MC10EP101 Quad 4-Input OR/NOR The MC10EP101 is a Quad 4–input OR/NOR gate. The device is functionally equivalent to the E101. With AC performance faster than the E101 device, the EP101 is ideal for applications requiring the fastest AC performance available. All VCC and VEE pins must be externally connected to power supply to guarantee proper operation. • • • • • • • • • http://onsemi.com 250ps Typical Propagation Delay High Bandwidth to 3 Ghz Typical PECL mode: 3.0V to 5.5V VCC with VEE = 0V ECL mode: 0V VCC with VEE = –3.0V to –5.5V 75kΩ Internal Input Pulldown Resistors ESD Protection: >4KV HBM, >100V MM Moisture Sensitivity Level 2 For Additional Information, See Application Note AND8003/D Flammability Rating: UL–94 code V–0 @ 1/8”, Oxygen Index 28 to 34 Transistor Count = 173 devices 32–LEAD TQFP FA SUFFIX CASE 873A MARKING DIAGRAM* A WL YY WW MC10 EP101 AWLYYWW LOGIC DIAGRAM D0a D0b D0c D0d 32 1 *For additional information, see Application Note AND8002/D Q0 Q0 PIN DESCRIPTION D1a D1b D1c Q1 PIN FUNCTION D0a–D3d Q0–Q3, Q0–Q3 ECL Data Inputs ECL Data Outputs VCC VBB Positive Supply Reference Voltage Output VEE Negative, 0 Supply Q1 D1d D2a D2b D2c D2d D3a D3b D3c D3d = Assembly Location = Wafer Lot = Year = Work Week Q2 TRUTH TABLE Q2 Q3 Q3 Dna Dnb Dnc Dnd Qn Qn L H X X X H L X H X X H L X X H X H L X X X H H L H H H H H H L L L L L ORDERING INFORMATION Device Semiconductor Components Industries, LLC, 1999 March, 2000 – Rev. 1 1 Package Shipping MC10EP101FA TQFP 250 Units/Tray MC10EP101FAR2 TQFP 2000 Tape & Reel Publication Order Number: MC10EP101/D MC10EP101 D0d D1a D1b D1c D1d D2a D2b D2c 24 23 22 21 20 19 18 17 D0c 25 16 D2d D0b 26 15 D3a D0a 27 14 D3b VEE 28 13 VCC MC10EP101 Q0 29 12 D3c Q0 30 11 D3d VCC 31 10 VEE VCC 32 9 NC 1 2 VCC Q1 3 4 5 6 Q1 Q2 Q2 Q3 7 8 Q3 VCC Figure 1. 32–Lead TQFP Pinout (Top View) Warning: All VCC and VEE pins must be externally connected to Power Supply to guarantee proper operation. MAXIMUM RATINGS* Value Unit VEE Symbol Power Supply (VCC = 0V) Parameter –6.0 to 0 VDC VCC Power Supply (VEE = 0V) 6.0 to 0 VDC VI Input Voltage (VCC = 0V, VI not more negative than VEE) –6.0 to 0 VDC VI Input Voltage (VEE = 0V, VI not more positive than VCC) 6.0 to 0 VDC Iout Output Current 50 100 mA TA Operating Temperature Range –40 to +85 °C Tstg Storage Temperature –65 to +150 °C θJA Thermal Resistance (Junction–to–Ambient) 80 55 °C/W θJC Thermal Resistance (Junction–to–Case) 12 to 17 °C/W Tsol Solder Temperature (<2 to 3 Seconds: 245°C desired) 265 °C Continuous Surge Still Air 500lfpm * Maximum Ratings are those values beyond which damage to the device may occur. http://onsemi.com 2 MC10EP101 DC CHARACTERISTICS, ECL/LVECL (VCC = 0V, VEE = –5.5V to –3.0V) (Note 3.) –40°C Symbol Characteristic 25°C 85°C Min Typ Max Min Typ Max Min Typ Max Unit IEE Power Supply Current (Note 1.) 