NL27WZ125 Dual Buffer with 3−State Outputs The NL27WZ125 is a high performance dual noninverting buffer operating from a 1.65 V to 5.5 V supply. Features • • • • • • • • • • • http://onsemi.com Extremely High Speed: tPD 2.6 ns (typical) at VCC = 5 V Designed for 1.65 V to 5.5 V VCC Operation Over Voltage Tolerant Inputs and Outputs LVTTL Compatible − Interface Capability With 5 V TTL Logic with VCC = 3 V LVCMOS Compatible 24 mA Balanced Output Sink and Source Capability Near Zero Static Supply Current Substantially Reduces System Power Requirements 3−State OE Input is Active−Low Replacement for NC7WZ125 Chip Complexity = 72 FETs Pb−Free Package is Available MARKING DIAGRAM 8 8 1 M0 M G G US8 US SUFFIX CASE 493 1 M0 M G = Device Code = Date Code* = Pb−Free Package (Note: Microdot may be in either location) *Date Code orientation may vary depending upon manufacturing location. PIN ASSIGNMENT OE1 8 1 A1 2 Y2 7 6 3 GND 5 4 VCC OE2 Y1 A2 Pin Function 1 OE1 2 A1 3 Y2 4 GND 5 A2 6 Y1 7 OE2 8 VCC FUNCTION TABLE Figure 1. Pinout (Top View) A1 OE1 1 EN A2 OE2 Input Y1 Output OEn An Yn L L L L H H H X Z X = Don’t Care n = 1, 2 Y2 Figure 2. Logic Symbol ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 2 of this data sheet. © Semiconductor Components Industries, LLC, 2006 April, 2006 − Rev. 5 1 Publication Order Number: NL27WZ125/D NL27WZ125 DEVICE ORDERING INFORMATION Device Nomenclature Logic Circuit Indicator No. of Gates per Package Temp Range Identifier Technology Device Function Package Suffix Package Type Tape and Reel Size† NL27WZ125US NL 2 7 WZ 125 US US8 178 mm, 3000 Unit NL27WZ125USG NL 2 7 WZ 125 US US8 (Pb−Free) 178 mm, 3000 Unit Device Order Number †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. MAXIMUM RATINGS Symbol Value Unit DC Supply Voltage *0.5 to )7.0 V VI DC Input Voltage *0.5 to )7.0 V VO DC Output Voltage VCC Parameter *0.5 to )7.0 −0.5 to VCC + 0.5 Output in High Impedance State Output in HIGH or LOW State V VI < GND *50 mA VO < GND *50 mA $50 mA DC Supply Current per Supply Pin $100 mA IGND DC Ground Current per Ground Pin $100 mA TSTG Storage Temperature Range *65 to )150 °C 260 °C )150 °C 250 °C/W 250 mW IIK DC Input Diode Current IOK DC Output Diode Current IO DC Output Sink Current ICC TL Lead Temperature, 1 mm from Case for 10 Seconds TJ Junction Temperature under Bias qJA Thermal Resistance PD Power Dissipation in Still Air at 85°C MSL Moisture Sensitivity FR Flammability Rating VESD (Note 1) Level 1 Oxygen Index: 28 to 34 ESD Withstand Voltage UL 94 V−0 @ 0.125 in Human Body Model (Note 2) Machine Model (Note 3) Charged Device Model (Note 4) > 2000 > 200 N/A V Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2−ounce copper trace with no air flow. 