HA16116FP/FPJ, HA16121FP/FPJ Switching Regulator for Chopper Type DC/DC Converter Description HA16116FP/FPJ and HA16121FP/FPJ are dual-channel PWM switching regulator controller ICs for use in chopper-type DC/DC converters. This IC series incorporates totem pole gate drive circuits to allow direct driving of a power MOS FET. The output logic is preset for booster, step-down, or inverting control in a DC/DC converter. This logic assumes use of an N-channel power MOS FET for booster control, and a P-channel power MOS FET for step-down or inverting control. HA16116 includes a built-in logic circuit for step-down control only, and one for use in both step-down and inverting control. HA16121 has a logic circuit for booster control only and one for both step-down and inverting control. Both ICs have a pulse-by-pulse current limiter, which limits PWM pulse width per pulse as a means of protecting against overcurrent, and which uses an on/off timer for intermittent operation. Unlike conventional methods that use a latch timer for shutdown, when the pulse-by-pulse current limiter continues operation beyond the time set in the timer, the IC is made to operate intermittently (flickering operation), resulting in sharp vertical setting characteristics. When the overcurrent condition subsides, the output is automatically restored to normal. The dual control circuits in the IC output identical triangle waveforms, for completely synchronous configuring a compact, high efficiency dual-channel DC/DC converter, with fewer external components than were necessary previously. Functions • • • • • • • • 2.5 V reference voltage (Vref) regulator Triangle wave form oscillator Dual overcurrent detector Dual totem pole output driver UVL (under voltage lock out) system Dual error amplifier Vref overvoltage detector Dual PWM comparator HA16116FP/FPJ, HA16121FP/FPJ Features • • • • Wide operating supply voltage range* (3.9 V to 40.0 V) Wide operating frequency range (600 kHz maximum operation) Direct power MOS FET driving (output current ±1 A peak in maximum rating) Pulse-by-pulse overcurrent protection circuit with intermittent operation function (When overcurrent state continues beyond time set in timer, the IC operates intermittently to prevent excessive output current.) • Grounding the ON/OFF pin turns the IC off, saving power dissipation. (HA16116: IOFF = 10 µA max.; HA16121: IOFF = 150 µA max.) • Built-in UVL circuit (UVL voltage can be varied with external resistance.) • Built-in soft start and quick shutoff functions Note: The reference voltage 2.5 V is under the condition of VIN ≥ 4.5 V. Ordering Information Hitachi Control ICs for Chopper-Type DC/DC Converters Product Channel Control Functions Channels Number No. Step-Up Step-Down Inverting Output Circuits Protection Dual HA17451 Ch 1 ❍ ❍ ❍ Open collector SCP with timer (latch) Ch 2 ❍ ❍ ❍ Single HA16114 — — ❍ ❍ Totem pole Pulse-by-pulse HA16120 — ❍ — — power MOS FET current limiter and HA16116 Ch 1 — ❍ ❍ driver intermittent operation Ch 2 — ❍ — Ch 1 — ❍ ❍ Ch 2 ❍ — — Dual HA16121 2 Overcurrent by on/off timer HA16116FP/FPJ, HA16121FP/FPJ Pin Arrangement *1 *2 1 20 S.VIN CT 2 19 Vref RT 3 18 TIM IN(+)1 4 17 ON/OFF IN(−)1 5 16 IN(−)2 E/O1 6 15 E/O2 DB1 7 14 DB2 CL1 8 13 CL2 OUT1 9 12 OUT2 10 11 P.V IN S.GND Channel 1 P.GND *1 Channel 2 *2 (top view) Notes: 1. Pins S.GND (pin 1) and P.GND (pin 10) have no direct internal interconnection. Both pins must be connected to ground. 2. Pins S.VIN (pin 20) and P.V IN (pin 11) have no direct internal interconnection. Both pins must be connected to VIN . 3 HA16116FP/FPJ, HA16121FP/FPJ Pin Functions Pin No. Symbol Function 1 S.GND Signal circuitry*1 ground 2 CT Timing capacitance (triangle wave oscillator output) 3 RT Timing resistance (for bias current synchronization) 4 IN(+)1 Error amp. noninverting input (1) 5 IN(–)1 Error amp. inverting input (1) 6 E/O1 Error amp. output (1) 7 DB1 Dead band timer off period adjustment input (1) 8 CL1 Overcurrent detection input (1) 9 OUT1 PWM pulse output (1) 10 P.GND Output stage*1 ground 11 P.V IN Output stage*1 power supply input 12 OUT2 PWM pulse output (2) 13 CL2 Overcurrent detection input (2) 14 DB2 Dead band timer off period adjustment input (2) 15 E/O2 Error amp. output (2) 16 IN(–)2 Error amp. inverting input (2)*2 17 ON/OFF IC on/off switch input (off when grounded) 18 TIM Setting of intermittent operation timing when overcurrent is detected (collector input of timer transistor) 19 Vref 2.5 V reference voltage output 20 S.V IN Signal circuitry*1 power supply input Channel 1 Channel 2 Notes: 1. Here “output stage” refers to the power MOS FET driver circuits, and “signal circuitry” refers to all other circuits on the IC. Note that this IC is not protected against reverse insertion, which can cause breakdown of the IC between VIN and GND. Be careful to insert the IC correctly. 