Order this document by MPX7050/D SEMICONDUCTOR TECHNICAL DATA ! !# #$&'$ " #!%& $& "! $%%'$ !%"$% The new MPX7050 series pressure sensor incorporates all the innovative features of Motorola’s MPX2000 series family including the patented, single piezoresistive strain gauge (X–ducer) and on–chip temperature compensation and calibration. In addition, the MPX7050 series has a high input impedance of typically 10 kΩ for those portable, low power and battery–operated applications. This device is suitable for those systems in which users must have a dependable, accurate pressure sensor that will not consume significant power. The MPX7050 series device is a logical and economical choice for applications such as portable medical instrumentation, and remote sensing systems with 4 – 20 mAmp transmission. 0 to 50 kPa (0 to 7.25 psi) 40 mV FULL SCALE SPAN (TYPICAL) Features BASIC CHIP CARRIER ELEMENT CASE 344–15, STYLE 1 • Temperature Compensated Over 0°C to +85°C • Unique Silicon Shear Stress Strain Gauge • Easy to Use Chip Carrier Package Options • Available in Differential and Gauge Configurations • Ratiometric to Supply Voltage • ± 0.25% Linearity Application Examples • Portable Medical Instrumentation • Remote Sensing Systems Figure 1 shows a schematic of the internal circuitry on the stand–alone pressure sensor chip. DIFFERENTIAL PORT OPTION CASE 344C–01, STYLE 1 VS 3 NOTE: Pin 1 is the notched pin. THIN FILM TEMPERATURE COMPENSATION AND CALIBRATION CIRCUITRY HIGH Zin X–ducer SENSING ELEMENT 2 4 PIN NUMBER Vout+ Vout– 1 Gnd 3 VS 2 +Vout 4 –Vout 1 GND Figure 1. Temperature Compensated Pressure Sensor Schematic VOLTAGE OUTPUT versus APPLIED DIFFERENTIAL PRESSURE The differential voltage output of the X–ducer is directly proportional to the differential pressure applied. The output voltage of the differential or gauge sensor increases with increasing pressure applied to the pressure side (P1) relative to the vacuum side (P2). Similarly, output voltage increases as increasing vacuum is applied to the vacuum side (P2) relative to the pressure side (P1). Senseon and X–ducer are trademarks of Motorola, Inc. REV 3 Motorola Sensor Device Data Motorola, Inc. 1997 1 MAXIMUM RATINGS Rating Symbol Value Unit Overpressure(8) (P1 > P2) Pmax 200 kPa Burst Pressure(8) (P1 > P2) Pburst 500 kPa Tstg – 40 to +125 °C TA – 40 to +125 °C Storage Temperature Operating Temperature OPERATING CHARACTERISTICS (VS = 10 Vdc, TA = 25°C unless otherwise noted, P1 > P2) Symbol Min Typ Max Unit Pressure Range(1) POP 0 — 50 kPa Supply Voltage(2) VS — 10 16 Vdc Supply Current Io — 1.0 — mAdc VFSS 38.5 40 41.5 mV Characteristics Full Scale Span(3) Offset(4) Voff –1.0 — 1.0 mV Sensitivity ∆V/∆P — 0.80 — mV/kPa Linearity(5) — –0.25 — 0.25 %VFSS Pressure Hysteresis(5) (0 to 50 kPa) — — ± 0.1 — %VFSS Temperature Hysteresis(5) (– 40°C to +125°C) — — ± 0.5 — %VFSS TCVFSS –1.0 — 1.0 %VFSS TCVoff –1.0 — 1.0 mV Zin 5000 — 15,000 Ω Zout 2500 — 6000 Ω Response Time(6) (10% to 90%) tR — 1.0 — ms Warm–Up — — 20 — ms Offset Stability(9) — — ± 0.5 — %VFSS Temperature Effect on Full Scale Span(5) Temperature Effect on Offset(5) Input Impedance Output Impedance MECHANICAL CHARACTERISTICS Symbol Min Typ Max Unit Weight (Basic Element Case 344–15) Characteristics — — 2.0 — Grams Common Mode Line Pressure(7) — — — 690 kPa NOTES: 1. 