HRS CB1G-10S-1.5H

NEW
Memory Stick® Connectors
CB1 Series
Card Push Insert/Push Eject
<CB1G Series>
● Card ejection distance of 10 mm
● Mounting height of 3.5 mm
● Mounting area: Smaller design is 78% of former
size
■Outline
Receptacle connectors for use with the new generation of
digital media devices requiring “Memory Stick® ” type of
consumer removable memory card.
Several variations are available: Miniature, Low Profile and
with or without ejection mechanism.
Button Touch Ejection
<CB1F Series>
■Features
1. Indication of Incorrect Card Insertion
The connector will not allow the card to be complete
inserted from the wrong end or reversed.
The card will stop about 7mm before complete insertion
position, visually indicating incorrect insertion.
2. Protection of the Contacts
Incorrect insertion of the card will not damage the
contacts. The card can be easily withdrawn and reinserted correctly.
● Card ejection with tactile button operation
● Card ejection distance of 10 mm
● Equipped with card ejection switch
3. Excellent Card Handling
The type that is equipped with an ejection mechanism
provides a long ejection of the card which offers excellent
card handling qualities.
Without Card Ejection
<CB1D Series>
*Memory Stick is a registered trademark of the Sony Corporation.
● Miniaturized, low profile design
● Improved installation to the equipment is permitted
using (M1.7) tapping screws
● Can be equipped with an ejection mechanism
depending on the design of the equipment side
portion
Note: Please position the card ejection button at the side of the equipment.
2003.12
1
■Product Specifications
Current rating 0.5A
Operating temperature range
-20ç to +85ç(Note)
Voltage rating 125V AC
Storage temperature range
-40ç to +85ç
Rating
Operating humidity range
Relative humidity 96% max.
Item
Specification
1. Insulation resistance
(No condensation)
Conditions
1000 M ohms min.
500 V DC
2. Withstanding voltage
No flashover or insulation breakdown
500 V AC / one minute
3. Contact resistance
100 m ohms max.
100mA DC
4. Vibration
No electrical discontinuity of 1 µs or more
Frequency: 10 to 55 Hz, single amplitude of 0.75 mm, 2 hours / 3 axis
5. Humidity
Contact resistance: 40 m ohms max. from initial value
Insulation resistance: 100 M ohms min.
96 hours at temperature of 40ç±2ç and humidity
of 90% to 95%
6. Temperature cycle
Contact resistance: 40 m ohms max. from initial value
Insulation resistance: 100 M ohms min.
Temperature: -55ç/+5ç to +35ç/+85ç/+5ç to +35ç
Duration: 30/5/30/5(Minutes)
5 cycles
7. Durability
(mating/unmating)
Contact resistance: 40m ohms max. from initial value
12000 cycles at 400 to 600 cycles per hour
8. Resistance to
soldering heat
No deformation of any component.
No affect on contacts
Reflow: At the recommended temperature profile
Manual soldering: 300ç for 3 seconds
Note :Includes temperature rise caused by current flow.
■Materials
Part
Material
Insulator
Heat resistant glass reinforced
therm oplastic compound
Contacts
Phosphor bronze
Metal hold down
Finish
Phosphor bronze or stainless steel
Remarks
Color: Black
UL94V-0
Contact area: Gold plated
Termination area: Tin-Iead plated or
tinned copper plated
Contact area: Nickel plating
Termination area: Tin-Iead plated or
tinned copper plated
CB1E,CB1F,CB1G Series is
without the termination area.
----------
Cover
Stainless steel or cupper alloy
----------
The CB1E Series has termination
area with tin-lead plated.
Eject mechanism components
Stainless steel
Heat resistant glass reinforced
therm oplastic compound
----------
UL94V-0
■Ordering information
CB 1 E - 10 S - 1.5 H - PEJC - *
1
2
1 Series name
2 Series No.
3 Ejector type
3
4
5
6
: CB
:1
}
:C
E
With eject mechanism
F
G
D
Without eject mechanism
A
4 Number of contacts : 10
5 Connector type S : Receptacle
}
2
7
8
9
6 Contact pitch : 1.5 mm
7 Surface mount
8 Eject mechanism codes:
PEJC : Card Push insert/Push eject
EJL : Left button eject
EJR : Right button eject
9 Suffix
Card pushed for ejection
29.4
26.8
(5.525)
BPCB mounting pattern
Memory stick card outline
3.85
(3.25)
1.9±0.1
4±0.1
26.6±0.1
(19.8)
1.9±0.1
1.9±0.1
CL No.
