MC3488A Dual EIA−423/EIA−232D Line Driver The MC3488A dual is single−ended line driver has been designed to satisfy the requirements of EIA standards EIA−423 and EIA−232D, as well as CCITT X.26, X.28 and Federal Standard FIDS1030. It is suitable for use where signal wave shaping is desired and the output load resistance is greater than 450 W. Output slew rates are adjustable from 1.0 ms to 100 ms by a single external resistor. Output level and slew rate are insensitive to power supply variations. Input undershoot diodes limit transients below ground and output current limiting is provided in both output states. The MC3488A has a standard 1.5 V input logic threshold for TTL or NMOS compatibility. http://onsemi.com MARKING DIAGRAMS 8 SOIC−8 D SUFFIX CASE 751 1 3488A ALYW G 1 Features • • • • • • • • PNP Buffered Inputs to Minimize Input Loading Short Circuit Protection Adjustable Slew Rate Limiting MC3488A Equivalent to 9636A Output Levels and Slew Rates are Insensitive to Power Supply Voltages No External Blocking Diode Required for VEE Supply Second Source mA9636A Pb−Free Packages are Available 8 PDIP−8 P1 SUFFIX CASE 626 1 MC3488AP1 AWL YYWWG 1 A = Assembly Location L, WL = Wafer Lot Y, YY = Year W, WW = Work Week G or G = Pb−Free Package (Note: Microdot may be in either location) PIN CONNECTIONS Wave 1 Shape 8 VCC Input A 2 7 Output A Input B 3 6 Output B GND 4 5 VEE ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 3 of this data sheet. Wave Shape Control MC3488A Driver RS−423 Interface TTL Logic MC3486 Three−State Receiver Figure 1. Simplified Application © Semiconductor Components Industries, LLC, 2006 July, 2006 − Rev. 5 1 Publication Order Number: MC3488A/D MC3488A MAXIMUM RATINGS (Note 1) Rating Symbol Value Unit VCC VEE + 15 − 15 V IO + IO − + 150 − 150 mA Operating Ambient Temperature TA 0 to + 70 °C Junction Temperature Range TJ 150 °C Storage Temperature Range Tstg − 65 to + 150 °C Power Supply Voltages Output Current Source Sink Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. Devices should not be operated at these values. The IElectrical CharacteristicsI provide conditions for actual device operation. RECOMMENDED OPERATING CONDITIONS Characteristic Power Supply Voltages Operating Temperature Range Wave Shaping Resistor Symbol Min Typ Max Unit VCC VEE 10.8 − 13.2 12 − 12 13.2 − 10.8 V TA 0 25 70 °C RWS 10 − 1000 kW TARGET ELECTRICAL CHARACTERISTICS (Unless otherwise noted, specifications apply over recommended operating conditions) Characteristic Symbol Min Typ Max Unit Input Voltage − Low Logic State VIL − − 0.8 V Input Voltage − High Logic State VIH 2.0 − − V Input Current − Low Logic State (VIL = 0.4 V) IIL − 80 − − mA Input Current − High Logic State (VIH = 2.4 V) (VIH = 5.5 V) IIH1 IIH2 − − − − 10 100 Input Clamp Diode Voltage (IIK = − 15 mA) VIK − 1.5 − − Output Voltage − Low Logic State (RL = ∞), EIA−423 (RL= 3.0 kW), EIA−232D (RL= 450 W), EIA−423 VOL − 6.0 − 6.0 − 6.0 − − − − 5.0 − 5.0 − 4.0 Output Voltage − High Logic State (RL = ∞), EIA−423 (RL.= 3.0 kW), EIA−232D (RL = 450 W), EIA−423 VOH 5.0 5.0 4.0 − − − 6.0 6.0 6.0 Output Resistance (RL q 450 W) RO − 25 50 IOSH IOSL − 150 + 15 − − − 15 + 150 Output Leakage Current (Note 3) (VCC = VEE = 0 V, − 6.0 V p Vo p 6.0 V) Iox − 100 − 100 mA Power Supply Currents (RW = 100 kW, RL = ∞, VIL p Vin p VIH) ICC IEE − − 18 − − + 18 − mA mA Output Short−Circuit Current (Note 2) (Vin = Vout = 0 V) (Vin = VIH(Min), Vout = 0 V) V V V W mA 2. One output shorted at a time. 3. No VEE diode required. http://onsemi.com 2 MC3488A TRANSITION TIMES (Unless otherwise noted, CL = 30 pF, f = 1.0 kHz, VCC = − VEE = 12.0 V ± 10%, TA = 25°C, RL = 450 W. Transition times measured 10% to 90% and 90% to 10%) Characteristic Symbol Transition Time, Low−to−High State Output Min Typ Max ms tTLH (RW = 10 kW) (RW = 100 