MOTOROLA MC14043BD

SEMICONDUCTOR TECHNICAL DATA
Quad R–S Latches
The MC14043B and MC14044B quad R–S latches are constructed with
MOS P–channel and N–channel enhancement mode devices in a single
monolithic structure. Each latch has an independent Q output and set and
reset inputs. The Q outputs are gated through three–state buffers having a
common enable input. The outputs are enabled with a logical “1” or high on
the enable input; a logical “0” or low disconnects the latch from the Q
outputs, resulting in an open circuit at the Q outputs.
L SUFFIX
CERAMIC
CASE 620
P SUFFIX
PLASTIC
CASE 648
• Double Diode Input Protection
• Three–State Outputs with Common Enable
• Outputs Capable of Driving Two Low–power TTL Loads or One Low–
Power Schottky TTL Load Over the Rated Temperature Range
• Supply Voltage Range = 3.0 Vdc to 18 Vdc
D SUFFIX
SOIC
CASE 751B
ORDERING INFORMATION
MC14XXXBCP
MC14XXXBCL
MC14XXXBD
Plastic
Ceramic
SOIC
TA = – 55° to 125°C for all packages.
MC14043B
S0
R0
S1
R1
S2
R2
S3
4
MC14044B
2
R0
Q0
3
S0
6
9
R1
Q1
7
12
VDD = PIN 16
VSS = PIN 8
NC = PIN 13
10
Q2
S1
R2
11
S2
14
TRUTH TABLE
1
Q3
S R E
Q
X X 0
High
Impedance
15
R3
5
ENABLE
0
0
1
1
0
1
0
1
1 No Change
1
0
1
1
1
1
X = Don’t Care
R3
4
13
Q0
3
6
9
Q1
7
12
VDD = PIN 16
VSS = PIN 8
NC = PIN 2
10
Q2
11
14
TRUTH TABLE
1
Q3
S R E
Q
X X 0
High
Impedance
15
S3
5
ENABLE
0
0
1
1
0
1
0
1
1
0
1
1
1
0
1 No Change
X = Don’t Care
REV 3
1/94
MC14043B
Motorola, Inc. 1995
MC14044B
162
MOTOROLA CMOS LOGIC DATA
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ELECTRICAL CHARACTERISTICS (Voltages Referenced to VSS)
Characteristic
Output Voltage
Vin = VDD or 0
Symbol
– 55_C
25_C
125_C
VDD
Vdc
Min
Max
Min
Typ #
Max
Min
Max
Unit
“0” Level
VOL
5.0
10
15
—
—
—
0.05
0.05
0.05
—
—
—
0
0
0
0.05
0.05
0.05
—
—
—
0.05
0.05
0.05
Vdc
“1” Level
VOH
5.0
10
15
4.95
9.95
14.95
—
—
—
4.95
9.95
14.95
5.0
10
15
—
—
—
4.95
9.95
14.95
—
—
—
Vdc
5.0
10
15
—
—
—
1.5
3.0
4.0
—
—
—
2.25
4.50
6.75
1.5
3.0
4.0
—
—
—
1.5
3.0
4.0
5.0
10
15
3.5
7.0
11
—
—
—
3.5
7.0
11
2.75
5.50
8.25
—
—
—
3.5
7.0
11
—
—
—
5.0
5.0
10
15
– 3.0
– 0.64
– 1.6
– 4.2
—
—
—
—
– 2.4
– 0.51
– 1.3
– 3.4
– 4.2
– 0.88
– 2.25
– 8.8
—
—
—
—
– 1.7
– 0.36
– 0.9
– 2.4
—
—
—
—
IOL
5.0
10
15
0.64
1.6
4.2
—
—
—
0.51
1.3
3.4
0.88
2.25
8.8
—
—
—
0.36
0.9
2.4
—
—
—
mAdc
Input Current
Iin
15
—
± 0.1
—
± 0.00001
± 0.1
—
± 1.0
µAdc
Input Capacitance
(Vin = 0)
Cin
—
—
—
—
5.0
7.5
—
—
pF
Quiescent Current
(Per Package)
IDD
5.0
10
15
—
—
—
1.0
2.0
4.0
—
—
—
0.002
0.004
0.006
1.0
2.0
4.0
—
—
—
30
60
120
µAdc
Total Supply Current**†
(Dynamic plus Quiescent,
Per Package)
(CL = 50 pF on all outputs all
buffers switching)
IT
5.0
10
15
Three–State Output Leakage
Current
ITL
15
Vin = 0 or VDD
Input Voltage
“0” Level
(VO = 4.5 or 0.5 Vdc)
(VO = 9.0 or 1.0 Vdc)
(VO = 13.5 or 1.5 Vdc)
VIL
“1” Level
VIH
(VO = 0.5 or 4.5 Vdc)
(VO = 1.0 or 9.0 Vdc)
(VO = 1.5 or 13.5 Vdc)
Output Drive Current
(VOH = 2.5 Vdc)
(VOH = 4.6 Vdc)
(VOH = 9.5 Vdc)
(VOH = 13.5 Vdc)
Vdc
Vdc
IOH
Source
(VOL = 0.4 Vdc)
(VOL = 0.5 Vdc)
(VOL = 1.5 Vdc)
Sink
mAdc
IT = (0.58 µA/kHz) f + IDD
IT = (1.15 µA/kHz) f + IDD
IT = (1.73 µA/kHz) f + IDD
—
± 0.1
—
± 0.0001
± 0.1
µAdc
—
± 3.0
µAdc
#Data labelled “Typ” is not to be used for design purposes but is intended as an indication of the IC’s potential performance.