2. Noninverting input of the channel 2 error amp is connected internally to Vref. 4 OVP 2 CT S.GND ) in the case of RT 3 Bias current latch reset pulse 1.1 V RT VL VH UVL triangle wave 1.0 V 1.6 V 1 5k Note: * This block is AND ( HA16121. from UVL 0.8V VIN L H 18 TIM Triangle wave oscillator circuit 19 20 2.5 V output band gap reference voltage ON/OFF generator circuit Vref S.VIN Q IN(+)1 4 R S Latch OR UVL output 17 ON/OFF IN(−)1 5 16 IN(−)2 VIN from UVL E/O1 6 5k DB1 7 8 9 11 P.V IN OUT1 P.GND 10 NAND NAND (HA16116) OUT2* OUT1 0.2 V Vref Vref 12 OUT2 0.2 V to S.VIN CL1 − + CL1 from UVL − + CL2 to S.VIN 13 CL2 from UVL PWM COMP 1 − + + + + − PWM COMP 2 5k 14 DB2 [Channel 1] (HA16116/HA16121) Step-down or inverting control + EA1 − 0.8V VIN 0.8V − EA2 + from UVL 15 E/O2 [Channel 2] Step-down control only (HA16116) Booster control only (HA16121) HA16116FP/FPJ, HA16121FP/FPJ Block Diagram 5 HA16116FP/FPJ, HA16121FP/FPJ Function and Timing Chart Relation between triangle wave and PWM output (in steady-state operation) CT triangle wave 1.6 V typ Dead band voltage 1.0 V typ E/O Error amp output Booster channel output (HA16121Ch 2) only PWM pulse output VIN (on) t ON t OFF T Step-down or inverting output (HA16116Ch 1, Ch 2/ HA16121-Ch 1) Note: On duty = t ON /T, where T = 1/f OSC. 6 GND (off) This pulse is for N-channel power MOS FET gate driving. VIN (off) GND (on) This pulse is for P-channel power MOS FET gate driving. HA16116FP/FPJ, HA16121FP/FPJ Determining External Component Constants (pin usage) Constant settings are explained for the following items. S.GND 1 1. 2. Oscillator frequency (fOSC) setting DC/DC converter output voltage setting and error amp usage CT 2 19 Vref RT 3 18 TIM IN(+)1 4 17 ON/OFF IN(−)1 5 16 IN(−)2 E/O1 6 3. Dead band duty and soft start setting 20 S.V IN DB1 7 15 E/O2 Channel 1 Channel 2 CL1 8 4. Output stage circuit and power MOS FET driving method 5. Vref UVL and OVP 6. Setting of intermittent operation timing when overcurrent is detected 7. ON/OFF pin usage 8. Overcurrent detection value setting 14 DB2 13 CL2 OUT1 9 12 OUT2 P.GND 10 11 P.V IN 1. Oscillator Frequency (fOSC) Setting Figure 1.1 shows an equivalent circuit for the triangle wave oscillator. VH 1.6 V typ t1 t2 (3.3 V IC internal circuits) Vref (2.5 V) VL 1.0 V typ CT charging IO RA Comparator RC IO Discharging 1.1 V 1:2 RT RB CT (external) CT RT (external) Inside the IC Figure 1.1 Equivalent Circuit for the Triangle Wave Oscillator 7 HA16116FP/FPJ, HA16121FP/FPJ The triangle wave is a voltage waveform used as a reference in creating a PWM pulse. This block operates according to the following principles. A constant current IO, determined by an external timing resistor RT , is made to flow continuously to external timing capacitor C T . When the CT pin voltage exceeds the comparator threshold voltage VH, the comparator output causes a switch to operate, discharging a current IO from C T . Next, when the CT pin voltage drops below threshold voltage VL, the comparator output again causes the switch to operate, stopping the I O discharge. The triangle wave is generated by this repeated operation. Note that IO = 1.1 V/RT. Since the IO current mirror circuit has a very limited current producing ability, RT should be set to ≥ 5 kΩ (IO ≥ 220 µA). With this IC series, VH and VL of the triangle wave are fixed internally at about 1.6 V and 1.0 V by the internal resistors R A, RB, and R C. The oscillator frequency can be calculated as follows. fOSC = 1 t1 + t2 + t3 Here, t1 = CT ⋅ (VH − VL) C R ⋅ (VH − VL) = T T 1.1 V/RT 1.1 V t2 = CT ⋅ (VH − VL) C R ⋅ (VH − VL) = T T = t1 (2 − 1) × 1.1 V/RT 1.1 V VH − VL = 0.6 V t1 = t2 = 0.6 C R 1.1 T T t3 ≈ 0.8 µs (comparator delay time in the oscillator) Accordingly, fOSC ≈ 1 1 [Hz] ≈ 2t1 + t3 1.1 CT RT + 0.8 µs Note that the value of fOSC may differ slightly from the above calculation depending on the amount of delay in the comparator circuit. Also, at high frequencies this comparator delay can cause triangle wave overshoot or undershoot, skewing the dead band threshold. Confirm the actual value in implementation and adjust the constants accordingly. 