kW) (RW = 500 kW) (RW = 1000 kW) Transition Time, High−to−Low State Output Unit 0.8 8.0 40 80 1.4 14 70 140 0.8 8.0 40 80 1.4 14 70 140 ms tTHL (RW = 10 kW) (RW = 100 kW) (RW = 500 kW) (RW = 1000 kW) ORDERING INFORMATION Device Operating Temperature Range MC3488AD MC3488ADG MC3488ADR2 TA = 0 to +70°C MC3488ADR2G MC3488AP1 MC3488AP1G Package Shipping † SOIC−8 98 Units / Rail SOIC−8 (Pb−Free) 98 Units / Rail SOIC−8 1000 / Tape & Reel SOIC−8 (Pb−Free) 1000 / Tape & Reel PDIP−8 50 Units / Rail PDIP−8 (Pb−Free) 50 Units / Rail †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. To Scope (Input) To Scope (Output) VCC MC3488A 50 Pulse Generator RL CL (Includes Probe and Jig Capacitance) RWS f = 1.0 kHz PW = 500 ms VEE Note: Input Rise and Fall Times (10% to 90%) p 10 ns 3.0 V Input 0V VOH 90% 90% 0V Output 10% VOL 10% tTHL tTLH Figure 2. Test Circuit and Waveforms for Transition Times http://onsemi.com 3 MC3488A 6.0 Vout , OUTPUT VOLTAGE (V) WAVE SHAPE RESISTOR, Rw (kΩ ) 1000 100 CL = 30 pF 4.0 0°C TA = 25°C 70°C 2.0 0 − 2.0 10 VCC = 12 V VEE = −12 V RWS = 100 kW RL = 450 W − 4.0 − 6.0 1.0 0.1 1.0 10 100 TRANSITION TIMES, tTLH/tTHL (ms) 0 1000 Figure 3. Output Transition Times versus Wave Shape Resistor Value 1.0 Vin, INPUT VOLTAGE (V) Figure 4. Input/Output Characteristics versus Temperature Power−On Power−Off 0.10 50 0.08 I out , OUTPUT CURRENT (mA) 40 I out , OUTPUT CURRENT (mA) 2.0 Vin = VIH(Min) 30 20 TA = 25°C VCC = 12 V VEE = −12 V RWS = 100 kW 10 0 − 10 − 20 − 30 Vin = 0 V − 40 − 50 − 10 − 8.0 − 6.0 − 4.0 − 2.0 0 2.0 4.0 Vout, OUTPUT VOLTAGE (V) VCC = VEE = Vin = 0 V TA = 25°C (No diode required at VEE Pin.) 0.06 0.04 0.02 0 − 0.02 − 0.04 − 0.06 − 0.08 − 0.10 6.0 8.0 10 − 8.0 − 6.0 − 4.0 − 2.0 0 2.0 4.0 Vout, OUTPUT VOLTAGE (V) 10 6.0 8.0 10 Figure 5. Output Current versus Output Voltage 100 12.0 10.0 8.0 6.0 4.0 2.0 0 − 2.0 − 4.0 − 6.0 − 8.0 − 10.0 − 12.0 t TLH t THL , RISE/FALL TIME (s) μ I xx , SUPPLY CURRENT (mA) Vin = 0 V, Vin = VIH ICC VCC = 12V VEE = − 12 V RWS = 100 kW, RL = ∞ Vin = 0 V IEE Vin = VIH 0 10 20 30 40 50 60 70 80 TA, AMBIENT TEMPERATURE (°C) 90 VCC = 12 V VEE = − 12 V CL = 30 pF TA = 0°C, 70°C 10 TA = 25°C 1 10 k 100 Figure 6. Supply Current versus Temperature 100 k RWS, WAVE SHAPING RESISTANCE (W) Figure 7. Rise/Fall Time versus RWS http://onsemi.com 4 1M MC3488A PACKAGE DIMENSIONS SOIC−8 NB D SUFFIX PLASTIC PACKAGE CASE 751−07 ISSUE AH NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. 751−01 THRU 751−06 ARE OBSOLETE. NEW STANDARD IS 751−07. −X− A 8 5 S B 1 0.25 (0.010) M Y M 4 K −Y− G C N DIM A B C D G H J K M N S X 45 _ SEATING PLANE −Z− 0.10 (0.004) H M D 0.25 (0.010) M Z Y S X J S SOLDERING FOOTPRINT* 1.52 0.060 7.0 0.275 4.0 0.155 0.6 0.024 1.270 0.050 SCALE 6:1 mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 5 MILLIMETERS MIN MAX 4.80 5.00 3.80 4.00 1.35 1.75 0.33 0.51 1.27 BSC 0.10 0.25 0.19 0.25 0.40 1.27 0_ 8_ 0.25 0.50 5.80 6.20 INCHES MIN MAX 0.189 0.197 0.150 0.157 0.053 0.069 0.013 0.020 0.050 BSC 0.004 0.010 0.007 0.010 0.016 0.050 0 _ 8 _ 0.010 0.020 0.228 0.244 MC3488A PACKAGE DIMENSIONS PDIP−8 P1 SUFFIX PLASTIC PACKAGE CASE 626−05 ISSUE L 8 NOTES: 1. DIMENSION L TO CENTER OF LEAD WHEN FORMED PARALLEL. 2. PACKAGE CONTOUR OPTIONAL (ROUND OR SQUARE CORNERS). 3. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 5 −B− 1 4 F −A− NOTE 2 L C J −T− MILLIMETERS MIN MAX 9.40 10.16 6.10 6.60 3.94 4.45 0.38 0.51 1.02 1.78 2.54 BSC 0.76 1.27 0.20 0.30 2.92 3.43 7.62 BSC −−− 10 _ 0.76 1.01 INCHES MIN MAX 0.370 0.400 0.240 0.260 0.155 0.175 0.015 0.020 0.040 0.070 0.100 BSC 0.030 0.050 0.008 0.012 0.115 0.135 0.300 BSC −−− 10_ 0.030 0.040 N SEATING PLANE D H DIM A B C D F G H J K L M N M K G 0.13 (0.005) M T A M B M ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. 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