MBRA340T3 Surface Mount Schottky Power Rectifier SMA Power Surface Mount Package Employing the Schottky Barrier principle in a large area metal−to−silicon power diode. State of the art geometry features epitaxial construction with oxide passivation and metal overlay contact. Ideally suited for low voltage, high frequency rectification, or as free wheeling and polarity diodes in surface mount applications where compact size and weight are critical to the system. • • • • • • Small Compact Surface Mountable Package with J−Bent Leads Rectangular Package for Automated Handling Highly Stable Oxide Passivated Junction Very Low Forward Voltage Drop Guardring for Stress Protection Pb−Free Package is Available http://onsemi.com SCHOTTKY BARRIER RECTIFIER 3.0 AMPERES 40 VOLTS 1 Cathode 2 Anode 1 Mechanical Characteristics: • Case: Epoxy, Molded • Weight: 70 mg (approximately) • Finish: All External Surfaces Corrosion Resistant and Terminal 2 SMA CASE 403D PLASTIC Leads are Readily Solderable • Lead and Mounting Surface Temperature for Soldering Purposes: • • • • 260°C Max. for 10 Seconds Shipped in 12 mm tape, 5000 units per 13 inch reel Polarity: Cathode Lead Indicated by Polarity Band ESD Ratings: Machine Model = C ESD Ratings: Human Body Model = 3B Device Meets MSL 1 Requirements A34 ALYW MAXIMUM RATINGS Rating Symbol Value Unit VRRM VRWM VR 40 V IO 3.0 A Non−Repetitive Peak Surge Current (Surge Applied at Rated Load Conditions Halfwave, Single Phase, 60 Hz) IFSM 100 A Storage/Operating Case Temperature Tstg, TC −55 to +150 °C TJ −55 to +125 °C dv/dt 10,000 V/s Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage Average Rectified Forward Current (At Rated VR, TL = 100°C) Operating Junction Temperature Voltage Rate of Change (Rated VR, TJ = 25°C) MARKING DIAGRAM A34 A L Y W = Device Code = Assembly Location = Wafer Lot = Year = Work Week ORDERING INFORMATION Device MBRA340T3 MBRA340T3G Package Shipping† SMA 5000/Tape & Reel SMA (Pb−Free) 5000/Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. Semiconductor Components Industries, LLC, 2004 July, 2004 − Rev. 2 1 Publication Order Number: MBRA340T3/D MBRA340T3 THERMAL CHARACTERISTICS Characteristic Symbol Value Unit RθJL RθJA 15 81 °C/W Thermal Resistance − Junction−to−Lead (Note 1) Thermal Resistance − Junction−to−Ambient (Note 1) ELECTRICAL CHARACTERISTICS VF Maximum Instantaneous Forward Voltage (Note 2) TJ = 25°C TJ = 100°C 0.450 0.390 TJ = 25°C TJ = 100°C 0.3 15 (IF = 3.0 A) IR Maximum Instantaneous Reverse Current (VR = 40 V) Volts mA 1. Mounted on 2″ Square PC Board with 1″ Square Total Pad Size, PC Board FR4. 