2. Tested to EIA/JESD22−A114−A. 3. Tested to EIA/JESD22−A115−A. 4. Tested to JESD22−C101−A. RECOMMENDED OPERATING CONDITIONS Symbol VCC Parameter Supply Voltage VI Input Voltage VO Output Voltage TA Operating Free−Air Temperature Dt/DV Input Transition Rise or Fall Rate Min Max Unit 1.65 1.5 5.5 5.5 V (Note 5) 0 5.5 V (HIGH or LOW State) 0 5.5 V *40 )85 °C 0 0 0 20 10 5 ns/V Operating Data Retention Only VCC = 2.5 V $0.2 V VCC = 3.0 V $0.3 V VCC = 5.0 V $0.5 V 5. Unused inputs may not be left open. All inputs must be tied to a high− or low−logic input voltage level. http://onsemi.com 2 NL27WZ125 DC ELECTRICAL CHARACTERISTICS Min 0.75 VCC 0.7 VCC Symbol Parameter VIH High−Level Input Voltage 1.65 2.3 to 5.5 VIL Low−Level Input Voltage 1.65 2.3 to 5.5 VOH High−Level Output Voltage VIN = VIL or VIH IOH = 100 mA IOH = −3 mA IOH = −8 mA IOH = −12 mA IOH = −16 mA IOH = −24 mA IOH = −32 mA 1.65 to 5.5 1.65 2.3 2.7 3.0 3.0 4.5 VOL Low−Level Output Voltage VIN = VIL IOL = 100 mA IOL = 3 mA IOL = 8 mA IOL = 12 mA IOL = 16 mA IOL = 24 mA IOL = 32 mA 1.65 to 5.5 IIN Condition Typ VIN = VCC or GND IOFF Power Off Leakage Current VOUT = 5.5 V VIN = 5.5 V ICC Quiescent Supply Current VIN = VCC or GND IOZ 3−State Output Leakage VIN = VIL or VIH 0V v VOUT v 5.5 V Max Min VCC − 0.1 1.29 1.9 2.2 2.4 2.3 3.8 Max 0.75 VCC 0.7 VCC 0.25 VCC 0.3 VCC VCC 1.52 2.1 2.4 2.7 2.5 4.0 Unit V 0.25 VCC 0.3 VCC VCC−0.1 1.29 1.9 2.2 2.4 2.3 3.8 V V 0.1 0.24 0.3 0.4 0.4 0.55 0.55 0.1 0.24 0.3 0.4 0.4 0.55 0.55 V 5.5 $0.1 $1.0 mA 0 1.0 10 mA 5.5 1.0 10 mA 2.3 to 5.5 $0.5 $5 mA 0.08 0.20 0.22 0.28 0.38 0.42 2.3 2.7 3.0 3.0 4.5 Input Leakage Current *405C v TA v 855C TA = 255C VCC (V) AC ELECTRICAL CHARACTERISTICS (tR = tF = 3.0 ns) Symbol tPLH tPHL Parameter Propagation Delay AN to YN (Figures 3 and 4) tOSLH tOSHL Output to Output Skew (Note 6) tPZH tPZL Output Enable Time (Figures 5, 6 and 7) tPHZ tPLZ Condition *405C v TA v 855C TA = 255C VCC (V) Min Typ Max Min Max Unit ns RL = 1 MW CL = 15 pF 1.8 $ 0.15 2.5 $ 0.2 2.0 1.0 12 7.5 2.0 1.0 13 8 RL = 1 MW CL = 15 pF 3.3 $ 0.3 0.8 5.2 0.8 5.5 RL = 500 W CL = 50 pF 1.2 5.7 1.2 6.0 RL = 1 MW CL = 15 pF 0.5 4.5 0.5 4.8 RL = 500 W CL = 50 pF 0.8 5.0 0.8 5.3 RL = 500 W CL = 50 pF RL = 500 W CL = 50 pF Output Enable Time (Figures 5, 6 and 7) 5.0 $ 0.5 3.3 $ 0.3 1.0 5.0 $ 0.5 1.0 0.8 ns 0.8 1.8 $ 0.15 2.5 $ 0.2 3.0 1.8 14 8.5 3.0 1.8 15 9.0 3.3 $ 0.3 1.2 6.2 1.2 6.5 5.0 $ 0.5 0.8 5.5 0.8 5.8 1.8 $ 0.15 2.5 $ 0.2 2.5 1.5 12 8.0 2.5 1.5 13 8.5 3.3 $ 0.3 0.8 5.7 0.8 6.0 5.0 $ 0.5 0.3 4.7 0.3 5.0 ns ns 6. Skew is defined as the absolute value of the difference between the actual propagation delay for any two separate outputs of the same device. This specification applies to any