SEMICONDUCTOR TECHNICAL DATA The MC10H161 provides parallel decoding of a three bit binary word to one of eight lines. The MC10H161 is useful in high–speed multiplexer/demultiplexer applications. The MC10H161 is designed to decode a three bit input word to one of eight output lines. The MC10H161 output will be low when selected while all other output are high. The enable inputs, when either or both are high, force all outputs high. The MC10H161 is a true parallel decoder. This eliminates unequal parallel path delay times found in other decoder designs. These devices are ideally suited for multiplexer/demultiplexer applications. • Propagation Delay, 1.0 ns Typical • Power Dissipation, 315 mW Typical (same as MECL 10K) • Improved Noise Margin 150 mV (Over Operating Voltage and Temperature Range) • Voltage Compensated • MECL 10K–Compatible L SUFFIX CERAMIC PACKAGE CASE 620–10 P SUFFIX PLASTIC PACKAGE CASE 648–08 FN SUFFIX PLCC CASE 775–02 LOGIC DIAGRAM E0 2 E1 15 6 Q0 VCC1 = Pin 1 VCC2 = Pin 16 VEE = Pin 8 5 Q1 4 Q2 A 7 3 Q3 MAXIMUM RATINGS 13 Q4 Characteristic Symbol Rating Unit VEE VI –8.0 to 0 Vdc 12 Q5 11 Q6 Power Supply (VCC = 0) Input Voltage (VCC = 0) 0 to VEE Vdc Output Current — Continuous — Surge Iout 50 100 mA Operating Temperature Range TA Tstg 0 to +75 °C –55 to +150 –55 to +165 °C °C Storage Temperature Range — Plastic — Ceramic ELECTRICAL CHARACTERISTICS (VEE = –5.2 V ±5%) (See Note) 0° 25° 75° Characteristic Symbol Min Max Min Max Min Max Unit Power Supply Current IE — 84 — 76 — 84 mA IinH IinL — 465 — 275 — 275 µA 0.5 — 0.5 — 0.3 Input Current High Input Current Low High Output Voltage Low Output Voltage High Input Voltage Low Input Voltage — µA –0.735 Vdc –1.95 –1.63 –1.95 –1.63 –1.95 –1.60 Vdc –1.17 –0.84 –1.13 –0.81 –1.07 –0.735 Vdc VOH VOL –1.02 –0.84 –0.98 –0.81 –0.92 VIH VIL –1.95 –1.48 –1.95 –1.48 –1.95 –1.45 B 9 C 14 TRUTH TABLE ENABLE INPUTS E1 E0 L L L L L L L L L L L L L L L L H X X H Rise Time Fall Time tpd Vdc tr tf ns 0.6 0.8 2.0 2.3 0.65 0.8 2.1 2.4 0.7 0.9 2.2 2.5 0.55 1.7 0.65 1.8 0.7 1.9 0.55 1.7 0.65 1.8 0.7 1.9 ns ns NOTE: Each MECL 10H series circuit has been designed to meet the dc specifications shown in the test table, after thermal equilibrium has been established. The circuit is in a test socket or mounted on a printed circuit board and transverse air flow greater than 500 Iinear fpm is maintained. Outputs are terminated through a 50–ohm resistor to –2.0 volts. 2–249 Q6 H H H H H H L H H H Q7 H H H H H H H L H H VCC1 E0 1 16 2 15 VCC2 E1 Q3 3 14 C Q2 4 13 Q4 Q1 5 12 Q0 6 11 Q5 Q6 A 7 10 Q7 VEE 8 9 B Pin assignment is for Dual–in–Line Package. For PLCC pin assignment, see the Pin Conversion Tables on page 6–11 of the Motorola MECL Data Book (DL122/D). 3/93 Motorola, Inc. 1996 INPUTS OUTPUTS C B A Q0 Q1 Q2 Q3 Q4 Q5 L L L L H H H H H L L H H L H H H H L H L H H L H H H L H H H H H L H H H L L H H H H L H H L H H H H H H L H H L H H H H H H H H H H H H H H H X X X H H H H H H X X X H H H H H H DIP PIN ASSIGNMENT AC PARAMETERS Propagation Delay Data Enable 10 Q7 REV 5 MC10H161 TYPICAL APPLICATIONS FIGURE 1 — HIGH SPEED 16–BIT MULTIPLEXER/DEMULTIPLEXER Control Selection 15 14 13 12 11 10 9 8 S0 S1 CR A 7 6 5 4 3 2 1 0 MC10H136 B C D E1 C B A MC10H164 E1 C B A MC10H161 D0 E1 C B A MC10H164 E1 C B A MC10H161 D0 S0 S0 S1 S1 CR A CR MC10H136 B C D Start/Stop E0 15 14 1312 11 10 9 8 E0 7 6 5 4 3 2 1 0 FIGURE 2 — 1–OF–64 LINE MULTIPLEXER E A B C MC10H164 E A B C MC10H164 E MSB MC10H161 9 7 LSB Q7 Q6 Q5 Q4 Q3 Q2 Q1 Q0 E The Bit chosen is dependent on six–bit code present on inputs 7, 9, 14 of the MC10H161 and the A, B, C inputs of the MC10H164. Dout A B C MC10H164 MOTOROLA Dout A B C MC10H164 E Dout A B C MC10H164 E Dout A B C MC10H164 E Dout A B C MC10H164 E Dout A B C MC10H164 14 Dout 2–250 Dout