ACU7503 Datasheet Latest Version: 1.3 ACU7503PRODUCT DATASHEET Declaration Circuit diagrams and other information relating to products of Actions Semiconductor Company, Ltd. (“Actions”) are included as a means of illustrating typical applications. Consequently, complete information sufficient for construction is not necessarily given. Although the information has been examined and is believed to be accurate, Actions makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and disclaims any responsibility for inaccuracies. Information in this document is provided solely to enable use of Actions’ products. The information presented in this document does not form part of any quotation or contract of sale. Actions assumes no liability whatsoever, including infringement of any patent or copyright, for sale and use of Actions’ products, except as expressed in Actions’ Terms and Conditions of Sale for. All sales of any Actions products are conditional on your agreement of the terms and conditions of recently dated version of Actions’ Terms and Conditions of Sale agreement Dated before the date of your order. This information does not convey to the purchaser of the described semiconductor devices any licenses under any patent rights, copyright, trademark rights, rights in trade secrets and/or know how, or any other intellectual property rights of Actions or others, however denominated, whether by express or implied representation, by estoppel, or otherwise. Information Documented here relates solely to Actions products described herein supersedes, as of the release date of this publication, all previously published data and specifications relating to such products provided by Actions or by any other person purporting to distribute such information. Actions reserves the right to make changes to specifications and product descriptions at any time without notice. Contact your Actions sales representative to obtain the latest specifications before placing your product order. Actions product may contain design defects or errors known as anomalies or errata which may cause the products functions to deviate from published specifications. Anomaly or “errata” sheets relating to currently characterized anomalies or errata are available upon request. Designers must not rely on the absence or characteristics of any features or instructions of Actions’ products marked “reserved” or “undefined.” Actions reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. Actions’ products are not designed, intended, authorized or warranted for use in any life support or other application where product failure could cause or contribute to personal Copyright © Actions Semiconductor Co., Ltd. 2006. All rights reserved. Ver 1.3 Page 2 2007-1-22 ACU7503PRODUCT DATASHEET injury or severe property damage. Any and all such uses without prior written approval of an Officer of Actions and further testing and/or modification will be fully at the risk of the customer. Copies of this document and/or other Actions product literature, as well as the Terms and Conditions of Sale Agreement, may be obtained by visiting Actions’ website at http://www.actions-semi.com/ or from an authorized Actions representative. The word “ACTIONS”, the Actions’ LOGO, whether used separately and/or in combination, and the phase “ACU7503”, are trademarks of Actions Semiconductor Company, Ltd., Names and brands of other companies and their products that may from time to time descriptively appear in this product data sheet are the trademarks of their respective holders; no affiliation, authorization, or endorsement by such persons is claimed or implied except as may be expressly stated therein. ACTIONS DISCLAIMS AND EXCLUDES ANY AND ALL WARRANTIES, INCLUDING WITHOUT LIMITATION ANY AND ALL IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, TITLE, AND AGAINST INFRINGEMENT AND THE LIKE, AND ANY AND ALL WARRANTIES ARISING FROM ANY COURSE OF DEALING OR USAGE OF TRADE. IN NO EVENT SHALL ACTIONS BE RELIABLE FOR ANY DIRECT, INCIDENTAL, INDIRECT, SPECIAL, PUNITIVE, OR CONSEQUENTIAL DAMAGES; OR FOR LOST DATA, PROFITS, SAVINGS OR REVENUES OF ANY KIND; REGARDLESS OF THE FORM OF ACTION, WHETHER BASED ON CONTRACT; TORT; NEGLIGENCE OF ACTIONS OR OTHERS; STRICT LIABILITY; BREACH OF WARRANTY; OR OTHERWISE; WHETHER OR NOT ANY REMEDY OF BUYER IS HELD TO HAVE FAILED OF ITS ESSENTIAL PURPOSE, AND WHETHER ACTIONS HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES OR NOT. Additional Support Additional product and company information can be obtained by visiting the Actions website at: http://www.actions-semi.com Copyright © Actions Semiconductor Co., Ltd. 2006. 