8 HA16116FP/FPJ, HA16121FP/FPJ 2. DC/DC Converter Output Voltage Setting and Error Amp Usage 2.1 Positive Voltage Booster (VO > VIN ) or Step-Down (VIN > VO > Vref) Use VO = R1 + R2 ⋅ Vref (V) R2 Booster output is possible only at channel 2 of HA16121. For step-down output, both channels of HA16116 or channel 1 of HA16121 are used. VO Error amp. IN(−)1 − CH1 R1 R2 IN(+)1 + VO R1 IN(−)2 − R2 CH2 + Vref pin Vref 2.5 V (internal connection) Figure 2.1 2.2 Negative Voltage (VO < Vref) for Inverting Output Use VO = −Vref ⋅ R3 + R4 R1 ⋅ −1 R3 R1 + R2 (V) Channel 1 is used for inverting output on both ICs. Vref pin Vref 2.5 V R1 IN(−)1 R2 R3 IN(+)2 R4 − CH1 + Error amp VO Figure 2.1 Inverting Output 9 HA16116FP/FPJ, HA16121FP/FPJ 2.3 Error Amplifier Figure 2.3 shows an equivalent circuit of the error amplifier. The error amplifier on these ICs is configured of a simple NPN transistor differential input amplifier and the output circuit of a constant-current driver. This amplifier features wide bandwidth (fT = 4 MHz) with open loop gain kept to 50 dB, allowing stable feedback to be applied when the power supply is designed. Phase compensation is also easy. Both HA16116 and HA16121 have a noninverting input (IN(+)) pin, in order to allow use of the channel 1 error amplifier for inverting control. The channel 2 error amplifier, on the other hand, is used for stepdown control in HA16116 and booster control in HA16121; so the channel 2 noninverting input is connected internally to Vref. IC internal VIN IN(−) E/O IN(+) To internal PWM comparator 80 µA 40 µA Figure 2.3 Error Amplifier Equivalent Circuit 3. Dead Band (DB) Duty and Soft Start Setting (common to both channels) 3.1 Dead Band Duty Setting Dead band duty is set by adjusting the DB pin input voltage (VDB). A convenient means of doing this is to connect two external resistors to the Vref of this IC so as to divide VDB (see figure 3.1). VDB = Vref × Duty (DB) = Here, T = R2 (V) R1 + R2 VTH − VDB × 100 (%) ⋅ ⋅ ⋅ ⋅ This applies when VDB > VTL. VTH − VTL If VDB < VTL, there is no PWM output. 1 fOSC Note: VTH: 1.6 V (Typ) VTL: 1.0 V (Typ) Vref is typically 2.5 V. Select R1 and R2 so that 1.0 V ≤ VDB ≤ 1.6 V. 10 HA16116FP/FPJ, HA16121FP/FPJ To Vref CT VDB R1 − + + E/O DB PWM comparator VIN 1.6 V typ VTL 1.0 V typ Booster channel 5k From UVL CST R 2 VTH VE/O VDB On t ON tOFF PWM pulse output Step-down/ 0.8V VIN Off Off inverting channel On GND VIN GND T Figure 3.1 Dead Band Duty Setting 3.2 Soft Start (SST) Setting (each channel) When the power is turned on, the soft start function gradually raises VDB (refer to section 3.1), and the PWM output pulse width gradually widens. This function is realized by adding a capacitor CST to the DB pin. The function is realized as follows. In the figure 3.2, the DB pin is clamped internally at approximately 0.8 V, which is 0.2 V lower than the triangle wave VTL = 1.0 V typ. t A: Standby time until PWM pulse starts widening. t B: Time during which SST is in effect. During soft start, the DB pin voltage in the figure below is as expressed in the following equation. VSST = VDB ⋅ 1 − e −t − t0.8 T , tSST = tA + tB Here, t0.8 = −T ln 1− 0.8 VDB , T = CST ⋅ (R1 // R2) How to select values: If the soft start time tSST is too short, the DC/DC converter output voltage will tend to overshoot. To prevent this, set tSST to a few tens of ms or above. 11 HA16116FP/FPJ, HA16121FP/FPJ V (voltage) VSST Triangle wave VTH 1.6 V VTL 1.0 V Starts from clamp voltage of 0.8 V PWM output pulse starts to widen t 0.8 tA Steady-state operation VIN Booster channel PWM pulse output 0V tB 0V Step-down/ inverting channel VIN 0V VO DC/DC converter output (positive in this example) 0V t = 0 (here IC is on) t = tSST Figure 3.2 Soft Start (SST) Setting 12 HA16116FP/FPJ, HA16121FP/FPJ 4. Totem Pole Output Stage Circuit and Power MOS FET Driving Method The output stage of this IC series is configured of totem pole circuits, allowing direct connection to a power MOS FET as an external switching device, so long as VIN is below the gate breakdown voltage. If there is a possibility that V IN will exceed the gate breakdown voltage of the power MOS FET, a Zener diode circuit like that shown figure 4.1 or other protective measures should be used. The figure 4.1 shows an example using a P-channel power MOS FET. P.V IN Bias circuit E.g.: V IN = 18 V Zener diode for gate protection OUT Gate protection resistor Drive circuit VO + − Schottky barrier diode Figure 4.1 P-channel Power MOS FET (example) 5. Vref Undervoltage Error Prevention (UVL) and Overvoltage Protection (OVP) Functions 5.1 Operation Principles The reference voltage circuit is equipped with UVL and OVP functions. • UVL In normal operation the Vref output voltage is fixed at 2.5 V. If VIN is lower than normal, the UVL circuit detects the Vref output voltage with a hysteresis of 1.7 V and 2.0 V, and shuts off the PWM output if Vref falls below this level, in order to prevent malfunction. • OVP The OVP circuit protects the IC from inadvertent application of a high voltage from outside, such as if VIN is shorted. A Zener diode (5.6 V) and resistor are used between Vref and GND for overvoltage detection. PWM output is shut off if Vref exceeds approximately 7.0 V. Note that the PWM output pulse logic and the precision of the switching regulator output voltage are not guaranteed at an applied voltage of 2.5 V to 7 V. 13 HA16116FP/FPJ, HA16121FP/FPJ 