SEMICONDUCTOR TECHNICAL DATA $# $# &!" &!" %# # $!!# # #! Automotive Customized These devices are pin compatible to standard HC405x and MC1405xB analog mux/demux devices, but feature injection current effect control. This makes them especially suited for usage in automotive applications where voltages in excess of normal logic voltage are common. The injection current effect control allows signals at disabled analog input channels to exceed the supply voltage range without affecting the signal of the enabled analog channel. This eliminates the need for external diode/ resistor networks typically used to keep the analog channel signals within the supply voltage range. The devices utilize low power silicon gate CMOS technology. The Channel Select and Enable inputs are compatible with standard CMOS outputs. • • • • • N SUFFIX 16–LEAD PLASTIC DIP PACKAGE CASE 648–08 D SUFFIX 16–LEAD PLASTIC SOIC PACKAGE CASE 751B–05 Injection Current Cross–Coupling Less than 1mV/mA (See Figure 9) Pin Compatible to HC405X and MC1405XB Devices Power Supply Range (VCC – GND) = 2.0 to 6.0 V In Compliance With the Requirements of JEDEC Standard No. 7A Chip Complexity: 154 FETs or 36 Equivalent Gates DW SUFFIX 16–LEAD PLASTIC WIDE SOIC PACKAGE CASE 751G–02 13 X0 14 X1 15 X2 ANALOG 12 MULTIPLEXER/ INPUTS/ X3 DEMULTIPLEXER OUTPUTS X4 1 5 X5 2 X6 4 X7 11 A CHANNEL 10 B SELECT 9 INPUTS C 6 ENABLE PIN 16 = VCC PIN 8 = GND DT SUFFIX 16–LEAD PLASTIC TSSOP PACKAGE CASE 948F–01 3 X COMMON OUTPUT/ INPUT Figure 1. MC74HC4851A Logic Diagram Single–Pole, 8–Position Plus Common Off VCC 16 X2 X1 X0 X3 A B C 15 14 13 12 11 10 9 6 7 8 GND 1 2 3 4 5 X4 X6 X X7 X5 ORDERING INFORMATION MC74HCXXXXAN MC74HCXXXXAD MC74HCXXXXADW MC74HCXXXXADT Enable NC FUNCTION TABLE – MC74HC4851A Control Inputs Enable C L L L L L L L L H L L L L H H H H X Figure 2. MC74HC4851A 16–Lead Pinout (Top View) 11/97 Motorola, Inc. 1997 1 Plastic SOIC SOIC Wide TSSOP REV 3 Select B A L L H H L L H H X L H L H L H L H X ON Channels X0 X1 X2 X3 X4 X5 X6 X7 NONE MC74HC4851A MC74HC4852A FUNCTION TABLE – MC74HC4852A Control Inputs Select Enable B A ON Channels L L L L H L L H H X L H L H X Y0 Y1 Y2 Y3 12 ANALOG INPUTS/OUTPUTS CHANNEL-SELECT INPUTS X0 14 X1 15 X2 11 X3 Y0 Y1 Y2 Y3 A B ENABLE X SWITCH 13 X COMMON OUTPUTS/INPUTS 1 Y SWITCH 3 Y 4 VCC 16 10 9 NONE X = Don’t Care 5 2 X0 X1 X2 X3 PIN 16 = VCC PIN 8 = GND X2 X1 X X0 X3 A B 15 14 13 12 11 10 9 6 7 8 GND 6 Figure 3. MC74HC4852A Logic Diagram Double–Pole, 4–Position Plus Common Off 1 2 3 4 5 Y0 Y2 Y Y3 Y1 Enable NC Figure 4. MC74HC4852A 16–Lead Pinout (Top View) MOTOROLA 2 High–Speed CMOS Logic Data DL129 — Rev 6 MC74HC4851A MC74HC4852A ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎ ÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎ ÎÎÎ MAXIMUM RATINGS* Symbol Parameter Value Unit VCC Positive DC Supply Voltage (Referenced to GND) – 0.5 to + 7.0 V Vin DC Input Voltage (Any Pin) (Referenced to GND) – 0.5 to VCC + 0.5 V I Power Dissipation in Still Air, Tstg Storage Temperature