3.0 V
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120
105
100
90
80
Ron , ON RESISTANCE (OHMS)
Ron , ON RESISTANCE (OHMS)
MC74VHC4051, MC74VHC4052, MC74VHC4053
125°C
60
25°C
40
-55°C
20
0
75
125°C
60
25°C
45
-55°C
30
15
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
0
4.5
0
0.5
Figure 7. Typical On Resistance, VCC − VEE = 4.5 V
3.0 3.5
4.0
4.5 5.0 5.5 6.0
60
70
60
50
125°C
40
30
25°C
20
-55°C
50
Ron , ON RESISTANCE (OHMS)
Ron , ON RESISTANCE (OHMS)
2.0 2.5
Figure 8. Typical On Resistance, VCC − VEE = 6.0 V
80
125°C
40
25°C
30
-55°C
20
10
10
0
-4.5
1.0 1.5
VIS, INPUT VOLTAGE (VOLTS), REFERENCED TO VEE
VIS, INPUT VOLTAGE (VOLTS), REFERENCED TO VEE
-3.5
-2.5
-1.5
-0.5
0.5
1.5
2.5
3.5
0
-6.0 -5.0 -4.0 -3.0 -2.0 -1.0
4.5
VIS, INPUT VOLTAGE (VOLTS), REFERENCED TO VEE
2.0
3.0 4.0
5.0
6.0
Figure 10. Typical On Resistance, VCC − VEE = 12.0 V
PLOTTER
-
1.0
VIS, INPUT VOLTAGE (VOLTS), REFERENCED TO VEE
Figure 9. Typical On Resistance, VCC − VEE = 9.0 V
PROGRAMMABLE
POWER
SUPPLY
0
MINI COMPUTER
DC ANALYZER
+
VCC
DEVICE
UNDER TEST
ANALOG IN
COMMON OUT
VEE
GND
Figure 11. On Resistance Test Set−Up
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8
MC74VHC4051, MC74VHC4052, MC74VHC4053
VCC
VCC
VCC
16
VEE
ANALOG I/O
OFF
A
VCC
VIH
OFF
VCC
COMMON O/I
OFF
NC
OFF
VIH
6
7
8
VEE
COMMON O/I
6
7
8
VEE
Figure 12. Maximum Off Channel Leakage Current,
Any One Channel, Test Set−Up
Figure 13. Maximum Off Channel Leakage Current,
Common Channel, Test Set−Up
VCC
VCC
VCC
16
A
VEE
fin
COMMON O/I
OFF
VOS
16
0.1μF
ON
VCC
VCC
16
VEE
dB
METER
ON
N/C
RL
CL*
ANALOG I/O
VIL
6
7
8
6
7
8
VEE
VEE
Figure 14. Maximum On Channel Leakage Current,
Channel to Channel, Test Set−Up
VCC
VIS
fin
VCC
dB
METER
OFF
RL
Figure 15. Maximum On Channel Bandwidth,
Test Set−Up
VOS
16
0.1μF
*Includes all probe and jig capacitance
CL*
16
RL
ON/OFF
COMMON O/I
ANALOG I/O
RL
OFF/ON
RL
RL
6
7
8
VEE
VIL or VIH
VCC
GND
CHANNEL SELECT
Vin ≤ 1 MHz
tr = tf = 6 ns
*Includes all probe and jig capacitance
6
7
8
VEE
TEST
POINT
CL*
VCC
11
CHANNEL SELECT
*Includes all probe and jig capacitance
Figure 16. Off Channel Feedthrough Isolation,
Test Set−Up
Figure 17. Feedthrough Noise, Channel Select to
Common Out, Test Set−Up
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9
MC74VHC4051, MC74VHC4052, MC74VHC4053
VCC
VCC
16
VCC
CHANNEL
SELECT
ON/OFF
50%
COMMON O/I
ANALOG I/O
OFF/ON
GND
tPLH
TEST
POINT
CL*
tPHL
ANALOG
OUT
6
7
8
50%
CHANNEL SELECT
*Includes all probe and jig capacitance
Figure 18. Propagation Delays, Channel Select
to Analog Out
Figure 19. Propagation Delay, Test Set−Up Channel
Select to Analog Out
VCC
16
VCC
ANALOG
IN
COMMON O/I
ANALOG I/O
ON
50%
TEST
POINT
CL*
GND
tPHL
tPLH
ANALOG
OUT
6
7
8
50%
*Includes all probe and jig capacitance
Figure 20. Propagation Delays, Analog In
to Analog Out
tf
tr
tPZL
POSITION 1 WHEN TESTING tPHZ AND tPZH
POSITION 2 WHEN TESTING tPLZ AND tPZL
2
GND
tPLZ
HIGH
IMPEDANCE
10%
VCC
VCC
16
1
TEST
POINT
ON/OFF
CL*
VOL
tPHZ
ENABLE
VOH
90%
1kΩ
ANALOG I/O
2
50%
tPZH
ANALOG
OUT
1
VCC
90%
50%
10%
ENABLE
ANALOG
OUT
Figure 21. Propagation Delay, Test Set−Up
Analog In to Analog Out
50%
6
7
8
HIGH
IMPEDANCE
Figure 22. Propagation Delays, Enable to
Analog Out
Figure 23. Propagation Delay, Test Set−Up
Enable to Analog Out
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10
MC74VHC4051, MC74VHC4052, MC74VHC4053
VCC
VIS
A
VCC
16
RL
fin
16
VOS
ON/OFF
ON
COMMON O/I
NC
ANALOG I/O
0.1μF
OFF/ON
OFF
VEE
RL
RL
CL*
RL
CL*
6
7
8
VEE
VCC
6
7
8
11
CHANNEL SELECT
*Includes all probe and jig capacitance
Figure 24. Crosstalk Between Any Two
Switches, Test Set−Up
Figure 25. Power Dissipation Capacitance,
Test Set−Up
0
VIS
VCC
0.1μF
fin
ON
CL*
-20
TO
DISTORTION
METER
-30
-40
dB
RL
FUNDAMENTAL FREQUENCY
-10
VOS
16
-50
DEVICE
-60
6
7
8
VEE
SOURCE
-70
-80
*Includes all probe and jig capacitance
-90
- 100
1.0
2.0
3.125
FREQUENCY (kHz)
Figure 26. Total Harmonic Distortion, Test Set−Up
Figure 27. Plot, Harmonic Distortion
APPLICATIONS INFORMATION
outputs to VCC or GND through a low value resistor helps
minimize crosstalk and feedthrough noise that may be
picked up by an unused switch.
Although used here, balanced supplies are not a
requirement. The only constraints on the power supplies are
that:
VCC − GND = 2 to 6 volts
VEE − GND = 0 to −6 volts
VCC − VEE = 2 to 12 volts
and VEE ≤ GND
When voltage transients above VCC and/or below VEE are
anticipated on the analog channels, external Germanium or
Schottky diodes (Dx) are recommended as shown in Figure
29. These diodes should be able to absorb the maximum
anticipated current surges during clipping.