5.2 Quick Shutoff When the UVL circuit goes into operation, a sink transistor is switched on as in the figure below, drawing off the excess current. This transistor also functions when the IC is turned off, drawing off current from the C T , E/O, and DB pins and enabling quick shutoff. ! PWM output On PWM output off PWM output on PWM output off Off 1.7 2.0 2.5 When VIN is low 5.0 7.0 Vref (V) Abnormal voltage applied to Vref Relation of Vref to UVL and OVP VIN Vref generation circuit Vref Vref 2.0 V and 1.7 V detection ZD 5.6 V UVL Internal pulse signal line OUT R OVP 10 kΩ Sink transistor To other circuitry Figure 5.1 Quick Shutoff 14 OUT HA16116FP/FPJ, HA16121FP/FPJ 6. Setting of Intermittent Operation Timing when Overcurrent is Detected 6.1 Operation Principles The current limiter on this IC detects overcurrent in each output pulse, providing pulse-by-pulse overcurrent protection by limiting pulse output whenever an overcurrent is detected. If the overcurrent state continues, the TIM pin and ON/OFF pin can be used to operate the IC intermittently. As a result, a power supply with sharp vertical characteristics can be configured. The ON/OFF timing for intermittent operation makes use of the hysteresis in the ON/OFF pin threshold voltage VON and VOFF , such that V ON – VOFF = VBE . Setting method is performed as described on the following pages. VBE is based-emitter voltage of internal transistor. Note: When an overcurrent is detected in one channel of this IC but not the other, the pulse-by-pulse current limiter still goes into operation on both channels. Also, when the intermittent operation feature is not used, the TIM pin should be set to open state and the ON/OFF pin pulled up to high level (above VON ). VIN 390 kΩ Latch S Q R RA TM 4.7 kΩ + − Vref generation circuit C ON/OFF # " ! ! 2.2 µF RB ON/OFF Current limiter CL Figure 6.1 Connection Diagram (example) 6.2 Intermittent Operation Timing Chart (VON/OFF only) *1 4VBE c c V ON/OFF 3VBE 2VBE On IC is on IC is off On Off VBE a 0V b T ON t TOFF 2TON a. Continuous overcurrent detected b. Intermittent operation starts (IC is off) c. Overcurrent cleared (dotted line) Note: 1.V BE is the base-emitter voltage in transistors on the IC, and is approximately 0.7 V (see the figure 7.1). For details, see the overall waveform timing diagram. Figure 6.2 Intermittent Operation Timing Chart 15 HA16116FP/FPJ, HA16121FP/FPJ 6.3 Calculating Intermittent Operation Timing Intermittent operation timing is calculated as follows. (1) TON time (the time until the IC is shut off when continuous overcurrent occurs) TON = CON/OFF × RB × ln 3VBE 2VBE = CON/OFF × RB × ln1.5 × 1 × 1 − On duty* 1 ≈ 0.4 × CON/OFF × RB × 1 − On duty* 1 1 − On duty* (2) TOFF time (when the IC is off, the time until it next goes on) TOFF = CON/OFF × (RA + RB) × ln VIN − 2VBE VIN − 3VBE Where, VBE ≈ 0.7 V Note: 1. On duty is the percent of time the IC is on during one PWM cycle when the pulse-by-pulse current limiter is operating. From the first equation (1) above, it is seen that the shorter the time T ON when the pulse-by-pulse current limiter goes into effect (resulting in a larger overload), the smaller the value TON becomes. As seen in the second equation (2), T OFF is a function of VIN. Further, according to this setting, when VIN is switched on, the IC goes on only after TOFF has elapsed. Dead band voltage Triangle wave Point at which current limiter operate PWM output (step-down channel) t ON On duty = T t ON T Where T = 1/f OSC Note: On duty is the percent of time the IC is on during one PWM cycle when the pulse-by-pulse current limiter is operating. Figure 6.3 16 HA16116FP/FPJ, HA16121FP/FPJ 6.4 Examples of Intermittent Operation Timing (calculated values) 4 (1) TON TON = T1 × C ON/OFF × R B 3 Here, coefficient T1 = 0.4 × 1 1 − On duty 2 from section 6.3 (1) previously. T1 1 Example: If C ON/OFF = 2.2 µF, R B = 4.7 k Ω, and the on duty of the current limiter is 75%, then TON = 16 ms. 0 0 20 40 60 80 100 (PWM) ON Duty (%) Figure 6.4 Examples of Intermittent Operation Timing (1) (2) TOFF TOFF = T2 × C ON/OFF × (R A + R B) 0.1 Here, coefficient T2 = ln VIN − 2VBE VIN − 3VBE from section 6.3 (2) previously. T2 0.05 Example: If C ON/OFF = 2.2 µF, R B = 4.7 k Ω, RA = 390 k Ω, VIN = 12 V, 0 then TOFF = 60 ms. 0 10 20 V IN (V) 30 40 Figure 6.5 Examples of Intermittent Operation Timing (2) 17 HA16116FP/FPJ, HA16121FP/FPJ Example of step-up circuit VIN Triangle wave VCT Dead band VDB CF RF Error output VE/O PWM pulse output (In case of HA16120) IC RCS CL Inductor L OUT Power MOS FET drain current (ID) (dotted line shows inductor current) VIN Current limiter pin (CL) VIN − 0.2 V VOUT ID F.B. Determined by L and VIN VTH (CL) Determined by RCS and RF Figure 6.6 7. ON/OFF Pin Usage 7.1 IC Shutoff by the ON/OFF Pin As shown