1.0 kPa (kiloPascal) equals 0.145 psi. 2. Device is ratiometric within this specified excitation range. Operating the device above the specified excitation range may induce additional error due to device self–heating. 3. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. 4. Offset (Voff) is defined as the output voltage at the minimum rated pressure. 5. Accuracy (error budget) consists of the following: • Linearity: Output deviation from a straight line relationship with pressure, using end point method, over the specified pressure range. • Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. • Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from the minimum or maximum rated pressure, at 25°C. • TcSpan: Output deviation at full rated pressure over the temperature range of 0 to 85°C, relative to 25°C. • TcOffset: Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85°C, relative to 25°C. 6. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 7. Common mode pressures beyond specified may result in leakage at the case–to–lead interface. 8. Exposure beyond these limits may cause permanent damage or degradation to the device. 9. Offset stability is the product’s output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test. 2 Motorola Sensor Device Data LEAST SQUARES FIT EXAGGERATED PERFORMANCE CURVE RELATIVE VOLTAGE OUTPUT LINEARITY Linearity refers to how well a transducer’s output follows the equation: Vout = Voff + sensitivity x P over the operating pressure range. There are two basic methods for calculating nonlinearity: (1) end point straight line fit (see Figure 2) or (2) a least squares best line fit. While a least squares fit gives the “best case” linearity error (lower numerical value), the calculations required are burdensome. Conversely, an end point fit will give the “worst case” error (often more desirable in error budget calculations) and the calculations are more straightforward for the user. Motorola’s specified pressure sensor linearities are based on the end point straight line method measured at the midrange pressure. LEAST SQUARE DEVIATION STRAIGHT LINE DEVIATION END POINT STRAIGHT LINE FIT OFFSET 50 PRESSURE (% FULLSCALE) 0 100 Figure 2. Linearity Specification Comparison ON–CHIP TEMPERATURE COMPENSATION and CALIBRATION Figure 3 shows the output characteristics of the MPX7050 series at 25°C. The output is directly proportional to the differential pressure and is essentially a straight line. OUTPUT (mVdc) 40 35 VS = 10 Vdc TA = 25°C P1 > P2 30 25 20 SILICONE DIE COAT TYP SPAN RANGE (TYP) MAX 15 10 5 The effects of temperature on Full Scale Span and Offset are very small and are shown under Operating Characteristics. MIN 0 STAINLESS STEEL METAL COVER EPOXY CASE ÉÉÉÉÉÉÉÉÉÉÉ ÉÉÉÉÉÉÉÉÉÉÉ ÉÉÉÉÉÉÉÉÉÉÉ ÉÉÉÉÉÉÉÉÉÉÉ ÉÉÉÉÉÉÉÉÉÉÉ DIE P1 WIRE BOND LEAD FRAME –5 kPa 0 PSI 12.5 1.83 25 3.63 37.5 5.44 50 7.3 OFFSET (TYP) DIFFERENTIAL/GAUGE ELEMENT RTV DIE BOND P2 Figure 3. Output versus Pressure Differential Figure 4. Cross–Sectional Diagram (not to scale) Figure 4 illustrates the differential or gauge configuration in the basic chip carrier (Case 344–15). A silicone gel isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the silicon diaphragm. The MPX7050 series pressure sensor operating charac- teristics and internal reliability and qualification tests are based on use of dry air as the pressure media. Media other than dry air may have adverse effects on sensor performance and long term reliability. Contact the factory for information regarding media compatibility in your application. Motorola Sensor Device Data 3 PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE Motorola designates the two sides of the pressure sensor as the Pressure (P1) side and the Vacuum (P2) side. The Pressure (P1) side is the side containing the silicone gel which isolates the die from the environment. The Motorola Part Number MPX pressure sensor is designed to operate with positive differential pressure applied, P1 > P2. The Pressure (P1) side may be identified by using the table below: Pressure (P1) Side Identifier Case Type MPX7050D 344–15C Stainless Steel Cap MPX7050DP 344C–01 Side with Part Marking MPX7050GP 344B–01 Side with Port Attached MPX7050GVP 344D–01 Stainless Steel Cap MPX7050GS 344E–01 Side with Port Attached MPX7050GVS 344A–01 Stainless Steel Cap MPX7050GSX 344F–01 Side with Port Attached MPX7050GVSX 344G–01 Stainless Steel Cap ORDERING INFORMATION MPX7050 series pressure sensors are available in differential and gauge configurations. Devices are available in the basic element package or with pressure port fittings which provide printed circuit board mounting ease and barbed hose pressure connections. MPX Series D i T Device Type O i Options C T Case Type Order Number Device Marking Basic Element Differential Case 344–15 MPX7050D MPX7050D Ported Elements Differential, Dual Ported Case 344C–01 MPX7050DP MPX7050DP Gauge Case 344B–01 MPX7050GP MPX7050GP Gauge, Vacuum Case 344D–01 MPX7050GVP MPX7050GVP Gauge, Stove Pipe Case 344E–01 MPX7050GS MPX7050D Gauge, Vacuum Stove Pipe Case 344A–01 MPX7050GVS MPX7050D Gauge, Axial Case 344F–01 MPX7050GSX MPX7050D Gauge, Vacuum Axial Case 344G–01 MPX7050GVSX MPX7050D 4 Motorola Sensor Device Data PACKAGE DIMENSIONS NOTES: C 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION –A– IS INCLUSIVE OF THE MOLD STOP RING. MOLD STOP RING NOT TO EXCEED 16.00 (0.630). POSITIVE PRESSURE (P1) R M B –A– DIM A B C D F G J L M N R N 1 PIN 1 2 3 L 4 –T– SEATING PLANE J POSITIVE PRESSURE (P1) G F D 4 PL 0.136 (0.005) M T A M INCHES MIN MAX 0.595 0.630 0.514 0.534 0.200 0.220 0.016 0.020 0.048 0.064 0.100 BSC 0.014 0.016 0.695 0.725 30_ NOM 0.475 0.495 0.430 0.450 STYLE 1: PIN 1. 2. 3. 