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Ver 1.3 Page 3 2007-1-22 ACU7503PRODUCT DATASHEET Contents Declaration......................................................................................................................2 Contents ..........................................................................................................................4 1 Introduction..............................................................................................................6 2 Pin Description ........................................................................................................7 3 2.1 Pin Assignment .................................................................................................................... 7 2.2 Pin Definition ........................................................................................................................ 8 Function Description ............................................................................................ 11 3.1 Functional Block Diagram ................................................................................................11 3.2 MCU Core............................................................................................................................. 11 3.2.1 Internal RAM ..............................................................................................................12 3.2.2 Internal ROM ..............................................................................................................12 3.2.3 External RAM/ROM Access......................................................................................12 3.3 DSP Core .............................................................................................................................12 3.4 Clock Management Unit (CMU)........................................................................................13 3.4.1 HOSC............................................................................................................................ 13 3.5 Power Management Unit (PMU) ......................................................................................13 3.5.1 Voltage Generator......................................................................................................13 3.5.2 Voltage monitor..........................................................................................................13 3.5.3 External Power Supply Controller............................................................................14 3.6 DMA Controller ................................................................................................................... 14 3.7 GPIO and Multifunction Configuration............................................................................14 3.8 USB 2.0 SIE ......................................................................................................................... 14 3.8.1 Features ......................................................................................................................15 3.8.2 USB Using Memory....................................................................................................15 3.9 Nand Flash and SMC Controller.......................................................................................15 3.10 Key Scan Interface.............................................................................................................16 Copyright © Actions Semiconductor Co., Ltd. 2006. 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Ver 1.3 Page 4 2007-1-22 ACU7503PRODUCT DATASHEET 4 3.11 DAC....................................................................................................................................... 16 3.12 ADC .................................................................................................................................. 16 Electrical Characteristics......................................................................................17 4.1 Absolute Maximum Ratings ............................................................................................. 17 4.2 Capacitance ........................................................................................................................ 17 4.3 DC Characteristics.............................................................................................................. 