** The formulas given are for the typical characteristics only at 25_C.
†To calculate total supply current at loads other than 50 pF:
IT(CL) = IT(50 pF) + (CL – 50) Vfk
where: IT is in µA (per package), CL in pF, V = (VDD – VSS) in volts, f in kHz is input frequency, and k = 0.004.
* Maximum Ratings are those values beyond which damage to the device may occur.
†Temperature Derating: Plastic “P and D/DW” Packages: – 7.0 mW/_C From 65_C To 125_C
Ceramic “L” Packages – 12 mW/_C From 100_C To 125_C
MOTOROLA CMOS LOGIC DATA
MC14043B MC14044B
163
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v
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ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
MAXIMUM RATINGS* (Voltages Referenced to VSS)
Symbol
VDD
Vin, Vout
lin, lout
PD
Tstg
TL
Parameter
Value
Unit
– 0.5 to + 18.0
V
Input or Output Voltage (DC or Transient)
– 0.5 to VDD + 0.5
V
Input or Output Current (DC or Transient),
per Pin
± 10
mA
DC Supply Voltage
Power Dissipation, per Package†
Storage Temperature
500
mW
– 65 to + 150
_C
260
_C
Lead Temperature (8–Second Soldering)
* Maximum Ratings are those values beyond which damage to the device may occur.
†Temperature Derating:
Plastic “P and D/DW” Packages: – 7.0 mW/_C From 65_C To 125_C
Ceramic “L” Packages: – 12 mW/_C From 100_C To 125_C
This device contains protection circuitry to
guard against damage due to high static
voltages or electric fields. However, precautions must be taken to avoid applications of
any voltage higher than maximum rated voltages to this high–impedance circuit. For proper
operation, Vin and Vout should be constrained
to the range VSS
(Vin or Vout)
VDD.
Unused inputs must always be tied to an
appropriate logic voltage level (e.g., either VSS
or VDD). Unused outputs must be left open.
SWITCHING CHARACTERISTICS* (CL = 50 pF, TA = 25_C)
VDD
Vdc
Min
Typ #
Max
5.0
10
15
—
—
—
100
50
40
200
100
80
5.0
10
15
—
—
—
100
50
40
200
100
80
5.0
10
15
—
—
—
175
75
60
350
175
120
tPHL
5.0
10
15
—
—
—
175
75
60
350
175
120
ns
Set, Set Pulse Width
tW
5.0
10
15
200
100
70
80
40
30
—
—
—
ns
Reset, Reset Pulse Width
tW
5.0
10
15
200
100
70
80
40
30
—
—
—
ns
Characteristic
Symbol
Output Rise Time
tTLH = (1.35 ns/pF) CL + 32.5 ns
tTLH = (0.60 ns/pF) CL + 20 ns
tTLH = (0.40 ns/pF) CL + 20 ns
Output Fall Time
tTHL = (1.35 ns/pF) CL + 32.5 ns
tTHL = (0.60 ns/pF) CL + 20 ns
tTHL = (0.40 ns/pF) CL + 20 ns
tTLH
Propagation Delay Time
tPLH = (0.90 ns/pF) CL + 130 ns
tPLH = (0.36 ns/pF) CL + 57 ns
tPLH = (0.26 ns/pF) CL + 47 ns
tPHL = (0.90 ns/pF) CL + 130 ns
tPHL = (0.90 ns/pF) CL + 57 ns
tPHL = (0.26 ns/pF) CL + 47 ns
tPLH
Unit
ns
tTHL
ns
ns
Three–State Enable/Disable Delay
tPLZ,
5.0
—
150
300
tPHZ,
10
—
80
160
tPZL,
15
—
55
110
tPZH
* The formulas given are for the typical characteristics only at 25_C.