4. MILLIMETERS MIN MAX 15.11 16.00 13.06 13.56 5.08 5.59 0.41 0.51 1.22 1.63 2.54 BSC 0.36 0.40 17.65 18.42 30_ NOM 12.07 12.57 10.92 11.43 GROUND + OUTPUT + SUPPLY – OUTPUT CASE 344–15 ISSUE W PORT #2 VACUUM PRESSURE (P2) –B– C NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. A POSITIVE PRESSURE (P1) PIN 1 V 1 2 3 4 K J N R SEATING PLANE S –T– G F D 4 PL 0.13 (0.005) M T B M DIM A B C D F G J K N R S V INCHES MIN MAX 0.690 0.720 0.245 0.255 0.780 0.820 0.016 0.020 0.048 0.064 0.100 BSC 0.014 0.016 0.345 0.375 0.300 0.310 0.178 0.186 0.220 0.240 0.182 0.194 STYLE 1: PIN 1. 2. 3. 4. MILLIMETERS MIN MAX 17.53 18.28 6.22 6.48 19.81 20.82 0.41 0.51 1.22 1.63 2.54 BSC 0.36 0.41 8.76 9.53 7.62 7.87 4.52 4.72 5.59 6.10 4.62 4.93 GROUND + OUTPUT + SUPPLY – OUTPUT CASE 344A–01 ISSUE B Motorola Sensor Device Data 5 PACKAGE DIMENSIONS — CONTINUED SEATING PLANE NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5, 1982. 2. CONTROLLING DIMENSION: INCH. –A– –T– U L R H N PORT #1 POSITIVE PRESSURE (P1) –Q– B 1 2 3 4 PIN 1 K –P– 0.25 (0.010) T Q M S S J F G D 4 PL 0.13 (0.005) C M T S S Q S INCHES MIN MAX 1.145 1.175 0.685 0.715 0.305 0.325 0.016 0.020 0.048 0.064 0.100 BSC 0.182 0.194 0.014 0.016 0.695 0.725 0.290 0.300 0.420 0.440 0.153 0.159 0.153 0.159 0.230 0.250 0.220 0.240 0.910 BSC DIM A B C D F G H J K L N P Q R S U STYLE 1: PIN 1. 2. 3. 4. MILLIMETERS MIN MAX 29.08 29.85 17.40 18.16 7.75 8.26 0.41 0.51 1.22 1.63 2.54 BSC 4.62 4.93 0.36 0.41 17.65 18.42 7.37 7.62 10.67 11.18 3.89 4.04 3.89 4.04 5.84 6.35 5.59 6.10 23.11 BSC GROUND + OUTPUT + SUPPLY – OUTPUT CASE 344B–01 ISSUE B PORT #1 R NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. –A– U V W L H PORT #2 N PORT #1 POSITIVE PRESSURE (P1) PORT #2 VACUUM (P2) –Q– B SEATING PLANE SEATING PLANE 1 2 3 4 PIN 1 K –P– –T– –T– 0.25 (0.010) M T Q S S F J G D 4 PL C 0.13 (0.005) M T S S Q S DIM A B C D F G H J K L N P Q R S U V W INCHES MIN MAX 1.145 1.175 0.685 0.715 0.405 0.435 0.016 0.020 0.048 0.064 0.100 BSC 0.182 0.194 0.014 0.016 0.695 0.725 0.290 0.300 0.420 0.440 0.153 0.159 0.153 0.159 0.063 0.083 0.220 0.240 0.910 BSC 0.248 0.278 0.310 0.330 STYLE 1: PIN 1. 2. 3. 4. MILLIMETERS MIN MAX 29.08 29.85 17.40 18.16 10.29 11.05 0.41 0.51 1.22 1.63 2.54 BSC 4.62 4.93 0.36 0.41 17.65 18.42 7.37 7.62 10.67 11.18 3.89 4.04 3.89 4.04 1.60 2.11 5.59 6.10 23.11 BSC 6.30 7.06 7.87 8.38 GROUND + OUTPUT + SUPPLY – OUTPUT CASE 344C–01 ISSUE B 6 Motorola Sensor Device Data PACKAGE DIMENSIONS — CONTINUED NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5, 1982. 2. CONTROLLING DIMENSION: INCH. –A– U L SEATING PLANE –T– R DIM A B C D F G H J K L N P Q R S U H PORT #2 VACUUM (P2) POSITIVE PRESSURE (P1) N –Q– B 1 2 3 4 K PIN 1 S C J F –P– 0.25 (0.010) M T Q G D 4 PL 0.13 (0.005) S M T S S Q S INCHES MIN MAX 1.145 1.175 0.685 0.715 0.305 0.325 0.016 0.020 0.048 0.064 0.100 BSC 0.182 0.194 0.014 0.016 0.695 0.725 0.290 0.300 0.420 0.440 0.153 0.159 0.153 0.158 0.230 0.250 0.220 0.240 0.910 BSC STYLE 1: PIN 1. 2. 3. 