CL689-0037-5
33
Part No.
CB1G-10S-1.5H-PEJC2
26.8±0.1
26.2
3.2
(21)
(31)
Card ejected
Card fully inserted
■Low Profile, Push Insert-Push Eject
0.9±0.05
P=1.5±0.03
0.6
P=1.5
13.5
9.3±0.05
3.5
CONTACT No.1
9.3
BPCB mounting pattern
Card fully inserted
27.75
22.75
Memory stick card outline
11.975 (5.525)
3.85
(2)
(0.8)
4.5
16.5±0.03
1.5±0.03
10.9±00.3
18.3
34.9
11.15±0.03
10.9
.05
+00
0.6±0.05
0.9±0.05
0.6
CONTACT No.1
0.4
3
4.2
P=1.5
13.5
32.5
37
P=1.5±0.05
13.5±0.05
3.5
3±0.05
4.2±0.05
5.3±0.1
1.3
2-Ø
3.4±0.1
39.8
18.3±00.3
5
(13)
1
0. 0
+ 0.
-
CL689-0028-4
.2
CB1F-10S-1.5H-TEJL-PA
Ø3
CL No.
32.5±00.3
4-
.4
Ø2
4-
Part No.
Eject stroke
(3.25)
(23)
Card ejected
■Button Touch Eject
Ø0.55
11.15
1.5
Ø1.2
16.5
■Without Card Ejection
BPCB mounting pattern
24.7
13.5
4.15
5.8
6.95
CB1D-10S-1.5H
CL689-0021-5
3.55
2.65±0.03
.3
+0
0 .0
.8
6.1±0.05
1±0.1
1±0.1
P=1.5±0.05
13.5±0.05
5.8±0.05
0.6
24.5
CL No.
0.3
1
0.
+ 0
Ø1
2±0.1
P=1.5
2±0.1
5.5
0.6
1.45
1.4
CONTACT No.1
1.05±0.05
4.15±0.05
6.1±0.05
0 .05
.3
Ø1
Part No.
18.7±0.03
.3 +0
Ø1
19.5
Ø1
5
3.5
Ø1.2
4.15
18.7
3
■Push Insert-Push Eject
Card ejected
(19.5)
(13.3)
Card fully inserted
Card pushed for ejection
(12)
BPCB mounting pattern
30.4
26.8
(5.525)
Memory stick card outline
(3.25)
0.9±0.05
P=1.5±0.03
CONTACT No.1
0.6
P=1.5
13.5
(19.5)
Card ejected
Card fully inserted
(13.3)
Card pushed for ejection
(12)
(3.5)
9.3
30.4
26.8
13.4
(5.525)
BPCB mounting pattern
8.85
3.85
Memory stick (3.25)
card outline
24±0.03
15.1
3.2
10.5±0.1
8.6±0.1
CL689-0034-7
24
40.8
CB1EBG-10S-1.5H-PEJC2
0.9±0.05
P=1.5±0.03
8.1
9.3±0.05
CONTACT No.1
3.5
9.3
29.4
26.8
8.3
(5.525)
BPCB mounting pattern
Memory stick
card outline 3.85
(3.25)
26.8±0.1
1.9±0.1
4±0.1
1.9±0.1
(12)
0.9±0.05
P=1.5±0.03
0.6
P=1.5
13.5
4
4±0.1
10.5±0.1
8.6±0.1
CL No.
CL689-0035-0
10.1
Part No.
CB1EBH-10S-1.5H-PEJC2
24
40.8
23.8
3.2
24±0.03
3.6
(19.5)
Card ejected
(13.3)
Card fully inserted
Card pushed for ejection
0.6
P=1.5
13.5
● With square window
2.4±0.1
26.8±0.1
4±0.1
2.4±0.1
10.1
CL No.
