Freescale Semiconductor, Inc. Order this document by MPX2010/D SEMICONDUCTOR TECHNICAL DATA ! !"$%" !#$ "$ "##%" # "# UNIBODY PACKAGE Freescale Semiconductor, Inc... The MPX2010/MPXV2010G series silicon piezoresistive pressure sensors provide a very ac c ur at e and l i n e a r v o l ta g e o u tp u t — d i r ec tl y proportional to the applied pressure. These sensors house a single monolithic silicon die with the strain gauge and thin–film resistor network integrated on each chip. The sensor is laser trimmed for precise span, offset calibration and temperature compensation. Motorola Preferred Device COMPENSATED PRESSURE SENSOR 0 to 10 kPa (0 to 1.45 psi) FULL SCALE SPAN: 25 mV MPX2010D CASE 344 Features SMALL OUTLINE PACKAGE SURFACE MOUNT • Temperature Compensated over 0°C to +85°C • Ratiometric to Supply Voltage • Differential and Gauge Options Application Examples • Respiratory Diagnostics • Air Movement Control MPX2010GP CASE 344B • Controllers MPXV2010GP CASE 1369 • Pressure Switching Figure 1 shows a block diagram of the internal circuitry on the stand–alone pressure sensor chip. +( ) # !" )"%')*' $"%#() $# # ! ') $# '* )'. (#( # !"#) MPX2010DP CASE 344C +587 MPXV2010DP CASE 1351 +587 PIN NUMBER # MPX2010GS CASE 344E Figure 1. Temperature Compensated and Calibrated Pressure Sensor Schematic 1 Gnd 5 N/C 2 +Vout 6 N/C 3 VS 7 N/C 4 –Vout 8 N/C NOTE: Pin 1 is noted by the notch in the lead. VOLTAGE OUTPUT versus APPLIED DIFFERENTIAL PRESSURE The output voltage of the differential or gauge sensor increases with increasing pressure applied to the pressure side (P1) relative to the vacuum side (P2). Similarly, output voltage increases as increasing vacuum is applied to the vacuum side (P2) relative to the pressure side (P1). MPX2010GSX CASE 344F PIN NUMBER Preferred devices are Motorola recommended choices for future use and best overall value. REV 9 Motorola Sensor Device Data Motorola, Inc. 2002 1 Gnd 3 VS 2 +Vout 4 –Vout NOTE: Pin 1 is noted by the notch in the lead. For More Information On This Product, Go to: www.freescale.com 1 Freescale Semiconductor, Inc. MAXIMUM RATINGS(NOTE) Rating Symbol Value Unit Maximum Pressure (P1 > P2) Pmax 75 kPa Storage Temperature Tstg –40 to +125 °C Operating Temperature TA –40 to +125 °C NOTE: Exposure beyond the specified limits may cause permanent damage or degradation to the device. OPERATING CHARACTERISTICS (VS = 10 Vdc, TA = 25°C unless otherwise noted, P1 > P2) Characteristic Symbol Min Typ Max Unit POP 0 — 10 kPa VS — 10 16 Vdc Io — 6.0 — mAdc VFSS 24 25 26 mV Voff –1.0 — 1.0 mV Sensitivity ∆V/∆P — 2.5 — mV/kPa Linearity(5) — –1.0 — 1.0 %VFSS — — ±0.1 — %VFSS — — ±0.5 — %VFSS TCVFSS –1.0 — 1.0 %VFSS TCVoff –1.0 — 1.0 mV Input Impedance Zin 1000 — 2550 Ω Output Impedance Zout 1400 — 3000 Ω tR — 1.0 — ms — — 20 — ms — — ±0.5 — %VFSS Pressure Supply Range(1) Voltage(2) Supply Current Full Scale Span(3) Freescale Semiconductor, Inc... Offset(4) Pressure Hysteresis(5) Temperature (0 to 10 kPa) Hysteresis(5) (–40°C to +125°C) Temperature Effect on Full Scale Temperature Effect on Offset(5) Response Time(6) Warm–Up Offset Stability(7) (10% to 90%) Span(5) NOTES: 1. 1.0 kPa (kiloPascal) equals 0.145 psi. 2. Device is ratiometric within this specified excitation range. Operating the device above the specified excitation range may induce additional error due to device self–heating. 3. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. 4. Offset (Voff) is defined as the output voltage at the minimum rated pressure. 5. Accuracy (error budget) consists of the following: • Linearity: Output deviation from a straight line relationship with pressure, using end point method, over the specified pressure range. • Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. • Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from the minimum or maximum rated pressure, at 25°C. • TcSpan: Output deviation at full rated pressure over the temperature range of 0 to 85°C, relative to 25°C. • TcOffset: Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85°C, relative to 25°C. 6. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 7. Offset stability is the product’s output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test. 2 For More Information On This Product, Go to: www.freescale.com Motorola Sensor Device Data Freescale Semiconductor, Inc. ON–CHIP TEMPERATURE COMPENSATION and CALIBRATION +( +21 ) ° % % $*)%*)4+21 /"- ).% (%# '# ).% "# 3%/ %( $() ).% Freescale Semiconductor, Inc... Figure 2. Output versus Pressure Differential Figure 2 shows the output characteristics of the MPX2010/MPXV2010G series at 25°C. The output is directly proportional to the differential pressure and is essentially a straight line. The effects of temperature on full scale span and offset are very small and are shown under Operating Characteristics. ( ! $# $) This performance over temperature is achieved by having both the shear stress strain gauge and the thin–film resistor circuitry on the same silicon diaphragm. Each chip is dynamically laser trimmed for precise span and offset calibration and temperature compensation. () #!(( ()! ")! $+' ÉÉÉÉÉÉÉÉÉÉÉ ÉÉÉÉÉÉÉÉÉÉÉ ÉÉÉÉÉÉÉÉÉÉÉ ÉÉÉÉÉÉÉÉÉÉÉ ÉÉÉÉÉÉÉÉÉÉÉ % %$-. ( , ' $# ! '" % ')+ $# Figure 3. Unibody Package — Cross–Sectional Diagram (not to scale) Figure 3 illustrates the differential/gauge die in the basic chip carrier (Case 344). A silicone gel isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the silicon diaphragm. The MPX2010/MPXV2010G series pressure sensor oper- Motorola Sensor Device Data ating characteristics and internal reliability and qualification tests are based on use of dry air as the pressure media. Media other than dry air may have adverse effects on sensor performance and long term reliability. Contact the factory for information regarding media compatibility in your application. For More Information On This Product, Go to: www.freescale.com 3 Semiconductor, Inc. LINEARITY Linearity refers to how well a transducer’s output follows the equation: Vout = Voff + sensitivity x P over the operating pressure range. There are two basic methods for calculating nonlinearity: (1) end point straight line fit (see Figure 5) or (2) a least squares best line fit. While a least squares fit gives the “best case” linearity error (lower numerical value), the calculations required are burdensome. Conversely, an end point fit will give the “worst case” error (often more desirable in error budget calculations) and the calculations are more straightforward for the user. Motorola’s specified pressure sensor linearities are based on the end point straight line method measured at the midrange pressure. !() (&*' + ) $# !() (&*'( ) -') %'$'"# *'+ '!) ++$!)$*)%*) Freescale ()' ) ! # + ) $# # %$ #) ()' ) ! # ) $() %'((*' *!!(! Freescale Semiconductor, Inc... Figure 4. Linearity Specification Comparison PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE Motorola designates the two sides of the pressure sensor as the Pressure (P1) side and the Vacuum (P2) side. The Pressure (P1) side is the side containing silicone gel which isolates the die from the environment. The Motorola MPX Part Number pressure sensor is designed to operate with positive differential pressure applied, P1 > P2. The Pressure (P1) side may be identified by using the table below: Case Type Pressure (P1) Side Identifier MPX2010D 344 Stainless Steel Cap MPX2010DP 344C Side with Part Marking MPX2010GP 344B Side with Port Attached MPX2010GS 344E Side with Port Attached MPX2010GSX 344F Side with Port Attached MPXV2010GP 1369 Side with Port Attached MPXV2010DP 1351 Side with Part Marking ORDERING INFORMATION — UNIBODY PACKAGE (MPX2010 SERIES) MPX Series Device Type Options Order Number Case Type Device Marking Basic Element Differential 344 MPX2010D MPX2010D Ported Elements Differential, Dual Port 344C MPX2010DP MPX2010DP Gauge 344B MPX2010GP MPX2010GP Gauge, Axial 344E MPX2010GS MPX2010D Gauge, Axial PC Mount 344F MPX2010GSX MPX2010D ORDERING INFORMATION — SMALL OUTLINE PACKAGE (MPXV2010G SERIES) Device Type Ported Elements 4 Options Case No. MPX Series Order No. Packing Options Marking Gauge, Side Port, SMT 1369 MPXV2010GP Trays MPXV2010G Differential, Dual Port, SMT 1351 MPXV2010DP Trays MPXV2010G For More Information On This Product, Go to: www.freescale.com Motorola Sensor Device Data Freescale Semiconductor, Inc. SMALL OUTLINE PACKAGE DIMENSIONS E A e e/2 .014 (0.35) θ L D A1 DETAIL G b #$)( $#)'$!! # "#( $# # #)'%') "#( $#( # )$!'