45 57 75 45 58 75 45 59 75 mA VOH Output HIGH Voltage (Note 2.) –1135 –1060 –885 –1070 –945 –820 –1010 –885 –760 mV VOL Output LOW Voltage (Note 2.) –1995 –1810 –1685 –1995 –1745 –1620 –1995 –1685 –1560 mV VIH Input HIGH Voltage Single Ended –1210 –885 –1145 –820 –1085 –760 mV VIL Input LOW Voltage Single Ended –1935 –1610 –1870 –1545 –1810 –1485 mV IIH Input HIGH Current 150 µA 150 150 IIL Input LOW Current –150 –150 –150 µA NOTE: 10EP circuits are designed to meet the DC specifications shown in the above table after thermal equilibrium has been established. The circuit is in a test socket or mounted on a printed circuit board and transverse airflow greater than 500lfpm is maintained. 1. VCC = 0V, VEE = VEEmin to VEEmax, all other pins floating. 2. All loading with 50 ohms to VCC –2.0 volts. 3. Input and output parameters vary 1:1 with VCC. DC CHARACTERISTICS, LVPECL (VCC = 3.3V ± 0.3V, VEE = 0V) (Note 6.) –40°C Symbol Characteristic 25°C 85°C Min Typ Max Min Typ Max Min Typ Max Unit IEE Power Supply Current (Note 4.) 45 57 75 45 58 75 45 59 75 mA VOH Output HIGH Voltage (Note 5.) 2165 2240 2415 2230 2355 2480 2290 2415 2540 mV VOL Output LOW Voltage (Note 5.) 1305 1490 1615 1305 1555 1680 1305 1615 1740 mV VIH Input HIGH Voltage Single Ended 2090 2415 2155 2480 2215 2540 mV VIL Input LOW Voltage Single Ended 1365 1690 1430 1755 1490 1815 mV IIH Input HIGH Current 150 µA 150 150 IIL Input LOW Current –150 –150 –150 µA NOTE: 10EP circuits are designed to meet the DC specifications shown in the above table after thermal equilibrium has been established. The circuit is in a test socket or mounted on a printed circuit board and transverse airflow greater than 500lfpm is maintained. 4. VCC = 3.0V, VEE = 0V, all other pins floating. 5. All loading with 50 ohms to VCC –2.0 volts. 6. Input and output parameters vary 1:1 with VCC. http://onsemi.com 3 MC10EP101 DC CHARACTERISTICS, PECL (VCC = 5.0V ± 0.5V, VEE = 0V) (Note 9.) –40°C Symbol Characteristic 25°C 85°C Min Typ Max Min Typ Max Min Typ Max Unit IEE Power Supply Current (Note 7.) 45 57 75 45 58 75 45 59 75 mA VOH Output HIGH Voltage (Note 8.) 3865 3940 4115 3930 4055 4180 3990 4115 4240 mV VOL Output LOW Voltage (Note 8.) 3005 3190 3315 3005 3255 3380 3005 3315 3440 mV VIH Input HIGH Voltage Single Ended 3790 4115 3855 4180 3915 4240 mV VIL Input LOW Voltage Single Ended 3065 3390 3130 3455 3190 3515 mV IIH Input HIGH Current 150 µA 150 150 IIL Input LOW Current –150 –150 –150 µA NOTE: 10EP circuits are designed to meet the DC specifications shown in the above table after thermal equilibrium has been established. The circuit is in a test socket or mounted on a printed circuit board and transverse airflow greater than 500lfpm is maintained. 