#Data labelled “Typ” is not to be used for design purposes but is intended as an indication of the IC’s potential performance.
ns
AC WAVEFORMS
MC14043B
MC14044B
20 ns
50%
10%
VSS
20 ns
RESET
20 ns
VDD
90%
SET
20 ns
20 ns
SET
20 ns
50%
Q
tPHL
10%
VSS
50%
RESET
tTLH
90%
50%
10%
tTLH
VOH
Q
50%
VOL
tTHL
90%
10%
VSS
VOH
VOL
tPLH
tPLH
MC14043B MC14044B
164
VSS
20 ns
90% VDD
VDD
10%
10%
VDD
90%
20 ns
90%
tTHL
50%
tPHL
MOTOROLA CMOS LOGIC DATA
THREE–STATE ENABLE/DISABLE DELAYS
Set, Reset, Enable, and Switch Conditions for 3–State Tests
MC14043B
Test
tPZH
Enable
VDD
MC14044B
S1
S2
Q
S
R
S
R
Open
Closed
A
VDD
VSS
VSS
VDD
tPZL
Closed
Open
B
VSS
VDD
VDD
VSS
tPHZ
Open
Closed
A
VDD
VSS
VSS
VDD
tPLZ
Closed
Open
B
VSS
VDD
VDD
VSS
S1
TO
OUTPUT
UNDER
TEST
1k
CL
50 pF
S2
VSS
VDD
ENABLE
50%
VSS
tPZH
VDD
90%
QA
10%
tPZL
tPHZ
VOL
tPLZ
VOH
QB
10%
VSS
PIN ASSIGNMENT
MC14043B
MC14044B
Q3
1
16
VDD
Q3
1
16
VDD
Q0
2
15
R3
NC
2
15
S3
R0
3
14
S3
S0
3
14
R3
S0
4
13
NC
R0
4
13
Q0
E
5
12
S2
E
5
12
R2
S1
6
11
R2
R1
6
11
S2
R1
7
10
Q2
S1
7
10
Q2
VSS
8
9
Q1
VSS
8
9
Q1
NC = NO CONNECTION
MOTOROLA CMOS LOGIC DATA
MC14043B MC14044B
165
OUTLINE DIMENSIONS
L SUFFIX
CERAMIC DIP PACKAGE
CASE 620–10
ISSUE V
–A–
16
9
1
8
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMENSION F MAY NARROW TO 0.76 (0.030)
WHERE THE LEAD ENTERS THE CERAMIC
BODY.
–B–
C
L
DIM
A
B
C
D
E
F
G
H
K
L
M
N
–T–
K
N
SEATING
PLANE
M
E
F
J
G
D
16 PL
0.25 (0.010)
16 PL
0.25 (0.010)
M
T A
T B
M
S
INCHES
MIN
MAX
0.750
0.785
0.240
0.295
–––
0.200
0.015
0.020
0.050 BSC
0.055
0.065
0.100 BSC
0.008
0.015
0.125
0.170
0.300 BSC
0_
15 _
0.020
0.040
MILLIMETERS
MIN
MAX
19.05
19.93
6.10
7.49
–––
5.08
0.39
0.50
1.27 BSC
1.40
1.65
2.54 BSC
0.21
0.38
3.18
4.31
7.62 BSC
0_
15 _
0.51
1.01
S
P SUFFIX
PLASTIC DIP PACKAGE
CASE 648–08
ISSUE R
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
–A–
16
9
1
8
B
F
C
L
S
–T–
SEATING
PLANE
K
H
G
D
16 PL
0.25 (0.010)
MC14043B MC14044B
166
J
M
T A
M
M
DIM
A
B
C
D
F
G
H
J
K
L
M
S
INCHES
MIN
MAX
0.740
0.770
0.250
0.270
0.145
0.175
0.015
0.021
0.040
0.70
0.100 BSC
0.050 BSC
0.008
0.015
0.110
0.130
0.295
0.305
0_
10 _
0.020
0.040
MILLIMETERS
MIN
MAX
18.80
19.55
6.35
6.85
3.69
4.44
0.39
0.53
1.02
1.77
2.54 BSC
1.27 BSC
0.21
0.38
2.80
3.30
7.50
7.74
0_
10 _
0.51
1.01
MOTOROLA CMOS LOGIC DATA
OUTLINE DIMENSIONS
D SUFFIX
PLASTIC SOIC PACKAGE
CASE 751B–05
ISSUE J
–A–
16
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
9
–B–
1
P
8 PL
0.25 (0.010)
8
M
B
S
G
R
K
F
X 45 _
C
–T–
SEATING
PLANE
M
D
16 PL
0.25 (0.010)
M
T B
S
A
S
J
DIM
A
B
C
D
F
G
J
K
M
P
R
MILLIMETERS
MIN
MAX
9.80
10.00
3.80
4.00
1.35
1.75
0.35
0.49
0.40
1.25
1.27 BSC
0.19
0.25
0.10
0.25
0_
7_
5.80
6.20
0.25
0.50
INCHES
MIN
MAX
0.386
0.393
0.150
0.157
0.054
0.068
0.014
0.019
0.016
0.049
0.050 BSC
0.008
0.009
0.004
0.009
0_
7_
0.229
0.244
0.010
0.019
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MOTOROLA CMOS LOGIC DATA
◊
*MC14043B/D*
MC14043B
MC14044B
MC14043B/D
167