9.3±0.05
4±0.1
● With "U" cut-out
Part No.
2.4±0.1
4±0.1
24±0.03
10.5±0.1
3.2
40.8
24
CL No.
CL689-0026-9
10.1
Part No.
CB1EB-10S-1.5H-PEJC2
26.8±0.1
4±0.1
2.4±0.1
8.6±0.1
● Normal type
CONTACT No.1
3.5
9.3
9.3±0.05
Card ejected
■Left Ejection
23.1
4.45
21.8
3.65
Memory stick card outline
16.45
4.05
(3.3)
5.2
3.5
Eject stroke
(6)
8.75
0.1
Ø1
47.95
26.45
CL No.
CL689-0006-1-56
53.45
Part No.
CB1C-10S-1.5H-EJL(56)
51.45
.8
BPCB mounting pattern
10.5
5.55
.05
+00
.3
1
2-Ø
6.55
48MAX
3±0.1
10.5±0.03
2
4.55
13.5
5.5
0.9±0.1
P= 1.5±0.05
0.6
P=1.5
CONTACT No.1
4.95±0.05
2.4±0.1
0.4±0.05
29.9
.2
Ø1
2-
4.65±0.05
3.45
Front edge of the printed
circuit board
3.2±0.1
13.5±0.05
4.55±0.05
9.25
Memory stick card outline
17.35
Card ejected
■Right Ejection
4.4
23
21.8
3.65
CL689-0007-4-59
41MAX
2.4±0.1
4.95±0.05
0.4±0.05
3±0.1
13.5±0.05
53.45
5.55
2
0.6
31.2
2
0.9±0.1
P=1.5±0.05
5
.0
+0 0
3
1.
Ø
2-
.
Ø1
10.5±0.03
2-
4.65±0.05
Front edge of the printed
circuit board
3.45
BPCB mounting pattern
10.5
4.55
P=1.5
CONTACT No.1
13.5
5.5
CB1C-10S-1.5H-EJR(59)
47.15
CL No.
23.4
Part No.
43.95
Ø2
.
3
8.6
Eject stroke (3.3)
3.2
(6)
4.05
3.2±0.1
4.55±0.05
5
■With flange, for screw attachment
BPCB mounting pattern
33.45
16.5
13.5
1.5
P=1.5
30.05±0.05
4.725
30.05
4.725±0.05
e)
ol
P=1.5±0.05
(h
8
2Ø1
.
2
0.
+ 0
0.5
13.5±0.05
5.25
.2
Ø2
CONTACT No.1
+
0
0 .2
26.3
0.6
16.5±0.05
.2
Ø2
6.3±0.1
6.6±0.1
7.4±0.1
4.9±0.1
4.4±0.05
11.6±0.1
2.75±0.1
.1
+0 0
e)
ol
(h
2
0.9±0.05
.1
Ø2
2-
CL No.
CL689-0001-8-57
1.2
20.3
18.6
2.9
1.9
4.4
e)
ol
(h
Part No.
CB1A-10S-1.5H(57)
3.8±0.1
4.1±0.1
1.7
5.3
1.5
3.3±0.1
19.25
3.8±0.1
Ø2
■Without flange
BPCB mounting pattern
16.5
13.5
P=1.5
16.5±0.05
13.5±0.05
26.3
6.3±0.1
6.6±0.1
3.8±0.1
4.1±0.1
11.6±0.1
4.9±0.1
18.6
2
5.3
26.7
3.3±0.1
CL689-0002-0-57
1.2
CB1AA-10S-1.5H(57)
2.75±0.1
e)
ol
(h
CL No.
1
0.
+ 0
Part No.
