SEMICONDUCTOR TECHNICAL DATA High–Performance Silicon–Gate CMOS The MC54/74HC4051A, MC74HC4052A and MC54/74HC4053A utilize silicon–gate CMOS technology to achieve fast propagation delays, low ON resistances, and low OFF leakage currents. These analog multiplexers/ demultiplexers control analog voltages that may vary across the complete power supply range (from VCC to VEE). The HC4051A, HC4052A and HC4053A are identical in pinout to the metal–gate MC14051AB, MC14052AB and MC14053AB. The Channel–Select inputs determine which one of the Analog Inputs/Outputs is to be connected, by means of an analog switch, to the Common Output/Input. When the Enable pin is HIGH, all analog switches are turned off. The Channel–Select and Enable inputs are compatible with standard CMOS outputs; with pullup resistors they are compatible with LSTTL outputs. These devices have been designed so that the ON resistance (Ron) is more linear over input voltage than R on of metal–gate CMOS analog switches. For a multiplexer/demultiplexer with channel–select latches, see HC4351A. • Fast Switching and Propagation Speeds • Low Crosstalk Between Switches • Diode Protection on All Inputs/Outputs • Analog Power Supply Range (VCC – VEE) = 2.0 to 12.0 V • Digital (Control) Power Supply Range (VCC – GND) = 2.0 to 6.0 V • Improved Linearity and Lower ON Resistance Than Metal–Gate Counterparts • Low Noise • In Compliance With the Requirements of JEDEC Standard No. 7A • Chip Complexity: HC4051A — 184 FETs or 46 Equivalent Gates HC4052A — 168 FETs or 42 Equivalent Gates HC4053A — 156 FETs or 39 Equivalent Gates 16 1 1 1 ORDERING INFORMATION MC54HCXXXXAJ MC74HCXXXXAN MC74HCXXXXAD MC74HCXXXXADW MC74HCXXXXADT Control Inputs Enable C L L L L L L L L H L L L L H H H H X X0 X3 A B C 15 14 13 12 11 10 9 6 7 2 3 4 5 X6 X X7 X5 8 Enable VEE GND This document contains information on a new product. Specifications and information herein are subject to change without notice. 10/97 Motorola, Inc. 1997 1 Select B A L L H H L L H H X L H L H L H L H X ON Channels X0 X1 X2 X3 X4 X5 X6 X7 NONE X = Don’t Care X1 1 Ceramic Plastic SOIC SOIC Wide TSSOP FUNCTION TABLE – MC54/74HC4051A X2 X4 1 DT SUFFIX TSSOP PACKAGE CASE 948F–01 16 Pinout: MC54/74HC4051A (Top View) VCC 16 1 DW SUFFIX SOIC WIDE PACKAGE CASE 751G–02 16 COMMON OUTPUT/ INPUT X D SUFFIX SOIC PACKAGE CASE 751B–05 16 13 3 N SUFFIX PLASTIC PACKAGE CASE 648–08 16 LOGIC DIAGRAM MC54/74HC4051A Single–Pole, 8–Position Plus Common Off X0 14 X1 15 X2 ANALOG 12 MULTIPLEXER/ INPUTS/ X3 DEMULTIPLEXER OUTPUTS X4 1 5 X5 2 X6 4 X7 11 A CHANNEL 10 B SELECT 9 INPUTS C 6 ENABLE PIN 16 = VCC PIN 7 = VEE PIN 8 = GND J SUFFIX CERAMIC PACKAGE CASE 620–10 REV 0 MC54/74HC4051A MC74HC4052A MC54/74HC4053A FUNCTION TABLE – MC74HC4052A LOGIC DIAGRAM MC74HC4052A Double–Pole, 4–Position Plus Common