17 4.4 AC Characteristics.............................................................................................................. 18 4.4.1 AC Test Input Waveform ...........................................................................................18 4.4.2 AC Test Output Measuring Points............................................................................18 4.4.3 Reset Parameter........................................................................................................19 4.4.4 Initialization Parameter............................................................................................19 4.4.5 GPIO Interface Parameter........................................................................................19 4.4.6 Ordinary ROM Parameter.........................................................................................20 4.4.7 External System Bus Parameter ............................................................................. 21 4.4.8 Bus Operation.............................................................................................................21 4.4.9 A/D Converter Characteristics.................................................................................22 4.4.10 Headphone Driver Characteristics Table................................................................23 4.4.11 LCM Driver Parameter .............................................................................................. 24 5 Soldering Conditions and Package Description ............................................... 25 5.1 Recommended Soldering Conditions (Lead Free) ........................................................25 5.2 Precaution against ESD for Semiconductors ................................................................25 5.3 Handling of Unused Input Pins for CMOS.......................................................................26 5.4 Status before Initialization of MOS Devices...................................................................26 5.5 ACU7503 Package Drawing.............................................................................................26 Copyright © Actions Semiconductor Co., Ltd. 2006. All rights reserved. Ver 1.3 Page 5 2007-1-22 ACU7503PRODUCT DATASHEET 1 Introduction The ACU7503 is one of the ACU750x Single-cell Series SOC which is the second generation highly-integrated digital music system solutions for devices such as audio players and photo viewers. Besides an audio decoder with a high performance DSP that has built-in RAM and ROM, the ACU7503 includes ADPCM record capabilities and USB interface for downloading and uploading. It also provides interface for flash memory, LED/ OLED/color LCD, buttons and switch inputs, headphone, microphone, and FM radio input and control. The ACU7503 has programmable architecture supporting the WMA and other digital audio standards. For storage device, it can act as a USB mass storage slave device to personal computer system. ACU7503 has low power consumption to ensure longer battery life. It has two flexible on-chip DC-DC converters using 1xAA or 1xAAA battery as power supply. And a Low Drop Regulator is also embedded to replace one of the DC-DC generating VDD when Battery is not present. The built-in Sigma-Delta (Σ-Δ) DAC includes a headphone driver to directly drive low impedance headphone(s). The ADC includes inputs for both Microphone and Analog Audio In to support voice and FM radio recording. Thus, it provides a true ‘ALL-IN-ONE’ solution that is ideally suitable for highly optimized digital multimedia players. Features ¾ ¾ ¾ ¾ ¾ ¾ ¾ ¾ ¾ ¾ ¾ ¾ ¾ Instruction set of MCU compatible with Z80 Internal SRAM access time<7ns, MROM access time<16ns Accurate Clock Management Unit, supplies 24MHz OSC Energy saving Power Management Unit, supports 1xAA, 1xAAA 2-channel DMA, 1-channel Counter/Timer Controller and Interrupt Controller Support USB 2.0 high speed, acting as mass storage device Support up to 4(pcs)*64M-4G bytes Nand type SLC/MLC Flash Built-in Key Scan Circuit and GPIOs Built-in Stereo Sigma-Delta DAC and ADC Digital voice recording at ultra low 4.4 or 8Kbps with Actions Speech Algorithm Headphone driver output 2x11mW @16ohm Support FM Radio input and 32 levels volume control Support extended low frequency crystal to generalize RTC 0.18um 1P5M CMOS process and packaged at LQFP-80(10*10mm) Copyright © Actions Semiconductor Co., Ltd. 2006. All rights reserved. Ver 1.3 Page 6 2007-1-22 ACU7503PRODUCT DATASHEET 2 2.1 Pin Description Pin Assignment Copyright © Actions