0.9±0.05
.1
Ø2
2-
20.3
7.4±0.1
0.5
P=1.5±0.05
5.25
0.6
CONTACT No.1
3.8±0.1
1.5
19.25
Ø2
BMemory Stick card insertion direction BMemory Stick fully inserted dimensions
21.45
4.4
2.8
9.5
40.5
1.35
6
■Packaging specification (Tray packaging)
● Part Number: CB1G-10S-1.5H-PEJC2(1 tray: 40 pieces)
● Part Number: CB1F-10S-1.5H-TEJL-PA(1 tray: 20 pieces)
330 -10
30.1±0.2
320±0.5
252±0.3
P=36±0.2
43±0.2
A
● Part Number: CB1D-10S-1.5H(1 tray: 50 pieces)
● Part Number: CB1EB*-10S-1.5H-PEJC2(1 tray: 25 pieces)
330 -10
330 -10
27.5±0.2
320±0.5
255.5±0.3
19±0.2
32.25±0.2
CB1F(TEJL1)
2 0 PI CS
225 -1
0
PS
CB1G SERIES
0
225 -1
215±0.5
160±0.3
P=40±0.2
A
A
40PICS
PS
320±0.5
195±0.3
P=65±0.2
A
100±0.2
215±0.5
160±0.3
P=40±0.2
30.1±0.2
330 -10
P=36.5±0.2
B
320±0.5
220±0.3
55±0.2
P=55±0.2
A
A
CB1C(L1)
330 -10
320±0.5
222±0.3
55±0.2 P=74±0.2
CB1E(PEJC1)
B
B
CB1C(R1)
225 -10
215±0.5
156±0.3
P=52±0.2
225 -10
215±0.5
160±0.3
P=40±0.2
A
● Part Number: CB1C-10S-1.5H-EJR(59)(1 tray: 20 pieces)
20PICS
29.5±0.2
A
25PICS
0
330 -10
320±0.5
253.2±0.3
P=63.3±0.2
33.4±0.2
215±0.5
160±0.3
P=40±0.2
225 -1
● Part Number: CB1C-10S-1.5H-EJL(56)(1 tray: 20 pieces)
27.5±0.2
225 -10
215±0.5
177±0.3
P=29.5±0.2
PS
B
20PICS
● Part Number: CB1A*-10S-1.5H(57)(1 tray: 50 pieces)
330 -10
320±0.5
276.5±0.3
P=39.5±0.2
C
C
CB1A(1)
225 -10
215±0.5
177±0.3
P=29.5±0.2
19±0.2
21.75±0.2
7
BUsage Precautions
1.Care should be taken to correctly insert/withdraw the Memory Stick® card. Following correct insertion/withdrawal procedures
will prevent device or connector damage.
When handling the CB1C series connectors, hold it in the areas indicated by the arrows, as illustrated below.
CB1A Series
CB1C Series
Contacts
Recommended
holding area
Recommended
holding area
Contacts, metal hold-down and
ejection components areas
Metal hold-down
2.Follow the recommended insertion angles, as illustrated below.
<Memory Stick Allowable Insertion Angles>
CB1A Series
CB1C Series
Outline of the Memory
Stick card
±1°MAX
±2°MA
X
0°±0
±1°M
AX
Outline of the Memory
Stick card
°MAX
.22°
±0.
2°M
15
±0.5
Initial insertion
(15 mm max.)
8
Complete insertion
(from 15 mm to full insertion)
AX
3.When inserting or withdrawing cards from the CB1C Series, the side contacts on both sides will protrude outward
by 0.6 mm. Care should be taken that they will not be restricted or touch other components.
side contact
(0.6)
4. Application of an excessive external force to the push rod may prevent the ejection or insertion of the card.
Do not apply any load in a direction other than the push direction.
Do not twist or bend !
Push direction
Do not pull !
Push rod
9
■Recommended Temperature Profile
300ç
IR Reflow Conditions
Preheating : 150ç 30 to 90 sec.
240ç max.
Soldering : 235±5ç 10 sec. max.
220ç min. 10 to 20 sec.
220ç
200ç
Soldering
150ç
Preheating
100ç
0ç
0S
50S
100S
150S
<Recommended Conditions>
Reflow system : IR reflow
Solder
: Paste type 63 Sn/37 Pb (Flux content 9 wt%)
Test board
: Glass epoxy 60mm x 100mm x 1.6 mm
Metal mask thickness
: 0.15 mm
Recommended temperature.
The temperature may be slightly changed according to the solder paste type and volume used.
10
200S