Off Control Inputs Select Enable B A ON Channels L L L L H L L H H X L H L H X Y0 Y1 Y2 Y3 12 ANALOG INPUTS/OUTPUTS CHANNEL-SELECT INPUTS X0 14 X1 15 X2 11 X3 Y0 Y1 Y2 Y3 A B ENABLE X SWITCH 13 X COMMON OUTPUTS/INPUTS 1 5 2 Y SWITCH 3 X0 X1 X2 X3 NONE X = Don’t Care Y 4 Pinout: MC74HC4052A (Top View) 10 9 VCC 16 PIN 16 = VCC PIN 7 = VEE PIN 8 = GND 6 X2 X1 X X0 X3 A B 15 14 13 12 11 10 9 6 7 8 GND 1 2 3 4 5 Y0 Y2 Y Y3 Y1 Enable VEE FUNCTION TABLE – MC54/74HC4053A LOGIC DIAGRAM MC54/74HC4053A Triple Single–Pole, Double–Position Plus Common Off 12 X0 13 X1 X SWITCH 2 ANALOG INPUTS/OUTPUTS Y0 1 Y1 Y SWITCH 5 Z0 3 Z1 Z SWITCH 14 15 4 Control Inputs Enable C L L L L L L L L H L L L L H H H H X X Y COMMON OUTPUTS/INPUTS Select B A L L H H L L H H X ON Channels Z0 Z0 Z0 Z0 Z1 Z1 Z1 Z1 L H L H L H L H X Y0 Y0 Y1 Y1 Y0 Y0 Y1 Y1 NONE X0 X1 X0 X1 X0 X1 X0 X1 X = Don’t Care Z 11 A 10 CHANNEL-SELECT B INPUTS 9 C 6 ENABLE PIN 16 = VCC PIN 7 = VEE PIN 8 = GND Pinout: MC54/74HC4053A (Top View) VCC 16 Y X X1 X0 A B C 15 14 13 12 11 10 9 1 2 3 4 5 6 7 Y1 Y0 Z1 Z Z0 8 GND NOTE: This device allows independent control of each switch. Channel–Select Input A controls the X–Switch, Input B controls the Y–Switch and Input C controls the Z–Switch MOTOROLA 2 Enable VEE High–Speed CMOS Logic Data DL129 — Rev 6 MC54/74HC4051A MC74HC4052A MC54/74HC4053A ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎ ÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎ ÎÎÎ MAXIMUM RATINGS* Symbol Parameter Unit – 0.5 to + 7.0 – 0.5 to + 14.0 V VCC Positive DC Supply Voltage VEE Negative DC Supply Voltage (Referenced to GND) – 7.0 to + 5.0 V VIS Analog Input Voltage VEE – 0.5 to VCC + 0.5 V Vin Digital Input Voltage (Referenced to GND) – 0.5 to VCC + 0.5 V ± 25 mA 750 500 450 mW – 65 to + 150 _C I PD Tstg TL (Referenced to GND) (Referenced to VEE) Value DC Current, Into or Out of Any Pin Power Dissipation in Still Air, Plastic or Ceramic DIP† SOIC Package† TSSOP Package† Storage Temperature Range This device contains protection circuitry to guard against damage due to high static voltages or electric fields. However, precautions must be taken to avoid applications of any voltage higher than maximum rated voltages to this high–impedance circuit. For proper operation, Vin and Vout should be constrained to the range GND (Vin or Vout) VCC. Unused inputs must always be tied to an appropriate logic voltage level (e.g., either GND or VCC). Unused outputs must be left open. v v _C Lead Temperature, 1 mm from Case for 10 Seconds Plastic DIP, SOIC or TSSOP Package Ceramic DIP 260 300 * Maximum Ratings are those values beyond which damage to the device may occur. Functional operation should be restricted to the Recommended Operating Conditions. †Derating — Plastic DIP: – 10 mW/_C from 65_ to 125_C Ceramic DIP: – 10 mW/_C from 100_ to 125_C SOIC Package: – 7 mW/_C from 65_ to 125_C TSSOP Package: – 6.1 mW/_C from 65_ to 125_C For high frequency or heavy load considerations, see Chapter 2 of the Motorola High–Speed CMOS Data Book (DL129/D). ÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ RECOMMENDED OPERATING CONDITIONS Symbol Parameter (Referenced to GND) (Referenced to VEE) Min Max Unit 2.0 2.0 6.0 12.0 V VCC Positive DC Supply Voltage VEE Negative DC Supply Voltage, Output (Referenced to GND) – 6.0 GND V VIS Analog Input Voltage VEE VCC V Vin Digital Input Voltage (Referenced to GND) GND VCC V VIO* Static or Dynamic Voltage Across Switch 1.2 V – 55 + 125 _C 0 0 0 0 1000 600 500 400 ns TA Operating Temperature Range, All Package Types tr, tf Input Rise/Fall Time (Channel Select or Enable Inputs) VCC = 2.0 V VCC = 3.0 V VCC = 4.5 V VCC = 6.0 V * For voltage drops across switch greater than 1.2V (switch on), excessive VCC current may be drawn; i.e., the current out of the switch may contain both VCC and switch input components. The reliability of the device will be unaffected unless the Maximum Ratings are exceeded. High–Speed CMOS Logic Data DL129 — Rev 6 3 MOTOROLA MC54/74HC4051A MC74HC4052A MC54/74HC4053A DC CHARACTERISTICS — Digital Section (Voltages Referenced to GND) VEE = GND, Except Where Noted –55 to 25°C ≤85°C ≤125°C U i Unit S b l Symbol P Parameter VIH Minimum High–Level Input Voltage, Channel–Select or Enable Inputs Ron = Per Spec 2.0 3.0 4.5 6.0 1.50 2.10 3.15 4.20 1.50 2.10 3.15 4.20 1.50 2.10 3.15 4.20 V VIL Maximum Low–Level Input Voltage, Channel–Select or Enable Inputs Ron = Per Spec 2.0 3.0 4.5 6.0 0.5 0.9 1.35 1.8 0.5 0.9 1.35 1.8 0.5 0.9 1.35 1.8 V Iin Maximum Input Leakage Current, Channel–Select or Enable Inputs Vin = VCC or GND, VEE = – 6.0 V 6.0 ± 0.1 ± 1.0 ± 1.0 µA Maximum Quiescent Supply Current (per Package) Channel Select, Enable and VIS = VCC or GND; VEE = GND VIO = 0 V VEE = – 6.0 6.0 6.0 1 4 10 40 20 80 ICC C di i Condition Guaranteed Limit VCC V µA NOTE: Information on typical parametric values can be found in Chapter 2 of the Motorola High–Speed CMOS Data Book (DL129/D). DC CHARACTERISTICS — Analog Section Guaranteed Limit S b l Symbol Ron P Parameter Maximum “ON” Resistance C di i Condition VCC VEE –55 to 25°C ≤85°C ≤125°C U i Unit Vin = VIL or VIH; VIS = VCC to VEE; IS ≤ 2.0 mA (Figures 1, 2) 4.5 4.5 6.0 0.0 – 4.5 – 6.0 190 120 100 240 150 125 280 170 140 Ω Vin = VIL or VIH; VIS = VCC or VEE (Endpoints); IS ≤ 2.0 mA (Figures 1, 2) 4.5 4.5 6.0 0.0 – 4.5 – 6.0 150 100 80 190 125 100 230 140 115 ∆Ron Maximum Difference in “ON” Resistance Between Any Two Channels in the Same Package Vin = VIL or VIH; VIS = 1/2 (VCC – VEE); IS ≤ 2.0 mA 4.5 4.5 6.0 0.0 – 4.5 – 6.0 30 12 10 35 15 12 40 18 14 Ioff Maximum Off–Channel Leakage Current, Any