in the figure 7.1, these ICs can be turned off safely by lowering the voltage at the ON/OFF pin to below 2VBE . This feature is used to conserve the power in the power supply system. In off state the IC current consumption (I OFF) is 10 µA (Max) for HA16116 and 150 µA (Max) for HA16121. The ON/OFF pin can also be used to drive logic ICs such as TTL or CMOS with a sink current of 50 µA (Typ) at an applied voltage of 5 V. When it is desired to employ this feature along with intermittent operation, an open collector or open drain logic IC should be used. VIN I IN RA External logic IC Off On RB P.V IN S.VIN To output stage TIM To latch 50 kΩ Switch ON/OFF + − 4 VBE CON/OFF To other circuitry Q1 Q2 Q3 Vref output Q4 GND HA16116, HA16121 Figure 7.1 IC Shutoff by the ON/OFF Pin 18 Vref generation circuit On/off hysteresis circuit HA16116FP/FPJ, HA16121FP/FPJ 7.2 Adjusting UVL Voltage (when intermittent operation is not used) The UVL voltage setting in this IC series can be adjusted externally as shown below. Using the relationships shown in the figure, the UVL voltage in relation to VIN can be adjusted by changing the relative values of VTH and V TL. When the IC is operating, transistor Q4 is off, so VON = 3VBE ≈ 2.1 V. Accordingly, by connecting resistors R C and RD, the voltage at which UVL is cancelled is as follows. VIN = 2.1 V × RC + RD RD This VIN is simply the supply voltage at which the UVL stops functioning, so in this state Vref is still below 2.5 V. In order to restore Vref to 2.5 V, a V IN of approximately 4.3 V should be applied. With this IC series, V ON/OFF makes use of the VBE of internal transistors, so when designing a power supply system it should be noted that VON has a temperature dependency of around –6 mV/°C. VIN S.VIN P.VIN To output stage To latch TIM (open) RC To other circuitry ON/OFF Q1 50 kΩ RD Q2 Q3 GND 3 Vref output Q4 On/off hysteresis circuit 2.5 V VIN ≥ 4.5 V 2 Vref VOFF 1.4 V 1 0 Vref generation circuit 0 1 VON 2.1 V 2 3 4 5 VON/OFF Figure 7.2 Adjusting UVL Voltage 19 HA16116FP/FPJ, HA16121FP/FPJ Overcurrent Detection Value Setting The overcurrent detection value VTH for this IC series is 0.2 V (Typ) and the bias current is 200 µA (Typ) The power MOS FET peak current value before the current limiter goes into operation is derived from the following equation. ID = VTCL − (RF + RCS) ⋅ IBCL RCS Here VTH = VIN – VCL = 0.2 V, V CL is a voltage referd on GND. Note that CF and RCS form a low-pass filter, determined by their time constants, that prevents malfunctions from current spikes when the power MOS FET is turned on or off. C F 1800 PF S.VIN To other circuitry CL 1k 200 A R CS 0.05 Ω I BCL VCL V IN RF 240 Ω This circuit is an example for step-down output use. G OUT Detection output (internal) − + S D VO + − IN(—) Figure 8.1 Example for Step-Down Use The sample values given in this figure are calculated from the following equation. ID = 0.2 V − (240 Ω + 0.05 Ω) × 200 µA 0.05 Ω = 3.04 [A] The filter cutoff frequency is calculated as follows. fC = 20 1 2π CF RF = 1 6.28 × 1800 pF × 240 Ω = 370 [kHz] HA16116FP/FPJ, HA16121FP/FPJ Absolute Maximum Ratings (Ta = 25°C) Rating Item Symbol HA16116FP, HA16121FP HA16116FPJ, HA16121FPJ Unit Supply voltage VIN 40 40 V Output current (DC) IO ±0.1 ±0.1 A Output current (peak) I O peak ±1.0 ±1.0 A Current limiter pin voltage VCL VIN VIN V Error amp input voltage VIEA VIN VIN V E/O input voltage VIE/O Vref Vref V RT pin source current I RT 500 500 µA TIM pin sink current I TM 20 1 20 1, 2 mA 1, 2 Power dissipation* PT 680* * 680* * mW Operation temperature range Topr –20 to +85 –40 to +85 °C Junction temperature TjMax 125 125 °C Storage temperature range Tstg –55 to +125 –55 to +125 °C Permissible dissipation PT (mW) Note: 1. This value is based on actual measurements on a 40 × 40 × 1.6 mm glass epoxy circuit board. At a wiring density of 10%, it is the permissible value up to Ta = 45°C, but at higher temperatures this value should be derated by 8.3 mW/°C. At a wiring density of 30% it is the permissible value up to Ta = 64°C, but at higher temperatures it should be derated by 11.1 mW/°C. 2. For the DILP package. This value applies up to Ta = 45°C; at temperatures above this, 8.3 mW/°C derating should be applied. 