ONSEMI MBR10L60CTG

MBR10L60CT,
MBRF10L60CT
SWITCHMODE™
Power Rectifier
60 V, 10 A
http://onsemi.com
Features and Benefits
•
•
•
•
•
•
SCHOTTKY BARRIER
RECTIFIER
10 AMPERES, 60 VOLTS
Low Forward Voltage
Low Power Loss/High Efficiency
High Surge Capability
10 A Total (5 A Per Diode Leg)
Guard−Ring for Stress Protection
These are Pb−Free Devices
1
2, 4
3
Applications
• Power Supply − Output Rectification
• Power Management
• Instrumentation
Mechanical Characteristics:
•
•
•
•
•
MARKING
DIAGRAMS
4
Case: Epoxy, Molded
Epoxy Meets UL 94 V−0 @ 0.125 in
Weight (Approximately): 1.9 Grams
Finish: All External Surfaces Corrosion Resistant and Terminal
Leads are Readily Solderable
Lead Temperature for Soldering Purposes:
260°C Max. for 10 Seconds
TO−220AB
CASE 221A
PLASTIC
1
2
3
MAXIMUM RATINGS
TO−220 FULLPAK]
CASE 221D
STYLE 3
Please See the Table on the Following Page
1
2
AYWW
B10L60G
AKA
AYWW
B10L60G
AKA
3
A
Y
WW
B10L60
G
AKA
= Assembly Location
= Year
= Work Week
= Device Code
= Pb−Free Device
= Polarity Designator
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 2 of this data sheet.
© Semiconductor Components Industries, LLC, 2008
December, 2008 − Rev. 0
1
Publication Order Number:
MBR10L60CT/D
MBR10L60CT, MBRF10L60CT
MAXIMUM RATINGS (Per Diode Leg)
Symbol
Value
Unit
VRRM
VRWM
VR
60
V
IF(AV)
5
10
A
IFSM
200
A
Operating Junction Temperature (Note 1)
TJ
−55 to +150
°C
Storage Temperature
Tstg
−65 to +175
°C
> 400
> 8000
V
Rating
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
Average Rectified Forward Current
(Rated VR) TC = 140°C
(Per Leg)
(Per Device)
Nonrepetitive Peak Surge Current
(Surge applied at rated load conditions halfwave, single phase, 60 Hz)
ESD Ratings:
Machine Model = C
Human Body Model = 3B
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. The heat generated must be less than the thermal conductivity from Junction−to−Ambient: dPD/dTJ < 1/RqJA.
THERMAL CHARACTERISTICS
Rating
Maximum Thermal Resistance
MBR10L60CT
Junction−to−Case
Junction−to−Ambient
Junction−to−Case
Junction−to−Ambient
MBRF10L60CT
Symbol
Value
RqJC
RqJA
RqJC
RqJA
2.8
70
5.7
75
Typ
Max
0.49
0.43
0.60
0.53
0.57
0.49
0.66
0.61
77
33
220
60
Unit
°C/W
ELECTRICAL CHARACTERISTICS (Per Diode Leg)
Rating
Symbol
Maximum Instantaneous Forward Voltage (Note 2)
(IF = 5 A, TC = 25°C)
(IF = 5 A, TC = 125°C)
(IF = 10 A, TC = 25°C)
(IF = 10 A, TC = 125°C)
vF
Maximum Instantaneous Reverse Current (Note 2)
(Rated DC Voltage, TC = 25°C)
(Rated DC Voltage, TC = 125°C)
