ONSEMI MC10H115

SEMICONDUCTOR TECHNICAL DATA
The MC10H115 is a quad differential amplifier designed for use in sensing
differential signals over long lines. This 10H part is a functional/ pinout
duplication of the standard MECL 10K family part, with 100% improvement in
counting frequency and no increase in power–supply current.
The base bias supply (VBB) is made available at Pin 9 to make the device
useful as a Schmitt trigger, or in other applications where a stable reference
voltage is necessary. Active current sources provide the MC10H115 with
excellent common mode rejection. If any amplifier in a package is not used, one
input of that amplifier must be connected to VBB (Pin 9) to prevent upsetting the
current source bias network.
L SUFFIX
CERAMIC PACKAGE
CASE 620–10
P SUFFIX
PLASTIC PACKAGE
CASE 648–08
FN SUFFIX
PLCC
CASE 775–02
• Propagation Delay, 1.0 ns Typical
• Power Dissipation 110 mW Typ/Pkg (No Load)
• Improved Noise Margin 150 mV (Over Operating Voltage and
Temperature Range)
• Voltage Compensated
• MECL 10K–Compatible
LOGIC DIAGRAM
MAXIMUM RATINGS
Characteristic
Symbol
Power Supply (VCC = 0)
Rating
VEE
Input Voltage (VCC = 0)
Output Current — Continuous
— Surge
Operating Temperature Range
Storage Temperature Range — Plastic
— Ceramic
Unit
–8.0 to 0
Vdc
VI
0 to VEE
Vdc
Iout
50
100
mA
TA
0 to +75
°C
Tstg
–55 to +150
–55 to +165
°C
°C
VCC1 = Pin 1
VCC2 = Pin 16
VEE = Pin 8
0°
25°
Min
Max
Min
Max
Min
Max
Unit
IE
—
29
—
26
—
29
mA
IinH
—
150
—
95
—
95
µA
Input Leakage Current
ICBO
—
1.5
—
1.0
—
1.0
µA
Reference Voltage
VBB
–1.38
–1.27
–1.35
–1.25
–1.31
–1.19
Vdc
High Output Voltage
VOH
–1.02
–0.84
–0.98
–0.81
–0.92
–0.735
Vdc
Low Output Voltage
VOL
–1.95
–1.63
–1.95
–1.63
–1.95
–1.60
Vdc
High Input Voltage (1)
VIH
–1.17
–0.84
–1.13
–0.81
–1.07
–0.735
Vdc
Low Input Voltage (1)
VIL
–1.95
–1.48
–1.95
–1.48
–1.95
–1.45
Vdc
VCMR
—
—
–2.85 to –0.8
—
—
Vdc
VPP
—
—
150 typ
—
—
mVPP
tpd
0.4
1.3
0.4
1.3
0.45
1.45
ns
Rise Time
tr
0.5
1.4
0.5
1.5
0.5
1.6
ns
Fall Time
tf
0.5
1.4
0.5
1.5
0.5
1.6
ns
Power Supply Current
Input Current High
Common Mode
Range (3)
Input Sensitivity (4)
3
10
11
14
13
12
15
VBB*
9
DIP
PIN ASSIGNMENT
AC PARAMETERS
Propagation Delay
7
6
*VBB to be used to supply bias to the MC10H115 only
and bypassed (when used) with 0.01 µF to 0.1 µF
capacitor to ground (0 V). VBB can source < 1.0 mA.
The MC10H115 is designed to be used in sensing
differential signals over long lines. The bias supply
(VBB) is made available to make the device useful as a
Schmitt trigger, or in other applications where a stable
reference voltage is necessary.
Active current sources provide these receivers with
excellent common–mode noise rejection. If any
amplifier in a package is not used, one input of that
amplifier must be connected to VBB to prevent
unbalancing the current–source bias network.
The MC10H115 does not have internal–input pull–
down resistors. This provides high impedance to the
amplifier input and facilitates differential connections.
Applications:
• Low Level Receiver
• Voltage Level
• Schmitt Trigger
Interface
75°
Symbol
2
When input pin with
bubble goes positive
its respective output
pin with bubble goes
positive.
ELECTRICAL CHARACTERISTICS (VEE = –5.2 V ±5%) (2)
Characteristic
4
5
VCC1
AOUT
BOUT
NOTES:
1. When VBB is used as the reference voltage.
2. Each MECL 10H series circuit has been designed to meet the specifications shown in the test table, after thermal
equilibrium has been established. The circuit is in a test socket or mounted on a printed circuit board and transverse
air flow greater than 500 linear fpm is maintained. Outputs are terminated through a 50–ohm resistor to –2.0 volts.
3. Differential input not to exceed 1.0 Vdc.
4. 150 mVp–p differential input required to obtain full logic swing on output.
1
16
2
15
3
14
AIN
AIN
4
13
5
12
BIN
BIN
6
11
7
10
VEE
8
9
VCC2
DOUT
COUT
DIN
DIN
CIN
CIN
VBB
Pin assignment is for Dual–in–Line Package.
For PLCC pin assignment, see the Pin Conversion
Tables on page 6–11 of the Motorola MECL Data
Book (DL122/D).