800 10% wiring density 680 mW 30% wiring density 600 447 mW 400 348 mW 200 0 −20 0 20 40 45°C 64°C 60 80 85°C 100 125°C 120 140 Operating ambient temperature Ta (°C) 21 HA16116FP/FPJ, HA16121FP/FPJ Electrical Characteristics (Ta = 25°C, VIN = 12 V, fOSC = 300 kHz) Item Symbol Min Typ Max Unit Test Conditions Reference Output voltage Vref 2.45 2.50 2.55 V I O = 1 mA voltage Line regulation Line — 30 60 mV 4.5 V ≤ V IN ≤ 40 V block Load regulation Load — 30 60 mV 0 ≤ IO ≤ 10 mA Output shorting current I OS 10 25 — mA Vref = 0 V Vref OVP voltage Vrovp 6.2 6.8 7.0 V Output voltage temperature dependence ∆Vref/∆Ta — 100 — ppm/°C Triangle wave Maximum oscillator frequency f OSCmax 600 — — kHz oscillator block Minimum oscillator frequency f OSCmin — — 1 Hz Oscillator frequency input voltage stability ∆f OSC/∆VIN — ±1 ±3 % 4.5 V ≤ V IN ≤ 40 V Oscillator frequency temperature stability ∆f OSC/∆Ta — ±5 — % –20°C ≤ Ta ≤ 85°C Oscillator frequency f OSC 270 300 330 kHz CT = 220 pF, RT = 10 kΩ) Low-level threshold voltage VTLDB 0.87 0.97 1.07 V Output on duty 0% High-level threshold voltage VTHDB 1.48 1.65 1.82 V Output on duty 100% Threshold differential voltage ∆VTDB 0.55 0.65 0.75 V ∆VTH = VTH – VTL Output source current I Osource (DB) 100 150 200 µA DB pin = 0 V PWM comparator Low-level threshold voltage VTLCMP 0.87 0.97 1.07 V Output on duty = 0% block High-level threshold oltage VTHCMP 1.48 1.65 1.82 V Output on duty = 100% Threshold differential voltage ∆VTCMP 0.55 0.65 0.75 V ∆VTH = VTH – VTL Dead band precision DBdev –5 0 +5 % Deviation when VEO = (VTL + VTH)/2, duty = 50 % Dead band adjust block 22 HA16116FP/FPJ, HA16121FP/FPJ Electrical Characteristics (Ta = 25°C, VIN = 12 V, fOSC = 300 kHz) (cont) Item Symbol Min Typ Max Unit Test Conditions Error amp Input offset voltage VIOEA — 2 10 mV block Input bias current — 0.8 2 µA 28 40 52 µA In open loop, VI = 3 V, VO = 2 V Output source current I Osource (EA) 28 40 52 µA In open loop, VI = 2 V, VO = 1 V Voltage gain AV 40 50 — dB f = 10 kHz Unity gain bandwidth BW 3 4 — MHz High-level output voltage VOHEA 2.2 3.0 — V I O = 10 µA Low-level output voltage VOLEA — 0.2 0.5 V I O = 10 µA Ov erc urrent Threshold voltage VTCL VIN –0.22 VIN –0.2 VIN –0.18 V detection CL bias current I BCL 150 200 250 µA CL = VIN block Operating time t OFFCL — 200 300 ns CL = VIN –0.3 V — 500 600 ns Applies only to ch 2 of HA16121 — 0.7 2.2 V I Osink = 10 mA Applies only to HA16116 — 1.6 1.9 V I Osink = 10 mA Applies only to HA16121 — 1.0 1.3 V I Osink = 0 mA Applies only to HA16121 — 1.6 1.9 V I Osink = 1 mA ON/OFF pin = 0 V Applies only to ch 2 of HA16121 — 1.0 1.3 V I Osink = 0 mA ON/OFF = 0 V Applies only to ch 2 of HA16121 VIN –1.9 VIN –1.6 — V I Osource = 10 mA VIN –1.3 VIN –1.0 — V I Osource = 0 A VIN –1.9 VIN –1.6 — V I Osource = 1 mA ON/OFF pin = 0 V VIN –1.3 VIN –1.0 — V I Osource = 0 A ON/OFF pin = 0 V I BEA Output sink current I Osink (EA) Output stage Output low voltage VOL1 Off state low voltage VOL2 Output high voltage VOH1 Off state high voltage VOH2 23 HA16116FP/FPJ, HA16121FP/FPJ Electrical Characteristics (Ta = 25°C, VIN = 12 V, fOSC = 300 kHz) (cont) Item Symbol Min Typ Max Unit Test Conditions Output Rise time tr — 70 130 ns CL = 1000 pF (to VIN) *1, * 2 stage Fall time tf — 70 130 ns CL = 1000 pF (to VIN) *1, * 2 UVL block VIN high-level threshold voltage VTUH1 3.3 3.6 3.9 V VIN low-level threshold voltage VTUL1 3.0 3.3 3.6 V VIN threshold differential voltage ∆VTU1 0.1 0.3 0.5 V Vref high-level threshold voltage VTUH2 1.7 2.0 2.3 V Vref low-level threshold voltage VTUL2 1.4 1.7 2.0 V Vref threshold differential voltage ∆VTU2 0.1 0.3 0.5 V ∆VTU2 = VTUH2 – VTUL2 ON/OFF ON/OFF pin sink current I ON/OFF — 35 50 µA ON/OFF pin = 5 V block IC on-state voltage VON 1.8 2.1 2.4 V IC off-state voltage VOFF 1.1 1.4 1.7 V ON/OFF threshold differential voltage ∆VON/OFF 0.5 0.7 0.9 V TIM pin sink current in steady state I TIM1 0 — 10 µA CL pin = VIN VTIM = 0.3 V TIM pin sink current at overcurrent detection I TIM2 10 15 20 mA CL pin = VIN – 0.3 V VTIM = 0.3 V Operating current I IN 6.0 8.5 11.1 mA CL = 0 pF (to VIN) *1, * 2 8.5 12.1 15.7 mA CL = 500 pF (to VIN) *1, * 2 11.0 15.7 20.5 mA CL = 1000 pF (to VIN) *1, * 2 0 — 10 µA HA16116FP ON/OFF 0 120 150 µA HA16121FP pin = 0 V TIM block Common block Off current I OFF ∆VTU1 = VTUH1 – VTUL1 Notes: 1. CL is load capacitor for Power MOS FET’s gate, and C L = 1000 pF to GND in the case of HA16121 – ch 2. 2. CL in channel 2 of HA16121 is connected to GND. 24 HA16116FP/FPJ, HA16121FP/FPJ Characteristic Curves • Reference Voltage Block (Vref) 2 Ta = 25°C RA = 390 kΩ (Between the VIN and ON/OFF pins) 2.5 V UVL release: 3.6 V UVL operate: 3.3 V 1 3.3 3.6 0 Vref Temperature Characteristics 2.54 Reference voltage Vref (V) Reference voltage Vref (V) Reference Voltage vs. Power Supply Input Voltage 3 VIN = 12 V IO (Vref ) = 1 mA 2.52 2.50 2.48 4.3 1 2 3 4 5 Power supply input voltage VIN (V) 40 2.46 −20 85 0 20 40 60 80 100 Ambient temperature Ta (°C) Vref Load Regulation Reference voltage Vref (V) 3.0 2.5 2.0 1.50 Short circuit current 0 10 20 Output current IO sink (mA) 30 • UVL (Low Input Voltage Malfunction Prevention) Block Hysteresis Voltage Temperature Characteristics VIN UL voltage (V) 4.5 High threshold voltage 4.0 Hysteresis 3.5 3.0 2.5 Low threshold voltage −20 0 20 40 60 80 Ambient temperature Ta (°C) 100 25 HA16116FP/FPJ, HA16121FP/FPJ • Triangle Wave Oscillator Block RT pin Output Current Characteristics Sawtooth Wave Amplitude vs. Oscillator Frequency 2.0 Sawtooth wave level (V) RT pin voltage (V) 1.1 1.0 0.9 Reccomended usage range 10 (RT ≈ 100 kΩ) 0.8 0 100 VTH 1.5 VTL 1.0 Sawtooth wave amplitude Note: Due to these characteristics, the dead band and PWM comparator threshold voltages change at high frequencies. 