One Channel Vin = VIL or VIH; VIO = VCC – VEE; Switch Off (Figure 3) 6.0 – 6.0 0.1 0.5 1.0 Maximum Off–Channel HC4051A Leakage Current, HC4052A Common Channel HC4053A Vin = VIL or VIH; VIO = VCC – VEE; Switch Off (Figure 4) 6.0 6.0 6.0 – 6.0 – 6.0 – 6.0 0.2 0.1 0.1 2.0 1.0 1.0 4.0 2.0 2.0 Maximum On–Channel HC4051A Leakage Current, HC4052A Channel–to–Channel HC4053A Vin = VIL or VIH; Switch–to–Switch = VCC – VEE; (Figure 5) 6.0 6.0 6.0 – 6.0 – 6.0 – 6.0 0.2 0.1 0.1 2.0 1.0 1.0 4.0 2.0 2.0 Ion MOTOROLA Ω µA 4 µA High–Speed CMOS Logic Data DL129 — Rev 6 MC54/74HC4051A MC74HC4052A MC54/74HC4053A AC CHARACTERISTICS (CL = 50 pF, Input tr = tf = 6 ns) S b l Symbol P Parameter Guaranteed Limit VCC V –55 to 25°C ≤85°C ≤125°C U i Unit tPLH, tPHL Maximum Propagation Delay, Channel–Select to Analog Output (Figure 9) 2.0 4.5 6.0 370 74 63 465 93 79 550 110 94 ns tPLH, tPHL Maximum Propagation Delay, Analog Input to Analog Output (Figure 10) 2.0 4.5 6.0 60 12 10 75 15 13 90 18 15 ns tPLZ, tPHZ Maximum Propagation Delay, Enable to Analog Output (Figure 11) 2.0 4.5 6.0 290 58 49 364 73 62 430 86 73 ns tPZL, tPZH Maximum Propagation Delay, Enable to Analog Output (Figure 11) 2.0 4.5 6.0 345 69 59 435 87 74 515 103 87 ns Cin Maximum Input Capacitance, Channel–Select or Enable Inputs 10 10 10 pF CI/O Maximum Capacitance Analog I/O 35 35 35 pF Common O/I: HC4051A HC4052A HC4053A 130 80 50 130 80 50 130 80 50 Feedthrough 1.0 1.0 1.0 (All Switches Off) NOTE: For propagation delays with loads other than 50 pF, and information on typical parametric values, see Chapter 2 of the Motorola High– Speed CMOS Data Book (DL129/D). Typical @ 25°C, VCC = 5.0 V, VEE = 0 V CPD P Power Di Dissipation i i C Capacitance i (Fi (Figure 13)* HC4051A HC4052A HC4053A 45 80 45 pF F * Used to determine the no–load dynamic power consumption: P D = C PD V CC 2 f + I CC V CC . For load considerations, see Chapter 2 of the Motorola High–Speed CMOS Data Book (DL129/D). High–Speed CMOS Logic Data DL129 — Rev 6 5 MOTOROLA MC54/74HC4051A MC74HC4052A MC54/74HC4053A ADDITIONAL APPLICATION CHARACTERISTICS (GND = 0 V) S b l Symbol BW — — — THD P Parameter C di i Condition VCC V Limit* VEE V Maximum On–Channel Bandwidth or Minimum Frequency Response (Figure 6) fin = 1MHz Sine Wave; Adjust fin Voltage to Obtain 0dBm at VOS; Increase fin i Frequency Until dB Meter Reads –3dB; RL = 50Ω, CL = 10pF 2.25 2 25 4.50 6.00 –2.25 –4.50 –6.00 Off–Channel Feedthrough Isolation (Figure 7) fin = Sine Wave; Adjust fin Voltage to Obtain 0dBm at VIS fin = 10kHz, RL = 600Ω, CL = 50pF 2.25 4.50 6.00 –2.25 –4.50 –6.00 –50 –50 –50 fin = 1.0MHz, RL = 50Ω, CL = 10pF 2.25 4.50 6.00 –2.25 –4.50 –6.00 –40 –40 –40 Vin ≤ 1MHz Square Wave (tr = tf = 6ns); Adjust RL at Setup so that IS = 0A; Enable = GND RL = 600Ω, CL = 50pF 2.25 4.50 6.00 –2.25 –4.50 –6.00 25 105 135 RL = 10kΩ, CL = 10pF 2.25 4.50 6.00 –2.25 –4.50 –6.00 35 145 190 fin = Sine Wave; Adjust fin Voltage to Obtain 0dBm at VIS fin = 10kHz, RL = 600Ω, CL = 50pF 2.25 4.50 6.00 –2.25 –4.50 –6.00 –50 –50 –50 fin = 1.0MHz, RL = 50Ω, CL = 10pF 2.25 4.50 6.00 –2.25 –4.50 –6.00 –60 –60 –60 Feedthrough Noise. Channel–Select Input to Common I/O (Figure 8) Crosstalk Between Any Two Switches (Figure 12) (Test does not apply to HC4051A) Total Harmonic Distortion (Figure 14) fin = 1kHz, RL = 10kΩ, CL = 50pF THD = THDmeasured – THDsource VIS = 4.0VPP sine wave VIS = 8.0VPP sine wave VIS = 11.0VPP sine wave U i Unit 25°C ‘51 ‘52 ‘53 80 80 80 95 95 95 120 120 120 MHz dB mVPP dB % 2.25 4.50 6.00 –2.25 –4.50 –6.00 0.10 0.08 0.05 * Limits not tested. Determined by design and verified by qualification. MOTOROLA 6 High–Speed CMOS Logic Data DL129 — Rev 6 250 Ron , ON RESISTANCE (OHMS) Ron , ON RESISTANCE (OHMS) MC54/74HC4051A MC74HC4052A MC54/74HC4053A 200 125°C 150 25°C TBD 100 – 55°C 50 0 0.25 0.50 0.75 1.0 1.25 1.5 1.75 2.0 100 125°C 80 25°C 60 TBD – 55°C 40 20 2.25 0 0.5 VIS, INPUT VOLTAGE (VOLTS), REFERENCED TO VEE 25°C Ron , ON RESISTANCE (OHMS) Ron , ON RESISTANCE (OHMS) 75 60 TBD 45 – 55°C 30 15 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 2.0 2.5 3.0 4.0 3.5 4.5 Figure 1b. Typical On Resistance, VCC – VEE = 4.5 V 105 125°C 1.5 VIS, INPUT VOLTAGE (VOLTS), REFERENCED TO VEE Figure 1a. Typical On Resistance, VCC – VEE = 2.0 V 90 1.0 75 125°C 60 25°C 45 TBD – 55°C 30 15 0 6.0 1.0 2.0 3.0 4.0 5.0 6.0 7.0 8.0 9.0 VIS, INPUT VOLTAGE (VOLTS), REFERENCED TO VEE VIS, INPUT VOLTAGE (VOLTS), REFERENCED TO VEE Figure 1c. Typical On Resistance, VCC – VEE = 6.0 V Figure 1d. Typical On Resistance, VCC – VEE = 9.0 V PLOTTER Ron , ON RESISTANCE (OHMS) 70 60 125°C 50 25°C 40 PROGRAMMABLE POWER SUPPLY TBD – MINI COMPUTER + VCC – 55°C 30 DEVICE UNDER TEST 20 10 ANALOG IN 0 1.0 2.0 3.0 4.0 5.0 6.0 7.0 8.0 9.0 10.0 11.0 12.0 GND VIS, INPUT VOLTAGE (VOLTS), REFERENCED TO VEE Figure 1e. Typical On Resistance, VCC – VEE = 12.0 V High–Speed CMOS Logic Data DL129 — Rev 6 DC ANALYZER COMMON OUT VEE Figure 2. On Resistance Test Set–Up 7 MOTOROLA MC54/74HC4051A MC74HC4052A MC54/74HC4053A VCC VCC VCC 16 VEE ANALOG I/O OFF A VCC OFF NC VIH OFF VIH 6 7 8 VEE COMMON O/I 6 7 8 VEE Figure 3. Maximum Off Channel Leakage Current, Any One Channel, Test Set–Up VCC Figure 4. Maximum Off Channel Leakage Current, Common Channel, Test Set–Up VCC 16 A VEE VCC 16 0.1µF fin ON COMMON O/I OFF VCC OFF VCC COMMON O/I VCC 16 VEE VOS dB METER ON N/C RL CL* ANALOG I/O VIL 6 7 8 6 7 8 VEE VEE Figure 5. Maximum On Channel Leakage Current, Channel to Channel, Test Set–Up VCC 16 VIS 0.1µF fin Figure 6. Maximum On Channel Bandwidth, Test Set–Up VCC 16 VOS dB METER OFF RL *Includes all probe and jig capacitance