MOTOROLA MC14503

SEMICONDUCTOR TECHNICAL DATA
L SUFFIX
CERAMIC
CASE 620
The MC14503B is a hex non–inverting buffer with 3–state outputs, and a
high current source and sink capability. The 3–state outputs make it useful in
common bussing applications. Two disable controls are provided. A high
level on the Disable A input causes the outputs of buffers 1 through 4 to go
into a high impedance state and a high level on the Disable B input causes
the outputs of buffers 5 and 6 to go into a high impedance state.
• 3–State Outputs
• TTL Compatible — Will Drive One TTL Load Over Full Temperature
Range
• Supply Voltage Range = 3.0 Vdc to 18 Vdc
• Two Disable Controls for Added Versatility
• Pin for Pin Replacement for MM80C97 and 340097
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MAXIMUM RATINGS* (Voltages Referenced to VSS)
Symbol
VDD
Parameter
Unit
– 0.5 to + 18.0
V
– 0.5 to VDD + 0.5
V
Input Current (DC or Transient), per Pin
± 10
mA
Iout
Output Current (DC or Transient), per Pin
± 25
mA
PD
Power Dissipation, per Package†
500
mW
Tstg
Storage Temperature
– 65 to + 150
_C
Vin, Vout
Iin
DC Supply Voltage
Value
Input or Output Voltage (DC or Transient)
TL
Lead Temperature (8–Second Soldering)
260
_C
* Maximum Ratings are those values beyond which damage to the device may occur.
†Temperature Derating:
Plastic “P and D/DW” Packages: – 7.0 mW/_C From 65_C To 125_C
Ceramic “L” Packages: – 12 mW/_C From 100_C To 125_C
CIRCUIT DIAGRAM
P SUFFIX
PLASTIC
CASE 648
D SUFFIX
SOIC
CASE 751B
ORDERING INFORMATION
MC14XXXBCP
MC14XXXBCL
MC14XXXBD
Plastic
Ceramic
SOIC
TA = – 55° to 125°C for all packages.
TRUTH TABLE
Appropriate
Disable
Input
Outn
0
0
1
0
1
X
1
High
Impedance
Inn
0
X = Don’t Care
ONE OF TWO/FOUR BUFFERS
VDD
LOGIC DIAGRAM
* INn
OUTn
DISABLE B
IN 5
* DISABLE
* INPUT
IN 6
VSS
IN 1
TO OTHER BUFFERS
IN 2
* Diode protection on all inputs (not shown)
This device contains protection circuitry to guard against damage
due to high static voltages or electric fields. However, precautions must
be taken to avoid applications of any voltage higher than maximum rated
voltages to this high-impedance circuit. For proper operation, Vin and
Vout should be constrained to the range VSS ≤ (Vin or Vout) ≤ VDD.
Unused inputs must always be tied to an appropriate logic voltage
level (e.g., either VSS or VDD). Unused outputs must be left open.
IN 3
IN 4
DISABLE A
15
12
11
14
13
2
3
4
5
6
7
10
9
OUT 5
OUT 6
OUT 1
OUT 2
OUT 3
OUT 4
1
VDD = PIN 16
VSS = PIN 8
REV 3
1/94
MC14503B
Motorola, Inc. 1995
326
MOTOROLA CMOS LOGIC DATA
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ELECTRICAL CHARACTERISTICS (Voltages Referenced to VSS)
Characteristic
Output Voltage
Vin = 0
Symbol
– 55_C
25_C
125_C
VDD
Vdc
Min
Max
Min
Typ #
Max
Min
Max
Unit
“0” Level
VOL
5.0
10
15
—
—
—
0.05
0.05
0.05
—
—
—
0
0
0
0.05
0.05
0.05
—
—
—
0.05
0.05
0.05
Vdc
“1” Level
VOH
5.0
10
15
4.95
9.95
14.95
—
—
—
4.95
9.95
14.95
5.0
10
15
—
—
—
4.95
9.95
14.95
—
—
—
Vdc
5.0
10
15
—
—
—
1.5
3.0
4.0
—
—
—
2.25
4.50
6.75
1.5
3.0
4.0
—
—
—
1.5
3.0
4.0
5.0