Range TL ± 25 mA 750 500 450 mW – 65 to + 150 _C DC Current, Into or Out of Any Pin PD Plastic DIP† SOIC Package† TSSOP Package† _C Lead Temperature, 1 mm from Case for 10 Seconds Plastic DIP, SOIC or TSSOP Package 260 This device contains protection circuitry to guard against damage due to high static voltages or electric fields. However, precautions must be taken to avoid applications of any voltage higher than maximum rated voltages to this high–impedance circuit. For proper operation, Vin and Vout should be constrained to the range GND (Vin or Vout) VCC. Unused inputs must always be tied to an appropriate logic voltage level (e.g., either GND or VCC). Unused outputs must be left open. v v * Maximum Ratings are those values beyond which damage to the device may occur. Functional operation should be restricted to the Recommended Operating Conditions. †Derating — Plastic DIP: – 10 mW/_C from 65_ to 125_C SOIC Package: – 7 mW/_C from 65_ to 125_C TSSOP Package: – 6.1 mW/_C from 65_ to 125_C For high frequency or heavy load considerations, see Chapter 2 of the Motorola High–Speed CMOS Data Book (DL129/D). ÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ Î ÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ Î ÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ RECOMMENDED OPERATING CONDITIONS Symbol Parameter Min Max Unit VCC Positive DC Supply Voltage (Referenced to GND) 2.0 6.0 V Vin DC Input Voltage (Any Pin) (Referenced to GND) GND VCC V Static or Dynamic Voltage Across Switch 0.0 1.2 V TA Operating Temperature Range, All Package Types – 55 + 125 _C tr, tf Input Rise/Fall Time (Channel Select or Enable Inputs) 0 0 0 1000 500 400 ns VIO* VCC = 2.0 V VCC = 4.5 V VCC = 6.0 V * For voltage drops across switch greater than 1.2V (switch on), excessive VCC current may be drawn; i.e., the current out of the switch may contain both VCC and switch input components. The reliability of the device will be unaffected unless the Maximum Ratings are exceeded. DC CHARACTERISTICS — Digital Section (Voltages Referenced to GND) VEE = GND, Except Where Noted VCC V Guaranteed Limit S b l Symbol P Parameter –55 to 25°C ≤85°C ≤125°C U i Unit VIH Minimum High–Level Input Voltage, Channel–Select or Enable Inputs Ron = Per Spec 2.0 3.0 4.5 6.0 1.50 2.10 3.15 4.20 1.50 2.10 3.15 4.20 1.50 2.10 3.15 4.20 V VIL Maximum Low–Level Input Voltage, Channel–Select or Enable Inputs Ron = Per Spec 2.0 3.0 4.5 6.0 0.50 0.90 1.35 1.80 0.50 0.90 1.35 1.80 0.50 0.90 1.35 1.80 V Iin Maximum Input Leakage Current on Digital Pins (Enable/A/B/C) Vin = VCC or GND 6.0 ± 0.1 ± 1.0 ± 1.0 µA Maximum Quiescent Supply Current (per Package) Vin(digital) = VCC or GND Vin(analog) = GND 6.0 2 20 40 µA ICC C di i Condition NOTE: Information on typical parametric values can be found in Chapter 2 of the Motorola High–Speed CMOS Data Book (DL129/D). High–Speed CMOS Logic Data DL129 — Rev 6 3 MOTOROLA MC74HC4851A MC74HC4852A DC CHARACTERISTICS — Analog Section Guaranteed Limit C di i Condition VCC –55 to 25°C ≤85°C ≤125°C U i Unit Maximum “ON” Resistance Vin = VIL or VIH;VIS = VCC to GND; IS ≤ 2.0 mA 2.0 3.0 4.5 6.0 1700 1100 550 400 1750 1200 650 500 1800 1300 750 600 Ω Delta “ON” Resistance Vin = VIL or VIH; VIS = VCC/2 IS ≤ 2.0 mA 2.0 3.0 4.5 6.0 300 160 80 60 400 200 100 80 500 240 120 100 Ω Maximum Off–Channel Leakage Current, Any One Channel Common Channel Vin = VCC or GND 6.0 ±0.1 ±0.2 ±0.5 ±2.0 ±1.0 ±4.0 Maximum On–Channel Leakage Channel–to–Channel Vin = VCC or GND 6.0 ±0.2 ±2.0 ±4.0 VCC –55 to 25°C ≤85°C ≤125°C Unit Maximum Propagation Delay, Analog Input to Analog Output 2.0 3.0 4.5 6.0 160 80 40 30 180 90 45 35 200 100 50 40 ns Maximum Propagation Delay, Enable or Channel–Select to Analog Output 2.0 3.0 4.5 6.0 260 160 80 60 280 180 90 70 300 200 100 80 ns 10 35 130 10 35 130 10 35 130 pF S b l Symbol Ron ∆Ron Ioff Ion P Parameter µA µA AC CHARACTERISTICS (CL = 50 pF, Input tr = tf = 6 ns) Symbol Parameter tPHL, tPLH tPHL, tPHZ,PZH tPLH, tPLZ,PZL Cin CPD Maximum Input Capacitance (All Switches Off) (All Switches Off) Digital Pins Any Single Analog Pin Common Analog Pin Power Dissipation Capacitance Typical 5.0 20 pF INJECTION CURRENT COUPLING SPECIFICATIONS (VCC = 5V, TA = –55°C to +125°C) Symbol V∆out Parameter Maximum Shift of Output Voltage of Enabled Analog Channel Typ Max Unit 0.1 1.0 0.5 5.0 0.5 5.0 2.0 20 mV Condition Iin* ≤ 1mA, RS ≤ 3,9kΩ Iin* ≤ 10mA, RS ≤ 3,9kΩ Iin* ≤ 1mA, RS ≤ 20kΩ Iin* ≤ 10mA, RS ≤ 20kΩ * Iin = Total current injected into all disabled channels. MOTOROLA 4 High–Speed CMOS Logic Data DL129 — Rev 6 MC74HC4851A MC74HC4852A 1100 1000 R on , ON RESISTANCE (OHMS) 900 –55°C 800 +25°C 700 +125°C 600 500 400 300 200 R on , ON RESISTANCE (OHMS) 1100 1000 100 800 700 600 500 –55°C 400 +25°C 300 +125°C 200 100 0 0.0 0.4 0.8 1.2 1.6 0 0.0 2.0 1.2 1.8 2.4 3.0 Vin, INPUT VOLTAGE (VOLTS), REFERENCED TO GND Figure 5. Typical On Resistance VCC = 2V Figure 6. Typical On Resistance VCC = 3V 660 440 600 400 540 360 480 420 360 –55°C 300 +25°C 240 +125°C 180 320 –55°C 280 160 120 80 40 1.8 2.7 3.6 0 0.0 4.5 +125°C 200 60 0.9 +25°C 240 120 0 0.0 0.6 Vin, INPUT VOLTAGE (VOLTS), REFERENCED TO GND R on , ON RESISTANCE (OHMS) R on , ON RESISTANCE (OHMS) 900 1.2 2.4 3.6 4.8 6.0 Vin, INPUT VOLTAGE (VOLTS), REFERENCED TO GND Vin, INPUT VOLTAGE (VOLTS), REFERENCED TO GND Figure 7. Typical On Resistance VCC = 4.5V Figure 8. Typical On Resistance VCC = 6V High–Speed CMOS Logic Data DL129 — Rev 6 5 MOTOROLA MC74HC4851A MC74HC4852A VCC = 5V Iin Vin2 < VSS or VCC < Vin2 Any Disabled Channel VSS < Vin1 < VCC Enabled Channel Vout = Vin1 ±V∆out RS Figure 9. Injection Current Coupling Specification 5V 6V 5V HC4051 Sensor VCC VCC Microcontroller Channel 1 Channel 2 Channel 3 Channel 4 Channel 5 Channel 6 Channel 7 Channel 8 (8x Identical Circuitry) Common Out A/D – Input Figure 10. Actual Technology Requires 32 passive components and one extra 6V regulator to suppress injection current into a standard HC4051 multiplexer 5V HC4851A Sensor VCC VCC Microcontroller Channel 