0.5 330 (RT ≈ 3 kΩ) 200 300 400 500 0 (DC) IRT (µA) 100 200 300 400 fOSC (kHz) (linear scale) CT, RT Values (VIN = 12V) vs. Oscillator Frequency 100 70 C RT (kΩ) 50 T 30 20 0 00 22 10 7 00 47 00 00 .1 5 3 47 10 10 µF 20 30 22 0 pF = 10 47 0p pF 600 kHz F pF pF pF pF 50 70 100 200 300 Oscillator frequency fOSC (kHz) 500 700 1 M Oscillator Frequency Temperature Stability Frequency variation (∆f/fo) (%) +10 VIN = 12 V +5 B 0 A A −5 B 85 −10 −20 26 A: fOSC = 300 kHz B: fOSC = 600 kHz 0 20 40 60 Ambient temperature Ta (°C) 80 100 500 600 HA16116FP/FPJ, HA16121FP/FPJ • Error Amplifier Block Open Loop Gain Characteristics 60 40 Phase delay φ (deg.) Open loop gain A VO (dB) AVO 0 φ 45 20 90 135 BW 0 1k 3k 10 k 30 k 100 k 300 k 1M 180 10 M 3M Error amplifier input frequency fIN (Hz) Common Mode Input Characteristics +100 Output offset VO (mV) 0 − EA + −100 VO − + VI Vref −200 −300 0 1 2 3 Input voltage VI (V) 4 • On Duty Characteristics On Duty Characteristics On Duty Characteristics 100 Hz 0k 40 fO SC =5 20 20 30 0 40 60 k kH Hz z k On duty*2 (%) 0 60 Hz Boost PWM output (HA16121-2 ch) 60 0 kH z 80 0 30 =5 SC 60 fO On duty*1 (%) 80 Step-down PWM output (HA16116-1, 2ch HA16121-1ch) 0k Hz 100 0 0.8 1.0 1.2 1.4 VDB or VE/O (V) 1.6 1.8 Notes: 1. The percentage of a single timing cycle during which the output is low. 0 0.8 1.0 1.2 1.4 VDB or VE/O (V) 1.6 1.8 2. The percentage of a single timing cycle during which the output is high. 27 HA16116FP/FPJ, HA16121FP/FPJ • Other Characteristics IC On Voltage and Off Voltage Temperature Characteristics 4 210 3 VON or VOFF (V) Detection voltage VTH (mV) Current Limiter Level Temperature Characteristics 220 85°C 200 190 180 −20 0 20 40 60 Ambient temperature Ta (°C) 80 IIN vs. VIN Characteristics VOFF off voltage (about −4mV/°C) 0 20 40 60 80 Ambient temperature Ta (°C) 12 11 10 Output voltage VO (VDC) Current dissipation IIN (mA) 85°C 100 Output pin (Output Resistor) Characteristics Maximum rating at Ta = 25°C: 680 mW 30 1 0 −20 100 40 fOSC = 300 kHz On duty: 50% Ta = 25°C VON on voltage (about −6mV/°C) 2 Load capacitance: 1000 pF/ch 20 500 pF/ch 9 VGS (P-channel Power MOS FET) Output high voltage when on Output high voltage when off (channels 1 and 2 in the HA16116 and channel 1 in the HA16121) 3 No load Output low voltage when on 10 2 1 10 20 30 Power supply voltage VIN (V) 0 40 0 Output Drive Circuit Power MOS FET Direct Drive ability Data Output low voltage when off (channels 1 and 2 in the HA16121) 2 4 6 8 IO sink or IO source (mA) 10 VGS (N-channel Power MOS FET) Gate Drive Waveforms for the 2SJ214 800 VIN = 12 V fOSC = 130 kHz IO peak (mA) 600 2SJ214 400 2SJ176 ,,, ,,, ,,, 2SJ216 ,,, ,,, ,,, Drive voltage: 5 V/div ,,, ,,, 200 0 Drive current: * 200 mA/div 1000 2000 3000 4000 Ciss (pF) Note: The solid line is data measured with discrete capacitances (for each channel of HA16116). 28 650 nsec/div Note: * Measured using a current probe. (The boost channel (channel 2 in the HA16121) load is with respect to ground, and has almost identical characteristics.) 12V VIN from UVL 5k S.GND 1 0.8V VIN 2.5 V output band gap reference voltage ON/OFF generation circuit 20 S.VIN L H OVP VL VH UVL 18 TIM CT 220p CT 2 Bias current RT 10k RT 3 1.1 V RT Latch reset pulse Triangle wave 1.0 V 1.6 V Triangle wave oscillator circuit 19 Vref Units: R : Ω C : µF (unless otherwise specified) pF (p) The IC is the HA16116. Cref 0.1 Q IN(+)1 4 R S Latch OR UVL output + EA1 − 0.8V VIN 12k 14 DB2 + 2.2 − 24k 33k E/O1 5k from UVL R3 2k 2.2 R4 12k 24k + − DB1 7 CL2 CL1 8 0.2 V Vref Vref 0.2 V to S.VIN CL1 − + − + CL2 1800p 240 240 330µH HRP24 4.7 4.7 1800p P.GND 10 NAND OUT1 OUT1 9 11 P.VIN NAND (HA16116) OUT2* OUT2 13 to S.VIN 12 from UVL PWM COMP 1 − + + + + − PWM COMP 2 5k from UVL from UVL 6 12k 4700p 10k 100k 33k E/O2 15 0.8V − EA2 + IN(−)1 5 16 VIN 100k 10k 4700p ON/OFF IN(−)2 17 RB 4.7k CTM 2.2 RA 390k HA16116FP is used in a ±5 V output power supply, with a +12 V input. 