10
15
3.5
7.0
11
—
—
—
3.5
7.0
11
2.75
5.50
8.25
—
—
—
3.5
7.0
11
—
—
—
4.5
5.0
5.0
10
15
– 4.3
– 5.8
– 1.2
– 3.1
– 8.2
—
—
—
—
—
– 3.6
– 4.8
– 1.02
– 2.6
– 6.8
– 5.0
– 6.1
– 1.4
– 3.7
– 14.1
—
—
—
—
—
– 2.5
– 3.0
– 0.7
– 1.8
– 4.8
—
—
—
—
—
IOL
4.5
5.0
10
15
2.2
2.6
6.5
19.2
—
—
—
—
1.8
2.1
5.5
16.1
2.1
2.3
6.2
25
—
—
—
—
1.2
1.3
3.8
11.2
—
—
—
—
mAdc
Input Current
Iin
15
—
± 0.1
—
± 0.00001
± 0.1
—
± 1.0
µAdc
Input Capacitance
(Vin = 0)
Cin
—
—
—
—
5.0
7.5
—
—
pF
Quiescent Current
(Per Package)
IQ
5.0
10
15
—
—
—
1.0
2.0
4.0
—
—
—
0.002
0.004
0.006
1.0
2.0
4.0
—
—
—
30
60
120
µAdc
Total Supply Current**†
(Dynamic plus Quiescent,
Per Package)
(CL = 50 pF on all outputs)
(All outputs switching,
50% Duty Cycle)
IT
5.0
10
15
Three–State Output Leakage
Current
ITL
15
Vin = VDD
Input Voltage
“0” Level
(VO = 3.6 or 1.4 Vdc)
(VO = 7.2 or 2.8 Vdc)
(VO = 11.5 or 3.5 Vdc)
VIL
“1” Level
VIH
(VO = 1.4 or 3.6 Vdc)
(VO = 2.8 or 7.2 Vdc)
(VO = 3.5 or 11.5 Vdc)
Output Drive Current
(VOH = 2.5 Vdc)
(VOH = 2.5 Vdc)
(VOH = 4.6 Vdc)
(VOH = 9.5 Vdc)
(VOH = 13.5 Vdc)
Vdc
Vdc
IOH
Source
(VOL = 0.4 Vdc)
(VOL = 0.4 Vdc)
(VOL = 0.5 Vdc)
(VOL = 1.5 Vdc)
Sink
mAdc
IT = (2.5 µA/kHz) f + IDD
IT = (6.0 µA/kHz) f + IDD
IT = (10 µA/kHz) f + IDD
—
± 0.1
—
± 0.0001
± 0.1
µAdc
—
± 3.0
µAdc
#Data labelled “Typ” is not to be used for design purposes but is intended as an indication of the IC’s potential performance.
** The formulas given are for the typical characteristics only at 25_C.
†To calculate total supply current at loads other than 50 pF:
IT(CL) = IT(50 pF) + (CL – 50) Vfk
where: IT is in µA (per package), CL in pF, V = (VDD – VSS) in volts, f in kHz is input frequency, and k = 0.006.
MOTOROLA CMOS LOGIC DATA
MC14503B
327
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ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
SWITCHING CHARACTERISTICS* (CL = 50 pF, TA = 25_C)
Characteristic
Symbol
All Types
VDD
VCC
Typ #
Max
5.0
10
15
45
23
18
90
45
35
5.0
10
15
45
23
18
90
45
35
5.0
10
15
75
35
25
150
70
50
5.0
10
15
75
35
25
150
70
50
Unit
Output Rise Time
tTLH = (0.5 ns/pF) CL + 20 ns
tTLH = (0.3 ns/pF) CL + 8.0 ns
tTLH = (0.2 ns/pF) CL + 8.0 ns
tTLH
ns
Output Fall Time
tTHL = (0.5 ns/pF) CL + 20 ns
tTHL = (0.3 ns/pF) CL + 8.0 ns
tTHL = (0.2 ns/pF) CL + 8.0 ns
tTHL
Turn–Off Delay Time, all Outputs
tPLH = (0.3 ns/pF) CL + 60 ns
tPLH = (0.15 ns/pF) CL + 27 ns
tPLH = (0.1 ns/pF) CL + 20 ns
tPLH
Turn–On Delay Time, all Outputs
tPHL = (0.3 ns/pF) CL + 60 ns
tPHL = (0.15 ns/pF) CL + 27 ns
tPHL = (0.1 ns/pF) CL + 20 ns
tPHL
3–State Propagation Delay Time
Output “1” to High Impedance
tPHZ
5.0
10
15
75
40
35
150
80
70
ns
Output “0” to High Impedance
tPLZ
5.0
10
15
80
40
35
160
80
70
ns
High Impedance to “1” Level
tPZH
5.0
10
15
65
25
20
130
50
40
ns
High Impedance to “0” Level
tPZL
5.0
10
15
100
35
25
200
70
50
ns
ns
ns
ns
* The formulas given are for the typical characteristics only at 25_C.
#Data labelled “Typ” is not to be used for design purposes but is intended as an indication of the IC’s potential performance.