1 Channel 2 Channel 3 Channel 4 Channel 5 Channel 6 Channel 7 Channel 8 (8x Identical Circuitry) Common Out A/D – Input Figure 11. MC74HC4851A Solution Solution by applying the HC4851A multiplexer MOTOROLA 6 High–Speed CMOS Logic Data DL129 — Rev 6 MC74HC4851A MC74HC4852A PLOTTER VCC PROGRAMMABLE POWER SUPPLY MINI COMPUTER DC ANALYZER 16 VEE VCC OFF – + VCC VCC A COMMON O/I OFF NC DEVICE UNDER TEST ANALOG IN VIH COMMON OUT 6 8 GND Figure 13. Maximum Off Channel Leakage Current, Any One Channel, Test Set–Up Figure 12. On Resistance Test Set–Up VCC 16 VEE ANALOG I/O 16 A OFF VCC OFF VIH VCC VCC ON VEE COMMON O/I VCC 6 8 Figure 14. Maximum Off Channel Leakage Current, Common Channel, Test Set–Up Figure 15. Maximum On Channel Leakage Current, Channel to Channel, Test Set–Up VCC 16 VCC VCC ON/OFF 50% OFF/ON GND ANALOG OUT COMMON O/I ANALOG I/O tPLH N/C ANALOG I/O VIL 6 COMMON O/I OFF 8 CHANNEL SELECT VCC TEST POINT CL* tPHL 6 50% 8 CHANNEL SELECT *Includes all probe and jig capacitance Figure 16. Propagation Delays, Channel Select to Analog Out High–Speed CMOS Logic Data DL129 — Rev 6 Figure 17. Propagation Delay, Test Set–Up Channel Select to Analog Out 7 MOTOROLA MC74HC4851A MC74HC4852A VCC 16 ANALOG IN COMMON O/I ANALOG I/O VCC ON 50% TEST POINT CL* GND tPLH tPHL ANALOG OUT 6 8 50% *Includes all probe and jig capacitance Figure 18. Propagation Delays, Analog In to Analog Out Figure 19. Propagation Delay, Test Set–Up Analog In to Analog Out tr tf 90% 50% 10% ENABLE tPZL ANALOG OUT tPLZ 2 GND VCC 16 VCC HIGH IMPEDANCE 1 ANALOG OUT TEST POINT ON/OFF CL* VOL tPZH tPHZ ENABLE 90% 10kΩ ANALOG I/O 2 50% 10% POSITION 1 WHEN TESTING tPHZ AND tPZH POSITION 2 WHEN TESTING tPLZ AND tPZL 1 VCC VOH 50% 6 8 HIGH IMPEDANCE Figure 20. Propagation Delays, Enable to Analog Out Figure 21. Propagation Delay, Test Set–Up Enable to Analog Out VCC A VCC 16 ON/OFF COMMON O/I NC ANALOG I/O OFF/ON VCC 6 8 11 CHANNEL SELECT Figure 22. Power Dissipation Capacitance, Test Set–Up MOTOROLA 8 High–Speed CMOS Logic Data DL129 — Rev 6 MC74HC4851A MC74HC4852A Gate = VCC (Disabled) Disabled Analog Mux Input Vin > VCC + 0.7V P+ Common Analog Output Vout > VCC P+ + + + N – Substrate (on VCC potential) Figure 23. Diagram of Bipolar Coupling Mechanism Appears if Vin exceeds VCC, driving injection current into the substrate A B C ENABLE 11 10 9 6 INJECTION CURRENT CONTROL 13 INJECTION CURRENT CONTROL 14 INJECTION CURRENT CONTROL 15 INJECTION CURRENT CONTROL 12 INJECTION CURRENT CONTROL 1 INJECTION CURRENT CONTROL 5 INJECTION CURRENT CONTROL 2 INJECTION CURRENT CONTROL 4 INJECTION CURRENT CONTROL 3 X0 X1 X2 X3 X4 X5 X6 X7 X Figure 24. Function Diagram, HC4851A High–Speed CMOS Logic Data DL129 — Rev 6 9 MOTOROLA MC74HC4851A MC74HC4852A A B ENABLE 10 9 6 INJECTION CURRENT CONTROL 13 INJECTION CURRENT CONTROL 14 INJECTION CURRENT CONTROL 15 INJECTION CURRENT CONTROL 12 INJECTION CURRENT CONTROL 13 INJECTION CURRENT CONTROL 1 INJECTION CURRENT CONTROL 5 INJECTION CURRENT CONTROL 2 INJECTION CURRENT CONTROL 4 INJECTION CURRENT CONTROL 3 X0 X1 X2 X3 X Y0 Y1 Y2 Y3 Y Figure 25. Function Diagram, HC4852A MOTOROLA 10 High–Speed CMOS Logic Data DL129 — Rev 6 MC74HC4851A MC74HC4852A OUTLINE DIMENSIONS N SUFFIX PLASTIC PACKAGE CASE 648–08 ISSUE R –A – 16 9 1 8 B F C NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL. 4. DIMENSION B DOES NOT INCLUDE MOLD FLASH. 