MBRS540T3 Preferred Device Surface Mount Schottky Power Rectifier The MBRS540T3 employs the Schottky Barrier principle in a large area metal−to−silicon power diode. State−of−the−art geometry features epitaxial construction with oxide passivation and metal overlay contact. Ideally suited for low voltage, high frequency rectification, or as free wheeling and polarity protection diodes in surface mount applications where compact size and weight are critical to the system. Features • • • • • • Pb−Free Package is Available Small Compact Surface Mountable Package with J−Bend Leads Rectangular Package for Automated Handling Highly Stable Oxide Passivated Junction Excellent Ability to Withstand Reverse Avalanche Energy Transients Guardring for Stress Protection http://onsemi.com SCHOTTKY BARRIER RECTIFIER 5.0 AMPERES 40 VOLTS MARKING DIAGRAM Mechanical Characteristics SMC CASE 403 PLASTIC • Case: Epoxy, Molded, Epoxy Meets UL 94 V−0 @ 0.125 in • Weight: 217 mg (approximately) • Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable • Lead and Mounting Surface Temperature for Soldering Purposes: • • • 260°C Max. for 10 Seconds Polarity: Notch in Plastic Body Indicates Cathode Lead ESD Rating: Machine Model, C (> 400 V) Human Body Model, 3B (> 8000 V) Device Meets MSL 1 Requirements Device MBRS540T3 Symbol Value Unit Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage VRRM VRWM VR 40 V Average Rectified Forward Current (At Rated VR, TC = 105°C) IF(AV) 5 A Peak Repetitive Forward Current (At Rated VR, Square Wave, 20 KHz, TC = 80°C) IFRM 10 A Non−Repetitive Peak Surge Current (Surge Applied at Rated Load Conditions Halfwave, Single Phase, 60 Hz) IFSM 190 A Storage Temperature Range Tstg −65 to +150 °C TJ −65 to +125 °C dv/dt 10,000 V/s Operating Junction Temperature Voltage Rate of Change (Rated VR) = Specific Device Code = Year = Work Week ORDERING INFORMATION MAXIMUM RATINGS Rating B540 Y W YWW B540 MBRS540T3G Package Shipping† SMC 2500/Tape & Reel SMC (Pb−Free) 2500/Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. Preferred devices are recommended choices for future use and best overall value. Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. Semiconductor Components Industries, LLC, 2004 September, 2004 − Rev. 3 1 Publication Order Number: MBRS540T3/D MBRS540T3 THERMAL CHARACTERISTICS Characteristic Symbol Value Unit RJL RJA 12 111 °C/W Thermal Resistance − Junction−to−Lead (Note 1) Thermal Resistance − Junction−to−Ambient (Note 1) ELECTRICAL CHARACTERISTICS Maximum Instantaneous Forward Voltage (Note 2) (iF = 5.0 A, TC= 25°C) VF 0.50 V Maximum Instantaneous Reverse Current (Note 2) (Rated dc Voltage, TC = 25°C) (Rated dc Voltage, TC = 100°C) iR 0.3 15 mA 1. Rating applies when surface mounted on the minimum pad size recommended. 