PIN ASSIGNMENT
MC14503B
328
DIS A
1
16
VDD
IN 1
2
15
DIS B
OUT 1
3
14
IN 6
IN 2
4
13
OUT 6
OUT 2
5
12
IN 5
IN 3
6
11
OUT 5
OUT 3
7
10
IN 4
VSS
8
9
OUT 4
MOTOROLA CMOS LOGIC DATA
DISABLE
INPUT
20 ns
20 ns
VDD
90%
VDD
16
50%
INPUT
INPUT
10%
tPLH
PULSE
GENERATOR
OUTPUT
VSS
90%
50%
OUTPUT
CL
VSS
tPHL
VOH
10%
VOL
tTHL
tTLH
tPLH
tPHL
Figure 1. Switching Time Test Circuit and Waveforms
(tTLH, tTHL, tPHL, and tPLH)
DISABLE INPUT
DISABLE INPUT
PULSE
GENERATOR
VDD
tPHZ, tPZH CIRCUIT
tPLZ, tPZL CIRCUIT
PULSE
GENERATOR
VDD
16
16
INPUT
OUTPUT
8
1k
VSS
INPUT
OUTPUT
CL
8
20 ns
10%
VSS
tPZL
VOH
90%
10%
≈ VOL + 0.05 V
tPHZ
OUTPUT FOR tPHZ, tPLZ CIRCUIT
CL
VDD
tPLZ
OUTPUT FOR tPZH, tPZL CIRCUIT
VSS
20 ns
90%
50%
DISABLE INPUT
1k
tPZH
≈ VOH – 0.15 V
90%
10%
VOL
Figure 2. 3–State AC Test Circuit and Waveforms
(tPLZ, tPHZ, tPZH, tPZL)
MOTOROLA CMOS LOGIC DATA
MC14503B
329
OUTLINE DIMENSIONS
L SUFFIX
CERAMIC DIP PACKAGE
CASE 620–10
ISSUE V
–A–
16
9
1
8
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMENSION F MAY NARROW TO 0.76 (0.030)
WHERE THE LEAD ENTERS THE CERAMIC
BODY.
–B–
C
L
DIM
A
B
C
D
E
F
G
H
K
L
M
N
–T–
K
N
SEATING
PLANE
M
E
F
J
G
D
16 PL
0.25 (0.010)
16 PL
0.25 (0.010)
M
T A
T B
M
S
INCHES
MIN
MAX
0.750
0.785
0.240
0.295
–––
0.200
0.015
0.020
0.050 BSC
0.055
0.065
0.100 BSC
0.008
0.015
0.125
0.170
0.300 BSC
0_
15 _
0.020
0.040
MILLIMETERS
MIN
MAX
19.05
19.93
6.10
7.49
–––
5.08
0.39
0.50
1.27 BSC
1.40
1.65
2.54 BSC
0.21
0.38
3.18
4.31
7.62 BSC
0_
15 _
0.51
1.01
S
P SUFFIX
PLASTIC DIP PACKAGE
CASE 648–08
ISSUE R
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
–A–
16
9
1
8
B
F
C
L
S
–T–
K
H
G
D
J
16 PL
0.25 (0.010)
MC14503B
330
SEATING
PLANE
M
T A
M
M
DIM
A
B
C
D
F
G
H
J
K
L
M
S
INCHES
MIN
MAX
0.740
0.770
0.250
0.270
0.145
0.175
0.015
0.021
0.040
0.70
0.100 BSC
0.050 BSC
0.008
0.015
0.110
0.130
0.295
0.305
0_
10 _
0.020
0.040
MILLIMETERS
MIN
MAX
18.80
19.55
6.35
6.85
3.69
4.44
0.39
0.53
1.02
1.77
2.54 BSC
1.27 BSC
0.21
0.38
2.80
3.30
7.50
7.74
0_
10 _
0.51
1.01
MOTOROLA CMOS LOGIC DATA
OUTLINE DIMENSIONS
D SUFFIX
PLASTIC SOIC PACKAGE
CASE 751B–05
ISSUE J
–A–
16
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
9
–B–
1
P
8 PL
0.25 (0.010)
8
M
B
S
G
R
K
F
X 45 _
C
–T–
SEATING
PLANE
M
D
16 PL
0.25 (0.010)
M
T B
S
A
S
J
DIM
A
B
C
D
F
G
J
K
M
P
R
MILLIMETERS
MIN
MAX
9.80
10.00
3.80
4.00
1.35
1.75
0.35
0.49
0.40
1.25
1.27 BSC
0.19
0.25
0.10
0.25
0_
7_
5.80
6.20
0.25
0.50
INCHES
MIN
MAX
0.386
0.393
0.150
0.157
0.054
0.068
0.014
0.019
0.016
0.049
0.050 BSC
0.008
0.009
0.004
0.009
0_
7_
0.229
0.244
0.010
0.019
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MOTOROLA CMOS LOGIC DATA
◊
*MC14503B/D*
MC14503B
MC14503B/D
331