The Channel Select and Enable control pins should be at
VCC or GND logic levels. VCC being recognized as a logic
high and GND being recognized as a logic low. In this
example:
VCC = +5V = logic high
GND = 0V = logic low
The maximum analog voltage swings are determined by
the supply voltages VCC and VEE. The positive peak analog
voltage should not exceed VCC. Similarly, the negative peak
analog voltage should not go below VEE. In this example,
the difference between VCC and VEE is ten volts. Therefore,
using the configuration of Figure 28, a maximum analog
signal of ten volts peak−to−peak can be controlled. Unused
analog inputs/outputs may be left floating (i.e., not
connected). However, tying unused analog inputs and
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11
MC74VHC4051, MC74VHC4052, MC74VHC4053
VCC
+5V
16
+5V
ANALOG
SIGNAL
-5V
ON
6
7
8
Dx
+5V
ANALOG
SIGNAL
VCC
16
Dx
Dx
VEE
VEE
7
8
-5V
VEE
Figure 28. Application Example
Figure 29. External Germanium or
Schottky Clipping Diodes
+5V
+5V
16
+5V
ANALOG
SIGNAL
VEE
ON/OFF
6
7
8
VEE
Dx
ON/OFF
-5V
TO EXTERNAL CMOS
CIRCUITRY 0 to 5V
DIGITAL SIGNALS
11
10
9
VCC
ANALOG
SIGNAL
+5V
*
R
R
11
10
9
+5V
+5V
VEE
VEE
16
ANALOG
SIGNAL
ON/OFF
+5V
ANALOG
SIGNAL
R
VEE
+5V
6
7
8
LSTTL/NMOS
CIRCUITRY
VEE
* 2K ≤ R ≤ 10K
a. Using Pull−Up Resistors
11
10
9
LSTTL/NMOS
CIRCUITRY
HCT
BUFFER
b. Using HCT Interface
Figure 30. Interfacing LSTTL/NMOS to CMOS Inputs
A
11
13
LEVEL
SHIFTER
14
B
10
15
LEVEL
SHIFTER
12
C
9
1
LEVEL
SHIFTER
5
ENABLE
6
2
LEVEL
SHIFTER
4
3
Figure 31. Function Diagram, VHC4051
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12
X0
X1
X2
X3
X4
X5
X6
X7
X
MC74VHC4051, MC74VHC4052, MC74VHC4053
A
10
12
LEVEL
SHIFTER
14
B
9
15
LEVEL
SHIFTER
11
13
ENABLE
6
1
LEVEL
SHIFTER
5
2
4
3
X0
X1
X2
X3
X
Y0
Y1
Y2
Y3
Y
Figure 33. Function Diagram, VHC4052
A
11
13
LEVEL
SHIFTER
12
14
B
10
1
LEVEL
SHIFTER
2
15
C
9
3
LEVEL
SHIFTER
5
4
ENABLE
6
LEVEL
SHIFTER
Figure 32. Function Diagram, VHC4053
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13
X1
X0
X
Y1
Y0
Y
Z1
Z0
Z
MC74VHC4051, MC74VHC4052, MC74VHC4053
ORDERING & SHIPPING INFORMATION
Device
Package
Shipping
SOIC−16
2500 Units / Tape & Reel
TSSOP−16
2500 Units / Tape & Reel
SOIC−16
2500 Units / Tape & Reel
TSSOP−16
2500 Units / Tape & Reel
SOIC−16
2500 Units / Tape & Reel
MC74VHC4053DTR2G
TSSOP−16
2500 Units / Tape & Reel
MC74VHC4051MG
SOEIAJ−16
50 Units / Rail
MC74VHC4052MG
SOEIAJ−16
50 Units / Rail
MC74VHC4052MELG
SOEIAJ−16
2000 Units / Reel
MC74VHC4053MG
SOEIAJ−16
50 Units / Rail
MC74VHC4051DR2G
MC74VHC4051DTR2G
MC74VHC4052DR2G
MC74VHC4052DTR2G
MC74VHC4053DR2G
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14
MC74VHC4051, MC74VHC4052, MC74VHC4053
PACKAGE DIMENSIONS
SOIC−16
CASE 751B−05
ISSUE K
−A−
16
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR PROTRUSION
SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D
DIMENSION AT MAXIMUM MATERIAL CONDITION.