5. ROUNDED CORNERS OPTIONAL. DIM A B C D F G H J K L M S L S SEATING PLANE –T – K H D 16 PL 0.25 (0.010) M J G T A M M D SUFFIX PLASTIC SOIC PACKAGE CASE 751B–05 ISSUE J –A – 16 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. 9 –B – 1 P 8 PL 0.25 (0.010) 8 B M M G K DIM A B C D F G J K M P R F R X 45° C –T SEATING – J M PLANE D 16 PL 0.25 (0.010) T M B A S S DW SUFFIX PLASTIC SOIC PACKAGE CASE 751G–02 ISSUE A –A– 16 9 –B– 8X P 0.010 (0.25) 1 M B M 8 16X J D 0.010 (0.25) M T A S B S F R X 45 _ C –T– 14X High–Speed CMOS Logic Data DL129 — Rev 6 G K SEATING PLANE M 11 INCHES MILLIMETERS MIN MAX MIN MAX 0.740 0.770 18.80 19.55 6.35 0.250 0.270 6.85 3.69 0.145 0.175 4.44 0.39 0.015 0.021 0.53 1.02 0.040 0.070 1.77 0.100 BSC 2.54 BSC 0.050 BSC 1.27 BSC 0.21 0.008 0.015 0.38 2.80 0.110 0.130 3.30 7.50 0.295 0.305 7.74 0° 0° 10° 10° 0.020 0.040 0.51 1.01 MILLIMETERS MIN MAX 9.80 10.00 4.00 3.80 1.75 1.35 0.49 0.35 1.25 0.40 1.27 BSC 0.25 0.19 0.25 0.10 7° 0° 6.20 5.80 0.50 0.25 INCHES MIN MAX 0.386 0.393 0.150 0.157 0.054 0.068 0.014 0.019 0.016 0.049 0.050 BSC 0.008 0.009 0.004 0.009 0° 7° 0.229 0.244 0.010 0.019 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.13 (0.005) TOTAL IN EXCESS OF D DIMENSION AT MAXIMUM MATERIAL CONDITION. DIM A B C D F G J K M P R MILLIMETERS MIN MAX 10.15 10.45 7.40 7.60 2.35 2.65 0.35 0.49 0.50 0.90 1.27 BSC 0.25 0.32 0.10 0.25 0_ 7_ 10.05 10.55 0.25 0.75 INCHES MIN MAX 0.400 0.411 0.292 0.299 0.093 0.104 0.014 0.019 0.020 0.035 0.050 BSC 0.010 0.012 0.004 0.009 0_ 7_ 0.395 0.415 0.010 0.029 MOTOROLA MC74HC4851A MC74HC4852A OUTLINE DIMENSIONS DT SUFFIX PLASTIC TSSOP PACKAGE CASE 948F–01 ISSUE O 16X K REF 0.10 (0.004) 0.15 (0.006) T U M T U V S S S K ÉÉ ÇÇ ÇÇ ÉÉ K1 2X L/2 16 9 J1 B –U– L SECTION N–N J PIN 1 IDENT. 8 1 N 0.25 (0.010) 0.15 (0.006) T U S A –V– NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH. PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5. DIMENSION K DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE K DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 7. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE –W–. M N F DETAIL E –W– C 0.10 (0.004) –T– SEATING PLANE H D DETAIL E DIM A B C D F G H J J1 K K1 L M MILLIMETERS MIN MAX 4.90 5.10 4.30 4.50 ––– 1.20 0.05 0.15 0.50 0.75 0.65 BSC 0.18 0.28 0.09 0.20 0.09 0.16 0.19 0.30 0.19 0.25 6.40 BSC 0_ 8_ INCHES MIN MAX 0.193 0.200 0.169 0.177 ––– 0.047 0.002 0.006 0.020 0.030 0.026 BSC 0.007 0.011 0.004 0.008 0.004 0.006 0.007 0.012 0.007 0.010 0.252 BSC 0_ 8_ G Motorola reserves the right to make changes without further notice to any products herein. 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