iR
2. Pulse Test: Pulse Width = 300 ms, Duty Cycle ≤ 2.0%.
DEVICE ORDERING INFORMATION
Package Type
Shipping
MBR10L60CTG
Device Order Number
TO−220AB
(Pb−Free)
50 Units / Rail
MBRF10L60CTG
TO−220FP
(Pb−Free)
50 Units / Rail
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2
Unit
V
mA
mA
MBR10L60CT, MBRF10L60CT
100
10
1
IF, AVERAGE FORWARD CURRENT
(A)
IF, AVERAGE FORWARD CURRENT
(A)
100
125°C
85°C
150°C
TJ = 25°C
0.1
0
0.2
0.4
0.6
0.8
1
1.2
1.4
VF, INSTANTANEOUS FORWARD VOLTAGE (V)
125°C
10
150°C
TJ = 25°C
0.1
0
Figure 1. Typical Forward Voltage
1.0E+00
150°C
125°C
1.0E−02
125°C
1.0E−02
85°C
1.0E−03
150°C
1.0E−01
IR, REVERSE CURRENT (A)
IR, REVERSE CURRENT (A)
1.0E−01
85°C
1.0E−03
1.0E−04
1.0E−04
TJ = 25°C
1.0E−05
10
20
30
TJ = 25°C
1.0E−05
40
50
60
1.0E−06
0
VR, REVERSE VOLTAGE (V)
Figure 3. Typical Reverse Current
dc
7
6
20
30
40
VR, REVERSE VOLTAGE (V)
50
60
6
RqJC = 2.8°C/W
9
10
Figure 4. Maximum Reverse Current
IF, AVERAGE FORWARD CURRENT
(A)
IF, AVERAGE FORWARD CURRENT
(A)
10
8
0.2
0.4
0.6
0.8
1
1.2
1.4
VF, INSTANTANEOUS FORWARD VOLTAGE (V)
Figure 2. Maximum Forward Voltage
1.0E+00
1.0E−06
0
85°C
1
SQUARE WAVE
5
4
3
2
1
0
110 115 120 125 130 135 140 145 150 155 160
RqJA = 70°C/W
5
4
dc
3
SQUARE WAVE
2
1
0
0
20
40
60
80
100
120
140 160
TC, CASE TEMPERATURE (°C)
TA, AMBIENT TEMPERATURE (°C)
Figure 5. Current Derating, Case per Leg
MBR10L60CT
Figure 6. Current Derating, Ambient per Leg
MBR10L60CT
http://onsemi.com
3
MBR10L60CT, MBRF10L60CT
6
RqJC = 5.7°C/W
9
IF, AVERAGE FORWARD CURRENT
(A)
IF, AVERAGE FORWARD CURRENT
(A)
10
dc
8
7
6
SQUARE WAVE
5
4
3
2
1
0
80
90
100 110
120 130 140
TC, CASE TEMPERATURE (°C)
150
160
RqJA = 75°C/W
5
dc
4
3
2
SQUARE WAVE
1
0
0
R(t), TRANSIENT THERMAL RESISTANCE
8
140 160
10000
TJ = 150°C
7
40
60
80
100 120
TA, AMBIENT TEMPERATURE (°C)
Figure 8. Current Derating, Ambient per Leg
MBRF10L60CT
TJ = 25°C
6
5
C, CAPACITANCE (pF)
PFO, AVERAGE POWER DISSIPATION (W)
Figure 7. Current Derating, Case per Leg
MBRF10L60CT
20
SQUARE WAVE
4
dc
3
2
1000
100
1
0
0
1
2
3
4
5
6
7
8
9
10
10
0
10
20
30
40
50
IO, AVERAGE FORWARD CURRENT (A)
VR, REVERSE VOLTAGE (V)
Figure 9. Forward Power Dissipation
Figure 10. Capacitance
60
10
D=
0.5
0.2
1
0.1
0.05
0.1
P(pk)
0.01
t1
t2
SINGLE PULSE
DUTY CYCLE, D = t1/t2
0.01
0.000001
0.00001
0.0001
0.001
0.01
0.1
1
10
t1, TIME (sec)
Figure 11. Thermal Response Junction−to−Case for MBR10L60CT
http://onsemi.com
4
100
1000
R(t), TRANSIENT THERMAL RESISTANCE
MBR10L60CT, MBRF10L60CT
100
10
1
D=
0.5
0.2
0.1
0.05
0.02
0.01
0.1
SINGLE PULSE
0.01
0.001