4. MILLIMETERS MIN MAX 29.08 29.85 17.40 18.16 7.75 8.26 0.41 0.51 1.22 1.63 2.54 BSC 4.62 4.93 0.36 0.41 17.65 18.42 7.37 7.62 10.67 11.18 3.89 4.04 3.89 4.04 5.84 6.35 5.59 6.10 23.11 BSC GROUND + OUTPUT + SUPPLY – OUTPUT CASE 344D–01 ISSUE B PORT #1 POSITIVE PRESSURE (P1) –B– C NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. A BACK SIDE VACUUM (P2) DIM A B C D F G J K N R S V V 4 3 2 1 PIN 1 K J N R SEATING PLANE S –T– INCHES MIN MAX 0.690 0.720 0.245 0.255 0.780 0.820 0.016 0.020 0.048 0.064 0.100 BSC 0.014 0.016 0.345 0.375 0.300 0.310 0.178 0.186 0.220 0.240 0.182 0.194 MILLIMETERS MIN MAX 17.53 18.28 6.22 6.48 19.81 20.82 0.41 0.51 1.22 1.63 2.54 BSC 0.36 0.41 8.76 9.53 7.62 7.87 4.52 4.72 5.59 6.10 4.62 4.93 G F D 4 PL 0.13 (0.005) M T B M STYLE 1: PIN 1. 2. 3. 4. GROUND + OUTPUT + SUPPLY – OUTPUT CASE 344E–01 ISSUE B Motorola Sensor Device Data 7 PACKAGE DIMENSIONS — CONTINUED –T– C A E –Q– U N V B R PORT #1 POSITIVE PRESSURE (P1) PIN 1 –P– 0.25 (0.010) M T Q M 4 3 2 1 S K F J NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. DIM A B C D E F G J K N P Q R S U V INCHES MIN MAX 1.080 1.120 0.740 0.760 0.630 0.650 0.016 0.020 0.160 0.180 0.048 0.064 0.100 BSC 0.014 0.016 0.220 0.240 0.070 0.080 0.150 0.160 0.150 0.160 0.440 0.460 0.695 0.725 0.840 0.860 0.182 0.194 MILLIMETERS MIN MAX 27.43 28.45 18.80 19.30 16.00 16.51 0.41 0.51 4.06 4.57 1.22 1.63 2.54 BSC 0.36 0.41 5.59 6.10 1.78 2.03 3.81 4.06 3.81 4.06 11.18 11.68 17.65 18.42 21.34 21.84 4.62 4.92 G D 4 PL 0.13 (0.005) T P M S Q STYLE 1: PIN 1. 2. 3. 4. S GROUND V (+) OUT V SUPPLY V (–) OUT CASE 344F–01 ISSUE B –T– C A E –Q– U POSITIVE PRESSURE (P1) N V B R PIN 1 PORT #2 VACUUM (P2) –P– 0.25 (0.010) M T Q M 1 2 3 4 S K J F G D 4 PL 0.13 (0.005) M T P S Q S NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. DIM A B C D E F G J K N P Q R S U V INCHES MIN MAX 1.080 1.120 0.740 0.760 0.630 0.650 0.016 0.020 0.160 0.180 0.048 0.064 0.100 BSC 0.014 0.016 0.220 0.240 0.070 0.080 0.150 0.160 0.150 0.160 0.440 0.460 0.695 0.725 0.840 0.860 0.182 0.194 STYLE 1: PIN 1. 2. 3. 4. MILLIMETERS MIN MAX 27.43 28.45 18.80 19.30 16.00 16.51 0.41 0.51 4.06 4.57 1.22 1.63 2.54 BSC 0.36 0.41 5.59 6.10 1.78 2.03 3.81 4.06 3.81 4.06 11.18 11.68 17.65 18.42 21.34 21.84 4.62 4.92 GROUND V (+) OUT V SUPPLY V (–) OUT CASE 344G–01 ISSUE B 8 Motorola Sensor Device Data Motorola reserves the right to make changes without further notice to any products herein. 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Motorola Sensor Device Data 9 Mfax is a trademark of Motorola, Inc. How to reach us: USA / EUROPE / Locations Not Listed: Motorola Literature Distribution; P.O. Box 5405, Denver, Colorado 80217. 303–675–2140 or 1–800–441–2447 JAPAN: Nippon Motorola Ltd.; Tatsumi–SPD–JLDC, 6F Seibu–Butsuryu–Center, 3–14–2 Tatsumi Koto–Ku, Tokyo 135, Japan. 81–3–3521–8315 Mfax: [email protected] – TOUCHTONE 602–244–6609 ASIA/PACIFIC: Motorola Semiconductors H.K. Ltd.; 8B Tai Ping Industrial Park, – US & Canada ONLY 1–800–774–1848 51 Ting Kok Road, Tai Po, N.T., Hong Kong. 852–26629298 INTERNET: http://motorola.com/sps 10 ◊ MPX7050/D Motorola Sensor Device Data