9
−B−
1
P
8 PL
0.25 (0.010)
8
B
M
S
G
R
K
F
X 45 _
C
−T−
SEATING
PLANE
J
M
D
16 PL
0.25 (0.010)
M
T B
S
A
S
SOLDERING FOOTPRINT
8X
6.40
16X
1
1.12
16
16X
0.58
1.27
PITCH
8
9
DIMENSIONS: MILLIMETERS
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15
DIM
A
B
C
D
F
G
J
K
M
P
R
MILLIMETERS
MIN
MAX
9.80
10.00
3.80
4.00
1.35
1.75
0.35
0.49
0.40
1.25
1.27 BSC
0.19
0.25
0.10
0.25
0_
7_
5.80
6.20
0.25
0.50
INCHES
MIN
MAX
0.386
0.393
0.150
0.157
0.054
0.068
0.014
0.019
0.016
0.049
0.050 BSC
0.008
0.009
0.004
0.009
0_
7_
0.229
0.244
0.010
0.019
MC74VHC4051, MC74VHC4052, MC74VHC4053
PACKAGE DIMENSIONS
TSSOP−16
CASE 948F−01
ISSUE B
16X K REF
0.10 (0.004)
0.15 (0.006) T U
T U
M
S
V
S
K
S
K1
2X
L/2
16
9
B
−U−
L
SECTION N−N
J
PIN 1
IDENT.
N
8
1
ÉÉÉ
ÇÇÇ
ÇÇÇ
ÉÉÉ
J1
0.25 (0.010)
M
0.15 (0.006) T U
S
A
−V−
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD
FLASH. PROTRUSIONS OR GATE BURRS.
MOLD FLASH OR GATE BURRS SHALL NOT
EXCEED 0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE
INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION SHALL
NOT EXCEED 0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08
(0.003) TOTAL IN EXCESS OF THE K
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE
DETERMINED AT DATUM PLANE −W−.
N
F
DETAIL E
−W−
C
0.10 (0.004)
−T− SEATING
PLANE
D
H
G
DETAIL E
DIM
A
B
C
D
F
G
H
J
J1
K
K1
L
M
SOLDERING FOOTPRINT
7.06
1
0.65
PITCH
16X
0.36
16X
1.26
DIMENSIONS: MILLIMETERS
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16
MILLIMETERS
MIN
MAX
4.90
5.10
4.30
4.50
−−−
1.20
0.05
0.15
0.50
0.75
0.65 BSC
0.18
0.28
0.09
0.20
0.09
0.16
0.19
0.30
0.19
0.25
6.40 BSC
0_
8_
INCHES
MIN
MAX
0.193 0.200
0.169 0.177
−−− 0.047
0.002 0.006
0.020 0.030
0.026 BSC
0.007
0.011
0.004 0.008
0.004 0.006
0.007 0.012
0.007 0.010
0.252 BSC
0_
8_
MC74VHC4051, MC74VHC4052, MC74VHC4053
PACKAGE DIMENSIONS
SOEIAJ−16
CASE 966−01
ISSUE A
16
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS D AND E DO NOT INCLUDE
MOLD FLASH OR PROTRUSIONS AND ARE
MEASURED AT THE PARTING LINE. MOLD FLASH
OR PROTRUSIONS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
4. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
5. THE LEAD WIDTH DIMENSION (b) DOES NOT
INCLUDE DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08 (0.003)
TOTAL IN EXCESS OF THE LEAD WIDTH
DIMENSION AT MAXIMUM MATERIAL CONDITION.
DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT. MINIMUM SPACE
BETWEEN PROTRUSIONS AND ADJACENT LEAD
TO BE 0.46 ( 0.018).
LE
9
Q1
E HE
1
M_
L
8
Z
DETAIL P
D
e
VIEW P
A
A1
b
0.13 (0.005)
c
M
0.10 (0.004)
DIM
A
A1
b
c
D
E
e
HE
L
LE
M
Q1
Z
MILLIMETERS
MIN
MAX
--2.05
0.05
0.20
0.35
0.50
0.10
0.20
9.90
10.50
5.10
5.45
1.27 BSC
7.40
8.20
0.50
0.85
1.10
1.50
10 _
0_
0.70
0.90
--0.78
INCHES
MIN
MAX
--0.081
0.002
0.008
0.014
0.020
0.007
0.011
0.390
0.413
0.201
0.215
0.050 BSC
0.291
0.323
0.020
0.033
0.043
0.059
10 _
0_
0.028
0.035
--0.031
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
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PUBLICATION ORDERING INFORMATION
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For additional information, please contact your local
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MC74VHC4051/D