CL* RL ON/OFF COMMON O/I ANALOG I/O RL OFF/ON RL RL 6 7 8 VEE VIL or VIH CHANNEL SELECT Vin ≤ 1 MHz tr = tf = 6 ns VEE VCC GND *Includes all probe and jig capacitance CL* VCC 11 CHANNEL SELECT *Includes all probe and jig capacitance Figure 7. Off Channel Feedthrough Isolation, Test Set–Up MOTOROLA 6 7 8 TEST POINT Figure 8. Feedthrough Noise, Channel Select to Common Out, Test Set–Up 8 High–Speed CMOS Logic Data DL129 — Rev 6 MC54/74HC4051A MC74HC4052A MC54/74HC4053A VCC 16 VCC VCC CHANNEL SELECT ON/OFF 50% COMMON O/I ANALOG I/O OFF/ON GND tPLH TEST POINT CL* tPHL ANALOG OUT 6 7 8 50% CHANNEL SELECT *Includes all probe and jig capacitance Figure 9a. Propagation Delays, Channel Select to Analog Out Figure 9b. Propagation Delay, Test Set–Up Channel Select to Analog Out VCC 16 ANALOG IN COMMON O/I ANALOG I/O VCC ON 50% TEST POINT CL* GND tPLH tPHL ANALOG OUT 6 7 8 50% *Includes all probe and jig capacitance Figure 10a. Propagation Delays, Analog In to Analog Out tf tr 90% 50% 10% ENABLE tPZL ANALOG OUT Figure 10b. Propagation Delay, Test Set–Up Analog In to Analog Out tPLZ 1 VCC 2 GND 50% 1 TEST POINT ON/OFF CL* ENABLE 90% 1kΩ ANALOG I/O 2 VOL tPZH tPHZ ANALOG OUT VCC 16 VCC HIGH IMPEDANCE 10% POSITION 1 WHEN TESTING tPHZ AND tPZH POSITION 2 WHEN TESTING tPLZ AND tPZL VOH 50% 6 7 8 HIGH IMPEDANCE Figure 11a. Propagation Delays, Enable to Analog Out High–Speed CMOS Logic Data DL129 — Rev 6 Figure 11b. Propagation Delay, Test Set–Up Enable to Analog Out 9 MOTOROLA MC54/74HC4051A MC74HC4052A MC54/74HC4053A VCC VIS A VCC 16 RL fin 16 VOS ON ON/OFF COMMON O/I NC ANALOG I/O 0.1µF OFF/ON OFF VEE RL RL CL* RL CL* 6 7 8 VEE VCC 6 7 8 11 CHANNEL SELECT *Includes all probe and jig capacitance Figure 12. Crosstalk Between Any Two Switches, Test Set–Up Figure 13. Power Dissipation Capacitance, Test Set–Up 0 VIS VCC 16 0.1µF fin – 10 VOS ON CL* – 20 TO DISTORTION METER – 30 – 40 dB RL FUNDAMENTAL FREQUENCY – 50 DEVICE – 60 6 7 8 VEE SOURCE – 70 – 80 – 90 *Includes all probe and jig capacitance – 100 1.0 2.0 3.125 FREQUENCY (kHz) Figure 14a. Total Harmonic Distortion, Test Set–Up Figure 14b. Plot, Harmonic Distortion APPLICATIONS INFORMATION The Channel Select and Enable control pins should be at VCC or GND logic levels. VCC being recognized as a logic high and GND being recognized as a logic low. In this example: VCC = +5V = logic high GND = 0V = logic low The maximum analog voltage swings are determined by the supply voltages VCC and VEE. The positive peak analog voltage should not exceed VCC. Similarly, the negative peak analog voltage should not go below VEE. In this example, the difference between VCC and VEE is ten volts. Therefore, using the configuration of Figure 15, a maximum analog signal of ten volts peak–to–peak can be controlled. Unused analog inputs/outputs may be left