7. VCC = 5.0V, VEE = 0V, all other pins floating. 8. All loading with 50 ohms to VCC –2.0 volts. 9. Input and output parameters vary 1:1 with VCC. AC CHARACTERISTICS (VCC = 3.0V to 5.5V; VEE = 0V) or (VCC = 0V; VEE = –3.0V to –5.5V) –40°C Symbol Characteristic Min fmax Maximum Toggle Frequency (Note 10.) tPLH, tPHL Propagation Delay tSKEW Device Skew Part–to–Part (Note 11.) tJITTER Cycle–to–Cycle Jitter tr tf Output Rise and Fall Times (20% – 80%) Typ 25°C Max Min 3.0 D –>Q, Q 125 Q, Q 100 225 Typ 85°C Max Min 3.0 325 150 250 Typ Max 3.0 370 170 300 Unit GHz 420 ps TBD TBD TBD TBD TBD TBD ps TBD TBD TBD ps 150 200 100 Q, Q 10. Fmax guaranteed for functionality only. 11. Skew is measured between outputs under identical transitions. http://onsemi.com 4 170 250 120 190 270 ps MC10EP101 PACKAGE DIMENSIONS A –T–, –U–, –Z– TQFP FA SUFFIX 32–LEAD PLASTIC PACKAGE CASE 873A–02 ISSUE A 4X A1 32 0.20 (0.008) AB T–U Z 25 1 –U– –T– B V AE P B1 DETAIL Y 17 8 V1 AE DETAIL Y 9 4X –Z– 9 0.20 (0.008) AC T–U Z S1 S DETAIL AD G –AB– 0.10 (0.004) AC AC T–U Z –AC– BASE METAL ÉÉ ÉÉ ÉÉ ÉÉ F 8X M_ R M N D J 0.20 (0.008) SEATING PLANE SECTION AE–AE W K X DETAIL AD Q_ GAUGE PLANE H 0.250 (0.010) C E http://onsemi.com 5 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DATUM PLANE –AB– IS LOCATED AT BOTTOM OF LEAD AND IS COINCIDENT WITH THE LEAD WHERE THE LEAD EXITS THE PLASTIC BODY AT THE BOTTOM OF THE PARTING LINE. 4. DATUMS –T–, –U–, AND –Z– TO BE DETERMINED AT DATUM PLANE –AB–. 5. DIMENSIONS S AND V TO BE DETERMINED AT SEATING PLANE –AC–. 6. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. ALLOWABLE PROTRUSION IS 0.250 (0.010) PER SIDE. DIMENSIONS A AND B DO INCLUDE MOLD MISMATCH AND ARE DETERMINED AT DATUM PLANE –AB–. 7. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. DAMBAR PROTRUSION SHALL NOT CAUSE THE D DIMENSION TO EXCEED 0.520 (0.020). 8. MINIMUM SOLDER PLATE THICKNESS SHALL BE 0.0076 (0.0003). 9. EXACT SHAPE OF EACH CORNER MAY VARY FROM DEPICTION. DIM A A1 B B1 C D E F G H J K M N P Q R S S1 V V1 W X MILLIMETERS MIN MAX 7.000 BSC 3.500 BSC 7.000 BSC 3.500 BSC 1.400 1.600 0.300 0.450 1.350 1.450 0.300 0.400 0.800 BSC 0.050 0.150 0.090 0.200 0.500 0.700 12_ REF 0.090 0.160 0.400 BSC 1_ 5_ 0.150 0.250 9.000 BSC 4.500 BSC 9.000 BSC 4.500 BSC 0.200 REF 1.000 REF INCHES MIN MAX 0.276 BSC 0.138 BSC 0.276 BSC 0.138 BSC 0.055 0.063 0.012 0.018 0.053 0.057 0.012 0.016 0.031 BSC 0.002 0.006 0.004 0.008 0.020 0.028 12_ REF 0.004 0.006 0.016 BSC 1_ 5_ 0.006 0.010 0.354 BSC 0.177 BSC 0.354 BSC 0.177 BSC 0.008 REF 0.039 REF MC10EP101 Notes http://onsemi.com 6 MC10EP101 Notes http://onsemi.com 7 MC10EP101 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. 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