SEMICONDUCTOR TECHNICAL DATA The MC10123 consists of three NOR gates designed for bus driving applications on card or between cards. Output low logic levels are specified with VOL = –2.1 Vdc so that the bus may be terminated to –2.0 Vdc. The gate output, when low, appears as a high impedance to the bus, because the output emitter– followers of the MC10123 are “turned–off.” This eliminates discontinuities in the characteristic impedance of the bus. The VOH level is specified when driving a 25–ohm load terminated to –2.0 Vdc, the equivalent of a 50–ohm bus terminated at both ends. Although 25 ohms is the lowest characteristic impedance that can be driven by the MC10123, higher impedance values may be used with this part. A typical 50–ohm bus is shown in Figure 1. L SUFFIX CERAMIC PACKAGE CASE 620–10 P SUFFIX PLASTIC PACKAGE CASE 648–08 PD = 310 mW typ/pkg (No Load) tpd = 3.0 ns typ tr, tf = 2.5 ns typ (20%–80%) FN SUFFIX PLCC CASE 775–02 LOGIC DIAGRAM 4 5 DIP PIN ASSIGNMENT 3 6 7 9 10 11 2 12 13 14 15 VCC1 = PIN 1 VCC2 = PIN 16 VEE = PIN 8 VCC1 1 16 VCC2 BOUT 2 15 COUT AOUT 3 14 CIN AIN 4 13 CIN AIN 5 12 CIN AIN 6 11 BIN AIN 7 10 BIN VEE 8 9 BIN FIGURE 1 — 50–OHM BUS DRIVER (TYPICAL APPLICATION) 1/3 MC10123 1/3 MC10123 Pin assignment is for Dual–in–Line Package. For PLCC pin assignment, see the Pin Conversion Tables on page 6–11 of the Motorola MECL Data Book (DL122/D). 1/3 MC10123 ZO = 50 Ω 50 Ω –2.0 VDC 50 Ω RECEIVERS (MECL GATES) –2.0 VDC 3/93 Motorola, Inc. 1996 3–78 REV 5 MC10123 ELECTRICAL CHARACTERISTICS Test Limits Characteristic Power Supply Drain Current Input Current Symbol Pin Pi Under Test IE 8 82 IinH 4 350 IinL 4 VOH 3 –1.060 –0.890 –0.960 –0.810 –0.890 –0.700 Vdc –2.030 –2.100 –2.030 –2.100 –2.030 Vdc –30°C Min +25°C Max Min +85°C Max Unit 75 82 mAdc 220 220 µAdc Typ Max 71 Min µAdc 0.5 Output Voltage Logic 1 Output Voltage Logic 0 VOL 3 –2.100 Threshold Voltage Logic 1 VOHA 3 –1.080 Threshold Voltage Logic 0 VOLA 3 t4+3– t4–3+ 3 3 1.2 1.2 4.6 4.6 1.2 1.2 3.0 3.0 4.4 4.4 1.2 1.2 4.8 4.8 Switching Times –0.980 –0.910 –2.100 Vdc –2.100 –2.100 (50Ω Load) Propagation Delay Vdc ns Rise Time (20 to 80%) t3+ 3 1.0 3.7 1.0 2.5 3.5 1.0 3.9 Fall Time (20 to 80%) t3– 3 1.0 3.7 1.0 2.5 3.5 1.0 3.9 ELECTRICAL CHARACTERISTICS (continued) TEST VOLTAGE VALUES (Volts) Characteristic Power Supply Drain Current Input Current @ Test Temperature VIHmax VILmin VIHAmin VILAmax VEE –30°C –0.890 –1.890 –1.205 –1.500 –5.2 +25°C –0.810 –1.850 –1.105 –1.475 –5.2 +85°C –0.700 –1.825 –1.035 –1.440 –5.2 Symbol Pin Under Test IE 8 4,5,6,7,9 10,11,12 13,14 IinH 4 4 IinL 4 Output Voltage Logic 1 VOH 3 Output Voltage Logic 0 VOL 3 Threshold Voltage Logic 1 VOHA 3 Logic 0 VOLA 3 Threshold Voltage Switching Times TEST VOLTAGE APPLIED TO PINS LISTED BELOW VIHmax Rise Time (20 to 80%) Fall Time (20 to 80%) VEE (VCC) Gnd 8 1, 16 8 1, 16 8 1, 16 8 1, 16 8 1, 16 4,5,6,7 8 1, 16 8 1, 16 Pulse In Pulse Out –3.2 V +2.0 V VIHAmin VILAmax 4 4,5,6,7 9,12 9,12 (50Ω Load) Propagation Delay VILmin 4,5,6,7 t4+3– t4–3+ 3 3 4 4 3 3 8 8 1, 16 1, 16 t3+ 3 4 3 8 1, 16 t3– 3 4 3 8 1, 16 Each MECL 10,000 series circuit has been designed to meet the dc specifications shown in the test table, after thermal equilibrium has been established. The circuit is in a test socket or mounted on a printed circuit board and transverse air flow greater than 500 linear fpm is maintained. Outputs are terminated through a 50-ohm resistor to –2.0 volts. Test procedures are shown for only one gate. The other gates are tested in the same manner. MECL Data DL122 — Rev 6 3–79 MOTOROLA MC10123 OUTLINE DIMENSIONS FN SUFFIX PLASTIC PLCC PACKAGE CASE 775–02 ISSUE C 0.007 (0.180) M T L–M B Y BRK –N– U N S 0.007 (0.180) M T L–M S S N S D –L– –M– Z W 20 D 1 V 0.010 (0.250) G1 X S T L–M N S S VIEW D–D A 0.007 (0.180) M T L–M S N S R 0.007 (0.180) M T L–M S N S Z C H –T– SEATING PLANE F VIEW S G1 0.010 (0.250) S T L–M S 0.007 (0.180) M T L–M S N S VIEW S S N S NOTES: 1. DATUMS –L–, –M–, AND –N– DETERMINED WHERE TOP OF LEAD SHOULDER EXITS PLASTIC BODY AT MOLD PARTING LINE. 2. DIMENSION G1, TRUE POSITION TO BE MEASURED AT DATUM –T–, SEATING PLANE. 