2. Pulse Test: Pulse Width ≤ 300 s, Duty Cycle ≤ 2.0%. TYPICAL CHARACTERISTICS IF, INSTANTANEOUS FORWARD CURRENT (AMPS) 1 10 TJ = 125°C 0.1 0.10 TJ = 100°C 0.20 TJ = 25°C 0.30 TJ = −55°C 0.40 0.50 TJ = 125°C TJ = 100°C TJ = −55°C TJ = 25°C 0.20 0.30 0.40 0.50 0.60 VF, INSTANTANEOUS FORWARD VOLTAGE (VOLTS) VF, MAXIMUM INSTANTANEOUS FORWARD VOLTAGE (VOLTS) Figure 1. Typical Forward Voltage Figure 2. Maximum Forward Voltage 100E−3 IR, REVERSE CURRENT (AMPS) 1 0.1 0.10 0.60 IR, MAXIMUM REVERSE CURRENT (AMPS) IF, INSTANTANEOUS FORWARD CURRENT (AMPS) 10 0.70 100E−3 TJ = 125°C 10E−3 1E−3 TJ = 100°C 100E−6 10E−6 TJ = 25°C 1E−6 TJ = 125°C 10E−3 TJ = 100°C 1E−3 TJ = 25°C 100E−6 100E−9 TJ = −55°C 10E−9 1E−9 100E−12 0 10 20 30 VR, REVERSE VOLTAGE (VOLTS) 40 TJ = −55°C 10E−6 1E−6 0 Figure 3. Typical Reverse Current 10 20 30 VR, REVERSE VOLTAGE (VOLTS) Figure 4. Maximum Reverse Current http://onsemi.com 2 40 MBRS540T3 PFO, AVERAGE POWER DISSIPATION (WATTS) TYPICAL CHARACTERISTICS 9 IO, AVERAGE FORWARD CURRENT (AMPS) 8 freq = 20 kHz dc 7 6 5 4 3 2 1 SQUARE WAVE Ipk/IO = Ipk/IO = 5 Ipk/IO = 10 Ipk/IO = 20 0 25 45 65 85 105 125 145 TL, LEAD TEMPERATURE (°C) 4.5 4 SQUARE WAVE 3.5 3 2.5 2 Ipk/IO = 1.5 Ipk/IO = 5 1 Ipk/IO = 10 0.5 0 Ipk/IO = 20 0 TJ, DERATED OPERATING TEMPERATURE (°C) TJ = 25 °C 0 5 2 3 4 5 6 7 8 9 Figure 6. Forward Power Dissipation C, CAPACITANCE (pF) 100 1 IO, AVERAGE FORWARD CURRENT (AMPS) Figure 5. Current Derating 1000 dc 10 15 20 25 30 VR, REVERSE VOLTAGE (VOLTS) 35 40 125 RJA = 12 °C/W 115 105 RJA = 47 °C/W 95 RJA = 81 °C/W 85 RJA = 111 °C/W 75 RJA = 136 °C/W 65 55 0 Figure 7. Capacitance 5 10 15 20 25 30 35 40 VR, DC REVERSE VOLTAGE (VOLTS) Figure 8. Typical Operating Temperature Derating http://onsemi.com 3 45 MBRS540T3 r(t), TRANSIENT THERMAL RESPONSE (C/W) 1000 100 D = 0.5 10 0.2 0.1 P(pk) 0.05 0.02 1 0.01 Test Type > min pad 1 oz RJC = min pad 1 oz C/W t1 t2 DUTY CYCLE, D = t1/t2 SINGLE PULSE 0.1 0.00001 0.0001 0.001 0.1 0.01 10 1 100 1000 t, TIME (s) r(t), TRANSIENT THERMAL RESPONSE (C/W) Figure 9. Thermal Response − MBRS540T3 on min pad 100 D = 0.5 0.2 10 0.1 P(pk) 0.05 1 0.02 0.01 0.1 0.00001 Test Type > min pad 1 oz RJC = min pad 1 oz C/W t1 t2 DUTY CYCLE, D = t1/t2 SINGLE PULSE 0.0001 0.001 0.01 0.1 1 t, TIME (s) Figure 10. Thermal Response − MBRS540T3 on 1” pad http://onsemi.com 4 10 100 1000 MBRS540T3 PACKAGE DIMENSIONS SMC CASE 403−03 ISSUE D NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. D DIMENSION SHALL BE MEASURED WITHIN DIMENSION P. 4. 403−01 THRU −02 OBSOLETE, NEW STANDARD 403−03. S A D INCHES DIM MIN MAX A 0.260 0.280 B 0.220 0.240 C 0.075 0.095 D 0.115 0.121 H 0.0020 0.0060 J 0.006 0.012 K 0.030 0.050 P 0.020 REF S 0.305 0.320 B C K P J H SOLDERING FOOTPRINT* 4.343 0.171 3.810 0.150 2.794 0.110 SCALE 4:1 mm inches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 5 MILLIMETERS MIN MAX 6.60 7.11 5.59 6.10 1.90 2.41 2.92 3.07 0.051 0.152 0.15 0.30 0.76 1.27 0.51 REF 7.75 8.13 MBRS540T3 ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. 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