floating (i.e., not connected). However, tying unused analog inputs and outputs to MOTOROLA VCC or GND through a low value resistor helps minimize crosstalk and feedthrough noise that may be picked up by an unused switch. Although used here, balanced supplies are not a requirement. The only constraints on the power supplies are that: VCC – GND = 2 to 6 volts VEE – GND = 0 to –6 volts VCC – VEE = 2 to 12 volts and VEE ≤ GND When voltage transients above VCC and/or below VEE are anticipated on the analog channels, external Germanium or Schottky diodes (Dx) are recommended as shown in Figure 16. These diodes should be able to absorb the maximum anticipated current surges during clipping. 10 High–Speed CMOS Logic Data DL129 — Rev 6 MC54/74HC4051A MC74HC4052A MC54/74HC4053A VCC +5V 16 +5V ANALOG SIGNAL –5V ON 6 7 8 Dx +5V ANALOG SIGNAL VCC 16 Dx Dx VEE VEE 7 8 –5V VEE Figure 15. Application Example Figure 16. External Germanium or Schottky Clipping Diodes +5V +5V 16 +5V ANALOG SIGNAL VEE Dx ON/OFF –5V TO EXTERNAL CMOS CIRCUITRY 0 to 5V DIGITAL SIGNALS 11 10 9 VCC ON/OFF 6 7 8 VEE ANALOG SIGNAL +5V * R R 11 10 9 +5V +5V VEE VEE 16 ANALOG SIGNAL ON/OFF +5V ANALOG SIGNAL R VEE +5V 6 7 8 LSTTL/NMOS CIRCUITRY VEE * 2K ≤ R ≤ 10K a. Using Pull–Up Resistors 11 10 9 LSTTL/NMOS CIRCUITRY HCT BUFFER b. Using HCT Interface Figure 17. Interfacing LSTTL/NMOS to CMOS Inputs A 11 13 LEVEL SHIFTER 14 B 10 15 LEVEL SHIFTER 12 C 9 1 LEVEL SHIFTER 5 ENABLE 6 2 LEVEL SHIFTER 4 3 Figure 18. Function Diagram, HC4051A High–Speed CMOS Logic Data DL129 — Rev 6 11 X0 X1 X2 X3 X4 X5 X6 X7 X MOTOROLA MC54/74HC4051A MC74HC4052A MC54/74HC4053A A 10 12 LEVEL SHIFTER 14 B 9 15 LEVEL SHIFTER 11 13 ENABLE 6 1 LEVEL SHIFTER 5 2 4 3 X0 X1 X2 X3 X Y0 Y1 Y2 Y3 Y Figure 19. Function Diagram, HC4052A A 11 13 LEVEL SHIFTER 12 14 B 10 1 LEVEL SHIFTER 2 15 C 9 3 LEVEL SHIFTER 5 4 ENABLE 6 X1 X0 X Y1 Y0 Y Z1 Z0 Z LEVEL SHIFTER Figure 20. Function Diagram, HC4053A MOTOROLA 12 High–Speed CMOS Logic Data DL129 — Rev 6 MC54/74HC4051A MC74HC4052A MC54/74HC4053A OUTLINE DIMENSIONS J SUFFIX CERAMIC PACKAGE CASE 620–10 ISSUE V –A – 16 9 1 8 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEAD WHEN FORMED PARALLEL. 4. DIM F MAY NARROW TO 0.76 (0.030) WHERE THE LEAD ENTERS THE CERAMIC BODY. –B – L C DIM A B C D E F G J K L M N –T K N SEATING – PLANE E M F J 16 PL 0.25 (0.010) G D 16 PL 0.25 (0.010) T A M 9 1 8 T B N SUFFIX PLASTIC PACKAGE CASE 648–08 ISSUE R –A – 16 M C DIM A B C D F G H J K L M S L S –T – SEATING PLANE K H D 16 PL 0.25 (0.010) M M J G T A M D SUFFIX PLASTIC SOIC PACKAGE CASE 751B–05 ISSUE J –A – 16 1 P 8 PL 0.25 (0.010) 8 M B M G K F R X 45° C –T SEATING – PLANE J M D 16 PL 0.25 (0.010) High–Speed CMOS Logic Data DL129 — Rev 6 M T B S A S 13 INCHES MILLIMETERS MIN MAX MIN MAX 0.740 0.770 18.80 19.55 0.250 0.270 6.35 6.85 0.145 0.175 3.69 4.44 0.015 0.021 0.39 0.53 0.040 0.070 1.77 1.02 0.100 BSC 2.54 BSC 0.050 BSC 1.27 BSC 0.008 0.015 0.21 0.38 0.110 0.130 2.80 3.30 0.295 0.305 7.50 7.74 0° 10° 0° 10° 0.020 0.040 0.51 1.01 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. 