2. Pulse Test: Pulse Width ≤ 250 µs, Duty Cycle ≤ 2.0%. TYPICAL CHARACTERISTICS IF, INSTANTANEOUS FORWARD CURRENT (AMPS) 1 10 TJ = 125°C 0.1 0.10 TJ = 100°C 0.20 TJ = 25°C 0.30 TJ = −55°C 0.40 0.50 0.60 TJ = 125°C TJ = 100°C TJ = −55°C TJ = 25°C 0.20 0.30 0.40 0.50 VF, INSTANTANEOUS FORWARD VOLTAGE (VOLTS) VF, MAXIMUM INSTANTANEOUS FORWARD VOLTAGE (VOLTS) Figure 1. Typical Forward Voltage Figure 2. Maximum Forward Voltage 100E−3 IR, REVERSE CURRENT (AMPS) 1 0.1 0.10 IR, MAXIMUM REVERSE CURRENT (AMPS) IF, INSTANTANEOUS FORWARD CURRENT (AMPS) 10 0.60 100E−3 TJ = 125°C 10E−3 1E−3 TJ = 100°C 100E−6 10E−6 TJ = 25°C 1E−6 TJ = 125°C 10E−3 TJ = 100°C 1E−3 TJ = 25°C 100E−6 100E−9 TJ = −55°C 10E−9 1E−9 100E−12 0 10 20 30 VR, REVERSE VOLTAGE (VOLTS) 40 TJ = −55°C 10E−6 1E−6 0 Figure 3. Typical Reverse Current 10 20 30 VR, REVERSE VOLTAGE (VOLTS) Figure 4. Maximum Reverse Current http://onsemi.com 2 40 MBRA340T3 PFO, AVERAGE POWER DISSIPATION (WATTS) IO, AVERAGE FORWARD CURRENT (AMPS) TYPICAL CHARACTERISTICS 5 4.5 freq = 20 kHz dc 4 3.5 3 SQUARE WAVE Ipk/IO = 2.5 2 1.5 1 Ipk/IO = 5 Ipk/IO = 10 Ipk/IO = 20 0.5 0 25 45 65 85 105 125 145 TL, LEAD TEMPERATURE (°C) 1.8 1.6 SQUARE WAVE 1.4 dc 1.2 1.0 0.8 Ipk/IO = 0.6 Ipk/IO = 5 0.4 Ipk/IO = 10 0.2 0 Ipk/IO = 20 0 TJ, DERATED OPERATING TEMPERATURE (°C) TJ = 25 °C 0 5 1.5 2 2.5 3 3.5 4 4.5 5 Figure 6. Forward Power Dissipation C, CAPACITANCE (pF) 100 1 IO, AVERAGE FORWARD CURRENT (AMPS) Figure 5. Current Derating 1000 0.5 10 15 20 25 30 VR, REVERSE VOLTAGE (VOLTS) 35 40 125 RJA = 22 °C/W 115 RJA = 43 °C/W 105 RJA = 63 °C/W 95 85 RJA = 81 °C/W 75 RJA = 96 °C/W 65 55 0 Figure 7. Capacitance 5 10 15 20 25 30 35 VR, DC REVERSE VOLTAGE (VOLTS) Figure 8. Typical Operating Temperature Derating http://onsemi.com 3 40 R(t), TRANSIENT THERMAL RESISTANCE (°C/W) MBRA340T3 100 D = 0.5 0.2 0.1 10 0.05 0.02 0.01 1 SINGLE PULSE 0.1 0.00001 0.0001 0.001 0.01 0.1 1 10 100 1000 100 1000 t, TIME (S) R(t), TRANSIENT THERMAL RESISTANCE (°C/W) Figure 9. Thermal Response, Junction−to−Ambient (min pad) 100 D = 0.5 0.2 10 0.1 0.05 0.02 1 0.1 0.01 SINGLE PULSE 0.00001 0.0001 0.001 0.01 0.1 1 10 t, TIME (S) Figure 10. Thermal Response, Junction to Ambient (1 inch pad) http://onsemi.com 4 MBRA340T3 PACKAGE DIMENSIONS SMA CASE 403D−02 ISSUE A S NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. 403D−01 OBSOLETE, NEW STANDARD IS 403D−02. A D B DIM A B C D H J K S POLARITY INDICATOR OPTIONAL AS NEEDED INCHES MIN MAX 0.160 0.180 0.090 0.115 0.075 0.095 0.050 0.064 0.002 0.006 0.006 0.016 0.030 0.060 0.190 0.220 C K J H SOLDERING FOOTPRINT* 0.157 4.0 0.0787 2.0 0.0787 2.0 inches mm *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 5 MILLIMETERS MIN MAX 4.06 4.57 2.29 2.92 1.91 2.41 1.27 1.63 0.05 0.15 0.15 0.41 0.76 1.52 4.83 5.59 MBRA340T3 ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. 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