Semiconductor Co., Ltd. 2006. All rights reserved. Ver 1.3 Page 7 2007-1-22 ACU7503PRODUCT DATASHEET 2.2 Pin No. Pin Definition Pin Name I/O Type Driver Capacity Reset Default Short Description 1 UVCC PWR / / Power supply for USB 2 URES AO / / USB precision Resistor 3 USBGND PWR / / USB ground 4 USBDP A / H USB data plus 5 USBDM A / H USB data minus 6 USBVDD PWR / / USB power 7 PAVCC PWR / / Power supply for Power Amplifier 8 AOUTR AO / / Int. PA right channel analog output 9 AOUTL AO / / Int. PA left channel analog output 10 PAGND PWR / / Power Amplifier ground 11 VRDA AO / / Bypass capacitor connect pin for int. DAC Reference voltage 12 MICIN AI / / Microphone pre-amplifier input 13 VMIC PWR / / Power supply for Microphone 14 FMINL AI / / Left channel of FM line input 15 FMINR AI / / Right channel of FM line input 16 AGND PWR / / Analog ground 17 AVCC PWR / / Power supply of analog 18 VREFI AI / / Voltage reference input 19 AVDD PWR / / Analog core power pin 20 VDD PWR / Z Core power 21 VCC PWR / / IO power 22 LRADC1 AI / / Low resolution A/D input 1 23 VDDFB AI / / VDD feedback 24 VCC PWR / / IO power 25 HOSCI AI / / High frequency crystal OSC input 26 HOSCO AO / / High frequency crystal OSC output 27 BAT I / / Battery voltage input. GPIO_B0 BI Z Bit0 of General Purpose I/O port B KEYI0 I H Bit0 of key scan circuit input CE3- O H Chip enable 3 28 2mA Copyright © Actions Semiconductor Co., Ltd. 2006. All rights reserved. Ver 1.3 Page 8 2007-1-22 ACU7503PRODUCT DATASHEET GPIO_B2 BI Z Bit2 of General Purpose I/O port B KEYI2 I H Bit2 of key scan circuit input CE4- O H Chip enable 4. 30 LXVDD PWR / / VDD DC-DC pin 31 GND PWR / / Ground 32 NGND PWR / / NMOS ground 33 LXVCC PWR / / VCC DC-DC pin 34 CE2- O NF_PAD H Ext. memory chip enable 2 35 CE1- O NF_PAD H Ext. memory chip enable 1 CE5- O H Ext. memory chip enable 5 GPO_A3 BI / Bit3 of General Purpose Output port A GPIO_G0 BI Z Bit0 of General Purpose I/O port G MMC_CMD O / Command/Respond of SD/MMC 38 VDD PWR / / Digital core power 39 RB- I 4mA H Nand Flash Ready/Busy status input GPO_A1 O L Bit1 of General Purpose Output port A ICECK I / Clock input of DSU GPO_A2 O L Bit2 of General Purpose Output port A ICEDO O / Data output of DSU GPO_A0 O 0 Bit0 of General Purpose Output port A ICEDI I / Data input of DSU ICEEN- I 4mA / DSU enable (active low) ICERST- I 4mA / DSU reset (active low) GPIO_B4 BI Z Bit4 of General Purpose I/O port B 45 KEYO0 O / Bit0 of key scan circuit output 46 GPIO_B5 BI Z Bit5 of General Purpose I/O port B KEYO1 O / Bit1 of key scan circuit output RESET- I USCU H System reset input (active low) 48 VCC PWR / / Digital power pad 49 D7 BI NF_PAD L Bit7 of ext. memory data bus 50 D6 BI NF_PAD L Bit6 of ext. memory data bus 51 D5 BI NF_PAD L Bit5 of ext. memory data bus 52 D4 BI NF_PAD L Bit4 of ext. memory data bus 53 D3 BI NF_PAD L Bit3 of ext. memory data bus 54 D2 BI NF_PAD L Bit2 of ext. memory data bus 29 36 37 40 41 42 43 44 47 2mA 4mA 2mA 4mA 4mA 4mA 2mA 2mA Copyright © Actions Semiconductor Co., Ltd. 2006. All rights reserved. Ver 1.3 Page 9 2007-1-22 ACU7503PRODUCT DATASHEET 55 GND PWR / / Ground 56 D1 BI NF_PAD L Bit1 of ext. memory data bus 57 D0 BI NF_PAD L Bit0 of ext. memory data bus 58 MWR- O NF_PAD H Ext. memory write strobe 59 MRD- O NF_PAD H Ext. memory read strobe 60 CLE O NF_PAD L Command NandFlash 61 ALE O NF_PAD L Address latch enable for NAND flash GPIO_C1 BI OD Bit1 of General Purpose I/O port C I2C_SDA O / I2C Serial data (Open drain) SIRQ- I / Ext. interrupt request input GPIO_C0 BI OD Bit0 of General Purpose I/O port C I2C_SCL O / I2C serial clock (Open drain) VDD PWR / Digital core power 62 63 64 2mA 2mA / Latch Enable NOTE: 1 PWR----Power Supply 2 AI-----Analog Input 3 AO----Analog Output 4 O----Output 5 I----Input 6 BI----Bi-direction 7 NF_PAD----Pad of Nand Flash 8 USCU, USCL----USB SCHIMIT CU, USB SCHIMIT CL 9 Driver capacity here refers to a pin’s driving capacity in GPIO mode. Copyright © Actions Semiconductor Co., Ltd. 2006. All rights reserved. Ver 1.3 Page 10 2007-1-22 fo ACU7503PRODUCT DATASHEET 3 Function Description 3.1 Functional Block Diagram DMA BUS (Peripheral DMA DMA Controller &Arbiter path) ZRAM1 MCU USB IPM/IDM(24-bit) FLASH MCU BUS (include DMA1/2 path) NAND Chip DSP IO Register (two bank) MMC/SDC ADC DAC EM I2C PMU (Power Management Unit) Supply 3.2 Monitor CMU(Clock) GPIO Charger MCU Core ACU7503 has 126K+192 bytes on-chip SRAM and 50K bytes on-chip ROM. Copyright © Actions Semiconductor Co., Ltd. 2006. All rights reserved. Ver 1.3 Page 11 2007-1-22 ACU7503PRODUCT DATASHEET 3.2.1 Internal RAM There are three independent banks of SRAM called ZRAM1 (16KB-64B), ZRAM2 (3KB+3KB) and ZRAM3 (3KB+3KB) that can be accessed by MCU and DMA only. The internal SRAM memory mapping is as follows. 