9 –B – MILLIMETERS MIN MAX 19.05 19.93 6.10 7.49 — 5.08 0.39 0.50 1.27 BSC 1.40 1.65 2.54 BSC 0.21 0.38 3.18 4.31 7.62 BSC 15° 0° 1.01 0.51 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL. 4. DIMENSION B DOES NOT INCLUDE MOLD FLASH. 5. ROUNDED CORNERS OPTIONAL. B F S S INCHES MIN MAX 0.750 0.785 0.240 0.295 — 0.200 0.015 0.020 0.050 BSC 0.055 0.065 0.100 BSC 0.008 0.015 0.125 0.170 0.300 BSC 15° 0° 0.020 0.040 DIM A B C D F G J K M P R MILLIMETERS MIN MAX 9.80 10.00 4.00 3.80 1.75 1.35 0.49 0.35 1.25 0.40 1.27 BSC 0.25 0.19 0.25 0.10 7° 0° 6.20 5.80 0.50 0.25 INCHES MIN MAX 0.386 0.393 0.150 0.157 0.054 0.068 0.014 0.019 0.016 0.049 0.050 BSC 0.008 0.009 0.004 0.009 0° 7° 0.229 0.244 0.010 0.019 MOTOROLA MC54/74HC4051A MC74HC4052A MC54/74HC4053A OUTLINE DIMENSIONS DW SUFFIX PLASTIC SOIC PACKAGE CASE 751G–02 ISSUE A –A– 16 9 –B– 8X P 0.010 (0.25) 1 B M M 8 16X J D 0.010 (0.25) M T A S B NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.13 (0.005) TOTAL IN EXCESS OF D DIMENSION AT MAXIMUM MATERIAL CONDITION. S DIM A B C D F G J K M P R F R X 45 _ C –T– 14X G K 0.10 (0.004) M T U V S S S ÉÉ ÇÇ ÇÇ ÉÉ ÇÇ ÉÉ K K1 2X L/2 16 9 J1 B –U– L SECTION N–N J PIN 1 IDENT. 8 1 N 0.25 (0.010) 0.15 (0.006) T U S A –V– NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH. PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5. DIMENSION K DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE K DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 7. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE –W–. M N F DETAIL E –W– C 0.10 (0.004) –T– SEATING PLANE MOTOROLA H D INCHES MIN MAX 0.400 0.411 0.292 0.299 0.093 0.104 0.014 0.019 0.020 0.035 0.050 BSC 0.010 0.012 0.004 0.009 0_ 7_ 0.395 0.415 0.010 0.029 DT SUFFIX PLASTIC TSSOP PACKAGE CASE 948F–01 ISSUE O 16X K REF 0.15 (0.006) T U M SEATING PLANE MILLIMETERS MIN MAX 10.15 10.45 7.40 7.60 2.35 2.65 0.35 0.49 0.50 0.90 1.27 BSC 0.25 0.32 0.10 0.25 0_ 7_ 10.05 10.55 0.25 0.75 DETAIL E DIM A B C D F G H J J1 K K1 L M MILLIMETERS MIN MAX 4.90 5.10 4.30 4.50 ––– 1.20 0.05 0.15 0.50 0.75 0.65 BSC 0.18 0.28 0.09 0.20 0.09 0.16 0.19 0.30 0.19 0.25 6.40 BSC 0_ 8_ INCHES MIN MAX 0.193 0.200 0.169 0.177 ––– 0.047 0.002 0.006 0.020 0.030 0.026 BSC 0.007 0.011 0.004 0.008 0.004 0.006 0.007 0.012 0.007 0.010 0.252 BSC 0_ 8_ G 14 High–Speed CMOS Logic Data DL129 — Rev 6 MC54/74HC4051A MC74HC4052A MC54/74HC4053A Motorola reserves the right to make changes without further notice to any products herein. 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