MECL Data DL122 — Rev 6 MC10H161 OUTLINE DIMENSIONS FN SUFFIX PLASTIC PLCC PACKAGE CASE 775–02 ISSUE C 0.007 (0.180) M T L–M B Y BRK –N– U N S 0.007 (0.180) M T L–M S S N S D –L– –M– Z W 20 D 1 V 0.010 (0.250) G1 X S T L–M S N S VIEW D–D A 0.007 (0.180) M T L–M S N S R 0.007 (0.180) M T L–M S N S Z C H –T– SEATING PLANE F VIEW S G1 0.010 (0.250) S T L–M S 0.007 (0.180) M T L–M S N S VIEW S S N S NOTES: 1. DATUMS –L–, –M–, AND –N– DETERMINED WHERE TOP OF LEAD SHOULDER EXITS PLASTIC BODY AT MOLD PARTING LINE. 2. DIMENSION G1, TRUE POSITION TO BE MEASURED AT DATUM –T–, SEATING PLANE. 3. DIMENSIONS R AND U DO NOT INCLUDE MOLD FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250) PER SIDE. 4. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 5. CONTROLLING DIMENSION: INCH. 6. THE PACKAGE TOP MAY BE SMALLER THAN THE PACKAGE BOTTOM BY UP TO 0.012 (0.300). DIMENSIONS R AND U ARE DETERMINED AT THE OUTERMOST EXTREMES OF THE PLASTIC BODY EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS, GATE BURRS AND INTERLEAD FLASH, BUT INCLUDING ANY MISMATCH BETWEEN THE TOP AND BOTTOM OF THE PLASTIC BODY. 7. DIMENSION H DOES NOT INCLUDE DAMBAR PROTRUSION OR INTRUSION. THE DAMBAR PROTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE GREATER THAN 0.037 (0.940). THE DAMBAR INTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE SMALLER THAN 0.025 (0.635). MECL Data DL122 — Rev 6 N K 0.004 (0.100) J S K1 E G 0.007 (0.180) M T L–M 2–251 DIM A B C E F G H J K R U V W X Y Z G1 K1 INCHES MIN MAX 0.385 0.395 0.385 0.395 0.165 0.180 0.090 0.110 0.013 0.019 0.050 BSC 0.026 0.032 0.020 ––– 0.025 ––– 0.350 0.356 0.350 0.356 0.042 0.048 0.042 0.048 0.042 0.056 ––– 0.020 2_ 10 _ 0.310 0.330 0.040 ––– MILLIMETERS MIN MAX 9.78 10.03 9.78 10.03 4.20 4.57 2.29 2.79 0.33 0.48 1.27 BSC 0.66 0.81 0.51 ––– 0.64 ––– 8.89 9.04 8.89 9.04 1.07 1.21 1.07 1.21 1.07 1.42 ––– 0.50 2_ 10 _ 7.88 8.38 1.02 ––– MOTOROLA MC10H161 OUTLINE DIMENSIONS L SUFFIX CERAMIC DIP PACKAGE CASE 620–10 ISSUE V –A– 16 9 1 8 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEAD WHEN FORMED PARALLEL. 4. DIMENSION F MAY NARROW TO 0.76 (0.030) WHERE THE LEAD ENTERS THE CERAMIC BODY. –B– C L DIM A B C D E F G H K L M N –T– K N SEATING PLANE M E F J G D 16 PL 0.25 (0.010) 16 PL 0.25 (0.010) M T A T B M –A– 9 1 8 B F C L S –T– SEATING PLANE K H G D M J 16 PL 0.25 (0.010) M MILLIMETERS MIN MAX 19.05 19.93 6.10 7.49 ––– 5.08 0.39 0.50 1.27 BSC 1.40 1.65 2.54 BSC 0.21 0.38 3.18 4.31 7.62 BSC 0_ 15 _ 0.51 1.01 S P SUFFIX PLASTIC DIP PACKAGE CASE 648–08 ISSUE R 16 S INCHES MIN MAX 0.750 0.785 0.240 0.295 ––– 0.200 0.015 0.020 0.050 BSC 0.055 0.065 0.100 BSC 0.008 0.015 0.125 0.170 0.300 BSC 0_ 15 _ 0.020 0.040 T A M NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL. 4. DIMENSION B DOES NOT INCLUDE MOLD FLASH. 5. ROUNDED CORNERS OPTIONAL. DIM A B C D F G H J K L M S INCHES MIN MAX 0.740 0.770 0.250 0.270 0.145 0.175 0.015 0.021 0.040 0.70 0.100 BSC 0.050 BSC 0.008 0.015 0.110 0.130 0.295 0.305 0_ 10 _ 0.020 0.040 MILLIMETERS MIN MAX 18.80 19.55 6.35 6.85 3.69 4.44 0.39 0.53 1.02 1.77 2.54 BSC 1.27 BSC 0.21 0.38 2.80 3.30 7.50 7.74 0_ 10 _ 0.51 1.01 Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters which may be provided in Motorola data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. 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Box 5405; Denver, Colorado 80217. 1–800–441–2447 JAPAN: Nippon Motorola Ltd.; Tatsumi–SPD–JLDC, 6F Seibu–Butsuryu–Center, 3–14–2 Tatsumi Koto–Ku, Tokyo 135, Japan. 81–3–3521–8315 MFAX: [email protected] – TOUCHTONE 602–244–6609 INTERNET: http://Design–NET.com ASIA/PACIFIC: Motorola Semiconductors H.K. Ltd.; 8B Tai Ping Industrial Park, 51 Ting Kok Road, Tai Po, N.T., Hong Kong. 852–26629298 ◊ MOTOROLA 2–252 MC10H161/D MECL Data DL122 — Rev 6