0000H 16KB Internal RAM Space (MCU.IA15=0) 16KB IPMH IPMM IPML IDMH IDMM IDML ZRAM2 ZRAM3 16KB 16KB 16KB 16KB 16KB 16KB (3+3)KB (3+3)KB 7FFFH 3.2.2 Internal ROM Of the 50KB on-chip ROM, 12KB is boot up BROM that has USB upgrade firmware built in. 3.2.3 External RAM/ROM Access The External RAM/ROM Controller is able to support up to 6 pieces of 32M*8bit SRAM/ROM. There are up to 6 chip select signals (CE1- to CE6-) for selecting 6 pieces of SRAM/ROM. At any time only one chip select signal can be controlled by the bit [5:3] of EMHIGHP register. There are three extended memory control registers, EMLOWP, EMHIGHP and EMPIORD. Note: There is no CE6- pin at all. One of the GPIOs would be used as CE6-. When accessing the memory space of CE6-, The GPIO should be pulled down before reading or writing to this memory space. 3.3 DSP Core 24-bit Harvard architecture DSP with DSU built in. Works with a memory word length of 24 bits. ACU7503 has 16K*3 bytes program memory (PM) and 16K*3 bytes data memory (DM). Memory-Mapped register includes DAC interface. Both DSP and MCU can access the Host Interface Port (HIP) registers with reading or writing operations and information can be communicated between the DSP and MCU through it. Copyright © Actions Semiconductor Co., Ltd. 2006. All rights reserved. Ver 1.3 Page 12 2007-1-22 ACU7503PRODUCT DATASHEET 3.4 Clock Management Unit (CMU) The CMU uses 24MHz Oscillator to generate clocks for DSP/USB/CTC/ADC/DAC/MCU/ DMA, etc. 3.4.1 HOSC ¾ ¾ ¾ HOSC is a high frequency clock source which: Generates clock for DSP and for serial communication interfaces such as USB Generates 22.5792MHz for sample rate 44.1K/22.05KHz/11.025KHz and 24.576MHz for audio sequence of 48 KHz. Generates high frequency clock up to 72MHz for MCU and DMA. ¾ Generates Counter/Timer Controller(CTC) 3.5 Power Management Unit (PMU) The PMU is made up of a Voltage Monitor and Voltage Generator. 3.5.1 Voltage Generator ACU7503 embeds two DC-DC converters and an LDO on chip. The output of DC-DC1 depends on the external feedback circuit, while the DC-DC2 can generate VCC which is a fixed 3.1V voltage. The power source of DC-DC1 is the AA/AAA battery while the power source of this LDO is USB host, so when the Battery is removed and being plugged on an USB host, the LDO built-in will take the place of DC-DC1 supplying VDD. VDDFB as the Voltage-feedback is fixed once the ratio of R1/R2 fixed by the external feedback circuit as show. 3.5.2 Voltage monitor Voltage monitor is used to detect the battery voltage and has it displayed on LCD. Copyright © Actions Semiconductor Co., Ltd. 2006. All rights reserved. Ver 1.3 Page 13 2007-1-22 ACU7503PRODUCT DATASHEET 3.5.3 External Power Supply Controller The Battery Charger uses the external power supply from either USB VBUS or adapter. 3.6 DMA Controller The ACU7503 series SOC has four DMA Controllers. DMA1/2 can transfer data between memory and memory, memory and I/O, I/O and I/O. DMA5 is for flash controller, DMA6 is USB DMA. Both DMA1 and DMA2 can be configured to have higher priority over the other. The DMA Controller Arbiter is embedded to prevent any conflict of transferring from happening, and let the DMA Controller with higher priority to start first and end first. 3.7 GPIO and Multifunction Configuration There are two Multi Function Modes that can be configured, including GPIO mode, KEY mode. In different mode, GPIO pins can be configured to have alternated functions. PIN No PIN NAME F1(GPIO) F2(Key) 42 GPO_A0 GPO_A0/ICEDI GPO_A0/ICEDI 40 GPO_A1 GPO_A1/ICECK GPO_A1/ICECK 41 GPO_A2 GPO_A2/ICEDO GPO_A2/ICEDO 28 GPIO_B0 KEYI0/GPIO_B0/CE3- KEYI0/GPIO_B0/CE3- 29 GPIO_B2 KEYI2/GPIO_B2/CE4- KEYI2/GPIO_B2/ 45 GPIO_B4 KEYO0/GPIO_B4 KEYO0/GPIO_B4 46 GPIO_B5 KEYO1/GPIO_B5 KEYO1/GPIO_B5/ 63 GPIO_C0 GPIO_C0 GPIO_C0 62 GPIO_C1 GPIO_C1 GPIO_C1/SIRQ- 37 GPIO_G0 GPIO_G0 GPIO_G0 3.8 USB 2.0 SIE The Actions USB2.0 device controller is fully compliant with the Universal Serial Bus 2.0 specification. This high performance USB2.0 device controller integrates USB transceiver, SIE, and provides multifarious interfaces for generic MCU, RAM, ROM and DMA controller. So it is suitable for a variety of peripherals, such as: scanners, printers, mass storage devices, and digital cameras. It is designed to be a cost-effective USB total solution. Copyright © Actions