20k 20k 0.05 2SJ214 HRP24 + − 470 Inverting output Step-down output + 470 − 330µH 2SJ214 0.05 + −5 V 1A output − − +5 V 1A output + HA16116FP/FPJ, HA16121FP/FPJ Application Examples (1) 29 HA16116FP/FPJ, HA16121FP/FPJ Overall Waveform Timing Diagram (for Application Examples (1)) 12 V VIN 0V VTIM , 2.8 V 2.1 V VTIM , VON/OFF VON/OFF 2.1 V 1.4 V 0V On On (V) 3.0 On VE/O Off 2.0 VE/O, VCT, VDB On On Off Off Off Off VCT triangle wave 1.0 VDB 0.0 VCL 12 V 11.8 V 0V Pulse-by-pulse current limiter operates VOUT*1 12 V PWM pulse 0 V DC/DC output (example for positive voltage) Soft start IC operation states Power IC on supply on Steady-state operation Overcurrent detected; intermittent operation Overcurrent Quick cleared; shut-off steady-state operation Power supply off, IC off Note: 1.This PWM pulse is on the step-down/inverting control channel. The booster control channel output consists of alternating L and H of the IC on cycle. 30 HA16116FP/FPJ, HA16121FP/FPJ Application Examples (2) (Some Pointers on Use) 1. Inductor, Power MOS FET, and Diode Connections 1. Booster specification 2. Step-down specification V IN V IN CF RF V IN RCS CL CF Applicable only to channel 2 of HA16121FP RF V IN RCS CL OUT Applicable to HA16116FP and to channel 1 of HA16121FP VO VO OUT GND GND FB FB 3. Inverting specification CF RF V IN 4. Negative booster specification (Flyback transformer) RCS CF Applicable only to channel 1 RF V IN CL RCS Applicable only to channel 1 CL OUT OUT VO GND GND FB FB Vref 2. Turning Output On and Off while the IC is On 1. To turn only one channel off, ground the DB pin or the E/O pin. In the case of E/O, however, there will be no soft start when the output is turned back on. 2. When only one channel is to be used, the channel not used should be connected as follows. VIN DB Connect CL to VIN. Ground IN(+) and IN(−). Leave other pins open. E/O OFF CL IN + IN − GND 31 32 5V VIN 20 1 5k Triangle wave 1.0 V 1.6 V S.GND 2 CT 220p CT Bias current 3 RT 10k RT 1.1 V RT R S 4 Q Latch UVL output 17 Triangle wave generation circuit TIM OR VL VH UVL 18 CTM 2.2 RB 4.7k RA 390k OVP L H Vref Units: R : Ω C : µF (unless otherwise specified) pF (p) The IC is the HA16121. from UVL 0.8V VIN 19 Latch reset pulses S.VIN 2.5 V band gap reference voltage ON/OFF generation circuit Cref 0.1 IN(+)1 ON/OFF VIN IN(−)1 100k + EA1 − 0.8V VIN 0.8V − EA2 + 100k IN(−)2 12k 12k 4700p 10k 5 16 6 from UVL 33k E/O1 from UVL 5k R3 1.2k 24k + − 7 R4 22k 2.2 DB1 8 CL1 9 0.2 V to S.VIN CL1 − + Vref Vref 0.2 V 11 OUT1 10 NAND OUT1 1800p P.V IN 1800p P.GND NAND (HA16116) OUT2* CL2 OUT2 12 to S.VIN − + CL2 13 from UVL PWM COMP 1 − + + + + − PWM COMP 2 5k from UVL DB2 2.2 14 − + 24k E/O2 33k 15 4700p 10k Power supply using the HA16121FP: +5 V input, +12 and −22 V outputs 240 4.7 330µH 2SK1094 4.7 240 + + − 470 Inverting output 2SJ214 0.05 1.3 k 5.1 k Boost output 470 − HRP24 330µH 0.05 − −12 V output + − +12 V output + HA16116FP/FPJ, HA16121FP/FPJ Application Examples (3) HA16116FP/FPJ, HA16121FP/FPJ Package Dimensions Unit: mm 12.6 13 Max 11 1 10 1.27 *0.42 ± 0.08 0.40 ± 0.06 0.10 ± 0.10 0.80 Max *0.22 ± 0.05 0.20 ± 0.04 2.20 Max 5.5 20 0.20 7.80 +– 0.30 1.15 0° – 8° 0.70 ± 0.20 0.15 0.12 M *Dimension including the plating thickness Base material dimension Hitachi Code JEDEC EIAJ Mass (reference value) FP-20DA — Conforms 0.31 g 33 HA16116FP/FPJ, HA16121FP/FPJ Cautions 1. Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s patent, copyright, trademark, or other intellectual property rights for information contained in this document. Hitachi bears no responsibility for problems that may arise with third party’s rights, including intellectual property rights, in connection with use of the information contained in this document. 2. Products and product specifications may be subject to change without notice. Confirm that you have received the latest product standards or specifications before final design, purchase or use. 3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. 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Even within the guaranteed ranges, consider normally foreseeable failure rates or failure modes in semiconductor devices and employ systemic measures such as failsafes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other consequential damage due to operation of the Hitachi product. 5. This product is not designed to be radiation resistant. 6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without written approval from Hitachi. 7. Contact Hitachi’s sales office for any questions regarding this document or Hitachi semiconductor products. Hitachi, Ltd. Semiconductor & Integrated Circuits. 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Ltd. 16 Collyer Quay #20-00 Hitachi Tower Singapore 049318 Tel: 535-2100 Fax: 535-1533 Hitachi Asia Ltd. Taipei Branch Office 3F, Hung Kuo Building. No.167, Tun-Hwa North Road, Taipei (105) Tel: <886> (2) 2718-3666 Fax: <886> (2) 2718-8180 Hitachi Asia (Hong Kong) Ltd. Group III (Electronic Components) 7/F., North Tower, World Finance Centre, Harbour City, Canton Road, Tsim Sha Tsui, Kowloon, Hong Kong Tel: <852> (2) 735 9218 Fax: <852> (2) 730 0281 Telex: 40815 HITEC HX Copyright ' Hitachi, Ltd., 1998. All rights reserved. Printed in Japan. 34