#( %' (" ." "#( $#( # $ #$) #!* "$! !( $' %'$)'*( $#( "$! !( $' %'$)'*( $#( (!! #$) - %' ( "#( $# 0 $( #$) #!* "' %'$)'*( $# !!$,! "' %'$)'*( $# (!! "- "*" Freescale Semiconductor, Inc... F E1 B N ∅T K A P " M DETAIL G C ! " θ ( ( ° ° ( ( ° ° CASE 1369–01 ISSUE O Motorola Sensor Device Data For More Information On This Product, Go to: www.freescale.com 5 Freescale Semiconductor, Inc. SMALL OUTLINE PACKAGE DIMENSIONS—CONTINUED E A e e/2 .014 (0.35) θ L D A1 DETAIL G b Freescale Semiconductor, Inc... F " E1 B N # +587 +6 +587 # # # # ∅T M A P ().! % # DETAIL G C K ().! % # # +6 # +587 # # # # #$)( $#)'$!! # "#( $# # #)'%') "#( $#( # )$!'#( %' (" ." "#( $#( # $ #$) #!* "$! !( $' %'$)'*( $#( "$! !( $' %'$)'*( $#( (!! #$) - %' ( "#( $# 0 $( #$) #!* "' %'$)'*( $# !!$,! "' %'$)'*( $# (!! "- "*" ! " θ ( ° ° ( ° ° CASE 1351–01 ISSUE O 6 For More Information On This Product, Go to: www.freescale.com Motorola Sensor Device Data Freescale Semiconductor, Inc. UNIBODY PACKAGE DIMENSIONS C R M B –A– Z N PIN 1 L –T– J D Y 4 PL Freescale Semiconductor, Inc... F G F ().! % # " ) " DAMBAR TRIM ZONE: THIS IS INCLUDED WITHIN DIM. “F” 8 PL ().! % # '$*# $*)%*) (*%%!. $*)%*) ().! % # + (*%%!. (*%%!. '$*# #$)( "#( $# # # )$!'# # %' (" ." $#)'$!! # "#( $# # "#( $# ( #!*( + $ ) "$! ()$% ' # "$! ()$% ' # #$) )$ - ( #$" ( #$" # +$*) +( +$*) CASE 344–15 ISSUE Z #$)( "#( $# # # )$!'# # %' #( . $#)'$!! # "#( $# # –A– –T– U L R H N PORT #1 POSITIVE PRESSURE (P1) –Q– B PIN 1 K –P– J " ) & S ( F C G D 4 PL " ) ( ( & ( ( ( ().! % # ( ( '$*# $*)%*) (*%%!. $*)%*) CASE 344B–01 ISSUE B Motorola Sensor Device Data For More Information On This Product, Go to: www.freescale.com 7 Freescale Semiconductor, Inc. UNIBODY PACKAGE DIMENSIONS — CONTINUED PORT #1 R #$)( "#( $# # # )$!'# # %' #( ." $#)'$!! # "#( $# # –A– U V W L H PORT #2 N PORT #1 POSITIVE PRESSURE (P1) PORT #2 VACUUM (P2) –Q– B PIN 1 K –P– –T– –T– " ) & S F J Freescale Semiconductor, Inc... ( G D 4 PL C " ) ( ( & ( ( ( ().! % # ( ( '$*# $*)%*) (*%%!. $*)%*) CASE 344C–01 ISSUE B PORT #1 POSITIVE PRESSURE (P1) –B– C #$)( "#( $# # # )$!'# # %' #( ." $#)'$!! # "#( $# # A BACK SIDE VACUUM (P2) V PIN 1 K J N R S –T– G F D 4 PL " ) " ( ().! % # ( '$*# $*)%*) (*%%!. $*)%*) CASE 344E–01 ISSUE B 8 For More Information On This Product, Go to: www.freescale.com Motorola Sensor Device Data Freescale Semiconductor, Inc. UNIBODY PACKAGE DIMENSIONS — CONTINUED –T– C A E –Q– U N V B R PORT #1 POSITIVE PRESSURE (P1) PIN 1 –P– " ) & " S Freescale Semiconductor, Inc... K J F #$)( "#( $# # # )$!'# # %' #( ." $#)'$!! # "#( $# # ( ( G D 4 PL " ) % ( & ( ().! % # '$*# + $*) + (*%%!. + $*) CASE 344F–01 ISSUE B Motorola Sensor Device Data For More Information On This Product, Go to: www.freescale.com 9 Freescale Semiconductor, Inc. Freescale Semiconductor, Inc... NOTES 10 For More Information On This Product, Go to: www.freescale.com Motorola Sensor Device Data Freescale Semiconductor, Inc. Freescale Semiconductor, Inc... NOTES Motorola Sensor Device Data For More Information On This Product, Go to: www.freescale.com 11 Freescale Semiconductor, Inc... Freescale Semiconductor, Inc. Motorola reserves the right to make changes without further notice to any products herein. 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Motorola, Inc. is an Equal Opportunity/Affirmative Action Employer. MOTOROLA and the Stylized M Logo are registered in the US Patent & Trademark Office. All other product or service names are the property of their respective owners. Motorola, Inc. 2002. How to reach us: USA/EUROPE/Locations Not Listed: Motorola Literature Distribution; P.O. Box 5405, Denver, Colorado 80217. 1–303–675–2140 or 1–800–441–2447 JAPAN: Motorola Japan Ltd.; SPS, Technical Information Center, 3–20–1, Minami–Azabu. Minato–ku, Tokyo 106–8573 Japan. 81–3–3440–3569 ASIA/PACIFIC: Motorola Semiconductors H.K. Ltd.; Silicon Harbour Centre, 2 Dai King Street, Tai Po Industrial Estate, Tai Po, N.T., Hong Kong. 852–26668334 Technical Information Center: 1–800–521–6274 HOME PAGE: http://www.motorola.com/semiconductors/ 12 ◊For More Information On This Product, Go to: www.freescale.com Motorola Sensor Device Data MPX2010/D