Semiconductor Co., Ltd. 2006. All rights reserved. Ver 1.3 Page 14 2007-1-22 ACU7503PRODUCT DATASHEET 3.8.1 Features ¾ ¾ ¾ ¾ ¾ ¾ ¾ ¾ Fully compliant with USB Specification 2.0 Supports USB High Speed (480Mb/s) and Full Speed (12Mb/s) Supports Control, Bulk, Isochronous and Interrupt Transfers Embedded USB high-speed Transceiver which complies with Inter UTMI Supports DMA interface (16-bit) 2KB configurable FIFO for endpoints and provides double buffer to increase throughput. Supports USB remote wake-up feature Software controlled connection to USB bus for re-enumeration 3.8.2 USB Using Memory 0000h B1+B2 (ZRAM2) 6K ZRAM 16K USB FIFO 2K 4000h 5800h 6000h 6100h 8000h IDML IDMM IDMH IPML IPMM IPMH ZRAM3 16K 16K 16K 16K 16K 16K 6K EM 32K USB FIFO 192 + 64byte =256byte FFFFh 3.9 Nand Flash and SMC Controller The Nand Flash and Smart Media Card controller uses DMA5 for transferring data between Nand Flash and Internal SRAM. Features ¾ Support up to 4 pieces of SMC/Nand Flash with 4 Chip Select pins Copyright © Actions Semiconductor Co., Ltd. 2006. All rights reserved. Ver 1.3 Page 15 2007-1-22 ACU7503PRODUCT DATASHEET ¾ ¾ ¾ ¾ ¾ ¾ ¾ ¾ Support Reed Solomon ECC & Hamming ECC Command and address control state machine Reading and writing timing generator ECC accelerator (Reed-Solomon & Hamming) Sense R/B# status Comply with “Smart Media Software Algorithm Guidelines” Bad block detection and replacement Both SLC and MLC flash are supported 3.10 Key Scan Interface The key scan circuit’s pins are composed of KEYI[0,2,] and KEYO[0,1,]. The maximum key matrix is 2*2. When the key scan circuit is enabled, KEYI[x]’s logical level is high, while KEYO[x]’s logical level is low. If any key is pressed which pulls the corresponding KEYI[x]’s logical level to low, KEYO[x] will output a series of scanning waves. In case that key interrupt is enabled, an interrupt will occur after the 12 key data have been stored in KEYSCANDAT (Reg: 0C0H). 3.11 DAC The internal DAC is an on-chip Sigma-Delta Modulator and the DAC interface support 4-level play back FIFO (8 X 20-bit PCM data) for L/R channel and variable sample rates. Internal DAC can drive earphone application. Note: the pin PAVCC needs a bypass capacitor of about 100uF to eliminate the “PENG” sound when DAC is powered on or off. 3.12 ADC The audio A/D is an 18 bits sigma delta Analog-to-Digital Converter; it can work in a 16 bit or 18 bit mode. Its input source can be selected from MIC amplifier or line-in sources. Copyright © Actions Semiconductor Co., Ltd. 2006. All rights reserved. Ver 1.3 Page 16 2007-1-22 ACU7503PRODUCT DATASHEET 4 Electrical Characteristics 4.1 Absolute Maximum Ratings Parameter Supply voltage Input voltage Storage temperature Symbol Typical Rating Unit VDD 1.8 +10% V VCC 3.1 +10% V VIH 2.4 +10% V VIL 1.0 +10% V -65~150 ℃ Tstg Note: 1. TO = 25℃（Operating Temperature） 2. Do not short-circuit two or more output pins simultaneously. 3. Even if one of the above parameters exceeds the absolute maximum ratings momentarily, the quality of the product may be degraded. The absolute maximum ratings, therefore, specify at which point the product may be physically damaged. Use the product well within these ratings. 4. The specifications and conditions shown in the DC and AC characteristics are the ranges for normal operation and quality assurance of the product. 4.2 Capacitance Parameter Symbol Condition MIN Input capacitance CI I/O capacitance CIO fC = 1 MHz Unmeasured pins returned to 0V MAX Unit 15 pF 15 pF Note: TO = 25℃, VCC = 0 V. 4.3 Parameter DC Characteristics Symbol High-level output voltage VOH Condition MIN. IOH = -2 mA 2.4 TYP. MAX. V Copyright © Actions Semiconductor Co., Ltd. 2006. All rights reserved. Ver 1.3 Page 17 Unit 2007-1-22 ACU7503PRODUCT DATASHEET Low-level voltage output VOL IOL = 2 mA 0.4 V High-level input voltage VIH 0.6VCC VCC+0.6 V Low-level input voltage VIL -0.3 0.4VCC V Input leakage current ILI VCC = 3.1V, VI = VCC, 0 V +10 uA Output leakage current ILO VCC = 3.1 V, VI = VCC, 0 V +5 uA Idrive1 GPOA0,GPOA1,GPOA2 GPIO Drive Supply Current （One battery mode） 4 mA Idrive2 GPIO_B2, GPIO_B4, GPIO_B5 10 mA Idrive3 Other GPIO 2 mA In Full speed mode 12 15 mA In Standby mode 50 60 uA In Full speed mode 0.2 0.5 mA In Standby mode 73 76 uA IVDD IVCC NOTES: 1. To = -10 to +70℃, VDD = 1.8, VCC = 3.1 V 2. IVDD is a total power supply current for the 1.8V power supply. IVDD is applied to the LOGIC and PLL and OSC block. 3. IVCC is a total power supply current for the 3.1 V power supply. IVCC is applied to the USB, IO, TP, and AD block. 