0.000001
0.00001
0.0001
0.001
0.01
0.1
PULSE TIME (sec)
1
10
100
1000
R(t), TRANSIENT THERMAL RESISTANCE
Figure 12. Thermal Response Junction−to−Ambient for MBR10L60CT
10
D=
0.20.5
1
0.1
0.1
0.05
0.02
0.01
SINGLE PULSE
0.01
0.001
0.000001
0.00001
0.0001
0.001
0.01
0.1
1
10
100
1000
PULSE TIME (sec)
R(t), TRANSIENT THERMAL RESISTANCE
Figure 13. Thermal Response Junction−to−Case for MBRF10L60CT
100
D=
0.5
0.2
0.1
10
1
0.05
0.02
0.01
0.1
SINGLE PULSE
0.01
0.001
0.000001
0.00001
0.0001
0.001
0.01
0.1
1
10
PULSE TIME (sec)
Figure 14. Thermal Response Junction−to−Ambient for MBRF10L60CT
http://onsemi.com
5
100
1000
MBR10L60CT, MBRF10L60CT
PACKAGE DIMENSIONS
TO−220
CASE 221A−09
ISSUE AF
−T−
B
F
T
SEATING
PLANE
C
S
4
DIM
A
B
C
D
F
G
H
J
K
L
N
Q
R
S
T
U
V
Z
A
Q
U
1 2 3
H
K
Z
L
R
V
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION Z DEFINES A ZONE WHERE ALL
BODY AND LEAD IRREGULARITIES ARE
ALLOWED.
J
G
D
N
INCHES
MIN
MAX
0.570
0.620
0.380
0.405
0.160
0.190
0.025
0.035
0.142
0.161
0.095
0.105
0.110
0.155
0.014
0.025
0.500
0.562
0.045
0.060
0.190
0.210
0.100
0.120
0.080
0.110
0.045
0.055
0.235
0.255
0.000
0.050
0.045
----0.080
STYLE 6:
PIN 1.
2.
3.
4.
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6
ANODE
CATHODE
ANODE
CATHODE
MILLIMETERS
MIN
MAX
14.48
15.75
9.66
10.28
4.07
4.82
0.64
0.88
3.61
4.09
2.42
2.66
2.80
3.93
0.36
0.64
12.70
14.27
1.15
1.52
4.83
5.33
2.54
3.04
2.04
2.79
1.15
1.39
5.97
6.47
0.00
1.27
1.15
----2.04
MBR10L60CT, MBRF10L60CT
PACKAGE DIMENSIONS
TO−220 FULLPAK
CASE 221D−03
ISSUE J
−T−
−B−
F
SEATING
PLANE
C
S
Q
U
A
1 2 3
H
−Y−
K
G
N
L
D
J
R
3 PL
0.25 (0.010)
M
B
M
Y
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH
3. 221D-01 THRU 221D-02 OBSOLETE, NEW
STANDARD 221D-03.
DIM
A
B
C
D
F
G
H
J
K
L
N
Q
R
S
U
INCHES
MIN
MAX
0.617
0.635
0.392
0.419
0.177
0.193
0.024
0.039
0.116
0.129
0.100 BSC
0.118
0.135
0.018
0.025
0.503
0.541
0.048
0.058
0.200 BSC
0.122
0.138
0.099
0.117
0.092
0.113
0.239
0.271
MILLIMETERS
MIN
MAX
15.67
16.12
9.96
10.63
4.50
4.90
0.60
1.00
2.95
3.28
2.54 BSC
3.00
3.43
0.45
0.63
12.78
13.73
1.23
1.47
5.08 BSC
3.10
3.50
2.51
2.96
2.34
2.87
6.06
6.88
STYLE 3:
PIN 1. ANODE
2. CATHODE
3. ANODE
FULLPAK and SWITCHMODE are trademarks of Semiconductor Components Industries, LLC.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent
rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other
applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur.
Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries,
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MBR10L60CT/D