MMBV809LT1 Preferred Device Silicon Tuning Diode This device is designed for 900 MHz frequency control and tuning applications. It provides solid−state reliability in replacement of mechanical tuning methods. Features • • • • http://onsemi.com Controlled and Uniform Tuning Ratio Available in Surface Mount Package Available in 8 mm Tape and Reel Pb−Free Packages are Available 4.5−6.1 pF VOLTAGE VARIABLE CAPACITANCE DIODE MAXIMUM RATINGS Rating Symbol Value Unit VR 20 Vdc Forward Current IF 20 mAdc Total Power Dissipation (Note 1) @ TA = 25°C Derate above 25°C PD Junction Temperature Storage Temperature Range Reverse Voltage 225 1.8 mW mW/°C TJ +125 °C Tstg −55 to +125 °C 1 ANODE 3 3 CATHODE SOT−23 (TO−236) CASE 318 STYLE 8 1 2 MARKING DIAGRAM Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. 1. FR5 Board 1.0 x 0.75 x 0.62 in. 5K M G G 1 5K = Specific Device Code M = Date Code* G = Pb−Free Package (Note: Microdot may be in either location) *Date Code orientation and/or overbar may vary depending upon manufacturing location. ORDERING INFORMATION Shipping † Device Package MMBV809LT1 SOT−23 3,000 / Tape & Reel SOT−23 (Pb−Free) 3,000 / Tape & Reel SOT−23 10,000 / Tape & Reel MMBV809LT1G MMBV809LT3 MMBV809LT3G SOT−23 10,000 / Tape & Reel (Pb−Free) †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. Preferred devices are recommended choices for future use and best overall value. © Semiconductor Components Industries, LLC, 2006 January, 2006 − Rev. 4 1 Publication Order Number: MMBV809LT1/D MMBV809LT1 ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted) Characteristic − All Types Reverse Breakdown Voltage (IR = 10 mAdc) Symbol Min Typ Max Unit V(BR)R 20 − − Vdc IR − − 50 nAdc Reverse Voltage Leakage Current (VR = 15 Vdc) Ct, Diode Capacitance VR = 2.0 Vdc, f = 1.0 MHz pF Device MMBV809LT1 Q, Figure of Merit VR = 3.0 Vdc f = 500 MHz CR, Capacitance Ratio C2/C8 f = 1.0 MHz (Note 2) Min Typ Max Typ Min Max 4.5 5.3 6.1 75 1.8 2.6 2. CR is the ratio of Ct measured at 2.0 Vdc divided by Ct measured at 8.0 Vdc. TYPICAL CHARACTERISTICS 10 1000 CT , DIODE CAPACITANCE (pF) 9 Q, FIGURE OF MERIT 8 7 6 5 4 3 VR = 3 Vdc TA = 25°C 100 2 1 0 0.5 1 2 3 4 5 8 10 10 0.1 15 Figure 1. Diode Capacitance Figure 2. Figure of Merit CT , DIODE CAPACITANCE (NORMALIZED) R S , SERIES RESISTANCE (MHz) VR = 3.0 Vdc f = 1.0 MHz 800 600 0 10 f, FREQUENCY (GHz) 1000 400 1.0 VR, REVERSE VOLTAGE (VOLTS) 0.2 0.4 0.6 0.8 1.0 1.04 1.03 1.02 1.01 1.00 0.99 0.98 0.97 0.96 −75 1.2 VR = 3.0 Vdc f = 1.0 MHz f, FREQUENCY (GHz) −50 −25 0 +25 +50 +75 TA, AMBIENT TEMPERATURE (°C) Figure 3. Series Resistance Figure 4. Diode Capacitance http://onsemi.com 2 +100 +125 MMBV809LT1 PACKAGE DIMENSIONS SOT−23 (TO−236) CASE 318−08 ISSUE AN NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. 4. 318−01 THRU −07 AND −09 OBSOLETE, NEW STANDARD 318−08. D SEE VIEW C 3 HE E c 1 2 b DIM A A1 b c D E e L L1 HE 0.25 e q A L A1 L1 VIEW C MIN 0.89 0.01 0.37 0.09 2.80 1.20 1.78 0.10 0.35 2.10 MILLIMETERS NOM MAX 1.00 1.11 0.06 0.10 0.44 0.50 0.13 0.18 2.90 3.04 1.30 1.40 1.90 2.04 0.20 0.30 0.54 0.69 2.40 2.64 MIN 0.035 0.001 0.015 0.003 0.110 0.047 0.070 0.004 0.014 0.083 INCHES NOM 0.040 0.002 0.018 0.005 0.114 0.051 0.075 0.008 0.021 0.094 MAX 0.044 0.004 0.020 0.007 0.120 0.055 0.081 0.012 0.029 0.104 STYLE 8: PIN 1. ANODE 2. NO CONNECTION 3. CATHODE SOLDERING FOOTPRINT* 0.95 0.037 0.95 0.037 2.0 0.079 0.9 0.035 SCALE 10:1 0.8 0.031 mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. 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