Connector for microSD™ Card (Header Type) SCHD Series Low-profile with 1.6mm thickness provides improved flexibility in set design. For SD Memory Card For microSD™ Card For SIM Card 8pins For W-SIM Features ● ● Applications A comfortable click feel at insertion. Card-guide structure for smoother card insertion. ● For mobile phones and personal digital assistants For Memory Stick™ Typical Specifications Items Applicable media Specifications Combine Type microSD™ Card For Compact Flash™ Mounting type Surface mounting type Mounting style Standard mount Media ejection structure Manual insertion/removal For PC cards supporting CardBus Structure Performance Operating temperature range −20℃ to ＋70℃ Voltage proof 500V AC 1minute Insulation resistance （Initial） Contact resistance （Initial） For Memory Stick Micro™ For Express Card™ For CMOS Camera Module 1,000MΩ min. 100mΩ max. Insertion and removal cycle 10,000cycles Product Line Media ejection structure Mounting system Stand-off （mm） Packing system Product No. Manual insertion/removal Standard mount 0 Taping SCHD1A0101 23 Connector for microSD™ Card (Header Type) SCHD Series Dimensions Unit:mm PC board mounting hole dimensions （Viewed from the mounting face side） Style For SD Memory Card 12.5 For PC cards supporting CardBus For Express Card™ For CMOS Camera Module 24 1.6 0.1 2 10.1 2 10.95 8.6 6.55 9.80 6.15 8-0.8 Pitch 7-1.1 Pitch 7-1.1 8-0.3 3.2 3.2 13.1 Land area Combine Type For Compact Flash™ 11.95 13.20 For Memory Stick Micro™ For Memory Stick™ 7.6 6.15 4-1.4 （15） For W-SIM 1.9 3.65 7.6 For SIM Card 8pins 2.65 For microSD™ Card No pattern area 11.1 14.6 No parts area Small Memory Card Connectors Soldering Conditions Example of Reflow Soldering Condition（Reference） For SD Memory Card 1. Heating method: Double heating method with infrared heater. 2. Temperature measurement: Thermocouple 0.1 to 0.2φ CA（K）or CC（T）. 3. Temperature profile（Surface of products）. For microSD™ Card For W-SIM For Memory Stick Micro™ For Memory Stick™ Temperature (˚C ) For SIM Card 8pins 240℃(max.) 230℃(min.) 200 180℃ 150℃ 100 Room temperature Time (s) Pre-heating 90±30 sec. 10 sec.(max.) Combine Type Heating time sec. For Compact Flash™ For PC cards supporting CardBus For Express Card™ For CMOS Camera Module 50 Cautions for using this product 1. When soldering terminals, there is a danger that load placed on the terminals may cause rattle, deformation or electrical degradation to occur depending on the conditions. Caution is therefore required. 2. Avoid use of water-soluble soldering flux, since it may corrode the product. 3. Check and conform to reflow soldering requirements under actual mass production conditions. 4. PC board warping may alter the characteristics. Please take this into consideration when designing patterns and layout. 5. The card specifications are provided by the above manufactures. Products by other manufactures may not be compliant with these specifications and are subject to change without prior notice.