outputs switching in the same direction, either HIGH−to−LOW (tOSHL) or LOW−to−HIGH (tOSLH); parameter guaranteed by design. http://onsemi.com 3 NL27WZ125 CAPACITIVE CHARACTERISTICS Symbol Parameter CIN Condition Typical Unit Input Capacitance VCC = 5.5 V, VI = 0 V or VCC 7.0 pF COUT Output Capacitance VCC = 5.5 V, VI = 0 V or VCC 7.0 pF CPD Power Dissipation Capacitance (Note 7) 10 MHz, VCC = 3.3 V, VI = 0 V or VCC 10 MHz, VCC = 5.5 V, VI = 0 V or VCC 18 27 pF 7. CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load. Average operating current can be obtained by the equation: ICC(OPR) = CPD VCC fin + ICC. CPD is used to determine the no−load dynamic power consumption; PD = CPD VCC2 fin + ICC VCC. tf = 3 ns tf = 3 ns 90% INPUT A and B OE = GND VCC 90% INPUT 50% 50% 10% 10% tPHL OUTPUT CL * GND RL tPLH VOH OUTPUT Y 50% *Includes all probe and jig capacitance. A 1 MHz square input wave is recommended for propagation delay tests. 50% VOL Figure 3. Switching Waveform Figure 4. TPLH or TPHL VCC 50% 50% OE 0V tPZH tPHZ VCC VOH − 10% 50% On ≈0V tPZL tPLZ ≈ VCC 50% On VOL + 10% GND Figure 5. AC Output Enable and Disable Waveform 2 INPUT VCC INPUT R1 = 500 W VCC OUTPUT CL = 50 pF OUTPUT RL = 500 W CL = 50 pF RL = 250 W A 1 MHz square input wave is recommended for propagation delay tests. A 1 MHz square input wave is recommended for propagation delay tests. Figure 6. TPZL or TPL Figure 7. TPZH or TPHZ http://onsemi.com 4 NL27WZ125 PACKAGE DIMENSIONS US8 US SUFFIX CASE 493−02 ISSUE B −X− A 8 −Y− 5 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION “A” DOES NOT INCLUDE MOLD FLASH, PROTRUSION OR GATE BURR. MOLD FLASH. PROTRUSION AND GATE BURR SHALL NOT EXCEED 0.140 MM (0.0055”) PER SIDE. 4. DIMENSION “B” DOES NOT INCLUDE INTER−LEAD FLASH OR PROTRUSION. INTER−LEAD FLASH AND PROTRUSION SHALL NOT E3XCEED 0.140 (0.0055”) PER SIDE. 5. LEAD FINISH IS SOLDER PLATING WITH THICKNESS OF 0.0076−0.0203 MM. (300−800 “). 6. ALL TOLERANCE UNLESS OTHERWISE SPECIFIED ±0.0508 (0.0002 “). J DETAIL E B L 1 4 R S G P U C −T− SEATING PLANE D 0.10 (0.004) M H 0.10 (0.004) T K N R 0.10 TYP T X Y V M F DETAIL E DIM A B C D F G H J K L M N P R S U V MILLIMETERS MIN MAX 1.90 2.10 2.20 2.40 0.60 0.90 0.17 0.25 0.20 0.35 0.50 BSC 0.40 REF 0.10 0.18 0.00 0.10 3.00 3.20 0_ 6_ 5_ 10 _ 0.23 0.34 0.23 0.33 0.37 0.47 0.60 0.80 0.12 BSC INCHES MIN MAX 0.075 0.083 0.087 0.094 0.024 0.035 0.007 0.010 0.008 0.014 0.020 BSC 0.016 REF 0.004 0.007 0.000 0.004 0.118 0.126 0_ 6_ 5_ 10 _ 0.010 0.013 0.009 0.013 0.015 0.019 0.024 0.031 0.005 BSC SOLDERING FOOTPRINT* 3.8 0.15 0.50 0.0197 1.8 0.07 0.30 0.012 1.0 0.0394 SCALE 8:1 mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). 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