3. DIMENSIONS R AND U DO NOT INCLUDE MOLD FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250) PER SIDE. 4. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 5. CONTROLLING DIMENSION: INCH. 6. THE PACKAGE TOP MAY BE SMALLER THAN THE PACKAGE BOTTOM BY UP TO 0.012 (0.300). DIMENSIONS R AND U ARE DETERMINED AT THE OUTERMOST EXTREMES OF THE PLASTIC BODY EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS, GATE BURRS AND INTERLEAD FLASH, BUT INCLUDING ANY MISMATCH BETWEEN THE TOP AND BOTTOM OF THE PLASTIC BODY. 7. DIMENSION H DOES NOT INCLUDE DAMBAR PROTRUSION OR INTRUSION. THE DAMBAR PROTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE GREATER THAN 0.037 (0.940). THE DAMBAR INTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE SMALLER THAN 0.025 (0.635). MOTOROLA N K 0.004 (0.100) J S K1 E G 0.007 (0.180) M T L–M 3–80 DIM A B C E F G H J K R U V W X Y Z G1 K1 INCHES MIN MAX 0.385 0.395 0.385 0.395 0.165 0.180 0.090 0.110 0.013 0.019 0.050 BSC 0.026 0.032 0.020 ––– 0.025 ––– 0.350 0.356 0.350 0.356 0.042 0.048 0.042 0.048 0.042 0.056 ––– 0.020 2_ 10 _ 0.310 0.330 0.040 ––– MILLIMETERS MIN MAX 9.78 10.03 9.78 10.03 4.20 4.57 2.29 2.79 0.33 0.48 1.27 BSC 0.66 0.81 0.51 ––– 0.64 ––– 8.89 9.04 8.89 9.04 1.07 1.21 1.07 1.21 1.07 1.42 ––– 0.50 2_ 10 _ 7.88 8.38 1.02 ––– MECL Data DL122 — Rev 6 MC10123 OUTLINE DIMENSIONS L SUFFIX CERAMIC DIP PACKAGE CASE 620–10 ISSUE V –A– 16 9 1 8 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEAD WHEN FORMED PARALLEL. 4. DIMENSION F MAY NARROW TO 0.76 (0.030) WHERE THE LEAD ENTERS THE CERAMIC BODY. –B– C L DIM A B C D E F G H K L M N –T– K N SEATING PLANE M E F J G D 16 PL 0.25 (0.010) 16 PL 0.25 (0.010) M T A T B M –A– 9 1 8 B F C L S –T– SEATING PLANE K H G D M J 16 PL 0.25 (0.010) M MILLIMETERS MIN MAX 19.05 19.93 6.10 7.49 ––– 5.08 0.39 0.50 1.27 BSC 1.40 1.65 2.54 BSC 0.21 0.38 3.18 4.31 7.62 BSC 0_ 15 _ 0.51 1.01 S P SUFFIX PLASTIC DIP PACKAGE CASE 648–08 ISSUE R 16 S INCHES MIN MAX 0.750 0.785 0.240 0.295 ––– 0.200 0.015 0.020 0.050 BSC 0.055 0.065 0.100 BSC 0.008 0.015 0.125 0.170 0.300 BSC 0_ 15 _ 0.020 0.040 T A M NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL. 4. DIMENSION B DOES NOT INCLUDE MOLD FLASH. 5. ROUNDED CORNERS OPTIONAL. DIM A B C D F G H J K L M S INCHES MIN MAX 0.740 0.770 0.250 0.270 0.145 0.175 0.015 0.021 0.040 0.70 0.100 BSC 0.050 BSC 0.008 0.015 0.110 0.130 0.295 0.305 0_ 10 _ 0.020 0.040 MILLIMETERS MIN MAX 18.80 19.55 6.35 6.85 3.69 4.44 0.39 0.53 1.02 1.77 2.54 BSC 1.27 BSC 0.21 0.38 2.80 3.30 7.50 7.74 0_ 10 _ 0.51 1.01 Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters which may be provided in Motorola data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. Motorola does not convey any license under its patent rights nor the rights of others. Motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injury or death may occur. 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Box 5405, Denver, Colorado 80217. 303–675–2140 or 1–800–441–2447 JAPAN: Nippon Motorola Ltd.; Tatsumi–SPD–JLDC, 6F Seibu–Butsuryu–Center, 3–14–2 Tatsumi Koto–Ku, Tokyo 135, Japan. 81–3–3521–8315 Mfax: [email protected] – TOUCHTONE 602–244–6609 INTERNET: http://Design–NET.com ASIA/PACIFIC: Motorola Semiconductors H.K. Ltd.; 8B Tai Ping Industrial Park, 51 Ting Kok Road, Tai Po, N.T., Hong Kong. 852–26629298 ◊ MECL Data DL122 — Rev 6 3–81 MC10123/D MOTOROLA