4.4 AC Characteristics To = -10 to +70℃ 4.4.1 AC Test Input Waveform 4.4.2 AC Test Output Measuring Points Copyright © Actions Semiconductor Co., Ltd. 2006. All rights reserved. Ver 1.3 Page 18 2007-1-22 ACU7503PRODUCT DATASHEET 4.4.3 Reset Parameter Parameter Symbol Condition MIN. Reset input low-level width tWRSL RESET# pin 160 MAX. Unit us 4.4.4 Initialization Parameter Parameter Symbol Condition MIN. MAX. Unit Data sampling time(from RESET# ) tSS tOD 61.04 us Output delay time (from RESET# ) 61.04 us 4.4.5 GPIO Interface Parameter Parameter Symbol tGPIN GPIO input rise time tGPRISE GPIO input fall time tGPFALL Output level width tGPOUT Condition Input level width MIN. MAX. 11/fMCUCLK Normal operation Unit s 200 ns 200 ns s 11/ fMCUCLK Note: fMCUCLK is the frequency that MCU is running upon. Input level width Copyright © Actions Semiconductor Co., Ltd. 2006. All rights reserved. Ver 1.3 Page 19 2007-1-22 ACU7503PRODUCT DATASHEET Input rise/fall time Output level width 4.4.6 Ordinary ROM Parameter Parameter Symbol Condition MIN. MAX. Unit Data access time (from address)Note tACC HOSC=24MHz 102 ns Data access time (from CEx# )Note tCE HOSC=24MHz 82 ns Data input setup time tDS HOSC=24MHz 0 ns Data input hold time tDH HOSC=24MHz 0 ns Copyright © Actions Semiconductor Co., Ltd. 2006. All rights reserved. Ver 1.3 Page 20 2007-1-22 ACU7503PRODUCT DATASHEET 4.4.7 External System Bus Parameter Parameter Symbol Condition MIN. MAX. Unit Memory Read 25 tXAS Memory Write 10 tXAS Address hold time (from command signal)Note 1, 2 tXAH 5 Data output setup time (to command signal)Note 1 tWXDS 20 Data output hold time(from command signal)Note 1 tWXDH 10 Data input setup time (to command signal)Note 1 20 tRXDS Data input hold time (from command signal)Note 1 tRXDH 10 Address setup time (to command signal)Note 1, 2 ns ns ns ns ns ns ns Notes: 1. MRD# and MWR# are called the command signals for the External System Bus Interface. 2. T (ns) = 1/ fMCUCLK 4.4.8 Bus Operation Memory Read Timing Copyright © Actions Semiconductor Co., Ltd. 2006. All rights reserved. Ver 1.3 Page 21 2007-1-22 ACU7503PRODUCT DATASHEET Memory Write Timing 4.4.9 A/D Converter Characteristics (TA = -10 - +70℃, VDD = 1.8V, VCC = 3.1V, Sample Rate=32KHz) Characteristics Min Dynamic range Typ. Max Unit 80 Total Harmonic Distortion + Noise dB 76 dB Frequency Response Fluctuation (20-13KHz) Full Scale Input Voltage(Gain=0dB) ±0.3 2 dB VPP Copyright © Actions Semiconductor Co., Ltd. 2006. All rights reserved. Ver 1.3 Page 22 2007-1-22 ACU7503PRODUCT DATASHEET 4.4.10 Headphone Driver Characteristics Table (To =-10 - +70℃, VDD = 1.8V, VCC = 3.1 V, Sample Rate=32KHz, Volume Level=0x1F) Characteristics Min Dynamic Range Typ –60 dBFS Input Max Unit 90 Total Harmonic Distortion + Noise dB 81 dB Frequency Response Fluctuation 20-20KHz dB ±0.1 Output Common Mode Voltage 1.5 V Full Scale Output Voltage 1.1 VPP Inter-channel Isolation (1KHz) 94 dB Frequency Response Diagram of Headphone Driver A u d io P r e c is io n A C U 7 5 0 3 P A F re q u e n c y R e s p o n s e @ 1 V p p I n p u t,1 6 o h m s L o a d 0 6 /2 7 /0 6 1 1 :2 0 :3 4 -0 -1 -2 -3 d B r A -4 -5 -6 -7 -8 -9 -1 0 20 50 100 200 500 1k 2k 5k 10k 20k H z S w ee p T ra c e C o lo r L i n e S ty l e T h ic k D a ta A xis 1 1 1 2 Y e llo w R ed S o lid S o lid 1 1 A n l r .L e v e l A A n l r .L e v e l B L e ft L e ft C o m m e nt R e q u i r e s D S P . A n a l o g A n a l y z e r i n p u t i s A - D c o n v e r te d a n d a n a l y z e d w i th th e F F T D i g i ta l a n a l y z e r . S i g n a l s o u r c e m a y b e G e n e r a to r o r e x te r n a l . C l i c k " S w e e p S p e c tr u m /W a v e fo r m " s w a p b u tto n to s w i tc h b e tw e e n fr e q u e n c y a n d ti m e d i s p l a y s . A - A F F T .a t2 7 THD + N Amplitude Diagram of Headphone Driver: A u d io P r e c is io n A C U 7 5 0 3 P A T H D + N v s A m p litu d e @ 1 6 o h m s L o a d 0 6 /2 7 /0 6 1 1 :1 5 :2 6 + 0 -1 0 -2 0 -3 0 -4 0 d B -5 0 -6 0 -7 0 -8 0 -9 0 -1 0 0 0 2 0 0 m 4 0 0 m 6 0 0 m 8 0 0 m 1 1 .2 1 .4 V p p S w e e p T ra c e C o lo r L in e S ty le T h ic k D a ta 1 1 1 2 Y e llo w R e d S o lid S o lid 1 1 A n l r .T H D + N A n l r .T H D + N A xis R a tio R a tio C o m m e n t L e ft L e ft R e q u i r e s D S P . A n a l o g A n a l y z e r i n p u t i s A - D c o n v e r te d a n d a n a l y z e d w i th th e F F T D i g i ta l a n a l y z e r . S i g n a l s o u r c e m a y b e G e n e r a to r o r e x te r n a l . C l i c k " S w e e p S p e c tr u m /W a v e fo r m " s w a p b u tto n to s w i tc h b e tw e e n fr e q u e n c y a n d ti m e d i s p l a y s . A - A F F T .a t2 7 Copyright © Actions Semiconductor Co., Ltd. 2006. All rights reserved. Ver 1.3 Page 23 2007-1-22 ACU7503PRODUCT DATASHEET 4.4.11 LCM Driver Parameter Parameter Symbol Condition Typ Unit Data access time(write) tPW80(W) HOSC=24MHZ 29 ns Data access time (Read) tPW80(R) HOSC=24MHZ 67 ns Write cycle time tCY80(W) HOSC=24MHZ 407 ns Read cycle time tCY80(R) HOSC=24MHZ 284 ns Data setup time tDS80 HOSC=24MHZ 79 ns Data hold time tDH80 HOSC=24MHZ 8 ns Address setup time tAS80 HOSC=24MHZ 11 ns Address hold time tAH80 HOSC=24MHZ 11 ns Read access time tACC80 HOSC=24MHZ 13 ns Data input hold time tOD80 HOSC=24MHZ 8 ns Copyright © Actions Semiconductor Co., Ltd. 2006. All rights reserved. Ver 1.3 Page 24 2007-1-22 ACU7503PRODUCT DATASHEET 5 5.1 Soldering Conditions and Package Description Recommended Soldering Conditions (Lead Free) Soldering Conditions for Surface-Mount Devices Soldering Process Soldering Conditions Peak package’s surface temperature: 260℃ Reflow time: 60 seconds or less (217℃ or more) Infrared ray reflow Maximum allowable number of reflow processes: 2 Exposure limit: 1 days at Rh=60%, Tem=30℃ (12 hours of pre-baking is required at 125℃ afterward). Partial heating method Terminal temperature: 300℃ or less Heat time: 3 seconds or less (for one side of a device) Note: Maximum number of days during which the product can be stored at a temperature of 25℃ and a relative humidity of 65% or less after dry-pack package is opened. Caution: Do not apply two or more different soldering methods to one chip (except for partial heating method for terminal sections). 5.2 Precaution against ESD for Semiconductors Strong electric field, when exposed to a MOS device, can cause destruction of the gate oxide and ultimately degrade the device operation. Steps must be taken to stop generation of static electricity as much as possible, and quickly dissipate it once that has occurred. Environmental control must be adequate. When it is dry, a humidifier should be used. It is recommended to avoid using insulators that easily build static electricity. Semiconductor devices must be stored and transported in an anti-static container, static shielding bag or conductive material. All test and measurement tools including work bench and floor should be grounded. The operator should be grounded using wrist strap. Semiconductor devices must not be touched with bare hands. Similar precautions need to be taken for PW boards with semiconductor devices on it. Copyright © Actions Semiconductor Co., Ltd. 2006. All rights reserved. Ver 1.3 Page 25 2007-1-22 ACU7503PRODUCT DATASHEET 5.3 Handling of Unused Input Pins for CMOS No connection for CMOS device inputs can be the cause of a malfunction. If no connection is provided to the input pins, it is possible that an internal input level may be generated due to noise, etc., hence causing malfunction. CMOS devices behave differently than Bipolar or NMOS devices. Input levels of CMOS devices must be fixed high or low by using a pull-up or pull-down circuitry. Each unused pin should be connected to a VDD or GND with a resistor if it is considered to have the possibility of being an output pin. All handling related to the unused pins must be judged device by device using the related specifications governing the devices. 5.4 Status before Initialization of MOS Devices Power-on does not necessarily define initial status of MOS device. Production process of MOS does not define the initial operation status of the device. Immediately after the power source is turned ON, the devices with reset function have not yet been initialized. Hence, power-on does not guarantee out-pin levels, I/O settings or contents of registers. Device is not initialized until the reset signal is received. Reset operations must be executed immediately after power-on. 5.5 ACU7503 Package Drawing Copyright © Actions Semiconductor Co., Ltd. 2006. All rights reserved. Ver 1.3 Page 26 2007-1-22 ACU7503PRODUCT DATASHEET Copyright © Actions Semiconductor Co., Ltd. 2006. All rights reserved. Ver 1.3 Page 27 2007-1-22 ACU7503PRODUCT DATASHEET Actions Semiconductor Co., Ltd. Address: Bldg.15-1, NO.1, HIT Rd., Tangjia, Zhuhai, Guangdong, China Tel: +86-756-3392353 Fax: +86-756-3392251 Post code: 519085 http://www.actions-semi.com Business Email: [email protected] Technical Service Email: [email protected] Copyright © Actions Semiconductor Co., Ltd. 2006. All rights reserved. Ver 1.3 Page 28 2007-1-22