3/93
 Motorola, Inc. 1996
2–216
REV 5
MC10H115
OUTLINE DIMENSIONS
FN SUFFIX
PLASTIC PLCC PACKAGE
CASE 775–02
ISSUE C
0.007 (0.180) M T L–M
B
Y BRK
–N–
U
N
S
0.007 (0.180) M T L–M
S
S
N
S
D
–L–
–M–
Z
W
20
D
1
V
0.010 (0.250)
G1
X
S
T L–M
S
N
S
VIEW D–D
A
0.007 (0.180) M T L–M
S
N
S
R
0.007 (0.180) M T L–M
S
N
S
Z
C
H
–T–
SEATING
PLANE
F
VIEW S
G1
0.010 (0.250) S T L–M
S
0.007 (0.180)
M
T L–M
S
N
S
VIEW S
S
N
S
NOTES:
1. DATUMS –L–, –M–, AND –N– DETERMINED
WHERE TOP OF LEAD SHOULDER EXITS PLASTIC
BODY AT MOLD PARTING LINE.
2. DIMENSION G1, TRUE POSITION TO BE
MEASURED AT DATUM –T–, SEATING PLANE.
3. DIMENSIONS R AND U DO NOT INCLUDE MOLD
FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250)
PER SIDE.
4. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
5. CONTROLLING DIMENSION: INCH.
6. THE PACKAGE TOP MAY BE SMALLER THAN THE
PACKAGE BOTTOM BY UP TO 0.012 (0.300).
DIMENSIONS R AND U ARE DETERMINED AT THE
OUTERMOST EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS,
GATE BURRS AND INTERLEAD FLASH, BUT
INCLUDING ANY MISMATCH BETWEEN THE TOP
AND BOTTOM OF THE PLASTIC BODY.
7. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H
DIMENSION TO BE GREATER THAN 0.037 (0.940).
THE DAMBAR INTRUSION(S) SHALL NOT CAUSE
THE H DIMENSION TO BE SMALLER THAN 0.025
(0.635).
MECL Data
DL122 — Rev 6
N
K
0.004 (0.100)
J
S
K1
E
G
0.007 (0.180) M T L–M
2–217
DIM
A
B
C
E
F
G
H
J
K
R
U
V
W
X
Y
Z
G1
K1
INCHES
MIN
MAX
0.385
0.395
0.385
0.395
0.165
0.180
0.090
0.110
0.013
0.019
0.050 BSC
0.026
0.032
0.020
–––
0.025
–––
0.350
0.356
0.350
0.356
0.042
0.048
0.042
0.048
0.042
0.056
–––
0.020
2_
10 _
0.310
0.330
0.040
–––
MILLIMETERS
MIN
MAX
9.78
10.03
9.78
10.03
4.20
4.57
2.29
2.79
0.33
0.48
1.27 BSC
0.66
0.81
0.51
–––
0.64
–––
8.89
9.04
8.89
9.04
1.07
1.21
1.07
1.21
1.07
1.42
–––
0.50
2_
10 _
7.88
8.38
1.02
–––
MOTOROLA
MC10H115
OUTLINE DIMENSIONS
L SUFFIX
CERAMIC DIP PACKAGE
CASE 620–10
ISSUE V
–A–
16
9
1
8
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMENSION F MAY NARROW TO 0.76 (0.030)
WHERE THE LEAD ENTERS THE CERAMIC
BODY.
–B–
C
L
DIM
A
B
C
D
E
F
G
H
K
L
M
N
–T–
K
N
SEATING
PLANE
M
E
F
J
G
D
16 PL
0.25 (0.010)
16 PL
0.25 (0.010)
M
T A
T B
M
–A–
9
1
8
B
F
C
L
S
–T–
SEATING
PLANE
K
H
G
D
M
J
16 PL
0.25 (0.010)
M
MILLIMETERS
MIN
MAX
19.05
19.93
6.10
7.49
–––
5.08
0.39
0.50
1.27 BSC
1.40
1.65
2.54 BSC
0.21
0.38
3.18
4.31
7.62 BSC
0_
15 _
0.51
1.01
S
P SUFFIX
PLASTIC DIP PACKAGE
CASE 648–08
ISSUE R
16
S
INCHES
MIN
MAX
0.750
0.785
0.240
0.295
–––
0.200
0.015
0.020
0.050 BSC
0.055
0.065
0.100 BSC
0.008
0.015
0.125
0.170
0.300 BSC
0_
15 _
0.020
0.040
T A
M
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
DIM
A
B
C
D
F
G
H
J
K
L
M
S
INCHES
MIN
MAX
0.740
0.770
0.250
0.270
0.145
0.175
0.015
0.021
0.040
0.70
0.100 BSC
0.050 BSC
0.008
0.015
0.110
0.130
0.295
0.305
0_
10 _
0.020
0.040
MILLIMETERS
MIN
MAX
18.80
19.55
6.35
6.85
3.69
4.44
0.39
0.53
1.02
1.77
2.54 BSC
1.27 BSC
0.21
0.38
2.80
3.30
7.50
7.74
0_
10 _
0.51
1.01
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the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and
specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters which may be provided in Motorola
data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals”
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◊
MOTOROLA
2–218
*MC10H115/D*
MC10H115/D
MECL Data
DL122 — Rev 6